JP2004304003A - 処理システム - Google Patents

処理システム Download PDF

Info

Publication number
JP2004304003A
JP2004304003A JP2003096111A JP2003096111A JP2004304003A JP 2004304003 A JP2004304003 A JP 2004304003A JP 2003096111 A JP2003096111 A JP 2003096111A JP 2003096111 A JP2003096111 A JP 2003096111A JP 2004304003 A JP2004304003 A JP 2004304003A
Authority
JP
Japan
Prior art keywords
unit
substrate
processing
transfer
pass
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003096111A
Other languages
English (en)
Japanese (ja)
Other versions
JP2004304003A5 (cg-RX-API-DMAC7.html
Inventor
Kenichi Tajiri
健一 田尻
Takahito Murakami
卓人 村上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2003096111A priority Critical patent/JP2004304003A/ja
Publication of JP2004304003A publication Critical patent/JP2004304003A/ja
Publication of JP2004304003A5 publication Critical patent/JP2004304003A5/ja
Pending legal-status Critical Current

Links

Images

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP2003096111A 2003-03-31 2003-03-31 処理システム Pending JP2004304003A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2003096111A JP2004304003A (ja) 2003-03-31 2003-03-31 処理システム

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003096111A JP2004304003A (ja) 2003-03-31 2003-03-31 処理システム

Publications (2)

Publication Number Publication Date
JP2004304003A true JP2004304003A (ja) 2004-10-28
JP2004304003A5 JP2004304003A5 (cg-RX-API-DMAC7.html) 2005-07-28

Family

ID=33408272

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003096111A Pending JP2004304003A (ja) 2003-03-31 2003-03-31 処理システム

Country Status (1)

Country Link
JP (1) JP2004304003A (cg-RX-API-DMAC7.html)

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008141134A (ja) * 2006-12-05 2008-06-19 Tokyo Electron Ltd 塗布、現像装置及びその方法並びに記憶媒体
JP2008251736A (ja) * 2007-03-29 2008-10-16 Tokyo Electron Ltd 基板処理装置及びその大気搬送ユニット
KR100898395B1 (ko) * 2007-09-28 2009-05-21 세메스 주식회사 기판 정렬 장치 및 방법
JP2009135293A (ja) * 2007-11-30 2009-06-18 Sokudo:Kk 基板処理装置
CN102799082A (zh) * 2012-09-06 2012-11-28 深圳市华星光电技术有限公司 一种烤箱和可调式烘烤系统
JP2013168676A (ja) * 2013-05-17 2013-08-29 Sokudo Co Ltd 基板処理装置
JP2013214756A (ja) * 2013-05-17 2013-10-17 Sokudo Co Ltd 基板処理装置
US9687874B2 (en) 2007-11-30 2017-06-27 Screen Semiconductor Solutions Co., Ltd. Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units
US10290521B2 (en) 2007-06-29 2019-05-14 Screen Semiconductor Solutions Co., Ltd. Substrate treating apparatus with parallel gas supply pipes and a gas exhaust pipe
US12217986B2 (en) 2007-12-28 2025-02-04 Screen Semiconductor Solutions Co., Ltd. Substrate treating apparatus with parallel first and second parts of substrate treatment lines on multiple stories for simultaneously treating a plurality of substrates

Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008141134A (ja) * 2006-12-05 2008-06-19 Tokyo Electron Ltd 塗布、現像装置及びその方法並びに記憶媒体
JP2008251736A (ja) * 2007-03-29 2008-10-16 Tokyo Electron Ltd 基板処理装置及びその大気搬送ユニット
US10290521B2 (en) 2007-06-29 2019-05-14 Screen Semiconductor Solutions Co., Ltd. Substrate treating apparatus with parallel gas supply pipes and a gas exhaust pipe
KR100898395B1 (ko) * 2007-09-28 2009-05-21 세메스 주식회사 기판 정렬 장치 및 방법
JP2009135293A (ja) * 2007-11-30 2009-06-18 Sokudo:Kk 基板処理装置
US9687874B2 (en) 2007-11-30 2017-06-27 Screen Semiconductor Solutions Co., Ltd. Multi-story substrate treating apparatus with flexible transport mechanisms and vertically divided treating units
US12217986B2 (en) 2007-12-28 2025-02-04 Screen Semiconductor Solutions Co., Ltd. Substrate treating apparatus with parallel first and second parts of substrate treatment lines on multiple stories for simultaneously treating a plurality of substrates
CN102799082A (zh) * 2012-09-06 2012-11-28 深圳市华星光电技术有限公司 一种烤箱和可调式烘烤系统
JP2013168676A (ja) * 2013-05-17 2013-08-29 Sokudo Co Ltd 基板処理装置
JP2013214756A (ja) * 2013-05-17 2013-10-17 Sokudo Co Ltd 基板処理装置

Similar Documents

Publication Publication Date Title
JP4954162B2 (ja) 処理システム
KR100575320B1 (ko) 기판처리장치
JP3445757B2 (ja) 基板処理装置及び基板処理方法
JP4908304B2 (ja) 基板の処理方法、基板の処理システム及びコンピュータ読み取り可能な記憶媒体
TW201824343A (zh) 基板處理裝置及基板處理方法
WO2006006364A1 (ja) 基板の回収方法及び基板処理装置
JP2004304003A (ja) 処理システム
JP3911624B2 (ja) 処理システム
JP2006344658A (ja) 基板処理システム及び基板処理方法
JP2005340425A (ja) 真空処理装置
JP4319175B2 (ja) 減圧乾燥装置
JP4378114B2 (ja) 処理システム
JP4083371B2 (ja) 基板処理装置
JP3624127B2 (ja) 基板処理装置
JP2003168713A5 (cg-RX-API-DMAC7.html)
KR100562839B1 (ko) 기판처리장치
JPH11274265A (ja) 基板処理装置
JP2007173365A (ja) 塗布乾燥処理システム及び塗布乾燥処理方法
JP2001023873A (ja) 基板処理装置
JP2001060610A (ja) 基板搬送装置、処理装置、基板の処理システム、搬送方法、収納装置および収容ボックス
JP2002324740A (ja) 処理装置
JP5920981B2 (ja) 基板処理システム
JPH11145055A (ja) 基板処理装置
JP2000150395A (ja) 処理システム
JP3605544B2 (ja) 処理装置および処理方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20041222

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20041222

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060808

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070306

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070426

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070717

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20071225