JP2004507068A - シリコンウェハーを処理するための装置 - Google Patents
シリコンウェハーを処理するための装置 Download PDFInfo
- Publication number
- JP2004507068A JP2004507068A JP2000614487A JP2000614487A JP2004507068A JP 2004507068 A JP2004507068 A JP 2004507068A JP 2000614487 A JP2000614487 A JP 2000614487A JP 2000614487 A JP2000614487 A JP 2000614487A JP 2004507068 A JP2004507068 A JP 2004507068A
- Authority
- JP
- Japan
- Prior art keywords
- bearing member
- bearing
- shaft
- container
- carrier device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 43
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 43
- 239000010703 silicon Substances 0.000 title claims abstract description 43
- 238000012545 processing Methods 0.000 title claims description 16
- 235000012431 wafers Nutrition 0.000 title description 51
- 239000000463 material Substances 0.000 claims abstract description 25
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 description 25
- 230000008569 process Effects 0.000 description 19
- 238000001816 cooling Methods 0.000 description 11
- 239000007789 gas Substances 0.000 description 10
- 238000004140 cleaning Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 9
- 230000008901 benefit Effects 0.000 description 8
- 239000007788 liquid Substances 0.000 description 8
- 239000002245 particle Substances 0.000 description 8
- 239000000126 substance Substances 0.000 description 8
- 230000006870 function Effects 0.000 description 7
- 229910052757 nitrogen Inorganic materials 0.000 description 7
- 229910052717 sulfur Inorganic materials 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 230000004907 flux Effects 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 239000002887 superconductor Substances 0.000 description 5
- 239000013078 crystal Substances 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 239000011253 protective coating Substances 0.000 description 4
- 239000002033 PVDF binder Substances 0.000 description 3
- 238000013016 damping Methods 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 238000007654 immersion Methods 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 3
- 239000004810 polytetrafluoroethylene Substances 0.000 description 3
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 241000288673 Chiroptera Species 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000003993 interaction Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000012071 phase Substances 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 238000007704 wet chemistry method Methods 0.000 description 2
- 241000954177 Bangana ariza Species 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052779 Neodymium Inorganic materials 0.000 description 1
- 241000554740 Rusa unicolor Species 0.000 description 1
- 229910052772 Samarium Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 239000013043 chemical agent Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000006698 induction Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000005415 magnetization Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 229910001172 neodymium magnet Inorganic materials 0.000 description 1
- 230000035699 permeability Effects 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000002990 reinforced plastic Substances 0.000 description 1
- 230000008439 repair process Effects 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 229910000938 samarium–cobalt magnet Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000003631 wet chemical etching Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C32/00—Bearings not otherwise provided for
- F16C32/04—Bearings not otherwise provided for using magnetic or electric supporting means
- F16C32/0406—Magnetic bearings
- F16C32/044—Active magnetic bearings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C32/00—Bearings not otherwise provided for
- F16C32/04—Bearings not otherwise provided for using magnetic or electric supporting means
- F16C32/0406—Magnetic bearings
