WO2006046657A1 - 液処理装置 - Google Patents
液処理装置 Download PDFInfo
- Publication number
- WO2006046657A1 WO2006046657A1 PCT/JP2005/019815 JP2005019815W WO2006046657A1 WO 2006046657 A1 WO2006046657 A1 WO 2006046657A1 JP 2005019815 W JP2005019815 W JP 2005019815W WO 2006046657 A1 WO2006046657 A1 WO 2006046657A1
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- WO
- WIPO (PCT)
- Prior art keywords
- liquid
- processing apparatus
- processing
- liquid processing
- holding device
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
Definitions
- the present invention relates to a liquid processing apparatus that supplies a processing liquid to an object to be processed such as a semiconductor wafer, a glass substrate, and a disk substrate and performs processing such as cleaning and etching.
- liquid processing for carrying out such a liquid processing method
- a processing liquid such as a chemical liquid is supplied from the processing liquid supply unit.
- a liquid processing apparatus that sequentially supplies rinsing liquid (pure water) and performs processing are known.
- the rotating means is formed by two rollers that support the periphery of the object to be processed. Further, the roller is formed so as to be able to rotate in a non-contact manner with respect to the processing tank by receiving a rotational driving force from the roller driving portion in a non-contact manner (see, for example, JP-A-2002-100605).
- the present invention has been made in view of the above circumstances, and it is possible to improve the uniformity of the liquid processing by making the contact between the object to be processed and the processing liquid uniform while preventing the generation of particles.
- An object of the present invention is to provide a liquid processing apparatus.
- the present invention A holding device for holding a substantially flat object to be processed in a substantially vertical posture
- a processing container for storing an object to be processed held by the holding device
- a processing liquid supply system for supplying a processing liquid to a target object in the processing container;
- a rotational drive device that rotates about an axis;
- the liquid processing apparatus characterized by comprising.
- the holding device includes a driven shaft that is rotationally driven by the rotation driving device, and the processing container is an enclosing member that surrounds the driven shaft of the holding device so as to form a gap therebetween, It is preferable to include an enclosing member in which a liquid supply port for supplying the processing liquid is formed.
- the liquid supply port is disposed on the rotation axis. This makes it easier for the processing liquid to flow uniformly around the driven shaft.
- the driven shaft has a convex end facing the liquid supply port from the viewpoint of smoothing the flow of the processing liquid and allowing the processing liquid to flow more uniformly.
- a gas supply port for supplying a drying gas to the object to be processed by the gas supply system is further formed in the processing container.
- drying in the gap can be performed in parallel with performing the drying process with the drying gas supplied from the gas supply port on the target object that has been processed with the processing liquid.
- the processing liquid supply system is configured to supply at least the first and second processing liquids,
- the liquid processing apparatus is a liquid processing apparatus.
- the first processing liquid When the first processing liquid is supplied by the processing liquid supply system, the first processing liquid is supplied into the gap from the liquid supply port;
- the second processing liquid When the second processing liquid is supplied by the processing liquid supply system, the second processing liquid is supplied into the gap from the liquid supply port.
- the holding device is
- At least a pair of holding members for holding the outer edge of the object to be processed from the radially outer side with respect to the rotation axis;
- the holding device is
- An actuation shaft disposed concentrically within the driven shaft
- An operating device for rotating the operating shaft relative to the driven shaft ;
- the moving mechanism is operated by relative rotation of the operating shaft.
- the liquid processing apparatus can be downsized by incorporating the element for operating the moving mechanism into the driven shaft.
- An enclosure wall that surrounds the object to be processed from the outside in the radial direction with respect to the rotation axis has an enclosure wall having openings formed at both ends in the direction of the rotation axis, and a closing wall that closes the opening at one end of the enclosure wall A container body;
- a lid that fluid-tightly opens and closes the opening on the other end of the container body
- the processing container is a fluid-tight sealed container, and there is no possibility of being adversely affected by an external atmosphere, for example, oxygen in the air, air flow, temperature, etc. during processing, so that the processing quality can be improved. Can do.
- the holding device may be attached to the lid body, or the holding device may be attached to the container body.
