CA2389446A1 - Compositions d'alliage de brasage tendre sans pb composees essentiellement de sn, d'ag, de cu et/ou de p - Google Patents

Compositions d'alliage de brasage tendre sans pb composees essentiellement de sn, d'ag, de cu et/ou de p Download PDF

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Publication number
CA2389446A1
CA2389446A1 CA 2389446 CA2389446A CA2389446A1 CA 2389446 A1 CA2389446 A1 CA 2389446A1 CA 2389446 CA2389446 CA 2389446 CA 2389446 A CA2389446 A CA 2389446A CA 2389446 A1 CA2389446 A1 CA 2389446A1
Authority
CA
Canada
Prior art keywords
weight
solder
metallic component
free solder
amount
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
CA 2389446
Other languages
English (en)
Inventor
David Wai-Yin Leung
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to CA 2389446 priority Critical patent/CA2389446A1/fr
Publication of CA2389446A1 publication Critical patent/CA2389446A1/fr
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CA 2389446 2002-06-10 2002-06-10 Compositions d'alliage de brasage tendre sans pb composees essentiellement de sn, d'ag, de cu et/ou de p Abandoned CA2389446A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CA 2389446 CA2389446A1 (fr) 2002-06-10 2002-06-10 Compositions d'alliage de brasage tendre sans pb composees essentiellement de sn, d'ag, de cu et/ou de p

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CA 2389446 CA2389446A1 (fr) 2002-06-10 2002-06-10 Compositions d'alliage de brasage tendre sans pb composees essentiellement de sn, d'ag, de cu et/ou de p

Publications (1)

Publication Number Publication Date
CA2389446A1 true CA2389446A1 (fr) 2003-12-10

Family

ID=30121025

Family Applications (1)

Application Number Title Priority Date Filing Date
CA 2389446 Abandoned CA2389446A1 (fr) 2002-06-10 2002-06-10 Compositions d'alliage de brasage tendre sans pb composees essentiellement de sn, d'ag, de cu et/ou de p

Country Status (1)

Country Link
CA (1) CA2389446A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1707302A3 (fr) * 2005-03-30 2007-01-17 Aoki Laboratories Ltd. Alliage de brasage sans plomb comprenant essentiellement de l'étain, de l'argent, du cuivre et du phosphore
US7754343B2 (en) * 2005-08-17 2010-07-13 Oracle America, Inc. Ternary alloy column grid array
EP2359981A1 (fr) * 2008-11-28 2011-08-24 Guangzhou Solderwell Enterprise Co., Ltd. Procédé de réduction d'écume de brasure sans plomb
CN115255710A (zh) * 2022-07-15 2022-11-01 郑州轻工业大学 一种含有Sn、Cu的高熵合金软钎料及其制备方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1707302A3 (fr) * 2005-03-30 2007-01-17 Aoki Laboratories Ltd. Alliage de brasage sans plomb comprenant essentiellement de l'étain, de l'argent, du cuivre et du phosphore
US7754343B2 (en) * 2005-08-17 2010-07-13 Oracle America, Inc. Ternary alloy column grid array
EP2359981A1 (fr) * 2008-11-28 2011-08-24 Guangzhou Solderwell Enterprise Co., Ltd. Procédé de réduction d'écume de brasure sans plomb
EP2359981A4 (fr) * 2008-11-28 2011-10-05 Guangzhou Solderwell Entpr Co Ltd Procédé de réduction d'écume de brasure sans plomb
CN115255710A (zh) * 2022-07-15 2022-11-01 郑州轻工业大学 一种含有Sn、Cu的高熵合金软钎料及其制备方法
CN115255710B (zh) * 2022-07-15 2024-04-26 郑州轻工业大学 一种含有Sn、Cu的高熵合金软钎料及其制备方法

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