JP2004214617A - 金属−絶縁体−金属キャパシターの製造方法 - Google Patents
金属−絶縁体−金属キャパシターの製造方法 Download PDFInfo
- Publication number
- JP2004214617A JP2004214617A JP2003376689A JP2003376689A JP2004214617A JP 2004214617 A JP2004214617 A JP 2004214617A JP 2003376689 A JP2003376689 A JP 2003376689A JP 2003376689 A JP2003376689 A JP 2003376689A JP 2004214617 A JP2004214617 A JP 2004214617A
- Authority
- JP
- Japan
- Prior art keywords
- metal
- upper electrode
- film
- nitride
- forming
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 100
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 77
- 239000002184 metal Substances 0.000 title claims abstract description 77
- 238000000034 method Methods 0.000 title claims abstract description 71
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 49
- 239000007789 gas Substances 0.000 claims abstract description 64
- 239000010949 copper Substances 0.000 claims abstract description 52
- 229910052802 copper Inorganic materials 0.000 claims abstract description 48
- 229920000642 polymer Polymers 0.000 claims abstract description 48
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 47
- NBVXSUQYWXRMNV-UHFFFAOYSA-N fluoromethane Chemical compound FC NBVXSUQYWXRMNV-UHFFFAOYSA-N 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 230000015572 biosynthetic process Effects 0.000 claims abstract description 8
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 claims abstract description 6
- 229910001882 dioxygen Inorganic materials 0.000 claims abstract description 6
- 238000005530 etching Methods 0.000 claims description 21
- 239000004065 semiconductor Substances 0.000 claims description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 18
- MZLGASXMSKOWSE-UHFFFAOYSA-N tantalum nitride Chemical compound [Ta]#N MZLGASXMSKOWSE-UHFFFAOYSA-N 0.000 claims description 17
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 16
- 150000004767 nitrides Chemical class 0.000 claims description 16
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 15
- 239000010936 titanium Substances 0.000 claims description 14
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 11
- 238000004380 ashing Methods 0.000 claims description 11
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 claims description 11
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- BPUBBGLMJRNUCC-UHFFFAOYSA-N oxygen(2-);tantalum(5+) Chemical compound [O-2].[O-2].[O-2].[O-2].[O-2].[Ta+5].[Ta+5] BPUBBGLMJRNUCC-UHFFFAOYSA-N 0.000 claims description 10
- 229910052715 tantalum Inorganic materials 0.000 claims description 10
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 claims description 10
- 229910001936 tantalum oxide Inorganic materials 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 8
- 239000000460 chlorine Substances 0.000 claims description 8
- 229910052757 nitrogen Inorganic materials 0.000 claims description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 8
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 claims description 7
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 claims description 7
- 229910052801 chlorine Inorganic materials 0.000 claims description 7
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229910052707 ruthenium Inorganic materials 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 6
- FAQYAMRNWDIXMY-UHFFFAOYSA-N trichloroborane Chemical compound ClB(Cl)Cl FAQYAMRNWDIXMY-UHFFFAOYSA-N 0.000 claims description 6
- 230000009977 dual effect Effects 0.000 claims description 5
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 claims description 4
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052582 BN Inorganic materials 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 3
