JP2004245827A - Tft基板検査装置用パレットおよびtft基板検査装置 - Google Patents
Tft基板検査装置用パレットおよびtft基板検査装置 Download PDFInfo
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- JP2004245827A JP2004245827A JP2004007063A JP2004007063A JP2004245827A JP 2004245827 A JP2004245827 A JP 2004245827A JP 2004007063 A JP2004007063 A JP 2004007063A JP 2004007063 A JP2004007063 A JP 2004007063A JP 2004245827 A JP2004245827 A JP 2004245827A
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- 239000000758 substrate Substances 0.000 title claims abstract description 279
- 238000007689 inspection Methods 0.000 title claims abstract description 106
- 238000010894 electron beam technology Methods 0.000 claims abstract description 27
- 230000001678 irradiating effect Effects 0.000 claims abstract description 7
- 239000000523 sample Substances 0.000 claims description 14
- 238000005192 partition Methods 0.000 claims description 11
- 230000032258 transport Effects 0.000 claims description 10
- 230000007246 mechanism Effects 0.000 claims description 9
- 239000012634 fragment Substances 0.000 abstract description 12
- 239000011521 glass Substances 0.000 description 20
- 238000000034 method Methods 0.000 description 16
- 239000004973 liquid crystal related substance Substances 0.000 description 8
- 238000010586 diagram Methods 0.000 description 6
- 238000003860 storage Methods 0.000 description 5
- 239000003990 capacitor Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000008901 benefit Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N23/00—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00
- G01N23/22—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material
- G01N23/225—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion
- G01N23/2251—Investigating or analysing materials by the use of wave or particle radiation, e.g. X-rays or neutrons, not covered by groups G01N3/00 – G01N17/00, G01N21/00 or G01N22/00 by measuring secondary emission from the material using electron or ion using incident electron beams, e.g. scanning electron microscopy [SEM]
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B61—RAILWAYS
- B61D—BODY DETAILS OR KINDS OF RAILWAY VEHICLES
- B61D17/00—Construction details of vehicle bodies
- B61D17/04—Construction details of vehicle bodies with bodies of metal; with composite, e.g. metal and wood body structures
- B61D17/06—End walls
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
- F16B5/02—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of fastening members using screw-thread
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B5/00—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them
- F16B5/04—Joining sheets or plates, e.g. panels, to one another or to strips or bars parallel to them by means of riveting
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09G—ARRANGEMENTS OR CIRCUITS FOR CONTROL OF INDICATING DEVICES USING STATIC MEANS TO PRESENT VARIABLE INFORMATION
- G09G3/00—Control arrangements or circuits, of interest only in connection with visual indicators other than cathode-ray tubes
