JP2004503750A - 自己保持型ばねプローブ - Google Patents

自己保持型ばねプローブ Download PDF

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Publication number
JP2004503750A
JP2004503750A JP2002509780A JP2002509780A JP2004503750A JP 2004503750 A JP2004503750 A JP 2004503750A JP 2002509780 A JP2002509780 A JP 2002509780A JP 2002509780 A JP2002509780 A JP 2002509780A JP 2004503750 A JP2004503750 A JP 2004503750A
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JP
Japan
Prior art keywords
spring
barrel
plunger
diameter
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002509780A
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English (en)
Japanese (ja)
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JP2004503750A5 (enExample
Inventor
ビンザー，ゴードン　エー．
シャビノー，スコット　ディー．
クリスプ，ブライアン　エル．
Original Assignee
デラウェア　キャピタル　フォーメーション　インコーポレイテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by デラウェア　キャピタル　フォーメーション　インコーポレイテッド filed Critical デラウェア　キャピタル　フォーメーション　インコーポレイテッド
Publication of JP2004503750A publication Critical patent/JP2004503750A/ja
Publication of JP2004503750A5 publication Critical patent/JP2004503750A5/ja
Pending legal-status Critical Current

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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06722—Spring-loaded
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06733—Geometry aspects

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Pens And Brushes (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2002509780A 2000-07-12 2001-07-05 自己保持型ばねプローブ Pending JP2004503750A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US09/614,422 US6462567B1 (en) 1999-02-18 2000-07-12 Self-retained spring probe
PCT/US2001/021531 WO2002004961A2 (en) 2000-07-12 2001-07-05 Self-retained spring probe

Publications (2)

Publication Number Publication Date
JP2004503750A true JP2004503750A (ja) 2004-02-05
JP2004503750A5 JP2004503750A5 (enExample) 2005-02-24

Family

ID=24461196

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002509780A Pending JP2004503750A (ja) 2000-07-12 2001-07-05 自己保持型ばねプローブ

Country Status (8)

Country Link
US (1) US6462567B1 (enExample)
EP (1) EP1299735B1 (enExample)
JP (1) JP2004503750A (enExample)
AT (1) ATE495451T1 (enExample)
AU (1) AU2001271911A1 (enExample)
DE (1) DE60143844D1 (enExample)
TW (1) TW514730B (enExample)
WO (1) WO2002004961A2 (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008298792A (ja) * 2008-07-25 2008-12-11 Japan Electronic Materials Corp プローブユニット
JP2009288156A (ja) * 2008-05-30 2009-12-10 Unitechno Inc 検査用ソケット
US7677901B1 (en) 2008-12-26 2010-03-16 Yamaichi Electronics Co., Ltd. Electric connecting apparatus for semiconductor devices and contact used therefor
WO2012067076A1 (ja) * 2010-11-15 2012-05-24 日本発條株式会社 接続端子
JP2012515423A (ja) * 2009-01-14 2012-07-05 マグ インスツルメント インコーポレーテッド 携帯照明装置
JP2014190786A (ja) * 2013-03-27 2014-10-06 Enplas Corp 電気接触子及び電気部品用ソケット
US9684031B2 (en) 2012-07-23 2017-06-20 Yamaichi Electronics Co., Ltd. Contact probe and semiconductor element socket provided with same
JP2020016620A (ja) * 2018-07-27 2020-01-30 株式会社エンプラス コンタクトピン及び電気部品用ソケット

