JP2009094115A5 - - Google Patents

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Publication number
JP2009094115A5
JP2009094115A5 JP2007260569A JP2007260569A JP2009094115A5 JP 2009094115 A5 JP2009094115 A5 JP 2009094115A5 JP 2007260569 A JP2007260569 A JP 2007260569A JP 2007260569 A JP2007260569 A JP 2007260569A JP 2009094115 A5 JP2009094115 A5 JP 2009094115A5
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JP
Japan
Prior art keywords
removal step
substrate
gas containing
processing chamber
plasma
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007260569A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009094115A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2007260569A priority Critical patent/JP2009094115A/ja
Priority claimed from JP2007260569A external-priority patent/JP2009094115A/ja
Priority to US12/230,676 priority patent/US20090093124A1/en
Priority to KR1020080087264A priority patent/KR101014811B1/ko
Publication of JP2009094115A publication Critical patent/JP2009094115A/ja
Publication of JP2009094115A5 publication Critical patent/JP2009094115A5/ja
Pending legal-status Critical Current

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JP2007260569A 2007-10-04 2007-10-04 半導体装置の製造方法 Pending JP2009094115A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2007260569A JP2009094115A (ja) 2007-10-04 2007-10-04 半導体装置の製造方法
US12/230,676 US20090093124A1 (en) 2007-10-04 2008-09-03 Method of manufacturing semiconductor device
KR1020080087264A KR101014811B1 (ko) 2007-10-04 2008-09-04 반도체 장치의 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007260569A JP2009094115A (ja) 2007-10-04 2007-10-04 半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JP2009094115A JP2009094115A (ja) 2009-04-30
JP2009094115A5 true JP2009094115A5 (enExample) 2010-11-18

Family

ID=40523638

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007260569A Pending JP2009094115A (ja) 2007-10-04 2007-10-04 半導体装置の製造方法

Country Status (3)

Country Link
US (1) US20090093124A1 (enExample)
JP (1) JP2009094115A (enExample)
KR (1) KR101014811B1 (enExample)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8193096B2 (en) 2004-12-13 2012-06-05 Novellus Systems, Inc. High dose implantation strip (HDIS) in H2 base chemistry
JP2009164365A (ja) * 2008-01-08 2009-07-23 Hitachi Kokusai Electric Inc 半導体装置の製造方法及び基板処理装置
US8844793B2 (en) * 2010-11-05 2014-09-30 Raytheon Company Reducing formation of oxide on solder
JP6060242B2 (ja) * 2010-11-30 2017-01-11 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及びバッフル構造
JP5837793B2 (ja) 2010-11-30 2015-12-24 株式会社日立国際電気 基板処理装置、半導体装置の製造方法及び基板処理装置のバッフル構造
US9613825B2 (en) * 2011-08-26 2017-04-04 Novellus Systems, Inc. Photoresist strip processes for improved device integrity
CN102522358B (zh) * 2011-12-30 2016-04-06 上海集成电路研发中心有限公司 半导体硅片的去胶工艺腔及去胶方法
CN102496592B (zh) * 2011-12-30 2016-04-06 上海集成电路研发中心有限公司 半导体硅片的去胶工艺腔及去胶方法
KR200495358Y1 (ko) 2020-09-21 2022-05-06 조남규 구조자 보호용 구명기구

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05160022A (ja) * 1991-12-09 1993-06-25 Mitsubishi Electric Corp 半導体装置の製造方法
US5811358A (en) * 1997-01-03 1998-09-22 Mosel Vitelic Inc. Low temperature dry process for stripping photoresist after high dose ion implantation
JP3728165B2 (ja) * 1999-01-28 2005-12-21 キヤノン株式会社 イオン注入されたホトレジストの残渣の処理方法及び半導体装置の製造方法
JP2001308078A (ja) * 2000-02-15 2001-11-02 Canon Inc 有機物除去方法、半導体装置の製造方法及び有機物除去装置並びにシステム
US20010027023A1 (en) * 2000-02-15 2001-10-04 Shigenori Ishihara Organic substance removing methods, methods of producing semiconductor device, and organic substance removing apparatuses
US20070186953A1 (en) * 2004-07-12 2007-08-16 Savas Stephen E Systems and Methods for Photoresist Strip and Residue Treatment in Integrated Circuit Manufacturing
US20080009127A1 (en) * 2006-07-04 2008-01-10 Hynix Semiconductor Inc. Method of removing photoresist

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