JP2004228566A - 集積された受動部品を有する回路キャリアの製造方法 - Google Patents
集積された受動部品を有する回路キャリアの製造方法 Download PDFInfo
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- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
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- H05K3/46—Manufacturing multilayer circuits
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Abstract
【解決手段】 本発明は、回路キャリアと、該回路キャリアに集積されており電気的活性材を備えた少なくとも一つの受動部品とを備えた電気的サブアセンブリの製造方法に関する。本発明の方法は、前記受動部品のために少なくとも一つの凹部を形成した回路キャリアを構築する工程と、前記回路キャリアの凹部に電気的活性材を生の状態で導入する工程と、エネルギーを供給することにより前記電気的活性材を生の状態から最終状態へと変換する工程とを備え、一方で迅速かつ安価な製造を保障し、他方で関連する電気的活性材の選択において高い自由度を可能にする。
【選択図】 図6
Description
また、本発明の製造方法において、前記エネルギーは熱供給により供給されることが好ましい。
また、本発明の製造方法において、前記受動部品が、電気的活性材として誘電体を有するコンデンサであることが好ましい。
また、本発明の製造方法において、前記受動部品が抵抗であり、前記電気的活性材は生の状態では所与の比抵抗を有するペーストであることが好ましい。
また、本発明の製造方法において、前記回路キャリアの凹部に該電気的活性材を生の状態で導入する工程が、ペーストを塗りつけることを含むことが好ましい。
また、本発明の製造方法において、前記回路キャリアの凹部に該電気的活性材を生の状態で導入する工程が、ペーストを圧着することを含むことが好ましい。
また、本発明の製造方法において、前記電気的活性材と電気的に接触する少なくとも一つの導体トラック構造を形成する工程を有することが好ましい。
また、本発明の製造方法において、該回路キャリアを構築する工程が、機械加工により凹部を形成することを含むことが好ましい。
また、本発明の製造方法において、前記回路キャリアを構築する工程が、少なくとも一つの第1の層を形成することと、開口部が配置された少なくとも一つの第2の層を形成することと、前記凹部が前記開口部により形成されるように前記第1と第2の層を接合させて前記回路キャリアを得ることと、を含むことが好ましい。
また、本発明の製造方法において、前記第1と第2の層がセラミック製であり、前記接合工程が前記セラミックの圧着と焼成を含むことが好ましい。
また、本発明の製造方法において、前記第1の層を電気絶縁材料で成し、前記第2の層をメタル配線により形成することが好ましい。
また、本発明の製造方法において、前記受動部品を露出するために前記第2の層の少なくも一部を除去する工程を含むことが好ましい。
Claims (13)
- 回路キャリアおよび該回路キャリアに集積されてかつ電気的活性材を含んでいる少なくとも一つの受動部品を有する、電気的サブアセンブリの製造方法であって、
前記受動部品のために作られる少なくとも一つの凹部を設けて該回路キャリアを構築する工程と、
前記回路キャリアの凹部に前記電気的活性材を生の状態で導入する工程と、
エネルギーを供給して前記電気的活性材を前記生の状態から最終状態に変換する工程とを有する電気的サブアセンブリの製造方法。 - 前記エネルギーは機械的加圧により供給される、請求項1に記載の電気的サブアセンブリの製造方法。
- 前記エネルギーは熱供給により供給される、請求項1に記載の電気的サブアセンブリの製造方法。
- 前記受動部品が、電気的活性材として誘電体を有するコンデンサである、請求項1に記載の電気的サブアセンブリの製造方法。
- 前記受動部品が抵抗であり、前記電気的活性材は生の状態では所与の比抵抗を有するペーストである、請求項1に記載の電気的サブアセンブリの製造方法。
- 前記回路キャリアの凹部に前記電気的活性材を生の状態で導入する工程が、ペーストを塗りつけることを含む、請求項1に記載の電気的サブアセンブリの製造方法。
- 前記回路キャリアの凹部に前記電気的活性材を生の状態で導入する工程が、ペーストを圧着することを含む、請求項1に記載の電気的サブアセンブリの製造方法。
- 前記電気的活性材と電気的に接触する少なくとも一つの導体トラック構造を形成する工程を有する、請求項1に記載の電気的サブアセンブリの製造方法。
- 前記回路キャリアを構築する工程が、機械加工により凹部を形成することを含む、請求項1に記載の電気的サブアセンブリの製造方法。
- 前記回路キャリアを構築する工程が、
少なくとも一つの第1の層を形成することと、
開口部が配置された少なくとも一つの第2の層を形成することと、
前記凹部が前記開口部により形成されるように前記第1と第2の層を接合させて前記回路キャリアを得ることと、を含む請求項1に記載の電気的サブアセンブリの製造方法。 - 前記第1と第2の層がセラミック製であり、前記接合工程が前記セラミックの圧着と焼成を含む、請求項10に記載の電気的サブアセンブリの製造方法。
- 前記第1の層を電気絶縁材料で成し、前記第2の層をメタル配線により形成する、請求項10に記載の電気的サブアセンブリの製造方法。
- 前記受動部品を露出するために前記第2の層の少なくも一部を除去する工程を含む、請求項12に記載の電気的サブアセンブリの製造方法。
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DE10302104A DE10302104A1 (de) | 2003-01-21 | 2003-01-21 | Verfahren zum Herstellen von Schaltungsträgern mit intergrierten passiven Bauelementen |
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EP (1) | EP1445795B1 (ja) |
