JP2004086137A - 光トランシーバ及びその製造方法 - Google Patents

光トランシーバ及びその製造方法 Download PDF

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Publication number
JP2004086137A
JP2004086137A JP2003030030A JP2003030030A JP2004086137A JP 2004086137 A JP2004086137 A JP 2004086137A JP 2003030030 A JP2003030030 A JP 2003030030A JP 2003030030 A JP2003030030 A JP 2003030030A JP 2004086137 A JP2004086137 A JP 2004086137A
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JP
Japan
Prior art keywords
optical
substrate
light
socket
lens
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2003030030A
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English (en)
Japanese (ja)
Other versions
JP2004086137A5 (enExample
Inventor
Kimio Nagasaka
長坂 公夫
Akira Miyamae
宮前 章
Takeo Kaneko
金子 丈夫
Eiichi Fujii
藤井 永一
Atsushi Amako
尼子 淳
Tsugio Ide
井出 次男
Shojiro Kitamura
北村 昇二郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2003030030A priority Critical patent/JP2004086137A/ja
Priority to CNB031486630A priority patent/CN1276283C/zh
Priority to US10/601,707 priority patent/US7104703B2/en
Publication of JP2004086137A publication Critical patent/JP2004086137A/ja
Publication of JP2004086137A5 publication Critical patent/JP2004086137A5/ja
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4227Active alignment methods, e.g. procedures and algorithms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4204Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
    • G02B6/4214Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4219Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/422Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements
    • G02B6/4221Active alignment, i.e. moving the elements in response to the detected degree of coupling or position of the elements involving a visual detection of the position of the elements, e.g. by using a microscope or a camera
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4246Bidirectionally operating package structures
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4201Packages, e.g. shape, construction, internal or external details
    • G02B6/4249Packages, e.g. shape, construction, internal or external details comprising arrays of active devices and fibres
    • G02B6/425Optical features
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24Coupling light guides
    • G02B6/42Coupling light guides with opto-electronic elements
    • G02B6/4292Coupling light guides with opto-electronic elements the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)
  • Light Receiving Elements (AREA)
JP2003030030A 2002-07-01 2003-02-06 光トランシーバ及びその製造方法 Pending JP2004086137A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2003030030A JP2004086137A (ja) 2002-07-01 2003-02-06 光トランシーバ及びその製造方法
CNB031486630A CN1276283C (zh) 2002-07-01 2003-06-17 光收发机及其制造方法
US10/601,707 US7104703B2 (en) 2002-07-01 2003-06-24 Optical transceiver and method for producing the same

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2002192634 2002-07-01
JP2003030030A JP2004086137A (ja) 2002-07-01 2003-02-06 光トランシーバ及びその製造方法

Publications (2)

Publication Number Publication Date
JP2004086137A true JP2004086137A (ja) 2004-03-18
JP2004086137A5 JP2004086137A5 (enExample) 2005-09-29

Family

ID=30002339

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2003030030A Pending JP2004086137A (ja) 2002-07-01 2003-02-06 光トランシーバ及びその製造方法

Country Status (3)

Country Link
US (1) US7104703B2 (enExample)
JP (1) JP2004086137A (enExample)
CN (1) CN1276283C (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006227607A (ja) * 2005-01-21 2006-08-31 Seiko Epson Corp 通信用ケーブル
US7519243B2 (en) 2004-08-04 2009-04-14 Fujitsu Limited Substrate, substrate adapted for interconnecting optical elements and optical module
JP2012137537A (ja) * 2010-12-24 2012-07-19 Auto Network Gijutsu Kenkyusho:Kk 光コネクタ
JP2012253131A (ja) * 2011-06-01 2012-12-20 Murata Mfg Co Ltd 光モジュール
JP2016126308A (ja) * 2015-01-08 2016-07-11 富士通株式会社 光インターコネクションの光軸調整方法および光インターコネクション基板
WO2023176068A1 (ja) * 2022-03-16 2023-09-21 ナルックス株式会社 マイクロレンズ及びマイクロレンズアレイの製造方法

