JP2004304003A - 処理システム - Google Patents
処理システム Download PDFInfo
- Publication number
- JP2004304003A JP2004304003A JP2003096111A JP2003096111A JP2004304003A JP 2004304003 A JP2004304003 A JP 2004304003A JP 2003096111 A JP2003096111 A JP 2003096111A JP 2003096111 A JP2003096111 A JP 2003096111A JP 2004304003 A JP2004304003 A JP 2004304003A
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- JP
- Japan
- Prior art keywords
- unit
- substrate
- processing
- transfer
- pass
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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- 238000012545 processing Methods 0.000 title claims abstract description 164
- 239000000758 substrate Substances 0.000 claims abstract description 201
- 238000000034 method Methods 0.000 claims abstract description 80
- 239000000872 buffer Substances 0.000 claims abstract description 73
- 238000010438 heat treatment Methods 0.000 claims abstract description 39
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 24
- 238000012546 transfer Methods 0.000 claims description 76
- 238000003860 storage Methods 0.000 claims description 14
- 238000001816 cooling Methods 0.000 abstract description 22
- 230000007246 mechanism Effects 0.000 abstract description 13
- 238000004140 cleaning Methods 0.000 description 44
- 238000000576 coating method Methods 0.000 description 34
- 239000011248 coating agent Substances 0.000 description 20
- 230000007723 transport mechanism Effects 0.000 description 17
- 238000011161 development Methods 0.000 description 8
- 230000002093 peripheral effect Effects 0.000 description 7
- 238000004042 decolorization Methods 0.000 description 5
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 5
- 238000001035 drying Methods 0.000 description 4
- 238000011282 treatment Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 230000018044 dehydration Effects 0.000 description 3
- 238000006297 dehydration reaction Methods 0.000 description 3
- 230000003111 delayed effect Effects 0.000 description 3
- 229910001873 dinitrogen Inorganic materials 0.000 description 3
- 230000002209 hydrophobic effect Effects 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000001680 brushing effect Effects 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000011143 downstream manufacturing Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 238000005111 flow chemistry technique Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000001174 ascending effect Effects 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 238000005108 dry cleaning Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002203 pretreatment Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
Images
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003096111A JP2004304003A (ja) | 2003-03-31 | 2003-03-31 | 処理システム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2003096111A JP2004304003A (ja) | 2003-03-31 | 2003-03-31 | 処理システム |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004304003A true JP2004304003A (ja) | 2004-10-28 |
JP2004304003A5 JP2004304003A5 (enrdf_load_stackoverflow) | 2005-07-28 |
Family
ID=33408272
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003096111A Pending JP2004304003A (ja) | 2003-03-31 | 2003-03-31 | 処理システム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2004304003A (enrdf_load_stackoverflow) |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008141134A (ja) * | 2006-12-05 | 2008-06-19 | Tokyo Electron Ltd | 塗布、現像装置及びその方法並びに記憶媒体 |
JP2008251736A (ja) * | 2007-03-29 | 2008-10-16 | Tokyo Electron Ltd | 基板処理装置及びその大気搬送ユニット |
KR100898395B1 (ko) * | 2007-09-28 | 2009-05-21 | 세메스 주식회사 | 기판 정렬 장치 및 방법 |
JP2009135293A (ja) * | 2007-11-30 | 2009-06-18 | Sokudo:Kk | 基板処理装置 |
CN102799082A (zh) * | 2012-09-06 | 2012-11-28 | 深圳市华星光电技术有限公司 | 一种烤箱和可调式烘烤系统 |
JP2013168676A (ja) * | 2013-05-17 | 2013-08-29 | Sokudo Co Ltd | 基板処理装置 |
JP2013214756A (ja) * | 2013-05-17 | 2013-10-17 | Sokudo Co Ltd | 基板処理装置 |
US9687874B2 (en) | 2007-11-30 | 2017-06-27 | Screen Semiconductor Solutions Co., Ltd. | Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units |
US10290521B2 (en) | 2007-06-29 | 2019-05-14 | Screen Semiconductor Solutions Co., Ltd. | Substrate treating apparatus with parallel gas supply pipes and a gas exhaust pipe |
US12217986B2 (en) | 2007-12-28 | 2025-02-04 | Screen Semiconductor Solutions Co., Ltd. | Substrate treating apparatus with parallel first and second parts of substrate treatment lines on multiple stories for simultaneously treating a plurality of substrates |
-
2003
- 2003-03-31 JP JP2003096111A patent/JP2004304003A/ja active Pending
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008141134A (ja) * | 2006-12-05 | 2008-06-19 | Tokyo Electron Ltd | 塗布、現像装置及びその方法並びに記憶媒体 |
JP2008251736A (ja) * | 2007-03-29 | 2008-10-16 | Tokyo Electron Ltd | 基板処理装置及びその大気搬送ユニット |
US10290521B2 (en) | 2007-06-29 | 2019-05-14 | Screen Semiconductor Solutions Co., Ltd. | Substrate treating apparatus with parallel gas supply pipes and a gas exhaust pipe |
KR100898395B1 (ko) * | 2007-09-28 | 2009-05-21 | 세메스 주식회사 | 기판 정렬 장치 및 방법 |
JP2009135293A (ja) * | 2007-11-30 | 2009-06-18 | Sokudo:Kk | 基板処理装置 |
US9687874B2 (en) | 2007-11-30 | 2017-06-27 | Screen Semiconductor Solutions Co., Ltd. | Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units |
US12217986B2 (en) | 2007-12-28 | 2025-02-04 | Screen Semiconductor Solutions Co., Ltd. | Substrate treating apparatus with parallel first and second parts of substrate treatment lines on multiple stories for simultaneously treating a plurality of substrates |
CN102799082A (zh) * | 2012-09-06 | 2012-11-28 | 深圳市华星光电技术有限公司 | 一种烤箱和可调式烘烤系统 |
JP2013168676A (ja) * | 2013-05-17 | 2013-08-29 | Sokudo Co Ltd | 基板処理装置 |
JP2013214756A (ja) * | 2013-05-17 | 2013-10-17 | Sokudo Co Ltd | 基板処理装置 |
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