Families Citing this family (35)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60126936T2 (de) * 2000-06-16 2007-06-14 NHK Spring Co., Ltd., Yokohama Mikrokontaktprüfnadel und elektrischer messfühler
US6331836B1 (en) * 2000-08-24 2001-12-18 Fast Location.Net, Llc Method and apparatus for rapidly estimating the doppler-error and other receiver frequency errors of global positioning system satellite signals weakened by obstructions in the signal path
EP1488245B1 (en) * 2002-03-05 2007-08-22 Rika Denshi America, Inc. Apparatus for interfacing electronic packages and test equipment
KR100584225B1 (ko) * 2004-10-06 2006-05-29 황동원 전자장치용 콘택트
US7626408B1 (en) 2005-02-03 2009-12-01 KK Technologies, Inc. Electrical spring probe
KR100687027B1 (ko) * 2005-02-22 2007-02-26 세크론 주식회사 프로브와 프로브 카드 구조 및 그 제조 방법
EP1889080A2 (en) * 2005-06-10 2008-02-20 Delaware Capital Formation, Inc. Electrical contact probe with compliant internal interconnect
US7154286B1 (en) * 2005-06-30 2006-12-26 Interconnect Devices, Inc. Dual tapered spring probe
SG131790A1 (en) * 2005-10-14 2007-05-28 Tan Yin Leong Probe for testing integrated circuit devices
US7545159B2 (en) * 2006-06-01 2009-06-09 Rika Denshi America, Inc. Electrical test probes with a contact element, methods of making and using the same
US20080036484A1 (en) * 2006-08-10 2008-02-14 Leeno Industrial Inc. Test probe and manufacturing method thereof
JP5713559B2 (ja) * 2007-04-27 2015-05-07 日本発條株式会社 導電性接触子
US7862391B2 (en) * 2007-09-18 2011-01-04 Delaware Capital Formation, Inc. Spring contact assembly
TW200918917A (en) * 2007-10-16 2009-05-01 Compal Electronics Inc Testing probe and electrical connection method using the same
US8410948B2 (en) * 2008-05-12 2013-04-02 John Vander Horst Recreational vehicle holding tank sensor probe
JP2010060527A (ja) * 2008-09-05 2010-03-18 Yokowo Co Ltd グランド用コンタクトプローブを有する検査ユニット
TWM354896U (en) * 2008-09-30 2009-04-11 Hon Hai Prec Ind Co Ltd Terminal of electrical connector
JP5361518B2 (ja) * 2009-04-27 2013-12-04 株式会社ヨコオ コンタクトプローブ及びソケット
US8710856B2 (en) * 2010-01-15 2014-04-29 LTX Credence Corporation Terminal for flat test probe
TWI421504B (zh) * 2010-07-02 2014-01-01 Isc Co Ltd 測試用的測試探針以及其製造方法
JP5782261B2 (ja) 2011-01-17 2015-09-24 株式会社ヨコオ ソケット
JP5982372B2 (ja) * 2011-07-19 2016-08-31 日本発條株式会社 接触構造体ユニット
TWI426275B (zh) * 2011-08-26 2014-02-11 Pegatron Corp 探針裝置
US9088083B2 (en) 2012-03-07 2015-07-21 Tyco Electronics Corporation Contacts for use with an electronic device
US8373430B1 (en) * 2012-05-06 2013-02-12 Jerzy Roman Sochor Low inductance contact probe with conductively coupled plungers
US9059545B2 (en) 2012-07-11 2015-06-16 Tyco Electronics Corporations Socket connectors and methods of assembling socket connectors
JP6107234B2 (ja) * 2013-03-01 2017-04-05 山一電機株式会社 検査用プローブ、および、それを備えるｉｃソケット
JP6231690B2 (ja) * 2014-08-08 2017-11-15 日本発條株式会社 接続端子
JP2017142080A (ja) * 2016-02-08 2017-08-17 日本電産リード株式会社 接触端子、検査治具、及び検査装置
JP6837283B2 (ja) 2016-02-29 2021-03-03 株式会社ヨコオ ソケット
JP6395327B2 (ja) * 2016-03-18 2018-09-26 株式会社ヨコオ スプリングコネクタ
JP6889067B2 (ja) * 2017-08-24 2021-06-18 株式会社日本マイクロニクス 電気的接続装置
JP7141796B2 (ja) * 2018-09-26 2022-09-26 株式会社エンプラス コンタクトピン及びソケット
KR102212346B1 (ko) * 2019-12-17 2021-02-04 주식회사 제네드 프로브 핀
USD1090440S1 (en) 2023-01-12 2025-08-26 Johnstech International Corporation Spring probe contact assembly