Families Citing this family (76)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001324631A (ja) * 2000-05-12 2001-11-22 Nec Corp 基板、光ファイバ接続端部材、光素子ハウジング部材、光モジュール及び基板の製造方法
US7786983B2 (en) * 2003-04-08 2010-08-31 Poa Sana Liquidating Trust Apparatus and method for a data input device using a light lamina screen
US20050171112A1 (en) * 2003-11-03 2005-08-04 Probiodrug Ag Combinations useful for the treatment of neuronal disorders
US20100099721A1 (en) * 2003-11-03 2010-04-22 Probiodrug Ag Novel compounds for the treatment of neurological disorders
US7190706B2 (en) * 2003-12-10 2007-03-13 Avago Technologies Fiber Ip (Singapore) Ptd. Ltd. Soft metal heat transfer for transceivers
TWI229756B (en) * 2003-12-19 2005-03-21 Ind Tech Res Inst Array optical subassembly for array optical active component
US7509011B2 (en) * 2004-01-15 2009-03-24 Poa Sana Liquidating Trust Hybrid waveguide
US20050231758A1 (en) * 2004-02-06 2005-10-20 Reynolds Christopher H Systems and methods relating to paper and printer cartridge usage
JP2005315902A (ja) 2004-04-26 2005-11-10 Seiko Epson Corp 光コネクタ
US7676131B2 (en) * 2004-06-04 2010-03-09 Poa Sana Liquidating Trust Waveguide with a three-dimensional lens
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US7093985B2 (en) * 2004-07-12 2006-08-22 Protokraft, Llc Wall mount fiber optic connector and associated method for forming the same
US7418175B2 (en) * 2004-09-09 2008-08-26 Finisar Corporation Component feature cavity for optical fiber self-alignment
CA2589986A1 (en) * 2004-12-07 2006-06-15 Releaf Security and storage system and method
JP4103894B2 (ja) * 2005-02-15 2008-06-18 セイコーエプソン株式会社 光モジュール、電子機器
TWI285013B (en) * 2006-01-03 2007-08-01 Quarton Inc Laser module and method of manufacturing the same
US20080031584A1 (en) * 2006-08-02 2008-02-07 National Semiconductor Corporation Apparatus and method for a singulation of polymer waveguides using photolithography
US7568844B2 (en) * 2006-08-15 2009-08-04 Corning Cable Systems Llc Ruggedized fiber optic connector assembly
US7460750B2 (en) * 2006-08-23 2008-12-02 Stratos International, Inc. Expanded beam, single fiber, fiber optic connector
JP4753904B2 (ja) * 2007-03-15 2011-08-24 シャープ株式会社 発光装置
US7452216B2 (en) * 2007-03-27 2008-11-18 Tyco Electronics Corporation Transceiver receptacle assembly
DE102007051294B4 (de) * 2007-07-20 2012-03-22 Lasos Lasertechnik Gmbh Optische Steckverbindung für Lichtwellenleiter
JP4957503B2 (ja) * 2007-10-16 2012-06-20 住友電気工業株式会社 光モジュールおよび光モジュールの製造方法
CN101471330B (zh) * 2007-12-28 2010-06-09 鸿富锦精密工业(深圳)有限公司 半导体封装结构
CN101582720B (zh) * 2008-05-16 2014-06-25 光环科技股份有限公司 用于光纤通信的光收发组件
US8272792B2 (en) * 2008-09-30 2012-09-25 Corning Cable Systems Llc Retention bodies for fiber optic cable assemblies
US8303193B2 (en) * 2008-09-30 2012-11-06 Corning Cable Systems Llc Retention bodies for fiber optic cable assemblies
US8285096B2 (en) 2008-09-30 2012-10-09 Corning Cable Systems Llc Fiber optic cable assemblies and securing methods
WO2010113911A1 (ja) * 2009-03-30 2010-10-07 株式会社オートネットワーク技術研究所 光通信モジュール及び光通信モジュールの製造方法
US8573862B2 (en) * 2010-03-22 2013-11-05 Avago Technologies General Ip (Singapore) Pte. Ltd. Narrow, pluggable optical transceiver system
US8260097B2 (en) * 2010-06-16 2012-09-04 Avago Technologies Fiber Ip (Singapore) Pte. Ltd Opto-electronic alignment system and method
EP2428828B1 (en) * 2010-09-13 2016-06-29 Tyco Electronics Svenska Holdings AB Miniaturized high speed optical module
US9128258B2 (en) 2011-05-10 2015-09-08 Sumitomo Electric Industries, Ltd. Optical assembly and method for producing the same
US8836908B2 (en) * 2011-11-18 2014-09-16 Shenzhen China Star Optoelectronics Technology Co., Ltd. COF, COF carrier tape and drive circuit of liquid crystal television
CN103959117A (zh) * 2011-12-09 2014-07-30 惠普发展公司,有限责任合伙企业 光学连接器
US8724937B2 (en) 2011-12-20 2014-05-13 International Business Machines Corporation Fiber to wafer interface
US9164249B2 (en) 2012-01-27 2015-10-20 Hewlett-Packard Development Company, L.P. Glass-silicon wafer-stacked opto-electronic platforms
EP2810112A4 (en) * 2012-01-31 2015-10-14 Hewlett Packard Development Co DEVICE FOR USE IN AN OPTOELECTRONICS