- the holding device includes a driven shaft that is rotationally driven by the rotational driving device
- the processing container includes an enclosing member that surrounds the driven shaft of the holding device
- the rotational driving device includes an electromagnetic force
- the driven shaft is configured to be held in a non-contact state with respect to the surrounding member by the action of
- the liquid processing apparatus further includes a movement preventing device that prevents the driven shaft of the holding device from moving downward relative to the surrounding member in a state where the electromagnetic force does not act.
- the holding device can be easily rotated in a non-contact state with respect to the processing container. Even in a state where electromagnetic force is not activated due to a power failure or the like, the movement blocking device can prevent the driven shaft from moving downward. Accordingly, damage due to impacts received on the holding device and the processing container can be prevented, and the reliability of the device can be improved.
- FIG. 1 is a schematic plan view showing an example of a processing system including a liquid processing apparatus according to the present invention.
- 2 is a schematic longitudinal sectional view of the processing system shown in FIG.
- FIG. 3 is a perspective view showing a main part of the processing system shown in FIG.
- FIG. 4 is a schematic diagram showing a piping system of a liquid processing apparatus according to the present invention.
- FIG. 5 is a cross-sectional view showing a first embodiment of a liquid processing apparatus according to the present invention.
- FIG. 6 is a longitudinal sectional view of the liquid processing apparatus shown in FIG.
- FIG. 7 is a longitudinal sectional view showing the periphery of the treatment liquid nose in the liquid treatment apparatus shown in FIG.
- FIG. 8 is a perspective view showing a holding device in the liquid processing apparatus shown in FIG.
- FIG. 9 is a longitudinal sectional view showing a second embodiment of the liquid processing apparatus according to the present invention.
- FIG. 10 is an elevation view schematically showing a moving mechanism of the holding device in the liquid processing apparatus shown in FIG.
- the processing system includes a carry-in / carry-out unit 1 for a carrier C holding a semiconductor wafer W, which is a plurality of substantially flat workpieces, and a pitch conversion '
- a transport unit 3 a wafer transport unit 5, and a liquid processing apparatus 6 are provided.
- the carrier C holds, for example, 25 wafers W in a horizontal state at a predetermined interval, for example, 10 mm.
- the pitch converting / conveying unit 3 is provided with two wafer holders 2a and 2b having a pitch converting function for holding the wafers W at a predetermined interval, for example, 3 mm.
- the wafer transfer unit 5 is provided between the loading / unloading unit 1 and the pitch conversion / transfer unit 3. In order to transfer wafer W between carrier C and wafer holders 2a and 2b, this wafer transfer section 5 is movable in the X, Y and perpendicular Z directions orthogonal to each other in the horizontal plane and in the horizontal plane.
- a transfer arm 4 is provided which can be rotated (in the ⁇ direction).
- the liquid processing apparatus 6 was placed in a horizontal posture on the pitch conversion 'conveying unit 3 in Figs. 1 and 3
- a container body 12 that forms a sealed processing container 10 together with a lid 11 (in a state) is provided.
- the cover 11 placed on the pitch conversion / conveying unit 3 is located between the two wafer holders 2a and 2b arranged opposite to each other in the Y direction.
- the lid 11 is moved by the attitude conversion / movement mechanism 60 so as to be united with the container body 12 while being converted from a horizontal attitude to a substantially vertical attitude.
- the lid 11 is provided with a holding device 30 that holds the wafer W in a substantially vertical posture when united with the container body 12 (during processing).
- the liquid processing apparatus 6 includes a holding device 30 that holds the wafer W in a substantially vertical posture, and a processing container 10 that stores the wafer W held by the holding device 30. Further, the liquid processing apparatus 6 rotates the processing liquid supply system 40 (FIG. 4) for supplying the processing liquid to the wafer W in the processing container 10 and the holding device 30 in a non-contact state with respect to the processing container 10. And a rotary drive device 20 (FIG. 6). As will be described later, the rotation driving device 20 rotates the holding device 30 around the rotation axis passing through the approximate center of the wafer W in a non-contact state with respect to the processing container 10.
- the container body 12 includes a cylindrical surrounding wall 12a in which openings are formed on both end sides in the axial direction, and a closing wall 12b for closing the opening on one end side of the surrounding wall 12a.
