JP2004524983A - 半導体部品の製造方法および前記方法により製造される半導体部品 - Google Patents

半導体部品の製造方法および前記方法により製造される半導体部品 Download PDF

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Publication number
JP2004524983A
JP2004524983A JP2002579360A JP2002579360A JP2004524983A JP 2004524983 A JP2004524983 A JP 2004524983A JP 2002579360 A JP2002579360 A JP 2002579360A JP 2002579360 A JP2002579360 A JP 2002579360A JP 2004524983 A JP2004524983 A JP 2004524983A
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JP
Japan
Prior art keywords
layer
silicon
porous
semiconductor component
porous layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002579360A
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English (en)
Japanese (ja)
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JP2004524983A5 (enExample
Inventor
フーベルト　ベンツェル
ヘリベルト　ヴェーバー
フランク　シェーファー
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of JP2004524983A publication Critical patent/JP2004524983A/ja
Publication of JP2004524983A5 publication Critical patent/JP2004524983A5/ja
Pending legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00023—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems without movable or flexible elements
    • B81C1/00047—Cavities
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0278—Temperature sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0111—Bulk micromachining
    • B81C2201/0115—Porous silicon
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C2201/00—Manufacture or treatment of microstructural devices or systems
    • B81C2201/01—Manufacture or treatment of microstructural devices or systems in or on a substrate
    • B81C2201/0101—Shaping material; Structuring the bulk substrate or layers on the substrate; Film patterning
    • B81C2201/0128—Processes for removing material
    • B81C2201/013—Etching
    • B81C2201/0135—Controlling etch progression
    • B81C2201/0139—Controlling etch progression with the electric potential of an electrochemical etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
  • Measuring Fluid Pressure (AREA)
  • Investigating Or Analyzing Materials By The Use Of Fluid Adsorption Or Reactions (AREA)
JP2002579360A 2001-04-07 2002-02-21 半導体部品の製造方法および前記方法により製造される半導体部品 Pending JP2004524983A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10117486A DE10117486A1 (de) 2001-04-07 2001-04-07 Verfahren zur Herstelung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement
PCT/DE2002/000608 WO2002081363A2 (de) 2001-04-07 2002-02-21 Verfahren zur herstellung eines halbleiterbauelements sowie ein nach dem verfahren hergestelltes halbleiterbauelement

Publications (2)

Publication Number Publication Date
JP2004524983A true JP2004524983A (ja) 2004-08-19
JP2004524983A5 JP2004524983A5 (enExample) 2008-09-18

Family

ID=7680828

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002579360A Pending JP2004524983A (ja) 2001-04-07 2002-02-21 半導体部品の製造方法および前記方法により製造される半導体部品

Country Status (5)

Country Link
US (1) US7160750B2 (enExample)
EP (1) EP1379463B1 (enExample)
JP (1) JP2004524983A (enExample)
DE (2) DE10117486A1 (enExample)
WO (1) WO2002081363A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008539582A (ja) * 2005-04-26 2008-11-13 ザイカーブ・セラミクス・ビー．ブイ． 基板を支持するための装置及びこのような装置の製造方法

