JP2004054254A5 - - Google Patents
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- JP2004054254A5 JP2004054254A5 JP2003150454A JP2003150454A JP2004054254A5 JP 2004054254 A5 JP2004054254 A5 JP 2004054254A5 JP 2003150454 A JP2003150454 A JP 2003150454A JP 2003150454 A JP2003150454 A JP 2003150454A JP 2004054254 A5 JP2004054254 A5 JP 2004054254A5
- Authority
- JP
- Japan
- Prior art keywords
- mol
- hours
- resin film
- nmp
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 82
- 229920005989 resin Polymers 0.000 description 57
- 239000011347 resin Substances 0.000 description 57
- 238000009835 boiling Methods 0.000 description 24
- 239000000243 solution Substances 0.000 description 23
- 239000004642 Polyimide Substances 0.000 description 22
- 229920001721 polyimide Polymers 0.000 description 22
- 239000002243 precursor Substances 0.000 description 21
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 20
- 239000000203 mixture Substances 0.000 description 20
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 17
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 16
- 125000000962 organic group Chemical group 0.000 description 16
- 230000015572 biosynthetic process Effects 0.000 description 14
- 125000004432 carbon atom Chemical group C* 0.000 description 14
- 238000003786 synthesis reaction Methods 0.000 description 14
- 238000006243 chemical reaction Methods 0.000 description 13
- 239000002966 varnish Substances 0.000 description 13
- 230000000052 comparative effect Effects 0.000 description 12
- 238000001914 filtration Methods 0.000 description 12
- 239000000758 substrate Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 12
- 239000002904 solvent Substances 0.000 description 11
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- ZSXGLVDWWRXATF-UHFFFAOYSA-N N,N-dimethylformamide dimethyl acetal Chemical compound COC(OC)N(C)C ZSXGLVDWWRXATF-UHFFFAOYSA-N 0.000 description 9
- 238000007865 diluting Methods 0.000 description 9
- 239000011521 glass Substances 0.000 description 9
- 239000011342 resin composition Substances 0.000 description 9
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 8
- 239000011159 matrix material Substances 0.000 description 8
- -1 methylol group Chemical group 0.000 description 8
- 239000003960 organic solvent Substances 0.000 description 8
- 239000002981 blocking agent Substances 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 150000004985 diamines Chemical class 0.000 description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 6
- 229920006015 heat resistant resin Polymers 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- GPXCORHXFPYJEH-UHFFFAOYSA-N 3-[[3-aminopropyl(dimethyl)silyl]oxy-dimethylsilyl]propan-1-amine Chemical compound NCCC[Si](C)(C)O[Si](C)(C)CCCN GPXCORHXFPYJEH-UHFFFAOYSA-N 0.000 description 4
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 4
- 229940018563 3-aminophenol Drugs 0.000 description 4
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 4
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 4
- 150000008064 anhydrides Chemical class 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 239000011259 mixed solution Substances 0.000 description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 3
- JXYITCJMBRETQX-UHFFFAOYSA-N 4-ethynylaniline Chemical compound NC1=CC=C(C#C)C=C1 JXYITCJMBRETQX-UHFFFAOYSA-N 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 229940116333 ethyl lactate Drugs 0.000 description 3
- 239000003504 photosensitizing agent Substances 0.000 description 3
- MSTZGVRUOMBULC-UHFFFAOYSA-N 2-amino-4-[2-(3-amino-4-hydroxyphenyl)-1,1,1,3,3,3-hexafluoropropan-2-yl]phenol Chemical compound C1=C(O)C(N)=CC(C(C=2C=C(N)C(O)=CC=2)(C(F)(F)F)C(F)(F)F)=C1 MSTZGVRUOMBULC-UHFFFAOYSA-N 0.000 description 2
- UENRXLSRMCSUSN-UHFFFAOYSA-N 3,5-diaminobenzoic acid Chemical compound NC1=CC(N)=CC(C(O)=O)=C1 UENRXLSRMCSUSN-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 238000007607 die coating method Methods 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- 125000005016 hydroxyalkynyl group Chemical group 0.000 description 2
