JP2004343031A5 - - Google Patents
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- Publication number
- JP2004343031A5 JP2004343031A5 JP2003309332A JP2003309332A JP2004343031A5 JP 2004343031 A5 JP2004343031 A5 JP 2004343031A5 JP 2003309332 A JP2003309332 A JP 2003309332A JP 2003309332 A JP2003309332 A JP 2003309332A JP 2004343031 A5 JP2004343031 A5 JP 2004343031A5
- Authority
- JP
- Japan
- Prior art keywords
- dielectric film
- silicon
- plasma
- semiconductor device
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000010408 film Substances 0.000 claims description 187
- 239000000758 substrate Substances 0.000 claims description 124
- 239000007789 gas Substances 0.000 claims description 109
- 229910052710 silicon Inorganic materials 0.000 claims description 109
- 239000010703 silicon Substances 0.000 claims description 109
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 108
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 84
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 73
- 239000000203 mixture Substances 0.000 claims description 59
- 238000000034 method Methods 0.000 claims description 48
- 239000004065 semiconductor Substances 0.000 claims description 46
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 45
- 229910052760 oxygen Inorganic materials 0.000 claims description 44
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims description 42
- 239000001301 oxygen Substances 0.000 claims description 42
- 239000004033 plastic Substances 0.000 claims description 41
- 229920003023 plastic Polymers 0.000 claims description 41
- 239000011521 glass Substances 0.000 claims description 35
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 27
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 27
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 229910052757 nitrogen Inorganic materials 0.000 claims description 22
- 238000007254 oxidation reaction Methods 0.000 claims description 20
- 230000003647 oxidation Effects 0.000 claims description 19
- 238000004519 manufacturing process Methods 0.000 claims description 15
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 12
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical group [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims description 12
- 229910052743 krypton Inorganic materials 0.000 claims description 12
- 229910052724 xenon Inorganic materials 0.000 claims description 12
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 claims description 12
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims description 11
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 8
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 7
- 239000004697 Polyetherimide Substances 0.000 claims description 7
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 7
- 229920002530 polyetherether ketone Polymers 0.000 claims description 7
- 229920001601 polyetherimide Polymers 0.000 claims description 7
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 7
- 239000004695 Polyether sulfone Substances 0.000 claims description 6
- 229910021529 ammonia Inorganic materials 0.000 claims description 6
- 229910052786 argon Inorganic materials 0.000 claims description 6
- 229920006393 polyether sulfone Polymers 0.000 claims description 6
- -1 polyethylene naphthalate Polymers 0.000 claims description 6
- 239000009719 polyimide resin Substances 0.000 claims description 6
- 150000003377 silicon compounds Chemical class 0.000 claims description 6
- 229920001225 polyester resin Polymers 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims description 5
- 239000004645 polyester resin Substances 0.000 claims description 4
- 210000002381 plasma Anatomy 0.000 description 96
- 239000010410 layer Substances 0.000 description 86
- 238000006243 chemical reaction Methods 0.000 description 27
- 229910004298 SiO 2 Inorganic materials 0.000 description 15
- 125000004430 oxygen atom Chemical group O* 0.000 description 15
- 238000004458 analytical method Methods 0.000 description 11
- 235000012239 silicon dioxide Nutrition 0.000 description 10