- 229910052799 carbon Inorganic materials 0.000 claims description 3
- 229910010271 silicon carbide Inorganic materials 0.000 claims description 3
- 239000010408 film Substances 0.000 abstract description 84
- 239000010409 thin film Substances 0.000 abstract description 30
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract description 13
- 239000001301 oxygen Substances 0.000 abstract description 13
- 229910052760 oxygen Inorganic materials 0.000 abstract description 13
- 230000003647 oxidation Effects 0.000 abstract description 9
- 238000007254 oxidation reaction Methods 0.000 abstract description 9
- 239000000203 mixture Substances 0.000 abstract description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 26
- 239000010410 layer Substances 0.000 description 25
- 238000000635 electron micrograph Methods 0.000 description 8
- 238000004140 cleaning Methods 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 4
- 150000002736 metal compounds Chemical class 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 238000005498 polishing Methods 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 238000009713 electroplating Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- 239000010703 silicon Substances 0.000 description 3
- 229910052814 silicon oxide Inorganic materials 0.000 description 3
- TXEYQDLBPFQVAA-UHFFFAOYSA-N tetrafluoromethane Chemical compound FC(F)(F)F TXEYQDLBPFQVAA-UHFFFAOYSA-N 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- -1 copper halogen compounds Chemical class 0.000 description 2
- 238000001312 dry etching Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000004528 spin coating Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229910020776 SixNy Inorganic materials 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 239000005380 borophosphosilicate glass Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical class 0.000 description 1
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003609 titanium compounds Chemical class 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02057—Cleaning during device manufacture
- H01L21/02068—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers
- H01L21/02071—Cleaning during device manufacture during, before or after processing of conductive layers, e.g. polysilicon or amorphous silicon layers the processing being a delineation, e.g. RIE, of conductive layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
- H01L21/321—After treatment
- H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
- H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
- H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
- H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L28/00—Passive two-terminal components without a potential-jump or surface barrier for integrated circuits; Details thereof; Multistep manufacturing processes therefor
- H01L28/40—Capacitors
- H01L28/60—Electrodes
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Drying Of Semiconductors (AREA)
Abstract
【解決手段】 基板上に銅からなる金属配線を形成した後、金属配線上に誘電膜を形成する。前記誘電膜上に上部電極膜を形成し、上部電極膜を食刻して上部電極を形成した後、前記上部電極を形成する間に発生する金属性ハードポリマーを酸素ガス及びフッ化炭素系ガスを含む混合ガスを使用して除去する。MIMキャパシターを構成する各薄膜の特性を考慮して酸素及びフッ化炭素系ガスを含む混合ガスで最適の温度範囲で上部電極を形成する間に発生された金属性ハードポリマーを除去してMIMキャパシターを構成する薄膜のリフティング現象を防止し、MIMキャパシター製造工程の収率を向上させることができる。また、混合ガス内のフッ化炭素系ガスの組成を適切に調節して誘電膜の損傷を防止し、下部電極の酸化を遮断してMIMキャパシターが均一なキャパシタンスを有するようになる。
【選択図】 図9
Description
105、205 絶縁膜、
110、220 金属配線、
115、230 誘電膜、
120、235 上部電極膜、
125、240 フォトレジストパターン、
130、245 上部電極、
135 金属性ハードポリマー、
140、250 MIMキャパシター、
225 コンタクト。
Claims (20)
- 基板上に銅からなる金属配線を形成する段階と、
前記金属配線上に誘電膜を形成する段階と、