- an accommodating portion 14 that communicates with the inside of the container 10 is connected to the lower portion of the surrounding wall 12 a of the container body 12 through the communication port 16.
- a drainage port 17 is provided at a portion of the surrounding wall 12a facing the accommodating portion 14.
- a rapid drain port 17A is provided at the bottom of the surrounding wall 12a, and an air vent port 18 and a gas supply port 19 are provided at the upper portion of the surrounding wall 12a.
- the lid body 11 is formed in a disc shape so as to close the opening 13 on the other end side when the lid body 11 is united with the container body 12.
- An O-ring 11a (FIG. 6) is attached to the surface of the lid 11 that faces the opening 13. Thereby, the lid 11 can close and open the opening 13 of the container body 12 in a fluid-tight manner.
- the holding device 30 includes a driven shaft 21 that is disposed on the rotation axis and extends through the center of the lid 11 (FIG. 6).
- An enclosing member 23 is attached to the lid 11 so as to surround the driven shaft 21 so as to form a gap 22 therebetween (FIG. 6).
- the holding device 30 holds the outer edge of the wafer W from the outside in the radial direction with respect to the rotation axis.
- a pair of holding members 32 is provided. These holding members 32 are also provided with a beam-like base body 31 that is coupled to the driven shaft 21 and extends in the diametrical direction with respect to the rotation axis.
- a movable member 35 is attached to both ends of the base 31 via a bellows-like elastic member 34 so as to be movable in the radial direction.
- Each holding member 32 is integrally coupled to these movable members 35.
- a plurality of holding grooves 33 for receiving the outer edge of the wafer W are formed on the inner surface of each holding member 32 at intervals.
- a moving mechanism (not shown) for moving the pair of holding members 32 in the radial direction with respect to the rotation axis via each movable member 35 is provided in the base 31.
- the wafer holders 2a to 2b (FIGS. 1 and 2) holding the wafer W in a state where the pair of holding members 32 are moved radially outward by the moving mechanism. ) Is received between the holding members 32, and then the pair of holding members 32 are moved radially inward by the moving mechanism, whereby the wafer W can be received and held from the wafer holder. Then, the ⁇ E wafer W held on the lid 11 by the holding device 30, and converted into a substantially vertical position by the attitude conversion and transfer mechanism 60 may be force S accommodated in the container body 12.
- the wafer W can be received between the pair of holding members 32 after taking out the processed wafer W from the container body 12 and converting it into a horizontal posture in the reverse procedure. Then, the wafer W can be transferred from the holding device 30 to the wafer holder by moving the pair of holding members 32 outward in the radial direction by the moving mechanism.
- the rotational drive device 20 includes a ring-shaped levitation electromagnet 24 supported on the surrounding member 23 at an interval in the axial direction.
- a permanent magnet 25 is carried on the driven shaft 21.
- the surrounding member 23 and the driven shaft 21 are both formed of a material having high chemical resistance and corrosion resistance, for example, a synthetic resin such as polytetrafluoroethylene (PTFE).
- PTFE polytetrafluoroethylene
- a suitable current is passed through the levitation electromagnet 24, so that the driven shaft 21 is not contacted with the surrounding member 23 with a gap 22 therebetween. It can be rotated in the state. Thereby, the holding device 30 can be rotated around the rotation axis passing through the approximate center of the wafer W in a non-contact state with respect to the processing container 10. Accordingly, the generation of particles due to the rotation of the holding device 30 can be suppressed.
- a positioning electromagnet 26 is embedded between the levitation electromagnets 24 of the surrounding member 23. By energizing the positioning electromagnet 26, the position of the driven shaft 21 is restricted in the axial direction.
- the rotation drive device 20 controls the current and voltage to the electromagnet 24 based on a control signal from a controller (not shown), thereby rotating the driven shaft 21 in rotation direction and rotation speed (for example, 1 to 60 rpm). ) Can be controlled.
- the surrounding member 23 has a grip 'cylinder 27 force which is a movement blocking device that prevents the driven shaft 21 from moving downward in a state where no electromagnetic force acts on the levitation electromagnet 24. Installed.
- These grip cylinders 27 have piston rods 27 a that extend and support the driven shaft 21 when the energization of the levitation electromagnet 24 is stopped or cut off due to a power failure or the like.