- G09G3/006—Electronic inspection or testing of displays and display drivers, e.g. of LED or LCD displays
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- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Wood Science & Technology (AREA)
- Mechanical Engineering (AREA)
- Liquid Crystal (AREA)
- Testing Electric Properties And Detecting Electric Faults (AREA)
- Manufacture Of Electron Tubes, Discharge Lamp Vessels, Lead-In Wires, And The Like (AREA)
- Thin Film Transistor (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Analysing Materials By The Use Of Radiation (AREA)
- Tests Of Electronic Circuits (AREA)
Abstract
【解決手段】 TFT基板検査装置用パレットは、上面にTFT基板を保持するTFT基板保持部材と、TFT基板保持部材の上方から、TFT基板をTFT基板保持部材との間に介装して載置されるプローバとを有する。また、TFT基板検査装置は、チャンバ内を高真空状態にする排気装置と、TFT基板に電子線を照射する電子線発生源と、電子線発生源からの電子線の照射によりTFT基板から発生した二次電子を検出する電子検出器とを備えたチャンバと、その上面にTFT基板を保持するTFT基板保持部材と、保持部材の上方からTFT基板をTFT基板保持部材との間に介装して載置されるプローバとを備えたTFT基板検査装置用パレットとを備える。
【選択図】図1
Description
Claims (10)
- 上面にTFT基板を保持するTFT基板保持部材と、
前記TFT基板保持部材の上方から、前記TFT基板を前記TFT基板保持部材との間に介装して載置されるプローバとを備えることを特徴とするTFT基板検査装置用パレット。 - 前記TFT基板検査装置用パレットは、前記TFT基板保持部材の上面に、前記TFT基板を搬送する搬送手段が収容される凹溝を有することを特徴とする請求項1に記載のTFT基板検査装置用パレット。
- 前記TFT基板検査装置用パレットは、前記TFT基板が載置された際に、前記TFT基板保持部材上での前記TFT基板の位置を調整する位置アライメント機構を備えることを特徴とする請求項1又は2に記載のTFT基板検査装置用パレット。
- 前記TFT基板保持部材は、外部電源と接触する電極と、該電極からの電圧をプローバに印加する給電部と、前記電極と前記給電部とを接続するフレキシブルケーブルを備え、
前記プローバは、前記TFT基板保持部材の給電部と接触する電極と、該電極からの電圧を前記TFT基板に印加するプローブピンとを備え、
当該プローブピンは、プローバに絶縁部材を介して取り付けられることを特徴とする請求項1乃至3の何れか一つに記載のTFT基板検査装置用パレット。 - TFT基板に電子線を照射する電子線発生源と、前記電子線発生源からの電子線の照射により前記TFT基板から発生した二次電子を検出する電子検出器とを備えたチャンバと、
前記チャンバ内を高真空状態にする排気装置と、
上面に前記TFT基板を保持するTFT基板保持部材と、前記TFT基板保持部材の上方から前記TFT基板を前記TFT基板保持部材との間に介装して載置されるプローバとを備えたTFT基板検査装置用パレットとを備えることを特徴とするTFT基板検査装置。 - 前記TFT基板検査装置用パレットは、前記TFT基板保持部材の上面に前記TFT基板を搬送する搬送手段が収容される凹溝を有することを特徴とする請求項5に記載のTFT基板検査装置。
- 前記TFT基板検査装置用パレットは、前記TFT基板が載置された際に、前記TFT基板保持部材上での前記TFT基板の位置を調整する位置アライメント機構を備えることを特徴とする請求項5又は6に記載のTFT基板検査装置。
- 前記TFT基板検査装置用パレットにおいて、
前記TFT基板保持部材は、外部電源と接触する電極と、当該電極からの電圧をプローバに印加する給電部と、前記電極と前記給電部とを接続するフレキシブルケーブルを備え、
前記プローバは、前記TFT基板保持部材の給電部と接触する電極と、当該電極からの電圧を前記TFT基板に印加するプローブピンとを備えており、当該プローブピンは前記プローバに絶縁部材を介して接続されていることを特徴とする請求項5乃至7の何れか一つに記載のTFT基板検査装置。 - 前記チャンバは前記排気装置を備え、開閉可能な第一の隔壁を介して装置の外部と接続された予備チャンバと、前記電子線発生源と電子検出器を備えた本体チャンバから構成され、
前記予備チャンバと前記本体チャンバとは、開閉可能な第二の隔壁を介して接続され、
前記予備チャンバと前記本体チャンバとの間で前記TFT基板検査装置用パレットを搬送する搬送手段を有していることを特徴とする請求項5乃至8の何れか一つに記載のTFT基板検査装置。 - 前記予備チャンバは、一つの本体チャンバに対して少なくとも二つ以上設けられていることを特徴とする請求項9に記載のTFT基板検査装置。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US10/355,757 US6765203B1 (en) | 2003-01-31 | 2003-01-31 | Pallet assembly for substrate inspection device and substrate inspection device |
Publications (2)
Publication Number | Publication Date |
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JP2004245827A true JP2004245827A (ja) | 2004-09-02 |
JP4304719B2 JP4304719B2 (ja) | 2009-07-29 |
Family
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Application Number | Title | Priority Date | Filing Date |
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JP2004007063A Expired - Fee Related JP4304719B2 (ja) | 2003-01-31 | 2004-01-14 | Tft基板検査装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US6765203B1 (ja) |