前記誘電膜上に上部電極膜を形成する段階と、
前記上部電極膜を食刻して上部電極を形成する段階と、
前記上部電極を形成する間に発生する金属性ハードポリマーを除去する段階と、を含む金属−絶縁体−金属キャパシターの製造方法。 - 前記誘電膜は窒化珪素または窒化ホウ素を含む窒化物または炭化珪素を含む炭化物からなることを特徴とする請求項1記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記誘電膜は窒化珪素または窒化ホウ素を含む窒化物からなる窒化膜または炭化珪素を含む炭化物からなる炭化膜上に酸化膜が積層された多層構造を有することを特徴とする請求項1記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記上部電極膜はタンタル、窒化タンタル、チタン、窒化チタン、ルテニウム及び白金で構成されたグループのうち選択されたいずれかを含むことを特徴とする請求項1記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記上部電極膜は塩素、窒素及び塩化ホウ素を含む食刻ガスを使用して食刻されることを特徴とする請求項4記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記金属性ハードポリマーは酸化タンタル、窒化タンタル、酸化チタンまたは窒化チタンを含むことを特徴とする請求項5記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記金属性ハードポリマーは酸素ガス及びフッ化炭素系ガスを含む混合ガスを使用して除去されることを特徴とする請求項6記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記混合ガス中のフッ化炭素系ガスの流量は2%以下であることを特徴とする請求項7記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記フッ化炭素系ガスはCF4、C2F6、C3F8、C4F6及びC5F8からなるグループの中で選択されたいずれかひとつ以上を含むことを特徴とする請求項7記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記金属性ハードポリマーを除去する段階は前記半導体基板を150〜250℃の温度で20〜40秒間加熱を実施することを特徴とする請求項1記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記半導体基板は食刻装置の加熱プレートまたはアッシング装置の加熱プレートを使用して加熱されることを特徴とする請求項10記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記半導体基板はランプを使用して加熱することを特徴とする請求項10記載の金属−絶縁体−金属キャパシターの製造方法。
- デュアルダマシン工程を適用して金属−絶縁体−金属キャパシターを製造する工程において、半導体基板上に絶縁膜を形成する段階と、
前記絶縁膜にバイアホール及びトレンチを形成する段階と、
前記バイアホール及びトレンチにそれぞれ銅からなるコンタクト及び金属配線を形成する段階と、
前記金属配線が形成された絶縁膜上に誘電膜を形成する段階と、
前記誘電膜上に上部電極膜を形成する段階と、
前記上部電極膜を食刻して上部電極を形成する段階と、
前記上部電極を形成する間に発生する金属性ハードポリマーを除去する段階と、を含む金属−絶縁体−金属キャパシターの製造方法。 - 前記上部電極膜はタンタル、窒化タンタル、チタン、窒化チタン、ルテニウム及び白金で構成されたグループの中で選択されたいずれかからなり、前記上部電極膜は塩素、窒素及び塩化ホウ素を含む食刻ガスを使用して食刻されることを特徴とする請求項13記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記金属性ハードポリマーは酸化タンタル、窒化タンタル、酸化チタンまたは窒化チタンを含むことを特徴とする請求項14記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記金属性ハードポリマーは酸素ガス及びCF4、C2F6、C3F8、C4F6及びC5F8で構成されたグループの中で選択されたいずれかひとつ以上を含むフッ化炭素系ガスを含む混合ガスを使用して除去されることを特徴とする請求項15記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記混合ガス中のフッ化炭素系ガスの流量は2%以下であることを特徴とする請求項16記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記金属性ハードポリマーを除去する段階は前記半導体基板を150〜250℃の温度で20〜40秒間加熱が実施されることを特徴とする請求項13記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記半導体基板はランプを使用して加熱されることを特徴とする請求項18記載の金属−絶縁体−金属キャパシターの製造方法。
- 前記半導体基板は加熱プレートを使用して加熱されることを特徴とする請求項18記載の金属−絶縁体−金属キャパシターの製造方法。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2002-0070235A KR100466310B1 (ko) | 2002-11-13 | 2002-11-13 | 금속-절연체-금속 커패시터의 제조 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2004214617A true JP2004214617A (ja) | 2004-07-29 |
Family
ID=31713191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003376689A Pending JP2004214617A (ja) | 2002-11-13 | 2003-11-06 | 金属−絶縁体−金属キャパシターの製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US6699749B1 (ja) |
JP (1) | JP2004214617A (ja) |
KR (1) | KR100466310B1 (ja) |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20040245602A1 (en) * | 2003-05-21 | 2004-12-09 | Kim Sun Jung | Method of fabricating metal-insulator-metal capacitor (MIM) using lanthanide-doped HfO2 |
KR100695484B1 (ko) * | 2004-01-13 | 2007-03-15 | 주식회사 하이닉스반도체 | 반도체 소자의 콘택 형성 방법 |
US7271083B2 (en) * | 2004-07-22 | 2007-09-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | One-transistor random access memory technology compatible with metal gate process |
CN100359664C (zh) * | 2004-11-26 | 2008-01-02 | 上海华虹Nec电子有限公司 | 一种金属电容的刻蚀方法 |
KR100968646B1 (ko) * | 2007-12-28 | 2010-07-06 | 매그나칩 반도체 유한회사 | 반도체 수동 소자의 제조 방법 |
US8274777B2 (en) | 2008-04-08 | 2012-09-25 | Micron Technology, Inc. | High aspect ratio openings |
