CA2502747A1 - Compositions d'alliage de brasage tendre sans plomb (pb) essentiellement composees d'etain, d'argent, de cuivre et de phosphore - Google Patents

Compositions d'alliage de brasage tendre sans plomb (pb) essentiellement composees d'etain, d'argent, de cuivre et de phosphore Download PDF

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Publication number
CA2502747A1
CA2502747A1 CA 2502747 CA2502747A CA2502747A1 CA 2502747 A1 CA2502747 A1 CA 2502747A1 CA 2502747 CA2502747 CA 2502747 CA 2502747 A CA2502747 A CA 2502747A CA 2502747 A1 CA2502747 A1 CA 2502747A1
Authority
CA
Canada
Prior art keywords
weight
solder
metallic component
composition
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA 2502747
Other languages
English (en)
Inventor
David Wai-Yin Dl Leung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CA 2502747 priority Critical patent/CA2502747A1/fr
Priority to CNB2005101134413A priority patent/CN100467192C/zh
Priority to US11/362,310 priority patent/US7335269B2/en
Priority to EP06003796A priority patent/EP1707302B1/fr
Priority to JP2006067296A priority patent/JP2006281318A/ja
Priority to HK06103778A priority patent/HK1082372A2/xx
Publication of CA2502747A1 publication Critical patent/CA2502747A1/fr
Priority to HK07100771.8A priority patent/HK1094685A1/xx
Priority to HK07102812.5A priority patent/HK1096628A1/xx
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
CA 2502747 2005-03-30 2005-03-30 Compositions d'alliage de brasage tendre sans plomb (pb) essentiellement composees d'etain, d'argent, de cuivre et de phosphore Abandoned CA2502747A1 (fr)

Priority Applications (8)

Application Number Priority Date Filing Date Title
CA 2502747 CA2502747A1 (fr) 2005-03-30 2005-03-30 Compositions d'alliage de brasage tendre sans plomb (pb) essentiellement composees d'etain, d'argent, de cuivre et de phosphore
CNB2005101134413A CN100467192C (zh) 2005-03-30 2005-10-09 基本上包括锡(Sn)、银(Ag)、铜(Cu)和磷(P)的无Pb焊料合金组合物
US11/362,310 US7335269B2 (en) 2005-03-30 2006-02-23 Pb-free solder alloy compositions comprising essentially Tin(Sn), Silver(Ag), Copper(Cu), and Phosphorus(P)
EP06003796A EP1707302B1 (fr) 2005-03-30 2006-02-24 Alliage de brasage sans plomb comprenant essentiellement de l'étain, de l'argent, du cuivre et du phosphore
JP2006067296A JP2006281318A (ja) 2005-03-30 2006-03-13 スズ（Ｓｎ）と、銀（Ａｇ）と、銅（Ｃｕ）と、リン（Ｐ）とを基本的に含有する鉛フリーのはんだ合金組成物
HK06103778A HK1082372A2 (en) 2005-03-30 2006-03-25 Pb-free solder alloy compositions comprising essentially tin(sn), silver (ag), copper(cu), and phos phorus(p)
HK07100771.8A HK1094685A1 (en) 2005-03-30 2007-01-22 Pb-free solder alloy compositions comprising essentially tin (sn), silver (ag), copper (cu), and phosphorus (p)
HK07102812.5A HK1096628A1 (en) 2005-03-30 2007-03-15 Pb-free solder alloy compositions comprising essentially tin (sn), silver (ag), copper (cu), and phosphorus (p)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA 2502747 CA2502747A1 (fr) 2005-03-30 2005-03-30 Compositions d'alliage de brasage tendre sans plomb (pb) essentiellement composees d'etain, d'argent, de cuivre et de phosphore

Publications (1)

Publication Number Publication Date
CA2502747A1 true CA2502747A1 (fr) 2006-09-30

Family

ID=37029569

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2502747 Abandoned CA2502747A1 (fr) 2005-03-30 2005-03-30 Compositions d'alliage de brasage tendre sans plomb (pb) essentiellement composees d'etain, d'argent, de cuivre et de phosphore

Country Status (3)

Country Link
CN (1) CN100467192C (fr)
CA (1) CA2502747A1 (fr)
HK (2) HK1094685A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2359981A1 (fr) * 2008-11-28 2011-08-24 Guangzhou Solderwell Enterprise Co., Ltd. Procédé de réduction d'écume de brasure sans plomb

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101848787B (zh) * 2007-08-14 2013-10-23 株式会社爱科草英 无铅焊料组合物及使用它的印刷电路板与电子器件
CN101214591B (zh) * 2008-01-18 2010-11-24 重庆工学院 一种电子微连接使用的低银亚共晶Sn-Cu-Ag无铅钎料
CN103586600A (zh) * 2013-11-12 2014-02-19 宁波市鄞州恒迅电子材料有限公司 无铅焊锡合金球
CN112705878A (zh) * 2014-08-27 2021-04-27 贺利氏德国有限两合公司 焊膏
CN112247394B (zh) * 2020-09-25 2022-04-08 河南理工大学 一种大气环境下钢化真空玻璃封接用无铅焊料及其加压钎焊封接方法
CN113399859A (zh) * 2021-05-27 2021-09-17 西安理工大学 一种Sn-Zn-Cu系无铅钎料及其制备方法

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2359981A1 (fr) * 2008-11-28 2011-08-24 Guangzhou Solderwell Enterprise Co., Ltd. Procédé de réduction d'écume de brasure sans plomb
EP2359981A4 (fr) * 2008-11-28 2011-10-05 Guangzhou Solderwell Entpr Co Ltd Procédé de réduction d'écume de brasure sans plomb

Also Published As

Publication number Publication date
HK1096628A1 (en) 2007-06-08
HK1094685A1 (en) 2007-04-04
CN1840282A (zh) 2006-10-04
CN100467192C (zh) 2009-03-11

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