- 239000012046 mixed solvent Substances 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000002244 precipitate Substances 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 125000000542 sulfonic acid group Chemical group 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 125000003396 thiol group Chemical group [H]S* 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- MRABAEUHTLLEML-UHFFFAOYSA-N Butyl lactate Chemical compound CCCCOC(=O)C(C)O MRABAEUHTLLEML-UHFFFAOYSA-N 0.000 description 1
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 1
- WOBHKFSMXKNTIM-UHFFFAOYSA-N Hydroxyethyl methacrylate Chemical compound CC(=C)C(=O)OCCO WOBHKFSMXKNTIM-UHFFFAOYSA-N 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000001191 butyl (2R)-2-hydroxypropanoate Substances 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000012299 nitrogen atmosphere Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 229930195735 unsaturated hydrocarbon Chemical group 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003150454A JP4333219B2 (ja) | 2002-05-29 | 2003-05-28 | 感光性樹脂組成物および耐熱性樹脂膜の製造方法 |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002155460 | 2002-05-29 | ||
| JP2003150454A JP4333219B2 (ja) | 2002-05-29 | 2003-05-28 | 感光性樹脂組成物および耐熱性樹脂膜の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004054254A JP2004054254A (ja) | 2004-02-19 |
| JP2004054254A5 true JP2004054254A5 (enExample) | 2006-06-29 |
| JP4333219B2 JP4333219B2 (ja) | 2009-09-16 |
Family
ID=31949018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003150454A Expired - Lifetime JP4333219B2 (ja) | 2002-05-29 | 2003-05-28 | 感光性樹脂組成物および耐熱性樹脂膜の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4333219B2 (enExample) |
Families Citing this family (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2381308B1 (en) * | 2003-06-23 | 2015-07-29 | Sumitomo Bakelite Co., Ltd. | Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device |
| JP4556616B2 (ja) * | 2003-10-28 | 2010-10-06 | 住友ベークライト株式会社 | ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法 |
| JP4494061B2 (ja) * | 2004-03-30 | 2010-06-30 | 東京応化工業株式会社 | ポジ型レジスト組成物 |
| JP2005309032A (ja) * | 2004-04-21 | 2005-11-04 | Toray Ind Inc | ポジ型感光性樹脂組成物 |
| JP4698356B2 (ja) * | 2005-09-20 | 2011-06-08 | 旭化成イーマテリアルズ株式会社 | 感光性樹脂組成物 |
| EP2056163A4 (en) * | 2006-08-15 | 2009-11-11 | Asahi Kasei Emd Corp | POSITIVE PHOTOSENSITIVE RESIN COMPOSITION |
| JP4929982B2 (ja) * | 2006-10-30 | 2012-05-09 | 住友ベークライト株式会社 | 感光性樹脂組成物、絶縁膜、保護膜および電子機器 |
| JP4400695B2 (ja) * | 2007-02-19 | 2010-01-20 | 住友ベークライト株式会社 | 感光性樹脂組成物、硬化膜、保護膜、絶縁膜およびそれを用いた半導体装置、表示体装置 |
| US20100193971A1 (en) * | 2007-07-26 | 2010-08-05 | Toshio Banba | Positive photosensitive resin composition for spray coating, method for forming cured film using the same, cured film, and semiconductor device |
| US20100243960A1 (en) * | 2007-11-16 | 2010-09-30 | Sumitomo Chemical Company, Limited | Coating solution for application method of discharging coating solution through slit-like discharge port |
| JP5292799B2 (ja) * | 2007-12-19 | 2013-09-18 | 凸版印刷株式会社 | 基板用支持ピン |
| JP5434027B2 (ja) * | 2008-09-24 | 2014-03-05 | 住友化学株式会社 | 有機光電変換素子 |
| US20110200937A1 (en) * | 2008-10-20 | 2011-08-18 | Sumitomo Bakelite Co., Ltd. | Positive photosensitive resin composition for spray coating and method for producing through electrode using the same |
| JP4911248B2 (ja) * | 2009-09-10 | 2012-04-04 | 東レ株式会社 | 感光性樹脂組成物および感光性樹脂膜の製造方法 |
| KR101333704B1 (ko) | 2009-12-29 | 2013-11-27 | 제일모직주식회사 | 포지티브형 감광성 수지 조성물 |
| KR101728820B1 (ko) | 2013-12-12 | 2017-04-20 | 제일모직 주식회사 | 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자 |
| SG11201706425PA (en) * | 2015-03-27 | 2017-09-28 | Toray Industries | Photosensitive resin composition for thin film transistors, cured film, thin film transistor, liquid crystal display device, organic electroluminescent display device, method for producing cured film, method for manufacturing thin film transistor, and method for manufacturing liquid crystal display device or organic electroluminescent display device |
| JP7487518B2 (ja) * | 2020-03-27 | 2024-05-21 | 住友ベークライト株式会社 | 感光性樹脂組成物、硬化膜、硬化膜を備えるパネルレベルパッケージ及びその製造方法 |
| JP7443970B2 (ja) * | 2020-07-22 | 2024-03-06 | Ｈｄマイクロシステムズ株式会社 | 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品 |
| CN111825348B (zh) * | 2020-08-13 | 2021-09-17 | 乐清市川嘉电气科技有限公司 | 一种多孔电致变色玻璃及其制备方法 |
-
2003
- 2003-05-28 JP JP2003150454A patent/JP4333219B2/ja not_active Expired - Lifetime
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