- a liquid supply port 28 for supplying a processing liquid is provided in the gap 22 on the distal end side of the surrounding member 23. Thereby, it is possible to prevent the processing liquid from being trapped in the gap 22 during the processing of the wafer W by the processing liquid.
- the supply port 28 is disposed on the rotation axis, and the driven shaft 21 has a convex tip portion facing the supply port 28. Thereby, the flow of the processing liquid supplied from the liquid supply port 28 can be made smooth, and the processing liquid can easily flow uniformly around the driven shaft 21.
- the liquid supply port 28 is connected to a supply line 70A for a treatment liquid such as a chemical solution or a rinse liquid (pure water), and a supply line 84 for a drying gas such as nitrogen (N) gas.
- the processing liquid supply system 40 shown in FIG. 4 includes a substantially cylindrical supply member 42 accommodated in the accommodating portion 14 of the processing container main body 12 as shown in FIGS.
- the supply member 42 includes a central supply path 41 and a nozzle 43 that communicates with the supply path 41.
- the nozzle 43 is formed on the side surface of the supply member 42 as a slit extending in the axial direction or a plurality of holes arranged at intervals in the axial direction.
- a nose rotary shaft 53 extending in the axial direction is attached to one end face of the supply member 42.
- the rotary shaft 53 is inserted into a guide tube 45 provided integrally with a case 44 that forms the housing portion 14 with a gap.
- a nozzle rotating device 50 for rotating the nozzle rotating shaft 53 is attached.
- the supply member 42 is configured to be rotatable in a non-contact state with respect to the processing container 10 (case 44).
- Nozzles in supply member 42 At least one liquid pool prevention hole 46 (FIG. 5) may be provided on the back side of the rod 43.
- the nozzle rotating device 50 includes a bottomed cylindrical surrounding member 50 a fitted on the outer peripheral surface of the guide cylinder 45.
- a floating electromagnet 51 and a positioning electromagnet 52 are carried on the surrounding member 50a.
- a magnet 54 is carried on the nozzle rotating shaft 53.
- the levitation electromagnet 51 and the positioning electromagnet 52 are energized and excited, so that the nose rotating shaft 53 is not spaced apart from the guide tube 45 and the surrounding member 50a. It can be rotated in contact. Therefore, the generation of particles due to the rotation of the supply member 42 and the rotating shaft 53 can be suppressed.
- the nozzle surrounding member 50a and the nozzle rotating shaft 53 are both made of a material having high chemical resistance and corrosion resistance, for example, a synthetic resin such as PTFE.
- the nozzle rotation device 50 can also control the rotation drive based on a control signal from a controller (not shown).
- a main supply pipeline 70 is connected to the treatment liquid supply channel 41 (FIG. 5) of the supply member 42 via a first on-off valve VI.
- a pure water supply source 71 is connected to the other end of the main supply line 70.
- a branch line 72 is connected in parallel to the pure water supply source 71 side of the main supply line 70.
- the main supply line 70 has a second open / close valve V2, a filter F1, a flow meter FM1, and a heating mechanism for adjusting the processing liquid to the processing temperature in order from the pure water supply side. H is provided.
- the branch line 72 is provided with a third on-off valve V3, a finoleta F2, and a flow meter FM2 in this order from the pure water supply side.
- the chemical night supply lines 73a, 73b, 73c are connected to the chemical liquid tanks 74a, 74b, 74c, 74d via the switching supply valves Va, Vb, Vc, Vd. , 73d force S connected.
- the chemical tanks 74a, 74b, 74c, 74d different types of chemical liquids such as ammonium hydroxide (NH OH), hydrochloric acid (HC1), hydrofluoric acid (HF) are stored. Yes.
- each chemical solution is mixed with pure water flowing in the main supply line 70 by opening one of the switching supply valves Va, Vb, Vc, Vd, and the treatment container is supplied from the supply member 42. It can be supplied to wafers W in 10.
- a supply line 70A branched from the supply member 42 side of the main supply line 70 is connected to the liquid supply port 28 via the switching valve V0 (see FIG. 6).
- the same processing liquid (chemical solution or pure water) supplied from the supply member 42 to the wafer W can be supplied from the liquid supply port 28 into the gap 22 (FIG. 6).