- F16C32/0408—Passive magnetic bearings
- F16C32/0436—Passive magnetic bearings with a conductor on one part movable with respect to a magnetic field, e.g. a body of copper on one part and a permanent magnet on the other part
- F16C32/0438—Passive magnetic bearings with a conductor on one part movable with respect to a magnetic field, e.g. a body of copper on one part and a permanent magnet on the other part with a superconducting body, e.g. a body made of high temperature superconducting material such as YBaCuO
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C37/00—Cooling of bearings
- F16C37/005—Cooling of bearings of magnetic bearings
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16C—SHAFTS; FLEXIBLE SHAFTS; ELEMENTS OR CRANKSHAFT MECHANISMS; ROTARY BODIES OTHER THAN GEARING ELEMENTS; BEARINGS
- F16C2300/00—Application independent of particular apparatuses
- F16C2300/30—Application independent of particular apparatuses related to direction with respect to gravity
- F16C2300/32—Horizontal, e.g. bearings for supporting a horizontal shaft
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Magnetic Bearings And Hydrostatic Bearings (AREA)
- Chemically Coating (AREA)
- Silicon Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| DE19918922 | 1999-04-27 | ||
| DE19959299A DE19959299A1 (de) | 1999-04-27 | 1999-12-09 | Behandlungsvorrichtung für Silizium-Scheiben |
| PCT/EP2000/003351 WO2000065637A2 (de) | 1999-04-27 | 2000-04-13 | Behandlungsvorrichtung für silizium-scheiben |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004507068A true JP2004507068A (ja) | 2004-03-04 |
| JP2004507068A5 JP2004507068A5 (enExample) | 2007-05-31 |
Family
ID=26053088
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000614487A Pending JP2004507068A (ja) | 1999-04-27 | 2000-04-13 | シリコンウェハーを処理するための装置 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7048824B1 (enExample) |
| EP (1) | EP1173883B1 (enExample) |
| JP (1) | JP2004507068A (enExample) |
| CN (1) | CN1349655A (enExample) |
| AT (1) | ATE251340T1 (enExample) |
| AU (1) | AU5210300A (enExample) |
| WO (1) | WO2000065637A2 (enExample) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002100605A (ja) * | 2000-07-19 | 2002-04-05 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| WO2006046657A1 (ja) * | 2004-10-28 | 2006-05-04 | Tokyo Electron Limited | 液処理装置 |
Families Citing this family (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4026750B2 (ja) | 2002-04-24 | 2007-12-26 | 東京エレクトロン株式会社 | 基板処理装置 |
| US8471254B2 (en) * | 2005-12-27 | 2013-06-25 | Hana Microdisplay Technologies, Inc. | Liquid crystal cells with uniform cell gap and methods of manufacture |
| CN101432622B (zh) * | 2006-03-03 | 2013-05-29 | 国立大学法人新澙大学 | 存在于硅晶片中的原子空位的定量评价装置和方法 |
| JP5276347B2 (ja) * | 2007-07-03 | 2013-08-28 | 国立大学法人 新潟大学 | シリコンウェーハ中に存在する原子空孔の定量評価装置、その方法、シリコンウェーハの製造方法、及び薄膜振動子 |
| CN101217108B (zh) * | 2008-01-02 | 2010-06-09 | 株洲南车时代电气股份有限公司 | 一种芯片台面腐蚀装置 |
| US20100038498A1 (en) * | 2008-08-18 | 2010-02-18 | Skedco, Inc. | Configurable anchor point and modular kit for an anchor point |
| US20120098371A1 (en) * | 2010-10-22 | 2012-04-26 | Spinlectrix Inc. | Stabilization of rotating machinery |
| JP5715444B2 (ja) * | 2011-02-28 | 2015-05-07 | 東京エレクトロン株式会社 | 載置装置 |
| DE102019135182A1 (de) * | 2019-12-19 | 2021-06-24 | Oerlikon Surface Solutions Ag, Pfäffikon | Haltevorrichtung zum Halten eines Substrats |
| DE102023131367A1 (de) * | 2023-11-10 | 2025-05-15 | Gebr. Schmid Gmbh | Vorrichtung, Verfahren und Anlage zur Leiterplattenherstellung |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0558777A (ja) * | 1991-08-27 | 1993-03-09 | Canon Inc | 薄膜形成装置 |
| JPH07229517A (ja) * | 1993-12-13 | 1995-08-29 | Siemens Ag | 回転子軸の磁気軸受装置 |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH469404A (fr) * | 1968-01-26 | 1969-02-28 | Ebauches Sa | Diviseur de fréquence |
| US4300581A (en) * | 1980-03-06 | 1981-11-17 | Thompson Raymon F | Centrifugal wafer processor |