US9417408B2 (en) * 2012-03-02 2016-08-16 Tyco Electronics Corporation Modularized interposer
US8534927B1 (en) * 2012-03-23 2013-09-17 International Business Machines Corporation Flexible fiber to wafer interface
US9243784B2 (en) 2012-12-20 2016-01-26 International Business Machines Corporation Semiconductor photonic package
US9400356B2 (en) 2013-03-14 2016-07-26 International Business Machines Corporation Fiber pigtail with integrated lid
US9239432B2 (en) * 2013-03-14 2016-01-19 Micron Technology, Inc. Photonics grating coupler and method of manufacture
US8923665B2 (en) 2013-03-15 2014-12-30 International Business Machines Corporation Material structures for front-end of the line integration of optical polarization splitters and rotators
KR101480025B1 (ko) * 2013-11-28 2015-01-07 (주)옵토마인드 전송경로 확장기
JP6083401B2 (ja) * 2014-02-28 2017-02-22 株式会社村田製作所 光伝送モジュールの製造方法
US9335494B2 (en) 2014-05-15 2016-05-10 Tyco Electronics Corporation Optoelectronics structures
US9651745B2 (en) * 2014-09-25 2017-05-16 Optomedia Technology Inc Optical connector module for aligning optical connectors to optical connecting seat
US9939598B2 (en) * 2015-01-16 2018-04-10 Us Conec, Ltd. Fiber optic connector assembly, apparatus for forming a transceiver interface, and ferrule
JP2016178218A (ja) * 2015-03-20 2016-10-06 日本オクラロ株式会社 光送信モジュール
CN106796331A (zh) * 2015-09-07 2017-05-31 深圳市亚派光电器件有限公司 多通道透镜结构
US11585991B2 (en) 2019-02-28 2023-02-21 Teramount Ltd. Fiberless co-packaged optics
US12124087B2 (en) 2015-10-08 2024-10-22 Teramount Ltd. Wideband surface coupling
US12379555B2 (en) * 2021-10-27 2025-08-05 Teramount Ltd. Detachable connector for co-packaged optics
US12265259B2 (en) 2019-01-23 2025-04-01 Teramount Ltd. Waveguide mode coupling
US12189195B2 (en) 2015-10-08 2025-01-07 Teramount Ltd. Optical coupling
KR101925476B1 (ko) * 2015-11-25 2018-12-05 주식회사 옵텔라 광학 모듈 및 이를 포함하는 광학 엔진
US10409015B1 (en) 2015-12-15 2019-09-10 Optomind Inc. Optical receiving device including focusing lens and reflector mounted to housing body and collimating lens mounted to housing cover
CN108369322B (zh) * 2015-12-15 2020-06-12 光电思维株式会社 光缆用收发装置及其对齐方法
US10312536B2 (en) * 2016-05-10 2019-06-04 Hamilton Sundstrand Corporation On-board aircraft electrochemical system
US10410883B2 (en) 2016-06-01 2019-09-10 Corning Incorporated Articles and methods of forming vias in substrates
US10088639B2 (en) * 2016-06-28 2018-10-02 Mellanox Technologies, Ltd. Opto-mechanical coupler
US10345542B2 (en) * 2016-06-28 2019-07-09 Mellanox Technologies, Ltd. Opto-mechanical coupler
US10794679B2 (en) 2016-06-29 2020-10-06 Corning Incorporated Method and system for measuring geometric parameters of through holes
US10134657B2 (en) 2016-06-29 2018-11-20 Corning Incorporated Inorganic wafer having through-holes attached to semiconductor wafer
WO2018110981A1 (ko) * 2016-12-15 2018-06-21 엘지이노텍 주식회사 광 전송 모듈
US10580725B2 (en) 2017-05-25 2020-03-03 Corning Incorporated Articles having vias with geometry attributes and methods for fabricating the same
US11078112B2 (en) 2017-05-25 2021-08-03 Corning Incorporated Silica-containing substrates with vias having an axially variable sidewall taper and methods for forming the same
US12180108B2 (en) 2017-12-19 2024-12-31 Corning Incorporated Methods for etching vias in glass-based articles employing positive charge organic molecules
US11554984B2 (en) 2018-02-22 2023-01-17 Corning Incorporated Alkali-free borosilicate glasses with low post-HF etch roughness
JP2019184744A (ja) * 2018-04-05 2019-10-24 矢崎総業株式会社 光コネクタ
JP2020086082A (ja) * 2018-11-22 2020-06-04 日本電信電話株式会社 光接続構造
US10756839B1 (en) * 2019-05-09 2020-08-25 Hewlett Packard Enterprise Development Lp Hybrid coarse wavelength division multiplexing (CWDM) transceiver
US11886001B2 (en) * 2019-12-20 2024-01-30 Snap Inc. Optical waveguide fabrication process
JP2022124177A (ja) * 2021-02-15 2022-08-25 株式会社日本マイクロニクス 接続装置及び集光基板
FR3122503B1 (fr) * 2021-04-28 2024-05-10 Quandela Procédé de couplage de haute précision d’une fibre optique avec un dispositif photonique et microstructure de mise en oeuvre