- a drain line 75 provided with an on-off valve V4 is connected to a drain port 76 (Fig. 5) provided in the case 44 of the accommodating portion 14.
- the drain line 75 is connected to the drain line 78A.
- a drainage pipe 78 having an open / close valve V5 is connected to the drainage port 17 of the container body 12 (see FIG. 5).
- the downstream side of the drainage pipe 78 is connected to a drainage pipe 78B via a pure water drain valve DV1, and has three chemical drain valves DV2, DV3, DV4 in front of the valve DV1. Branches to drain line 79.
- An exhaust pipe 80 having an opening / closing valve V6 adjustable in opening degree is connected to the air vent 18 (see Fig. 5) of the container body 12, and the inside of the processing container 10 is opened by opening the opening / closing valve V6. To prevent the accumulation of bubbles.
- the exhaust line 80 is connected to the drain line 78.
- the gas supply port 19 (see Fig. 5) of the container body 12 is connected to a cool N gas supply line 81, a hot N gas supply line 82, and isopropyl alcohol through an on-off valve V7 and a supply line 84.
- (IPA) supply line 83 is connected. Through these pipes 81 to 84, cool or hot N gas or I from an N gas supply source or IPA supply source (not shown) as necessary.
- the PA vapor is configured to be supplied to the wafer W in the processing container 10.
- a branch line 84A from the supply line 84 is connected to the supply port 28 of the rotary drive device 20 via the switching valve V0 (see FIG. 6).
- the quick drain 17A (Fig. 5) of the container body 12 is connected to a drain pipe via an open / close valve V8. Route 78A is connected.
- the drainage pipe 78A allows the processing liquid (chemical solution, pure water) to be discharged from the processing container 10 to the outside through the drainage pipe 78A in a short time.
- the pipe has a relatively large inner diameter.
- the main supply pipe 70 is connected to the drain pipe 78B provided separately from the drain pipe 78A through a return pipe 84 having a switching valve VA.
- a fall prevention mechanism 90 is provided on the upper portion of the surrounding wall 12a of the container body 12 to prevent the wafers W from coming into contact with each other particularly when the liquid is discharged from the quick liquid discharge port 17A. It has been.
- This fall prevention mechanism 90 is formed such that a comb-like fall prevention member 92 having a plurality of support pieces 91 that can be inserted between adjacent wafers W can be advanced and retracted by a rotating means (not shown).
- the wafers W in the carrier C set in the loading / unloading section 1 are taken out one by one by the transfer arm 4 and transferred to one wafer holder 2a.
- the plurality of wafers W held by the wafer holder 2 a are delivered to the holding device 30 attached to the lid 11.
- the lid 11 (holding device 30) is converted from the horizontal posture to the substantially vertical posture and moved to the container main body 12 side by the posture conversion / movement mechanism 60, and the wafer W is moved into the container main body 12.
- the lid 11 is combined with the container body 12.
- the processing container 10 is sealed while the wafer W is accommodated in a substantially vertical posture.
- the open / close valve V2 is opened, and pure water adjusted to the treatment temperature is caused to flow from the pure water supply source 71 to the main supply pipeline 70.
- one of the switching on / off valves Va, Vb, Vc, Vd is opened to mix the chemical with pure water, and supply the mixed chemical to the supply member 42.
- the on-off valve V6 provided in the exhaust pipe 80 connected to the air vent 18 is opened, so that the chemical flow supplied into the processing container 10 is smooth. become.
- the supply member 42 shown in FIG. 5 positions the nozzle 43 on the lower side in the processing container 10.
- the supply member 42 is rotated or swung by the rotating device 50 to supply the mixed chemical solution to the wafer W in the processing container 10 while preventing the spray of the mixed chemical solution from splashing on the wafer W.
- the rotation drive device 20 shown in FIG. 6 slowly rotates the wafer W held by the holding device 30 around the rotation axis passing through the approximate center thereof.
- the liquid flow of the chemical liquid flows from the periphery of the wafer W toward the center, the chemical liquid uniformly contacts the entire surface of the wafer W, and liquid processing, for example, etching processing is performed.
- the rotating device 50 FIG. 7
- the peripheral portion can be further processed.
