JP2003211283A - 鉛フリーはんだ材料 - Google Patents

鉛フリーはんだ材料

Info

Publication number
JP2003211283A
JP2003211283A JP2002012446A JP2002012446A JP2003211283A JP 2003211283 A JP2003211283 A JP 2003211283A JP 2002012446 A JP2002012446 A JP 2002012446A JP 2002012446 A JP2002012446 A JP 2002012446A JP 2003211283 A JP2003211283 A JP 2003211283A
Authority
JP
Japan
Prior art keywords
alloy
phase
lead
composition
eutectic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002012446A
Other languages
English (en)
Japanese (ja)
Inventor
Toshio Narita
敏夫 成田
Junichi Tanaka
順一 田中
Daiki Kobayashi
大樹 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Science and Technology Agency
Original Assignee
Japan Science and Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Science and Technology Corp filed Critical Japan Science and Technology Corp
Priority to JP2002012446A priority Critical patent/JP2003211283A/ja
Priority to TW92101105A priority patent/TW200302147A/zh
Priority to PCT/JP2003/000470 priority patent/WO2003061897A1/fr
Publication of JP2003211283A publication Critical patent/JP2003211283A/ja
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/264—Bi as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP2002012446A 2002-01-22 2002-01-22 鉛フリーはんだ材料 Pending JP2003211283A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2002012446A JP2003211283A (ja) 2002-01-22 2002-01-22 鉛フリーはんだ材料
TW92101105A TW200302147A (en) 2002-01-22 2003-01-20 Lead-free solder alloy
PCT/JP2003/000470 WO2003061897A1 (fr) 2002-01-22 2003-01-21 Materiau de soudage sans plomb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002012446A JP2003211283A (ja) 2002-01-22 2002-01-22 鉛フリーはんだ材料

Publications (1)

Publication Number Publication Date
JP2003211283A true JP2003211283A (ja) 2003-07-29

Family

ID=27606048

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002012446A Pending JP2003211283A (ja) 2002-01-22 2002-01-22 鉛フリーはんだ材料

Country Status (3)

Country Link
JP (1) JP2003211283A (fr)
TW (1) TW200302147A (fr)
WO (1) WO2003061897A1 (fr)

Cited By (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100351035C (zh) * 2005-10-28 2007-11-28 亚通电子有限公司 无铅焊料
CN100364713C (zh) * 2005-12-12 2008-01-30 黄德欢 一种Ag-Al-Cu-Ni-Sn系无铅焊锡
CN100366376C (zh) * 2005-12-23 2008-02-06 南京航空航天大学 含铈的Sn-Cu-Ni钎料
JP2008031550A (ja) * 2006-06-26 2008-02-14 Hitachi Cable Ltd ＰｂフリーのＳｎ系材料及び配線用導体並びに端末接続部並びにＰｂフリーはんだ合金
JP2008137018A (ja) * 2006-11-30 2008-06-19 Mitsubishi Materials Corp ボイド発生の少ないＡｕ−Ｓｎ合金はんだペースト
JP2008142729A (ja) * 2006-12-07 2008-06-26 Hitachi Metals Ltd アルミニウム部材直接接続用はんだ
JP2008161913A (ja) * 2006-12-28 2008-07-17 Mitsubishi Materials Corp ボイド発生の少ないＳｎ−Ａｕ合金はんだペースト
JP2009119528A (ja) * 2007-03-29 2009-06-04 Hitachi Metals Ltd はんだ合金およびそれを用いたガラス接合体
US20100147926A1 (en) * 2005-07-14 2010-06-17 Sophia Product Co. Method for oxide bonding using solder alloy
US7749340B2 (en) * 2005-10-24 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of lead-free solders containing silver
CN102059469A (zh) * 2010-11-29 2011-05-18 力创(台山)电子科技有限公司 一种用于铜铝复合管的环保焊环的制备方法
JP2012500493A (ja) * 2008-08-21 2012-01-05 アギア システムズ インコーポレーテッド Ｓｎ膜におけるウイスカの軽減
WO2012137901A1 (fr) * 2011-04-08 2012-10-11 株式会社日本スペリア社 Alliage de brasure
JP2013022619A (ja) * 2011-07-21 2013-02-04 Sumitomo Metal Mining Co Ltd サーバー用ＣＰＵ向け無鉛Ｉｎ基はんだ合金及びその製造方法
CN103381526A (zh) * 2013-06-22 2013-11-06 宁波市鄞州品达电器焊料有限公司 一种新型焊料
JPWO2014181883A1 (ja) * 2013-05-10 2017-02-23 富士電機株式会社 半導体装置および半導体装置の製造方法
US11285569B2 (en) 2003-04-25 2022-03-29 Henkel Ag & Co. Kgaa Soldering material based on Sn Ag and Cu