JP (1) | JP2004228566A (ja) |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2006196608A (ja) * | 2005-01-12 | 2006-07-27 | Fujikura Ltd | 回路配線基板及びその製造方法 |
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EP1480500B1 (de) * | 2003-05-16 | 2007-05-16 | Friwo Mobile Power GmbH | Leistungsversorgungsschaltung mit dreidimensional angeordneten Schaltungsträgern sowie Herstellungsverfahren |
US20060087394A1 (en) * | 2004-09-30 | 2006-04-27 | Yves Baeyens | Area efficient inductors |
JP4818888B2 (ja) * | 2006-11-20 | 2011-11-16 | 日本メクトロン株式会社 | 抵抗素子を内蔵するプリント配線板の製造法 |
US10062838B2 (en) | 2015-03-31 | 2018-08-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Co-fired passive integrated circuit devices |
US10418181B2 (en) | 2016-04-20 | 2019-09-17 | Eulex Components Inc | Single layer capacitors |
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JPH08228064A (ja) * | 1994-12-22 | 1996-09-03 | Kanto Kasei Kogyo Kk | プリント回路基板 |
JPH0992983A (ja) * | 1995-07-17 | 1997-04-04 | Sumitomo Kinzoku Electro Device:Kk | セラミック多層基板の製造方法 |
JPH09116247A (ja) * | 1995-10-16 | 1997-05-02 | Oki Purintetsudo Circuit Kk | コンデンサー内蔵ビルドアップ型プリント配線基板の製造方法及びそのプリント配線基板並びにこの基板へのコンデンサーの実装構造 |
JPH09214090A (ja) * | 1996-01-31 | 1997-08-15 | Sony Corp | プリント配線板およびその製造方法 |
DE19627543B9 (de) * | 1996-05-18 | 2004-10-14 | Thomas Hofmann | Multi-Layer-Substrat sowie Verfahren zu seiner Herstellung |
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US20010001406A1 (en) * | 1998-02-17 | 2001-05-24 | Michael James Liberatore | Method of making transmission lines and buried passive components in green tape |
JP4136112B2 (ja) * | 1998-09-18 | 2008-08-20 | 株式会社小森コーポレーション | 枚葉印刷機のシート状物案内装置 |
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-
2003
- 2003-01-21 DE DE10302104A patent/DE10302104A1/de not_active Withdrawn
- 2003-12-08 US US10/730,374 patent/US20040139589A1/en not_active Abandoned
- 2003-12-26 JP JP2003434684A patent/JP2004228566A/ja active Pending
-
2004
- 2004-01-21 DE DE502004012432T patent/DE502004012432D1/de not_active Expired - Lifetime
- 2004-01-21 AT AT04001264T patent/ATE507709T1/de active
- 2004-01-21 EP EP04001264A patent/EP1445795B1/de not_active Expired - Lifetime
- 2004-01-21 DK DK04001264.3T patent/DK1445795T3/da active
-
2006
- 2006-11-17 US US11/561,261 patent/US20070077687A1/en not_active Abandoned
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006196608A (ja) * | 2005-01-12 | 2006-07-27 | Fujikura Ltd | 回路配線基板及びその製造方法 |
JP4616016B2 (ja) * | 2005-01-12 | 2011-01-19 | 株式会社フジクラ | 回路配線基板の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
ATE507709T1 (de) | 2011-05-15 |
DK1445795T3 (da) | 2011-08-01 |
US20040139589A1 (en) | 2004-07-22 |
US20070077687A1 (en) | 2007-04-05 |
DE502004012432D1 (de) | 2011-06-09 |
EP1445795B1 (de) | 2011-04-27 |
EP1445795A3 (de) | 2008-10-22 |
DE10302104A1 (de) | 2004-08-05 |
EP1445795A2 (de) | 2004-08-11 |
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