- the chemical solution supplied into the processing container 10 and used for the processing is drained from the drain port 17 via the drain line 78. Further, during the chemical solution processing, the switching valve V0 is switched, and the chemical solution is supplied into the gap 22 between the driven shaft 21 of the holding device 30 and the surrounding member 23 of the processing container 10. Can be prevented.
- the switching supply valve Va, Vb, Vc, or Vd is closed to stop the supply of the chemical.
- rinsing is performed by supplying only pure water from the supply member 42 to the wafer W in the processing container 10.
- the on-off valve V2 is closed and the on-off valve V3 is opened to supply pure water that is not temperature-controlled.
- the wafer W is rotated by the rotary drive device 20, so the pure water supplied from the rotating supply member 42 also flows in the central direction of the peripheral force of the wafer W, and is evenly distributed over the entire surface of the wafer W. The pure water comes into contact with the surface and is rinsed.
- the on-off valve V3 is closed, and the driving of the nose rotating device 50 is stopped to stop the supply of pure water.
- the open / close valves V8 and V4 are opened, and the pure water in the processing vessel 10 is discharged to the outside through the rapid drainage port 17A as well as the rapid drainage port 17A.
- a drying gas such as N gas or a mixed gas of N gas and IPA vapor is applied to the wafer W in the processing container 10 from the gas supply port 19. Then, the wafer W is dried.
- the switching valve V0 by switching the switching valve V0 and supplying the drying gas into the gap 22 from the liquid supply port 28, the droplets in the gap 22 are removed, and drying is promoted.
- the posture change 'moving mechanism 60 pulls the lid 11 away from the container main body 12 and takes out the wafer W held by the holding device 30 from the container main body 12 and converts it from a vertical posture to a horizontal posture. .
- the wafer W converted into the horizontal posture is received by the wafer holder 2b which is different from that at the time of loading, and then is accommodated in the empty carrier C by the wafer transfer arm 4, and is transferred to the next processing apparatus as necessary.
- an element for operating the moving mechanism 200 in the holding device 30A is incorporated in the driven shaft 21b so that the liquid processing apparatus can be reduced in size.
- the holding device 30A in this embodiment includes a double shaft 21A having a hollow driven shaft 21b and an operating shaft 21a disposed concentrically within the driven shaft 21b. I have.
- the operating shaft 21a and the driven shaft 21b are assembled with each other through a bearing 29 so as to be rotatable.
- the driven shaft 21b is connected to the base 31 of the holding device 30A and rotated by the rotary driving device 20 in the same manner as the driven shaft 21 of the first embodiment shown in FIGS.
- the holding device 30A includes an operation device that rotates the operating shaft 21a relative to the driven shaft 21b, and is configured to operate the moving mechanism 200 by the relative rotation of the operating shaft 21a.
- the moving mechanism 200 includes a rotating disc 201 fixed to one end of the operating shaft 21a, and a slider 204 coupled to each movable member 35 ( Fig. 10) and Each slider 204 has a radial direction relative to the base 31 (Fig. 9) via a guide 203. It is slidably mounted in the direction.
- a link 206 is provided to connect the base end portion 205 of each slider 204 and the outer peripheral portion 202 of the rotating disk 201.
- Each slider 204 is urged radially inward with respect to the rotation axis by a tension spring 207 (FIG. 10).
- each slider 204 can be moved radially inward Z outside the rotation axis via the link 206.
- each movable member 35 and holding member 32 can be moved radially outward Z outside (between the wafer holding position and the release position) with respect to the rotation axis.
- the rotating disk 201, the guide 203, the slider 204, the tension spring 207, and the link 206 (FIG. 10) constituting the moving mechanism 200 are housed in a fluid-tight manner inside the base 31, the movable member 35, and the telescopic member 34. ing.
- the enclosing member 23 is provided with a levitation electromagnet 24 and a positioning electromagnet 26 which are substantially the same as those of the first embodiment.
- a levitation permanent magnet 25a is embedded in a portion facing the electromagnet 24, and a positioning permanent magnet 25b is laid in a portion facing the electromagnet 26.
- the driven shaft 21b (double shaft 21A) can be rotated in a non-contact state with a gap between the surrounding member 23 and the rotation of the holding device 30. It is possible to suppress the generation of particles due to.