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153184A (ja) * 1984-01-21 1985-08-12 Sumitomo Electric Ind Ltd 受光素子
JPS60233601A (ja) * 1984-04-06 1985-11-20 ジーイーシー ― マルコニ リミテッド 光学装置の製造に関する改良
JPH04241477A (ja) * 1991-01-14 1992-08-28 Mitsubishi Electric Corp 半導体デバイス用サブマウントおよび半導体光デバイスモジュール
JPH11509687A (ja) * 1995-07-24 1999-08-24 シーメンス アクチエンゲゼルシヤフト 光電子変換器及び製造方法
WO2001001497A1 (en) * 1999-06-29 2001-01-04 Honeywell Inc. Hermetic chip-scale package for photonic devices
JP2001036100A (ja) * 1999-06-25 2001-02-09 Lucent Technol Inc 光電子デバイス
JP2002033546A (ja) * 2000-07-19 2002-01-31 Canon Inc 面型光素子、面型光素子実装体、その作製方法、およびそれを用いた光配線装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4188708A (en) * 1977-10-03 1980-02-19 National Semiconductor Corporation Integrated circuit package with optical input coupler
CA1276451C (en) 1986-02-27 1990-11-20 Neal Henry Thorsten Techniques and apparatus for aligning a light emitter within its package
US4876446A (en) * 1987-02-06 1989-10-24 Matsushita Electric Works, Ltd. Optical sensor with optical interconnection board
JP2581257B2 (ja) 1990-04-19 1997-02-12 三菱電機株式会社 光半導体素子モジユールの製造方法
JPH0453912A (ja) 1990-06-22 1992-02-21 Nec Corp 受光モジュールの光軸調整方法
JPH05251717A (ja) * 1992-03-04 1993-09-28 Hitachi Ltd 半導体パッケージおよび半導体モジュール
US5976835A (en) * 1992-03-19 1999-11-02 The Rockefeller University Nucleic acids encoding receptor recognition factor Stat1α and Stat1β, and methods of use thereof
JPH1010373A (ja) * 1996-06-21 1998-01-16 Toshiba Corp レセプタクル型光送受信装置およびその製造方法
US6330464B1 (en) * 1998-08-26 2001-12-11 Sensors For Medicine & Science Optical-based sensing devices
US6588949B1 (en) * 1998-12-30 2003-07-08 Honeywell Inc. Method and apparatus for hermetically sealing photonic devices
JP2001174672A (ja) 1999-12-16 2001-06-29 Mitsubishi Electric Corp 光素子モジュール
US6910812B2 (en) * 2001-05-15 2005-06-28 Peregrine Semiconductor Corporation Small-scale optoelectronic package
US6536957B1 (en) * 2001-08-14 2003-03-25 Nokia Corporation Integrated optical transceiver array
US6599031B2 (en) * 2001-09-12 2003-07-29 Intel Corporation Optical/electrical interconnects and package for high speed signaling