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2005090622A1 (fr) * 2004-03-24 2005-09-29 Agency For Science, Technology And Research Alliage de soudure exempt de plomb
DE102004050441A1 (de) * 2004-10-16 2006-04-20 Stannol Gmbh Lotmaterial
CN101549441B (zh) * 2008-04-01 2011-06-29 东莞市中实焊锡有限公司 一种无铅焊料
CN103056543B (zh) * 2013-01-18 2015-03-25 江苏师范大学 一种含Yb、Al、B的纳米无铅钎料
CN114850725B (zh) * 2022-05-24 2024-04-26 雅拓莱焊接科技（惠州）有限公司 超薄锡铋系预成型焊环及其制备工艺

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11129091A (ja) * 1997-10-28 1999-05-18 Ngk Spark Plug Co Ltd 半田合金
JP2000141078A (ja) * 1998-09-08 2000-05-23 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP2001058287A (ja) * 1999-06-11 2001-03-06 Nippon Sheet Glass Co Ltd 無鉛ハンダ
JP4462721B2 (ja) * 2000-06-07 2010-05-12 清仁 石田 はんだ合金及びはんだボール

Cited By (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11285569B2 (en) 2003-04-25 2022-03-29 Henkel Ag & Co. Kgaa Soldering material based on Sn Ag and Cu
US20100147926A1 (en) * 2005-07-14 2010-06-17 Sophia Product Co. Method for oxide bonding using solder alloy
US7749340B2 (en) * 2005-10-24 2010-07-06 Indium Corporation Of America Technique for increasing the compliance of lead-free solders containing silver
CN100351035C (zh) * 2005-10-28 2007-11-28 亚通电子有限公司 无铅焊料
CN100364713C (zh) * 2005-12-12 2008-01-30 黄德欢 一种Ag-Al-Cu-Ni-Sn系无铅焊锡
CN100366376C (zh) * 2005-12-23 2008-02-06 南京航空航天大学 含铈的Sn-Cu-Ni钎料
JP2008031550A (ja) * 2006-06-26 2008-02-14 Hitachi Cable Ltd ＰｂフリーのＳｎ系材料及び配線用導体並びに端末接続部並びにＰｂフリーはんだ合金
JP2008137018A (ja) * 2006-11-30 2008-06-19 Mitsubishi Materials Corp ボイド発生の少ないＡｕ−Ｓｎ合金はんだペースト
JP2008142729A (ja) * 2006-12-07 2008-06-26 Hitachi Metals Ltd アルミニウム部材直接接続用はんだ
JP2008161913A (ja) * 2006-12-28 2008-07-17 Mitsubishi Materials Corp ボイド発生の少ないＳｎ−Ａｕ合金はんだペースト
US7901782B2 (en) 2007-03-29 2011-03-08 Hitachi Metals, Ltd. Solder alloy and glass bonded body using the same
JP2009119528A (ja) * 2007-03-29 2009-06-04 Hitachi Metals Ltd はんだ合金およびそれを用いたガラス接合体
JP2012500493A (ja) * 2008-08-21 2012-01-05 アギア システムズ インコーポレーテッド Ｓｎ膜におけるウイスカの軽減
CN102059469A (zh) * 2010-11-29 2011-05-18 力创(台山)电子科技有限公司 一种用于铜铝复合管的环保焊环的制备方法
WO2012137901A1 (fr) * 2011-04-08 2012-10-11 株式会社日本スペリア社 Alliage de brasure
JP5973992B2 (ja) * 2011-04-08 2016-08-23 株式会社日本スペリア社 はんだ合金
US9999945B2 (en) 2011-04-08 2018-06-19 Nihon Superior Co., Ltd. Solder alloy
JP2013022619A (ja) * 2011-07-21 2013-02-04 Sumitomo Metal Mining Co Ltd サーバー用ＣＰＵ向け無鉛Ｉｎ基はんだ合金及びその製造方法
JPWO2014181883A1 (ja) * 2013-05-10 2017-02-23 富士電機株式会社 半導体装置および半導体装置の製造方法
CN103381526A (zh) * 2013-06-22 2013-11-06 宁波市鄞州品达电器焊料有限公司 一种新型焊料
CN103381526B (zh) * 2013-06-22 2016-02-03 宁波市鄞州品达电器焊料有限公司 一种新型焊料

Also Published As

Publication number Publication date
WO2003061897A1 (fr) 2003-07-31
TW200302147A (en) 2003-08-01

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