- the present invention can also be applied to a liquid processing apparatus that processes a single wafer W at a time.
- the present invention is not limited to this.
- direct delivery of wafer W to liquid processing equipment If the structure is performed in the processing container 10, the holding devices 30 and 30A can be attached to the container body 12.
- the substantially flat object to be processed is not limited to a wafer, but may be a glass substrate for LCD, a disk substrate, or the like.
- the present invention is not limited to this. That is, the present invention can be applied even when only one type of processing liquid is supplied. Further, the present invention can be applied more preferably as long as it can supply at least two types of processing liquids (first and second processing liquids).
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Weting (AREA)
Abstract
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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US11/665,847 US8201567B2 (en) | 2004-10-28 | 2005-10-27 | Liquid treating apparatus |
JP2006543259A JP4486649B2 (ja) | 2004-10-28 | 2005-10-27 | 液処理装置 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2004-313550 | 2004-10-28 | ||
JP2004313550 | 2004-10-28 |
Publications (1)
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WO2006046657A1 true WO2006046657A1 (ja) | 2006-05-04 |
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PCT/JP2005/019815 WO2006046657A1 (ja) | 2004-10-28 | 2005-10-27 | 液処理装置 |
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US (1) | US8201567B2 (ja) |
JP (1) | JP4486649B2 (ja) |
WO (1) | WO2006046657A1 (ja) |
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CN102871753B (zh) * | 2012-10-29 | 2014-10-08 | 温州市瓯海富顺家具制造厂 | 一种基于内部牙线进给的牙垢清洁装置 |
DE102015221646A1 (de) * | 2015-11-04 | 2017-05-04 | Gebr. Schmid Gmbh | Behandlungsfluid-Absaugvorrichtung und diese enthaltende Ätzvorrichtung |
JP2019164085A (ja) * | 2018-03-20 | 2019-09-26 | 株式会社東芝 | 分析装置 |
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DE69835988T2 (de) * | 1997-08-18 | 2007-06-21 | Tokyo Electron Ltd. | Doppelseitenreinigungsmaschine für ein Substrat |
US6374836B1 (en) * | 1997-10-22 | 2002-04-23 | Hitachi, Ltd. | Apparatus for treating plate type part with fluid |
JP3563605B2 (ja) * | 1998-03-16 | 2004-09-08 | 東京エレクトロン株式会社 | 処理装置 |
US6722964B2 (en) * | 2000-04-04 | 2004-04-20 | Ebara Corporation | Polishing apparatus and method |
US6776173B2 (en) | 2000-06-30 | 2004-08-17 | Tokyo Electron Limited | Liquid processing apparatus |
JP3808709B2 (ja) | 2000-07-19 | 2006-08-16 | 大日本スクリーン製造株式会社 | 基板処理装置 |
JP3874261B2 (ja) * | 2002-04-10 | 2007-01-31 | 大日本スクリーン製造株式会社 | 基板処理装置 |
-
2005
- 2005-10-27 WO PCT/JP2005/019815 patent/WO2006046657A1/ja active Application Filing
- 2005-10-27 US US11/665,847 patent/US8201567B2/en not_active Expired - Fee Related
- 2005-10-27 JP JP2006543259A patent/JP4486649B2/ja not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH09162152A (ja) * | 1995-12-13 | 1997-06-20 | Watanabe Shoko:Kk | 万能型洗浄装置 |
JPH10135172A (ja) * | 1996-10-31 | 1998-05-22 | Dainippon Screen Mfg Co Ltd | 基板処理装置 |
JP2004507068A (ja) * | 1999-04-27 | 2004-03-04 | ゲビュルダー デッカー ゲゼルシャフト ミット ベシュレンクテル ハフツング ウント コンパニー コマンディートゲゼルシャフト | シリコンウェハーを処理するための装置 |
JP2002016041A (ja) * | 2000-06-30 | 2002-01-18 | Tokyo Electron Ltd | 液処理装置 |
Also Published As
Publication number | Publication date |
---|---|
JP4486649B2 (ja) | 2010-06-23 |
US20090151756A1 (en) | 2009-06-18 |
US8201567B2 (en) | 2012-06-19 |
JPWO2006046657A1 (ja) | 2008-05-22 |
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