- 239000010453 quartz Substances 0.000 description 9
- 239000013078 crystal Substances 0.000 description 8
- 230000007423 decrease Effects 0.000 description 7
- 230000007547 defect Effects 0.000 description 7
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 7
- 229910001882 dioxygen Inorganic materials 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 229910021417 amorphous silicon Inorganic materials 0.000 description 5
- 238000005259 measurement Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 5
- 238000004833 X-ray photoelectron spectroscopy Methods 0.000 description 4
- 125000004429 atom Chemical group 0.000 description 4
- 239000011247 coating layer Substances 0.000 description 4
- 150000004767 nitrides Chemical class 0.000 description 4
- 239000000523 sample Substances 0.000 description 4
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000005229 chemical vapour deposition Methods 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 239000011229 interlayer Substances 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000005121 nitriding Methods 0.000 description 2
- 239000012495 reaction gas Substances 0.000 description 2
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 230000003213 activating effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 238000001739 density measurement Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 238000005499 laser crystallization Methods 0.000 description 1
- 238000004949 mass spectrometry Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000000644 propagated effect Effects 0.000 description 1
- 150000003376 silicon Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003309332A JP2004343031A (ja) | 2002-12-03 | 2003-09-01 | 誘電体膜およびその形成方法ならびに誘電体膜を用いた半導体装置およびその製造方法 |
| TW092124712A TWI230969B (en) | 2002-12-03 | 2003-09-08 | Dielectric film, its formation method, semiconductor device using the dielectric film and its production method |
| KR10-2003-0066819A KR100527149B1 (ko) | 2002-12-03 | 2003-09-26 | 유전체 막 및 그 형성방법, 및 유전체 막을 이용한 반도체장치 및 그 제조방법 |
| CNB2003101143644A CN1312743C (zh) | 2002-12-03 | 2003-11-11 | 电介体膜及其形成方法，使用其的半导体装置及制造方法 |
| US10/726,870 US20040113227A1 (en) | 2002-12-03 | 2003-12-02 | Dielectric film, its formation method, semiconductor device using the dielectric film and its production method |
| US11/998,202 US20090029507A1 (en) | 2002-12-03 | 2007-11-28 | Dielectric film, its formation method, semiconductor device using the dielectric film and its production method |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002351167 | 2002-12-03 | ||
| JP2003121773 | 2003-04-25 | ||
| JP2003309332A JP2004343031A (ja) | 2002-12-03 | 2003-09-01 | 誘電体膜およびその形成方法ならびに誘電体膜を用いた半導体装置およびその製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2004343031A JP2004343031A (ja) | 2004-12-02 |
| JP2004343031A5 true JP2004343031A5 (https=) | 2006-09-28 |
Family
ID=32512115
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003309332A Abandoned JP2004343031A (ja) | 2002-12-03 | 2003-09-01 | 誘電体膜およびその形成方法ならびに誘電体膜を用いた半導体装置およびその製造方法 |
Country Status (5)
| Country | Link |
|---|---|
| US (2) | US20040113227A1 (https=) |
| JP (1) | JP2004343031A (https=) |
| KR (1) | KR100527149B1 (https=) |
| CN (1) | CN1312743C (https=) |
| TW (1) | TWI230969B (https=) |
Families Citing this family (28)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7763327B2 (en) * | 1996-04-22 | 2010-07-27 | Micron Technology, Inc. | Methods using ozone for CVD deposited films |
| US7273638B2 (en) * | 2003-01-07 | 2007-09-25 | International Business Machines Corp. | High density plasma oxidation |
| US7282438B1 (en) | 2004-06-15 | 2007-10-16 | Novellus Systems, Inc. | Low-k SiC copper diffusion barrier films |
| WO2006025363A1 (ja) * | 2004-08-31 | 2006-03-09 | Tokyo Electron Limited | シリコン酸化膜の形成方法、半導体装置の製造方法およびコンピュータ記憶媒体 |
| JP4028538B2 (ja) * | 2004-09-10 | 2007-12-26 | 株式会社東芝 | 半導体装置の製造方法およびその製造装置 |
| JP2006135161A (ja) * | 2004-11-08 | 2006-05-25 | Canon Inc | 絶縁膜の形成方法及び装置 |
| KR100648632B1 (ko) * | 2005-01-25 | 2006-11-23 | 삼성전자주식회사 | 높은 유전율을 갖는 유전체 구조물의 제조 방법 및 이를 포함하는 반도체 소자의 제조 방법 |