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1324053A (en) 1971-09-09 1973-07-18 Carr V Electrical contact probe
FR2224757A1 (en) 1973-04-03 1974-10-31 Cit Alcatel Probe for printed circuit boards - mounted on subsidiary board in desired spatial arrangement for testing
US4438397A (en) 1979-12-26 1984-03-20 Teradyne, Inc. Test pin
US4740746A (en) * 1984-11-13 1988-04-26 Tektronix, Inc. Controlled impedance microcircuit probe
DE3500227A1 (de) 1985-01-05 1986-07-10 Riba-Prüftechnik GmbH, 7801 Schallstadt Tastnadel
JPS6212875A (ja) 1985-07-10 1987-01-21 Mitsubishi Electric Corp デイジタル保護継電装置の試験装置
US4701700A (en) * 1985-12-02 1987-10-20 Jenkins Jack E Captivated, pre-loaded spring means for vacuum displaced circuit board testing
US4897043A (en) 1986-06-23 1990-01-30 Feinmetall Gmbh Resilient contact pin
US4935695A (en) * 1988-07-13 1990-06-19 Hewlett-Packard Company Board alignment system
US4904213A (en) 1989-04-06 1990-02-27 Motorola, Inc. Low impedance electric connector
US5174763A (en) 1990-06-11 1992-12-29 Itt Corporation Contact assembly
EP0462706A1 (en) 1990-06-11 1991-12-27 ITT INDUSTRIES, INC. (a Delaware corporation) Contact assembly
JP2532331B2 (ja) 1992-11-09 1996-09-11 日本発条株式会社 導電性接触子
EP0616394A1 (en) 1993-03-16 1994-09-21 Hewlett-Packard Company Method and system for producing electrically interconnected circuits
US5746606A (en) 1996-09-30 1998-05-05 Hughes Electronics Spring loaded contact device and rotary connector
DE69700120T2 (de) 1997-02-04 1999-10-28 Durtal S.A., Delemont Federkontaktelement
US6104205A (en) 1998-02-26 2000-08-15 Interconnect Devices, Inc. Probe with tab retainer
GB2351399B (en) 1999-02-18 2001-07-25 Capital Formation Inc Spring probe assemblies

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009288156A (ja) * 2008-05-30 2009-12-10 Unitechno Inc 検査用ソケット
JP2008298792A (ja) * 2008-07-25 2008-12-11 Japan Electronic Materials Corp プローブユニット
US7677901B1 (en) 2008-12-26 2010-03-16 Yamaichi Electronics Co., Ltd. Electric connecting apparatus for semiconductor devices and contact used therefor
JP2012515423A (ja) * 2009-01-14 2012-07-05 マグ インスツルメント インコーポレーテッド 携帯照明装置
JP5903049B2 (ja) * 2010-11-15 2016-04-13 日本発條株式会社 接続端子
WO2012067076A1 (ja) * 2010-11-15 2012-05-24 日本発條株式会社 接続端子
US9684031B2 (en) 2012-07-23 2017-06-20 Yamaichi Electronics Co., Ltd. Contact probe and semiconductor element socket provided with same
JP2014190786A (ja) * 2013-03-27 2014-10-06 Enplas Corp 電気接触子及び電気部品用ソケット
JP2020016620A (ja) * 2018-07-27 2020-01-30 株式会社エンプラス コンタクトピン及び電気部品用ソケット
WO2020022493A1 (ja) * 2018-07-27 2020-01-30 株式会社エンプラス コンタクトピン及び電気部品用ソケット
CN112470011A (zh) * 2018-07-27 2021-03-09 恩普乐股份有限公司 接触针及电子部件用插座
JP7096095B2 (ja) 2018-07-27 2022-07-05 株式会社エンプラス コンタクトピン及び電気部品用ソケット
CN112470011B (zh) * 2018-07-27 2023-08-25 恩普乐股份有限公司 接触针及电子部件用插座

Also Published As

Publication number Publication date
AU2001271911A1 (en) 2002-01-21
ATE495451T1 (de) 2011-01-15
DE60143844D1 (de) 2011-02-24
US6462567B1 (en) 2002-10-08
TW514730B (en) 2002-12-21
WO2002004961A2 (en) 2002-01-17
EP1299735A2 (en) 2003-04-09
HK1054984A1 (en) 2003-12-19
WO2002004961A3 (en) 2002-05-23
EP1299735B1 (en) 2011-01-12

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