| EP0238908A1 (de) * | 1986-03-19 | 1987-09-30 | Siemens Aktiengesellschaft | Kryosorptionspumpe für ein thermisches Isoliervakuum im Läufer einer elektrischen Maschine mit supraleitender Erregerwicklung |
| DE3808331A1 (de) * | 1988-03-12 | 1989-09-28 | Kernforschungsanlage Juelich | Magnetische lagerung mit permanentmagneten zur aufnahme der radialen lagerkraefte |
| JPH05238683A (ja) * | 1992-02-28 | 1993-09-17 | Ebara Corp | 磁気浮上エレベータ |
| US5398481A (en) * | 1992-05-19 | 1995-03-21 | Ebara Corporation | Vacuum processing system |
| JPH0758036A (ja) * | 1993-08-16 | 1995-03-03 | Ebara Corp | 薄膜形成装置 |
| WO1995020264A1 (en) * | 1994-01-25 | 1995-07-27 | Kanagawa Academy Of Science And Technology | Magnetic levitation device |
| JPH081475A (ja) * | 1994-06-22 | 1996-01-09 | Nippon Seiko Kk | ターンテーブル装置 |
| US5554583A (en) * | 1994-09-08 | 1996-09-10 | Hull; John R. | Permanent magnet design for high-speed superconducting bearings |
| DE19503695C2 (de) * | 1995-02-04 | 1997-02-27 | Roland Man Druckmasch | Absicherung für eine Druckmaschine |
| US5747426A (en) * | 1995-06-07 | 1998-05-05 | Commonwealth Research Corporation | High performance magnetic bearing systems using high temperature superconductors |
| TW331652B (en) * | 1995-06-16 | 1998-05-11 | Ebara Corp | Thin film vapor deposition apparatus |
| WO1997003225A1 (en) * | 1995-07-10 | 1997-01-30 | Cvc Products, Inc. | Programmable ultraclean electromagnetic substrate rotation apparatus and method for microelectronics manufacturing equipment |
| JP3672416B2 (ja) * | 1997-06-27 | 2005-07-20 | 株式会社荏原製作所 | スピン処理装置 |
| JP3847935B2 (ja) * | 1998-01-09 | 2006-11-22 | キヤノン株式会社 | 多孔質領域の除去方法及び半導体基体の製造方法 |
| DE19847347C2 (de) * | 1998-10-14 | 2001-03-29 | Ldt Gmbh & Co | Magnetlager |
| TW466576B (en) * | 1999-06-15 | 2001-12-01 | Ebara Corp | Substrate processing apparatus |
-
2000
- 2000-04-13 WO PCT/EP2000/003351 patent/WO2000065637A2/de not_active Ceased
- 2000-04-13 JP JP2000614487A patent/JP2004507068A/ja active Pending
- 2000-04-13 AU AU52103/00A patent/AU5210300A/en not_active Abandoned
- 2000-04-13 CN CN00806788A patent/CN1349655A/zh active Pending
- 2000-04-13 US US09/959,495 patent/US7048824B1/en not_active Expired - Fee Related
- 2000-04-13 EP EP00936696A patent/EP1173883B1/de not_active Expired - Lifetime
- 2000-04-13 AT AT00936696T patent/ATE251340T1/de not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0558777A (ja) * | 1991-08-27 | 1993-03-09 | Canon Inc | 薄膜形成装置 |
| JPH07229517A (ja) * | 1993-12-13 | 1995-08-29 | Siemens Ag | 回転子軸の磁気軸受装置 |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002100605A (ja) * | 2000-07-19 | 2002-04-05 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
| WO2006046657A1 (ja) * | 2004-10-28 | 2006-05-04 | Tokyo Electron Limited | 液処理装置 |
| JPWO2006046657A1 (ja) * | 2004-10-28 | 2008-05-22 | 東京エレクトロン株式会社 | 液処理装置 |
| JP4486649B2 (ja) * | 2004-10-28 | 2010-06-23 | 東京エレクトロン株式会社 | 液処理装置 |
| US8201567B2 (en) | 2004-10-28 | 2012-06-19 | Tokyo Electron Limited | Liquid treating apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| ATE251340T1 (de) | 2003-10-15 |
| AU5210300A (en) | 2000-11-10 |
| EP1173883A2 (de) | 2002-01-23 |
| CN1349655A (zh) | 2002-05-15 |
| WO2000065637A2 (de) | 2000-11-02 |
| WO2000065637A3 (de) | 2001-04-12 |
| US7048824B1 (en) | 2006-05-23 |
| EP1173883B1 (de) | 2003-10-01 |
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Legal Events
| Date | Code | Title | Description |
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| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070326 |
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| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20070326 |
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| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20091117 |
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| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20100413 |