JP2004126508A5 - - Google Patents
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- Publication number
- JP2004126508A5 JP2004126508A5 JP2003105231A JP2003105231A JP2004126508A5 JP 2004126508 A5 JP2004126508 A5 JP 2004126508A5 JP 2003105231 A JP2003105231 A JP 2003105231A JP 2003105231 A JP2003105231 A JP 2003105231A JP 2004126508 A5 JP2004126508 A5 JP 2004126508A5
- Authority
- JP
- Japan
- Prior art keywords
- photosensitive composition
- layer
- semiconductor wafer
- composition
- binder polymer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US37187302P | 2002-04-11 | 2002-04-11 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004126508A JP2004126508A (ja) | 2004-04-22 |
| JP2004126508A5 true JP2004126508A5 (enExample) | 2005-09-15 |
| JP4224851B2 JP4224851B2 (ja) | 2009-02-18 |
Family
ID=28454879
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003105231A Expired - Lifetime JP4224851B2 (ja) | 2002-04-11 | 2003-04-09 | メッキ法 |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US7344970B2 (enExample) |
| EP (1) | EP1353228B1 (enExample) |
| JP (1) | JP4224851B2 (enExample) |
| KR (1) | KR100943677B1 (enExample) |
| CN (1) | CN100343758C (enExample) |
| SG (2) | SG111989A1 (enExample) |
| TW (1) | TWI236049B (enExample) |
Families Citing this family (26)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4699140B2 (ja) * | 2005-08-29 | 2011-06-08 | 東京応化工業株式会社 | パターン形成方法 |
| EP1783548B1 (en) * | 2005-11-08 | 2017-03-08 | Rohm and Haas Electronic Materials LLC | Method of forming a patterned layer on a substrate |
| US20100151118A1 (en) * | 2008-12-17 | 2010-06-17 | Eastman Chemical Company | Carrier solvent compositions, coatings compositions, and methods to produce thick polymer coatings |
| JP6133056B2 (ja) * | 2012-12-27 | 2017-05-24 | ローム・アンド・ハース電子材料株式会社 | スズまたはスズ合金めっき液 |
| US9017934B2 (en) | 2013-03-08 | 2015-04-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist defect reduction system and method |
| US9354521B2 (en) | 2013-03-12 | 2016-05-31 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist system and method |
| US9175173B2 (en) | 2013-03-12 | 2015-11-03 | Taiwan Semiconductor Manufacturing Company, Ltd. | Unlocking layer and method |
| US8932799B2 (en) * | 2013-03-12 | 2015-01-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist system and method |
| US9543147B2 (en) | 2013-03-12 | 2017-01-10 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist and method of manufacture |
| US9110376B2 (en) | 2013-03-12 | 2015-08-18 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist system and method |
| US9256128B2 (en) | 2013-03-12 | 2016-02-09 | Taiwan Semiconductor Manufacturing Company, Ltd. | Method for manufacturing semiconductor device |
| US9502231B2 (en) | 2013-03-12 | 2016-11-22 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist layer and method |
| US9245751B2 (en) | 2013-03-12 | 2016-01-26 | Taiwan Semiconductor Manufacturing Company, Ltd. | Anti-reflective layer and method |
| US9117881B2 (en) | 2013-03-15 | 2015-08-25 | Taiwan Semiconductor Manufacturing Company, Ltd. | Conductive line system and process |
| JP6059071B2 (ja) * | 2013-04-23 | 2017-01-11 | 東京応化工業株式会社 | 被膜形成方法 |
| US9341945B2 (en) | 2013-08-22 | 2016-05-17 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist and method of formation and use |
| US10036953B2 (en) | 2013-11-08 | 2018-07-31 | Taiwan Semiconductor Manufacturing Company | Photoresist system and method |
| US10095113B2 (en) | 2013-12-06 | 2018-10-09 | Taiwan Semiconductor Manufacturing Company | Photoresist and method |
| US9761449B2 (en) | 2013-12-30 | 2017-09-12 | Taiwan Semiconductor Manufacturing Company, Ltd. | Gap filling materials and methods |
| US9599896B2 (en) | 2014-03-14 | 2017-03-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist system and method |
| US9581908B2 (en) | 2014-05-16 | 2017-02-28 | Taiwan Semiconductor Manufacturing Company, Ltd. | Photoresist and method |
| US10568483B2 (en) * | 2014-12-12 | 2020-02-25 | Irobot Corporation | Cleaning system for autonomous robot |
| KR101598826B1 (ko) * | 2015-08-28 | 2016-03-03 | 영창케미칼 주식회사 | 에칭 내성이 우수한 i-선용 네가티브형 포토레지스트 조성물 |
| KR101757543B1 (ko) | 2015-09-07 | 2017-07-13 | 오병서 | 천장등 고정방법 및 그 구조 |
| CN110760896A (zh) * | 2018-07-26 | 2020-02-07 | 苏州苏大维格科技集团股份有限公司 | 一种工作版的防皱电铸工艺 |
| US12353129B2 (en) * | 2021-12-27 | 2025-07-08 | Nanya Technology Corporation | Method for preparing semiconductor device structure including bevel etching process |
Family Cites Families (32)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| NL101499C (enExample) | 1951-08-20 | |||
