JP2004228602A5 - - Google Patents

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Publication number
JP2004228602A5
JP2004228602A5 JP2004127699A JP2004127699A JP2004228602A5 JP 2004228602 A5 JP2004228602 A5 JP 2004228602A5 JP 2004127699 A JP2004127699 A JP 2004127699A JP 2004127699 A JP2004127699 A JP 2004127699A JP 2004228602 A5 JP2004228602 A5 JP 2004228602A5
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JP
Japan
Prior art keywords
process gas
reaction chamber
substrate
supply pipe
supply
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2004127699A
Other languages
English (en)
Japanese (ja)
Other versions
JP4695343B2 (ja
JP2004228602A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2004127699A priority Critical patent/JP4695343B2/ja
Priority claimed from JP2004127699A external-priority patent/JP4695343B2/ja
Publication of JP2004228602A publication Critical patent/JP2004228602A/ja
Publication of JP2004228602A5 publication Critical patent/JP2004228602A5/ja
Application granted granted Critical
Publication of JP4695343B2 publication Critical patent/JP4695343B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2004127699A 2002-04-11 2004-04-23 縦型半導体製造装置 Expired - Lifetime JP4695343B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2004127699A JP4695343B2 (ja) 2002-04-11 2004-04-23 縦型半導体製造装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2002109130 2002-04-11
JP2002109130 2002-04-11
JP2004127699A JP4695343B2 (ja) 2002-04-11 2004-04-23 縦型半導体製造装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2003107067A Division JP3947126B2 (ja) 2002-04-11 2003-04-10 半導体製造装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2010206362A Division JP5283673B2 (ja) 2002-04-11 2010-09-15 半導体装置の製造方法、成膜方法および基板処理装置

Publications (3)

Publication Number Publication Date
JP2004228602A JP2004228602A (ja) 2004-08-12
JP2004228602A5 true JP2004228602A5 (enExample) 2006-05-25
JP4695343B2 JP4695343B2 (ja) 2011-06-08

Family

ID=32910730

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004127699A Expired - Lifetime JP4695343B2 (ja) 2002-04-11 2004-04-23 縦型半導体製造装置

Country Status (1)

Country Link
JP (1) JP4695343B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101032006A (zh) * 2005-02-17 2007-09-05 株式会社日立国际电气 半导体器件的制造方法以及衬底处理装置
KR20100069629A (ko) * 2007-10-22 2010-06-24 나노마테리얼 레버러토리 코., 엘티디. 반도체 제조 장치, 반도체 제조 방법 및 전자 기기
JP5886531B2 (ja) 2011-02-24 2016-03-16 東京エレクトロン株式会社 成膜方法および成膜装置
JP5920242B2 (ja) 2012-06-02 2016-05-18 東京エレクトロン株式会社 成膜方法及び成膜装置
JP2015073020A (ja) * 2013-10-03 2015-04-16 三井造船株式会社 原子層堆積装置および原子層堆積方法

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6511539B1 (en) * 1999-09-08 2003-01-28 Asm America, Inc. Apparatus and method for growth of a thin film
WO2001099166A1 (en) * 2000-06-08 2001-12-27 Genitech Inc. Thin film forming method

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