JP2004176032A5 - - Google Patents
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- Publication number
- JP2004176032A5 JP2004176032A5 JP2003026332A JP2003026332A JP2004176032A5 JP 2004176032 A5 JP2004176032 A5 JP 2004176032A5 JP 2003026332 A JP2003026332 A JP 2003026332A JP 2003026332 A JP2003026332 A JP 2003026332A JP 2004176032 A5 JP2004176032 A5 JP 2004176032A5
- Authority
- JP
- Japan
- Prior art keywords
- resin composition
- expansion coefficient
- temperature
- resin
- linear expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 claims 53
- 230000009477 glass transition Effects 0.000 claims 20
- 239000011347 resin Substances 0.000 claims 16
- 229920005989 resin Polymers 0.000 claims 16
- 229920005992 thermoplastic resin Polymers 0.000 claims 6
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 claims 5
- 150000002484 inorganic compounds Chemical class 0.000 claims 4
- 229910010272 inorganic material Inorganic materials 0.000 claims 4
- 229920001955 polyphenylene ether Polymers 0.000 claims 4
- 238000010521 absorption reaction Methods 0.000 claims 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims 2
- 239000012776 electronic material Substances 0.000 claims 2
- -1 ether ketone Chemical class 0.000 claims 2
- 239000000463 material Substances 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 230000003287 optical effect Effects 0.000 claims 2
- 229920006259 thermoplastic polyimide Polymers 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000013032 Hydrocarbon resin Substances 0.000 claims 1
- 239000004693 Polybenzimidazole Substances 0.000 claims 1
- 239000004697 Polyetherimide Substances 0.000 claims 1
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 125000002723 alicyclic group Chemical group 0.000 claims 1
- 125000004432 carbon atom Chemical group C* 0.000 claims 1
- 239000011889 copper foil Substances 0.000 claims 1
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 claims 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims 1
- KWLMIXQRALPRBC-UHFFFAOYSA-L hectorite Chemical compound [Li+].[OH-].[OH-].[Na+].[Mg+2].O1[Si]2([O-])O[Si]1([O-])O[Si]([O-])(O1)O[Si]1([O-])O2 KWLMIXQRALPRBC-UHFFFAOYSA-L 0.000 claims 1
- 229910000271 hectorite Inorganic materials 0.000 claims 1
- 229920006270 hydrocarbon resin Polymers 0.000 claims 1
- 239000011229 interlayer Substances 0.000 claims 1
- 239000010410 layer Substances 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000000691 measurement method Methods 0.000 claims 1
- 239000010445 mica Substances 0.000 claims 1
- 229910052618 mica group Inorganic materials 0.000 claims 1
- 229910052901 montmorillonite Inorganic materials 0.000 claims 1
- 239000012299 nitrogen atmosphere Substances 0.000 claims 1
- 229920003055 poly(ester-imide) Polymers 0.000 claims 1
- 229920002480 polybenzimidazole Polymers 0.000 claims 1
- 229920001601 polyetherimide Polymers 0.000 claims 1
- 239000009719 polyimide resin Substances 0.000 claims 1
- 229920005990 polystyrene resin Polymers 0.000 claims 1
- 239000000377 silicon dioxide Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 claims 1
- 230000008961 swelling Effects 0.000 claims 1
