JP2004336065A5 - - Google Patents

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Publication number
JP2004336065A5
JP2004336065A5 JP2004179692A JP2004179692A JP2004336065A5 JP 2004336065 A5 JP2004336065 A5 JP 2004336065A5 JP 2004179692 A JP2004179692 A JP 2004179692A JP 2004179692 A JP2004179692 A JP 2004179692A JP 2004336065 A5 JP2004336065 A5 JP 2004336065A5
Authority
JP
Japan
Prior art keywords
conductive film
integrated circuit
circuit device
semiconductor integrated
element formation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004179692A
Other languages
English (en)
Japanese (ja)
Other versions
JP4939735B2 (ja
JP2004336065A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004179692A priority Critical patent/JP4939735B2/ja
Priority claimed from JP2004179692A external-priority patent/JP4939735B2/ja
Publication of JP2004336065A publication Critical patent/JP2004336065A/ja
Publication of JP2004336065A5 publication Critical patent/JP2004336065A5/ja
Application granted granted Critical
Publication of JP4939735B2 publication Critical patent/JP4939735B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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JP2004179692A 2004-06-17 2004-06-17 半導体集積回路装置 Expired - Fee Related JP4939735B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004179692A JP4939735B2 (ja) 2004-06-17 2004-06-17 半導体集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004179692A JP4939735B2 (ja) 2004-06-17 2004-06-17 半導体集積回路装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2001263736A Division JP3597495B2 (ja) 2001-08-31 2001-08-31 半導体集積回路装置

Publications (3)

Publication Number Publication Date
JP2004336065A JP2004336065A (ja) 2004-11-25
JP2004336065A5 true JP2004336065A5 (enExample) 2008-10-02
JP4939735B2 JP4939735B2 (ja) 2012-05-30

Family

ID=33509327

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004179692A Expired - Fee Related JP4939735B2 (ja) 2004-06-17 2004-06-17 半導体集積回路装置

Country Status (1)

Country Link
JP (1) JP4939735B2 (enExample)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008218881A (ja) * 2007-03-07 2008-09-18 Nec Electronics Corp 半導体装置
KR101192359B1 (ko) 2007-12-17 2012-10-18 삼성전자주식회사 Ｎａｎｄ 플래시 메모리 소자 및 그 제조 방법

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02196462A (ja) * 1989-01-24 1990-08-03 Mitsubishi Electric Corp 半導体装置
JPH0997762A (ja) * 1995-07-26 1997-04-08 Toshiba Corp 半導体装置の製造方法
JPH1022480A (ja) * 1996-07-05 1998-01-23 Hitachi Ltd 不揮発性半導体記憶装置及びその製造方法
JP3110328B2 (ja) * 1996-11-19 2000-11-20 日本電気アイシーマイコンシステム株式会社 半導体記憶装置
JPH10242420A (ja) * 1997-02-27 1998-09-11 Toshiba Corp 半導体装置およびその製造方法
JP3519583B2 (ja) * 1997-09-19 2004-04-19 株式会社東芝 不揮発性半導体記憶装置およびその製造方法
JP2001332708A (ja) * 2000-05-19 2001-11-30 Nec Corp 不揮発性半導体記憶装置及びその製造方法

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