JP4333219B2 - 感光性樹脂組成物および耐熱性樹脂膜の製造方法 - Google Patents

感光性樹脂組成物および耐熱性樹脂膜の製造方法 Download PDF

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JP4333219B2
JP4333219B2 JP2003150454A JP2003150454A JP4333219B2 JP 4333219 B2 JP4333219 B2 JP 4333219B2 JP 2003150454 A JP2003150454 A JP 2003150454A JP 2003150454 A JP2003150454 A JP 2003150454A JP 4333219 B2 JP4333219 B2 JP 4333219B2
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resin film
photosensitive resin
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boiling point
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JP2004054254A5 (enExample
JP2004054254A (ja
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一登 三好
良治 奥田
真佐夫 富川
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Toray Industries Inc
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  • Materials For Photolithography (AREA)
  • Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
JP2003150454A 2002-05-29 2003-05-28 感光性樹脂組成物および耐熱性樹脂膜の製造方法 Expired - Lifetime JP4333219B2 (ja)

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JP2002155460 2002-05-29
JP2003150454A JP4333219B2 (ja) 2002-05-29 2003-05-28 感光性樹脂組成物および耐熱性樹脂膜の製造方法

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JP2004054254A5 JP2004054254A5 (enExample) 2006-06-29
JP4333219B2 true JP4333219B2 (ja) 2009-09-16

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Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2381308B1 (en) * 2003-06-23 2015-07-29 Sumitomo Bakelite Co., Ltd. Positive-working photosensitive resin composition, method for producing pattern-formed resin film, semiconductor device, display device, and method for producing the semiconductor device and the display device
JP4556616B2 (ja) * 2003-10-28 2010-10-06 住友ベークライト株式会社 ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子、並びに半導体装置及び表示素子の製造方法
JP4494061B2 (ja) * 2004-03-30 2010-06-30 東京応化工業株式会社 ポジ型レジスト組成物
JP2005309032A (ja) * 2004-04-21 2005-11-04 Toray Ind Inc ポジ型感光性樹脂組成物
JP4698356B2 (ja) * 2005-09-20 2011-06-08 旭化成イーマテリアルズ株式会社 感光性樹脂組成物
WO2008020573A1 (en) * 2006-08-15 2008-02-21 Asahi Kasei Emd Corporation Positive photosensitive resin composition
JP4929982B2 (ja) * 2006-10-30 2012-05-09 住友ベークライト株式会社 感光性樹脂組成物、絶縁膜、保護膜および電子機器
US20100062273A1 (en) * 2007-02-19 2010-03-11 Sumitomo Bakelite Co., Ltd Photosensitive resin composition, cured film, protective film, insulating film, semiconductor device and display device using the same
US20100193971A1 (en) * 2007-07-26 2010-08-05 Toshio Banba Positive photosensitive resin composition for spray coating, method for forming cured film using the same, cured film, and semiconductor device
CN101855308A (zh) * 2007-11-16 2010-10-06 住友化学株式会社 从狭缝状喷口喷出涂布液的涂布法用的涂布液
JP5292799B2 (ja) * 2007-12-19 2013-09-18 凸版印刷株式会社 基板用支持ピン
JP5434027B2 (ja) * 2008-09-24 2014-03-05 住友化学株式会社 有機光電変換素子
US20110200937A1 (en) * 2008-10-20 2011-08-18 Sumitomo Bakelite Co., Ltd. Positive photosensitive resin composition for spray coating and method for producing through electrode using the same
CN102549497B (zh) * 2009-09-10 2013-07-31 东丽株式会社 感光性树脂组合物及感光性树脂膜的制造方法
KR101333704B1 (ko) 2009-12-29 2013-11-27 제일모직주식회사 포지티브형 감광성 수지 조성물
KR101728820B1 (ko) 2013-12-12 2017-04-20 제일모직 주식회사 포지티브형 감광성 수지 조성물, 감광성 수지막, 및 표시 소자
KR102245394B1 (ko) * 2015-03-27 2021-04-28 도레이 카부시키가이샤 박막 트랜지스터용 감광성 수지 조성물, 경화막, 박막 트랜지스터, 액정 표시 장치 또는 유기 전계 발광 표시 장치, 경화막의 제조 방법, 박막 트랜지스터의 제조 방법 및 액정 표시 장치 또는 유기 전계 발광 표시 장치의 제조 방법
JP7487518B2 (ja) * 2020-03-27 2024-05-21 住友ベークライト株式会社 感光性樹脂組成物、硬化膜、硬化膜を備えるパネルレベルパッケージ及びその製造方法
JP7443970B2 (ja) * 2020-07-22 2024-03-06 Ｈｄマイクロシステムズ株式会社 感光性樹脂組成物、硬化物、パターン硬化物の製造方法、及び電子部品
CN111825348B (zh) * 2020-08-13 2021-09-17 乐清市川嘉电气科技有限公司 一种多孔电致变色玻璃及其制备方法

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