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10064494A1 (de) * 2000-12-22 2002-07-04 Bosch Gmbh Robert Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement, wobei das Halbleiterbauelement insbesondere eine bewegliche Masse aufweist
DE10144873A1 (de) * 2001-09-12 2003-03-27 Bosch Gmbh Robert Mikromechanischer Wärmeleitfähigkeitssensor mit poröser Abdeckung
DE10219247A1 (de) * 2002-04-30 2003-12-18 Bosch Gmbh Robert Temperatursensor und Verfahren zu dessen Herstellung
DE10306129A1 (de) * 2003-02-14 2004-08-26 Robert Bosch Gmbh Verfahren zur Herstellung eines Bauelementes mit einem Halbleiterträger sowie Bauelement
DE10343792B4 (de) * 2003-09-22 2014-12-18 Robert Bosch Gmbh Heissfilmluftmassensensor mit poröser Stützstruktur und Porositätsgradient unter der Sensormembran sowie Herstellungsverfahren
DE102004010295A1 (de) 2004-03-03 2005-09-22 Robert Bosch Gmbh Mikromechanisches Bauelement und entsprechendes Herstellungsverfahren
DE102004015442A1 (de) * 2004-03-30 2005-10-20 Bosch Gmbh Robert Verfahren zum Verschließen von perforierten Membranen
DE102005029841B4 (de) * 2004-07-28 2013-09-05 Robert Bosch Gmbh Mikromechanischer Drucksensor mit beheiztem Passivierungsmittel und Verfahren zu seiner Steuerung
TW200807652A (en) * 2006-04-20 2008-02-01 Koninkl Philips Electronics Nv Thermal isolation of electronic devices in submount used for LEDs lighting applications
JP4882732B2 (ja) * 2006-12-22 2012-02-22 株式会社デンソー 半導体装置
KR100942439B1 (ko) * 2007-12-28 2010-02-17 전자부품연구원 마이크로 가스센서 및 제조방법
US8304785B2 (en) * 2008-07-29 2012-11-06 Industrial Technology Research Institute LED structure, manufacturing method thereof and LED module
EP2348292A1 (en) * 2010-01-13 2011-07-27 Sensirion AG Sensor device
US8735286B2 (en) 2010-10-29 2014-05-27 The Board Of Trustees Of The Leland Stanford Junior University Deposition-free sealing for micro- and nano-fabrication
WO2012126862A1 (de) 2011-03-18 2012-09-27 Hörmann KG Antriebstechnik Bauwerkszugangsvorrichtung sowie bauelement hierfür
DE102012200983A1 (de) 2011-12-23 2013-06-27 Continental Automotive Gmbh Sensorelement mit Luftdruckmessung
DE102012201304A1 (de) * 2012-01-31 2013-08-01 Robert Bosch Gmbh Mikromechanische Feststoffelektrolyt-Sensorvorrichtung und entsprechendes Herstellungsverfahren
US9200973B2 (en) * 2012-06-28 2015-12-01 Intel Corporation Semiconductor package with air pressure sensor
DE102016119031B4 (de) * 2016-10-07 2025-08-14 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Wärmeisoliertes Mikrosystem
CN116854027A (zh) * 2023-06-21 2023-10-10 北京大学 体硅内空腔结构及其制备方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61170618A (ja) * 1985-01-24 1986-08-01 Toyota Central Res & Dev Lab Inc 流速検出用半導体センサ
US5231878A (en) * 1991-12-23 1993-08-03 Ford Motor Company Mass air flow sensor
DE4331798B4 (de) * 1993-09-18 2004-08-26 Robert Bosch Gmbh Verfahren zur Herstellung von mikromechanischen Bauelementen
DE19518371C1 (de) * 1995-05-22 1996-10-24 Forschungszentrum Juelich Gmbh Verfahren zur Strukturierung porösen Siliciums, sowie eine poröses Silicium enthaltende Struktur
GR1003010B (el) 1997-05-07 1998-11-20 "����������" Ολοκληρωμενος αισθητηρας ροης αεριων χρησιμοποιωντας τεχνολογια πορωδους πυριτιου
DE19752208A1 (de) 1997-11-25 1999-06-02 Bosch Gmbh Robert Thermischer Membransensor und Verfahren zu seiner Herstellung
DE10032579B4 (de) * 2000-07-05 2020-07-02 Robert Bosch Gmbh Verfahren zur Herstellung eines Halbleiterbauelements sowie ein nach dem Verfahren hergestelltes Halbleiterbauelement
DE10046622B4 (de) * 2000-09-20 2010-05-20 Robert Bosch Gmbh Verfahren zur Herstellung einer Membransensoreinheit sowie Membransensoreinheit
FI112644B (fi) 2000-11-10 2003-12-31 Vaisala Oyj Pintamikromekaaninen absoluuttipaineanturi ja menetelmä sen valmistamiseksi

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008539582A (ja) * 2005-04-26 2008-11-13 ザイカーブ・セラミクス・ビー．ブイ． 基板を支持するための装置及びこのような装置の製造方法
KR101408823B1 (ko) * 2005-04-26 2014-06-19 싸이카브 세라믹스 비.브이. 기판 지지 장치 및 이 장치의 제조 방법

Also Published As

Publication number Publication date
DE50207724D1 (de) 2006-09-14
EP1379463A2 (de) 2004-01-14
EP1379463B1 (de) 2006-08-02
US7160750B2 (en) 2007-01-09
WO2002081363A2 (de) 2002-10-17
US20040147057A1 (en) 2004-07-29
WO2002081363A3 (de) 2003-02-20
DE10117486A1 (de) 2002-10-17

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