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60153184A (ja) * 1984-01-21 1985-08-12 Sumitomo Electric Ind Ltd 受光素子
JPS60233601A (ja) * 1984-04-06 1985-11-20 ジーイーシー ― マルコニ リミテッド 光学装置の製造に関する改良
JPH04241477A (ja) * 1991-01-14 1992-08-28 Mitsubishi Electric Corp 半導体デバイス用サブマウントおよび半導体光デバイスモジュール
JPH11509687A (ja) * 1995-07-24 1999-08-24 シーメンス アクチエンゲゼルシヤフト 光電子変換器及び製造方法
JP2001036100A (ja) * 1999-06-25 2001-02-09 Lucent Technol Inc 光電子デバイス
WO2001001497A1 (en) * 1999-06-29 2001-01-04 Honeywell Inc. Hermetic chip-scale package for photonic devices
JP2003503858A (ja) * 1999-06-29 2003-01-28 ハネウェル・インコーポレーテッド 光子デバイス用気密形チップスケールパッケージ
JP2002033546A (ja) * 2000-07-19 2002-01-31 Canon Inc 面型光素子、面型光素子実装体、その作製方法、およびそれを用いた光配線装置

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7519243B2 (en) 2004-08-04 2009-04-14 Fujitsu Limited Substrate, substrate adapted for interconnecting optical elements and optical module
JP2006227607A (ja) * 2005-01-21 2006-08-31 Seiko Epson Corp 通信用ケーブル
JP2012137537A (ja) * 2010-12-24 2012-07-19 Auto Network Gijutsu Kenkyusho:Kk 光コネクタ
CN103502862A (zh) * 2010-12-24 2014-01-08 株式会社自动网络技术研究所 光学连接器
US8985875B2 (en) 2010-12-24 2015-03-24 Autonetworks Technologies, Ltd. Optical connector having resin member including lens
JP2012253131A (ja) * 2011-06-01 2012-12-20 Murata Mfg Co Ltd 光モジュール
JP2016126308A (ja) * 2015-01-08 2016-07-11 富士通株式会社 光インターコネクションの光軸調整方法および光インターコネクション基板
WO2023176068A1 (ja) * 2022-03-16 2023-09-21 ナルックス株式会社 マイクロレンズ及びマイクロレンズアレイの製造方法

Also Published As

Publication number Publication date
CN1469147A (zh) 2004-01-21
US7104703B2 (en) 2006-09-12
CN1276283C (zh) 2006-09-20
US20040022487A1 (en) 2004-02-05

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