| JP5084169B2 (ja) * | 2005-04-28 | 2012-11-28 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US8138104B2 (en) * | 2005-05-26 | 2012-03-20 | Applied Materials, Inc. | Method to increase silicon nitride tensile stress using nitrogen plasma in-situ treatment and ex-situ UV cure |
| US8129290B2 (en) | 2005-05-26 | 2012-03-06 | Applied Materials, Inc. | Method to increase tensile stress of silicon nitride films using a post PECVD deposition UV cure |
| JP4679437B2 (ja) * | 2005-06-02 | 2011-04-27 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| US7820495B2 (en) * | 2005-06-30 | 2010-10-26 | Semiconductor Energy Laboratory Co., Ltd. | Method for manufacturing semiconductor device |
| JP2007043121A (ja) * | 2005-06-30 | 2007-02-15 | Semiconductor Energy Lab Co Ltd | 半導体装置の作製方法 |
| JP4897948B2 (ja) * | 2005-09-02 | 2012-03-14 | 古河電気工業株式会社 | 半導体素子 |
| KR20090115222A (ko) * | 2005-11-15 | 2009-11-04 | 가부시키가이샤 한도오따이 에네루기 켄큐쇼 | 반도체장치 제조방법 |
| JP2007250715A (ja) * | 2006-03-15 | 2007-09-27 | Konica Minolta Holdings Inc | 半導体デバイスの製造方法 |
| US7932138B2 (en) * | 2007-12-28 | 2011-04-26 | Viatron Technologies Inc. | Method for manufacturing thin film transistor |
| JP2010192755A (ja) * | 2009-02-19 | 2010-09-02 | Tokyo Electron Ltd | シリコン酸化膜の成膜方法および半導体装置の製造方法 |
| CN102239545A (zh) * | 2009-09-17 | 2011-11-09 | 东京毅力科创株式会社 | 成膜方法、半导体元件的制造方法、绝缘膜以及半导体元件 |
| JP5601821B2 (ja) * | 2009-11-11 | 2014-10-08 | 三菱電機株式会社 | 薄膜トランジスタおよびその製造方法 |
| KR101657341B1 (ko) * | 2011-04-25 | 2016-09-13 | 도쿄엘렉트론가부시키가이샤 | 성막 방법 |
| CN102260857B (zh) * | 2011-07-25 | 2013-02-06 | 润峰电力有限公司 | 一种晶硅表面镀膜及其制备方法 |
| JP5814712B2 (ja) * | 2011-09-15 | 2015-11-17 | 日本放送協会 | 薄膜デバイスの製造方法 |
| JP2013179106A (ja) * | 2012-02-28 | 2013-09-09 | Hitachi Ltd | Ｍｉｍキャパシタを有する半導体装置 |
| JP2013214655A (ja) * | 2012-04-03 | 2013-10-17 | Nippon Telegr & Teleph Corp <Ntt> | 光半導体素子 |
| US9018108B2 (en) | 2013-01-25 | 2015-04-28 | Applied Materials, Inc. | Low shrinkage dielectric films |
| US8975625B2 (en) * | 2013-05-14 | 2015-03-10 | Applied Materials, Inc. | TFT with insert in passivation layer or etch stop layer |
| KR102250116B1 (ko) | 2020-08-20 | 2021-05-11 | 쿠팡 주식회사 | 보냉 포장박스 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5274602A (en) * | 1991-10-22 | 1993-12-28 | Florida Atlantic University | Large capacity solid-state memory |
| JPH11279773A (ja) * | 1998-03-27 | 1999-10-12 | Tomoo Ueno | 成膜方法 |
| JP3698390B2 (ja) * | 1998-07-29 | 2005-09-21 | パイオニア株式会社 | 電子放出表示装置及び電子放出装置 |
| US6018187A (en) * | 1998-10-19 | 2000-01-25 | Hewlett-Packard Cmpany | Elevated pin diode active pixel sensor including a unique interconnection structure |
| US6218314B1 (en) * | 1999-04-01 | 2001-04-17 | Taiwan Semiconductor Manufacturing Company | Silicon dioxide-oxynitride continuity film as a passivation film |
| JP2001109014A (ja) * | 1999-10-05 | 2001-04-20 | Hitachi Ltd | アクティブマトリクス型液晶表示装置 |
| JP2001110802A (ja) * | 1999-10-06 | 2001-04-20 | Matsushita Electric Ind Co Ltd | 絶縁膜の形成方法 |
| US6288435B1 (en) * | 1999-12-28 | 2001-09-11 | Xerox Corporation | Continuous amorphous silicon layer sensors using doped poly-silicon back contact |
| US6613695B2 (en) * | 2000-11-24 | 2003-09-02 | Asm America, Inc. | Surface preparation prior to deposition |
| EP1378015A4 (en) * | 2001-04-10 | 2005-08-03 | Sarnoff Corp | METHOD AND DEVICE FOR PROVIDING AN ACTIVE MATRIX PIXEL WITH HIGH EFFICIENCY USING ORGANIC THIN FILM TRANSISTORS |
| TW588570B (en) * | 2001-06-18 | 2004-05-21 | Semiconductor Energy Lab | Light emitting device and method of fabricating the same |
-
2003
- 2003-09-01 JP JP2003309332A patent/JP2004343031A/ja not_active Abandoned
- 2003-09-08 TW TW092124712A patent/TWI230969B/zh not_active IP Right Cessation
- 2003-09-26 KR KR10-2003-0066819A patent/KR100527149B1/ko not_active Expired - Fee Related
- 2003-11-11 CN CNB2003101143644A patent/CN1312743C/zh not_active Expired - Fee Related
- 2003-12-02 US US10/726,870 patent/US20040113227A1/en not_active Abandoned
-
2007
- 2007-11-28 US US11/998,202 patent/US20090029507A1/en not_active Abandoned
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