JP (1) | JP4304719B2 (ja) |
KR (1) | KR100588366B1 (ja) |
TW (1) | TWI249036B (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008058767A (ja) * | 2006-09-01 | 2008-03-13 | Shimadzu Corp | Tftアレイの検査方法及びtftアレイ検査装置 |
WO2008087698A1 (ja) * | 2007-01-15 | 2008-07-24 | Shimadzu Corporation | Tftアレイ駆動装置 |
CN109738789A (zh) * | 2019-01-02 | 2019-05-10 | 大族激光科技产业集团股份有限公司 | 飞针测试机测试方法、装置、飞针测试机及存储介质 |
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DE10227332A1 (de) * | 2002-06-19 | 2004-01-15 | Akt Electron Beam Technology Gmbh | Ansteuervorrichtung mit verbesserten Testeneigenschaften |
JP4062527B2 (ja) * | 2003-05-09 | 2008-03-19 | 株式会社島津製作所 | Tftアレイ検査装置 |
JP4685336B2 (ja) * | 2003-06-06 | 2011-05-18 | 株式会社島津製作所 | Tftアレイ検査装置 |
US6833717B1 (en) * | 2004-02-12 | 2004-12-21 | Applied Materials, Inc. | Electron beam test system with integrated substrate transfer module |
US7355418B2 (en) * | 2004-02-12 | 2008-04-08 | Applied Materials, Inc. | Configurable prober for TFT LCD array test |
US20060038554A1 (en) * | 2004-02-12 | 2006-02-23 | Applied Materials, Inc. | Electron beam test system stage |
US7319335B2 (en) * | 2004-02-12 | 2008-01-15 | Applied Materials, Inc. | Configurable prober for TFT LCD array testing |
JP4241421B2 (ja) * | 2004-02-17 | 2009-03-18 | 株式会社島津製作所 | 液晶基板検査装置 |
US7075323B2 (en) * | 2004-07-29 | 2006-07-11 | Applied Materials, Inc. | Large substrate test system |
US7256606B2 (en) * | 2004-08-03 | 2007-08-14 | Applied Materials, Inc. | Method for testing pixels for LCD TFT displays |
KR100633091B1 (ko) * | 2005-01-31 | 2006-10-12 | 삼성전자주식회사 | 박막 트랜지스터 기판의 검사장치 |
US7535238B2 (en) * | 2005-04-29 | 2009-05-19 | Applied Materials, Inc. | In-line electron beam test system |
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US7602199B2 (en) * | 2006-05-31 | 2009-10-13 | Applied Materials, Inc. | Mini-prober for TFT-LCD testing |
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2003
- 2003-01-31 US US10/355,757 patent/US6765203B1/en not_active Expired - Fee Related
-
2004
- 2004-01-14 TW TW093100900A patent/TWI249036B/zh not_active IP Right Cessation
- 2004-01-14 KR KR1020040002567A patent/KR100588366B1/ko not_active IP Right Cessation
- 2004-01-14 JP JP2004007063A patent/JP4304719B2/ja not_active Expired - Fee Related
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008058767A (ja) * | 2006-09-01 | 2008-03-13 | Shimadzu Corp | Tftアレイの検査方法及びtftアレイ検査装置 |
WO2008087698A1 (ja) * | 2007-01-15 | 2008-07-24 | Shimadzu Corporation | Tftアレイ駆動装置 |
JPWO2008087698A1 (ja) * | 2007-01-15 | 2010-05-06 | 株式会社島津製作所 | Tftアレイ駆動装置 |
CN109738789A (zh) * | 2019-01-02 | 2019-05-10 | 大族激光科技产业集团股份有限公司 | 飞针测试机测试方法、装置、飞针测试机及存储介质 |
CN109738789B (zh) * | 2019-01-02 | 2021-09-21 | 深圳市大族数控科技股份有限公司 | 飞针测试机测试方法、装置、飞针测试机及存储介质 |
Also Published As
Publication number | Publication date |
---|---|
TWI249036B (en) | 2006-02-11 |
KR20040069987A (ko) | 2004-08-06 |
JP4304719B2 (ja) | 2009-07-29 |
TW200426373A (en) | 2004-12-01 |
US6765203B1 (en) | 2004-07-20 |
KR100588366B1 (ko) | 2006-06-09 |
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