US7745280B2 (en) * | 2008-05-29 | 2010-06-29 | United Microelectronics Corp. | Metal-insulator-metal capacitor structure |
KR101616555B1 (ko) * | 2009-07-13 | 2016-04-29 | 삼성전자주식회사 | 반도체 장치의 금속 배선 형성 방법 |
US9142607B2 (en) | 2012-02-23 | 2015-09-22 | Freescale Semiconductor, Inc. | Metal-insulator-metal capacitor |
KR102030797B1 (ko) | 2012-03-30 | 2019-11-11 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 제조 방법 |
TW201834075A (zh) * | 2017-03-01 | 2018-09-16 | 力晶科技股份有限公司 30078 新竹科學工業園區力行一路12號 | 金屬絕緣體金屬元件的製造方法 |
US11251261B2 (en) * | 2019-05-17 | 2022-02-15 | Micron Technology, Inc. | Forming a barrier material on an electrode |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3189892B2 (ja) * | 1998-09-17 | 2001-07-16 | 日本電気株式会社 | 半導体基板の洗浄方法及び洗浄液 |
JP3159257B2 (ja) * | 1998-12-07 | 2001-04-23 | 日本電気株式会社 | 半導体装置の製造方法 |
JP3177973B2 (ja) * | 1999-01-28 | 2001-06-18 | 日本電気株式会社 | 半導体装置の製造方法 |
US6498364B1 (en) * | 2000-01-21 | 2002-12-24 | Agere Systems Inc. | Capacitor for integration with copper damascene processes |
US6451664B1 (en) * | 2001-01-30 | 2002-09-17 | Infineon Technologies Ag | Method of making a MIM capacitor with self-passivating plates |
US6458650B1 (en) * | 2001-07-20 | 2002-10-01 | Taiwan Semiconductor Manufacturing Company | CU second electrode process with in situ ashing and oxidation process |
KR100532409B1 (ko) * | 2001-08-14 | 2005-11-30 | 삼성전자주식회사 | 유전체막과 상부 전극 계면에서의 누설 전류 특성이개선된 반도체 소자의 커패시터 형성 방법 |
-
2002
- 2002-11-13 KR KR10-2002-0070235A patent/KR100466310B1/ko not_active IP Right Cessation
-
2003
- 2003-05-05 US US10/429,321 patent/US6699749B1/en not_active Expired - Fee Related
- 2003-11-06 JP JP2003376689A patent/JP2004214617A/ja active Pending
Also Published As
Publication number | Publication date |
---|---|
KR100466310B1 (ko) | 2005-01-14 |
US6699749B1 (en) | 2004-03-02 |
KR20040042093A (ko) | 2004-05-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TW586130B (en) | Metal-insulator-metal (MIM) capacitor structure and methods of fabricating same | |
KR100468069B1 (ko) | 인터레벨 금속 접속을 위한 자기-정렬 금속 캡 | |
JP2000106396A (ja) | 半導体装置の製造方法 | |
TW200828404A (en) | Semiconductor component and method of manufacture | |
JP2007221161A (ja) | 半導体デバイスで用いられるキャパシタとその製造方法 | |
CN100403512C (zh) | 具有低电阻值的铜-阻障层镶嵌内连线结构及其制作方法 | |
JP2005340808A (ja) | 半導体装置のバリア構造 | |
JP2004214617A (ja) | 金属−絶縁体−金属キャパシターの製造方法 | |
KR101842903B1 (ko) | 에어 갭 상호연결 구조의 형성 방법 | |
US20110291235A1 (en) | Copper interconnection structure with mim capacitor and a manufacturing method thereof | |
US20220310513A1 (en) | Semiconductor device manufacturing method | |
JP2004214663A (ja) | 金属電極を有するキャパシター製造方法 | |
TW550747B (en) | Semiconductor device and method for fabricating the same | |
TW569384B (en) | Method of manufacturing semiconductor device | |
TW200945491A (en) | Method for fabricating a semiconductor device | |
JP2008016464A (ja) | 半導体装置及び半導体装置の製造方法 | |
TW200415797A (en) | Capacitor in an interconnect system and method of manufacturing thereof | |
KR20040077421A (ko) | 반도체 장치의 금속배선 형성 방법 | |
KR100571696B1 (ko) | 반도체 소자의 제조 방법 | |
JP2003031665A (ja) | 半導体装置の製造方法 | |
KR100476707B1 (ko) | 반도체 소자의 제조 방법 | |
KR100568449B1 (ko) | 반도체 소자의 배선 형성방법 | |
KR20040074769A (ko) | 금속-절연체-금속 커패시터의 제조 방법 | |
KR100624926B1 (ko) | 반도체 소자의 캐패시터 제조 방법 | |
TW480666B (en) | Method to prevent corrosion of metal interconnect |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20050407 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070227 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070523 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070731 |
|
A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20080205 |