- 229920001169 thermoplastic Polymers 0.000 claims 1
- 239000004416 thermosoftening plastic Substances 0.000 claims 1
- 239000010455 vermiculite Substances 0.000 claims 1
- 229910052902 vermiculite Inorganic materials 0.000 claims 1
- 235000019354 vermiculite Nutrition 0.000 claims 1
- 239000013585 weight reducing agent Substances 0.000 claims 1
- 238000004736 wide-angle X-ray diffraction Methods 0.000 claims 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003026332A JP4167909B2 (ja) | 2002-02-06 | 2003-02-03 | 樹脂組成物 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002029783 | 2002-02-06 | ||
| JP2002139090 | 2002-05-14 | ||
| JP2002158210 | 2002-05-30 | ||
| JP2002287005 | 2002-09-30 | ||
| JP2003026332A JP4167909B2 (ja) | 2002-02-06 | 2003-02-03 | 樹脂組成物 |
Related Child Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2005244645A Division JP5010124B2 (ja) | 2002-02-06 | 2005-08-25 | 熱可塑性樹脂組成物、シート、樹脂付き銅箔、プリント基板及びプリプレグ |
| JP2006147192A Division JP2006312745A (ja) | 2002-02-06 | 2006-05-26 | 樹脂組成物 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004176032A JP2004176032A (ja) | 2004-06-24 |
| JP2004176032A5 true JP2004176032A5 (enrdf_load_stackoverflow) | 2005-09-22 |
| JP4167909B2 JP4167909B2 (ja) | 2008-10-22 |
Family
ID=32719576
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003026332A Expired - Fee Related JP4167909B2 (ja) | 2002-02-06 | 2003-02-03 | 樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4167909B2 (enrdf_load_stackoverflow) |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4369134B2 (ja) * | 2003-01-31 | 2009-11-18 | 株式会社フジクラ | 基板及び成形品 |
| KR101079552B1 (ko) * | 2004-06-25 | 2011-11-04 | 스미또모 가가꾸 가부시끼가이샤 | 플렉시블 디스플레이용 기판 |
| JP4830365B2 (ja) * | 2004-06-25 | 2011-12-07 | 住友化学株式会社 | フレキシブルディスプレイ用基板 |
| JP4534094B2 (ja) * | 2004-07-12 | 2010-09-01 | オンキヨー株式会社 | スピーカー振動板およびその製造方法 |
| EP1898240B1 (en) * | 2005-06-21 | 2013-05-01 | Zeon Corporation | Protective film for polarizing plate |
| JP4693615B2 (ja) * | 2005-12-13 | 2011-06-01 | 積水化学工業株式会社 | 鉄骨用耐火被覆シート |
| JP2007211182A (ja) * | 2006-02-10 | 2007-08-23 | Kyocera Chemical Corp | 樹脂組成物、プリプレグ、積層板、金属張積層板およびプリント配線板 |
| WO2009107558A1 (ja) * | 2008-02-26 | 2009-09-03 | 電気化学工業株式会社 | プローブの検査方法及び硬化性樹脂組成物 |
| JP2010129964A (ja) * | 2008-12-01 | 2010-06-10 | Kurabo Ind Ltd | フレキシブルプリント配線板補強用シート及びそれを用いたフレキシブルプリント配線板 |
| JP5919989B2 (ja) * | 2011-04-19 | 2016-05-18 | 宇部興産株式会社 | ポリイミド前駆体組成物、並びにそれを用いた電極合剤ペースト、電極および塗料 |
| JP7344789B2 (ja) * | 2019-12-26 | 2023-09-14 | 信越ポリマー株式会社 | 高周波回路基板及びその製造方法 |
| JPWO2021182598A1 (enrdf_load_stackoverflow) * | 2020-03-13 | 2021-09-16 | ||
| JP7584837B2 (ja) * | 2020-08-21 | 2024-11-18 | エルジー・ケム・リミテッド | ポリイミド又はその前駆体を含む組成物及びその硬化物、硬化物を含むポリイミドフィルム、ポリイミドフィルムを備える積層体、並びに積層体を備えるデバイス |
| JP2023039829A (ja) * | 2021-09-09 | 2023-03-22 | 日東電工株式会社 | 電子部品仮固定用粘着シート |
| JP7617563B2 (ja) * | 2021-10-27 | 2025-01-20 | 信越ポリマー株式会社 | 樹脂フィルム、銅張積層板、及び回路基板 |
| TW202518952A (zh) * | 2023-07-12 | 2025-05-01 | 日商電化股份有限公司 | 積層體、電路基板及電路基板之製造方法 |
-
2003
- 2003-02-03 JP JP2003026332A patent/JP4167909B2/ja not_active Expired - Fee Related
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