| US2875047A (en) | 1955-01-19 | 1959-02-24 | Oster Gerald | Photopolymerization with the formation of coherent plastic masses |
| US2850445A (en) | 1955-01-19 | 1958-09-02 | Oster Gerald | Photopolymerization |
| US3074974A (en) | 1957-12-06 | 1963-01-22 | Monsanto Chemicals | Method for the preparation of diglycidyl ether of tetrachlorobisphenol-a |
| US3097097A (en) | 1959-02-12 | 1963-07-09 | Gisela K Oster | Photo degrading of gel systems and photographic production of reliefs therewith |
| NL254306A (enExample) | 1959-08-07 | |||
| GB1090142A (en) | 1965-02-26 | 1967-11-08 | Agfa Gevaert Nv | Photochemical insolubilisation of polymers |
| US3479185A (en) | 1965-06-03 | 1969-11-18 | Du Pont | Photopolymerizable compositions and layers containing 2,4,5-triphenylimidazoyl dimers |
| US3549367A (en) | 1968-05-24 | 1970-12-22 | Du Pont | Photopolymerizable compositions containing triarylimidazolyl dimers and p-aminophenyl ketones |
| US4162162A (en) | 1978-05-08 | 1979-07-24 | E. I. Du Pont De Nemours And Company | Derivatives of aryl ketones and p-dialkyl-aminoarylaldehydes as visible sensitizers of photopolymerizable compositions |
| US4343885A (en) | 1978-05-09 | 1982-08-10 | Dynachem Corporation | Phototropic photosensitive compositions containing fluoran colorformer |
| DE3365773D1 (en) | 1982-02-26 | 1986-10-09 | Ciba Geigy Ag | Coloured photo-hardenable composition |
| US4629680A (en) | 1984-01-30 | 1986-12-16 | Fuji Photo Film Co., Ltd. | Photopolymerizable materials capable of being developed by a weak alkaline aqueous solution |
| US4592816A (en) | 1984-09-26 | 1986-06-03 | Rohm And Haas Company | Electrophoretic deposition process |
| DE3540950A1 (de) | 1985-11-19 | 1987-05-21 | Basf Ag | Durch photopolymerisation vernetzbare gemische |
| US4794021A (en) | 1986-11-13 | 1988-12-27 | Microelectronics And Computer Technology Corporation | Method of providing a planarized polymer coating on a substrate wafer |
| EP0289004B1 (en) * | 1987-04-28 | 1994-03-23 | Sharp Kabushiki Kaisha | Recording and reproducing apparatus |
| US5055164A (en) | 1990-03-26 | 1991-10-08 | Shipley Company Inc. | Electrodepositable photoresists for manufacture of hybrid circuit boards |
| EP0490118A1 (en) * | 1990-12-10 | 1992-06-17 | Shipley Company Inc. | Photoimagable solder mask and photosensitive composition |
| US5202222A (en) | 1991-03-01 | 1993-04-13 | Shipley Company Inc. | Selective and precise etching and plating of conductive substrates |
| CA2076727A1 (en) | 1991-08-30 | 1993-03-01 | Richard T. Mayes | Alkaline-etch resistant dry film photoresist |
| US5186383A (en) | 1991-10-02 | 1993-02-16 | Motorola, Inc. | Method for forming solder bump interconnections to a solder-plated circuit trace |
| US5928839A (en) | 1992-05-15 | 1999-07-27 | Morton International, Inc. | Method of forming a multilayer printed circuit board and product thereof |
| JP3575109B2 (ja) * | 1995-05-10 | 2004-10-13 | Ｊｓｒ株式会社 | バンプ形成用材料 |
| KR100268967B1 (ko) | 1996-01-30 | 2000-10-16 | 모기 준이치 | 금속 착물 형성용 수용액, 주석-은 합금도금욕 및 당해도금욕을 사용하는 도금물의 제조방법 |
| US6099713A (en) | 1996-11-25 | 2000-08-08 | C. Uyemura & Co., Ltd. | Tin-silver alloy electroplating bath and tin-silver alloy electroplating process |
| JP3633179B2 (ja) | 1997-01-27 | 2005-03-30 | Ｊｓｒ株式会社 | ポジ型フォトレジスト組成物 |
| KR100219806B1 (ko) | 1997-05-27 | 1999-09-01 | 윤종용 | 반도체장치의 플립 칩 실장형 솔더 범프의 제조방법, 이에 따라 제조되는 솔더범프 및 그 분석방법 |
| US5990564A (en) | 1997-05-30 | 1999-11-23 | Lucent Technologies Inc. | Flip chip packaging of memory chips |
| KR100585071B1 (ko) | 1999-09-13 | 2006-06-01 | 삼성전자주식회사 | 스핀 코팅을 이용한 포토레지스트막의 도포 방법 |
| US6638847B1 (en) | 2000-04-19 | 2003-10-28 | Advanced Interconnect Technology Ltd. | Method of forming lead-free bump interconnections |
| WO2002027407A1 (en) | 2000-09-27 | 2002-04-04 | Hitachi Chemical Co., Ltd. | Resist pattern, process for producing the same, and utilization thereof |
-
2003
- 2003-04-07 US US10/408,428 patent/US7344970B2/en not_active Expired - Lifetime
- 2003-04-08 TW TW092107967A patent/TWI236049B/zh not_active IP Right Cessation
- 2003-04-09 JP JP2003105231A patent/JP4224851B2/ja not_active Expired - Lifetime
- 2003-04-09 EP EP03252227.8A patent/EP1353228B1/en not_active Expired - Lifetime
- 2003-04-10 KR KR1020030022486A patent/KR100943677B1/ko not_active Expired - Lifetime
- 2003-04-11 SG SG200302067A patent/SG111989A1/en unknown
- 2003-04-11 SG SG200607065-0A patent/SG145567A1/en unknown
- 2003-04-11 CN CNB031095984A patent/CN100343758C/zh not_active Expired - Lifetime
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