JP2003124286A - 工程間搬送システムおよび工程間搬送方法 - Google Patents

工程間搬送システムおよび工程間搬送方法

Info

Publication number
JP2003124286A
JP2003124286A JP2001321092A JP2001321092A JP2003124286A JP 2003124286 A JP2003124286 A JP 2003124286A JP 2001321092 A JP2001321092 A JP 2001321092A JP 2001321092 A JP2001321092 A JP 2001321092A JP 2003124286 A JP2003124286 A JP 2003124286A
Authority
JP
Japan
Prior art keywords
stocker
bay
semi
storage shelf
storage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2001321092A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003124286A5 (enExample
Inventor
Hirofumi Otsuka
浩文 大塚
Ryoji Ogata
良二 尾形
Taichi Yanaru
太一 矢鳴
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Semiconductor Engineering Corp
Mitsubishi Electric Corp
Original Assignee
Renesas Semiconductor Engineering Corp
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Semiconductor Engineering Corp, Mitsubishi Electric Corp filed Critical Renesas Semiconductor Engineering Corp
Priority to JP2001321092A priority Critical patent/JP2003124286A/ja
Priority to US10/115,009 priority patent/US6733243B2/en
Priority to TW091112088A priority patent/TW536514B/zh
Publication of JP2003124286A publication Critical patent/JP2003124286A/ja
Publication of JP2003124286A5 publication Critical patent/JP2003124286A5/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

Landscapes

  • Engineering & Computer Science (AREA)
  • Automation & Control Theory (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Warehouses Or Storage Devices (AREA)
JP2001321092A 2001-10-18 2001-10-18 工程間搬送システムおよび工程間搬送方法 Pending JP2003124286A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001321092A JP2003124286A (ja) 2001-10-18 2001-10-18 工程間搬送システムおよび工程間搬送方法
US10/115,009 US6733243B2 (en) 2001-10-18 2002-04-04 Method of interbay transportation
TW091112088A TW536514B (en) 2001-10-18 2002-06-05 Interbay transportation system and method of interbay transportation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001321092A JP2003124286A (ja) 2001-10-18 2001-10-18 工程間搬送システムおよび工程間搬送方法

Publications (2)

Publication Number Publication Date
JP2003124286A true JP2003124286A (ja) 2003-04-25
JP2003124286A5 JP2003124286A5 (enExample) 2005-05-26

Family

ID=19138377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001321092A Pending JP2003124286A (ja) 2001-10-18 2001-10-18 工程間搬送システムおよび工程間搬送方法

Country Status (3)

Country Link
US (1) US6733243B2 (enExample)
JP (1) JP2003124286A (enExample)
TW (1) TW536514B (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006298562A (ja) * 2005-04-20 2006-11-02 Matsushita Electric Ind Co Ltd 搬送システムの制御方法および搬送システム
JP2006310330A (ja) * 2004-02-28 2006-11-09 Applied Materials Inc 電子デバイス製造設備内において、基板キャリアを搬送するための方法及び装置
JP2007161353A (ja) * 2005-12-09 2007-06-28 Murata Mach Ltd 搬送システム
JP2012009584A (ja) * 2010-06-24 2012-01-12 Denso Corp 搬送システムおよびその制御方法
JP2012231117A (ja) * 2011-04-11 2012-11-22 Hitachi Kokusai Electric Inc 基板処理装置、基板処理装置制御プログラム、及び半導体装置の製造方法
JP2013105844A (ja) * 2011-11-11 2013-05-30 Denso Corp 搬送システムおよびその制御方法
JP2018093131A (ja) * 2016-12-07 2018-06-14 株式会社デンソー 搬送システム
JP2021176161A (ja) * 2020-05-01 2021-11-04 パナソニックＩｐマネジメント株式会社 搬送方法および搬送管理装置

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI256372B (en) * 2001-12-27 2006-06-11 Tokyo Electron Ltd Carrier system of polishing processing body and conveying method of polishing processing body
US7778721B2 (en) 2003-01-27 2010-08-17 Applied Materials, Inc. Small lot size lithography bays
US7221993B2 (en) 2003-01-27 2007-05-22 Applied Materials, Inc. Systems and methods for transferring small lot size substrate carriers between processing tools
US6931303B2 (en) * 2003-10-02 2005-08-16 Taiwan Semiconductor Manufacturing Co., Ltd. Integrated transport system
US7076326B2 (en) * 2003-10-06 2006-07-11 Intel Corporation Proactive staging for distributed material handling
US7720557B2 (en) * 2003-11-06 2010-05-18 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US7218983B2 (en) 2003-11-06 2007-05-15 Applied Materials, Inc. Method and apparatus for integrating large and small lot electronic device fabrication facilities
US20050209721A1 (en) * 2003-11-06 2005-09-22 Applied Materials, Inc. Methods and apparatus for enhanced operation of substrate carrier handlers
US7099739B2 (en) * 2003-12-09 2006-08-29 Taiwan Semiconductor Manufacturing Co., Ltd. Stocker utilization self-balancing system and method
JP4490124B2 (ja) * 2004-01-23 2010-06-23 セイコーエプソン株式会社 搬送状況提示システムおよび方法、プログラム並びに情報記憶媒体
US7274971B2 (en) 2004-02-28 2007-09-25 Applied Materials, Inc. Methods and apparatus for electronic device manufacturing system monitoring and control
TWI316044B (en) * 2004-02-28 2009-10-21 Applied Materials Inc Methods and apparatus for material control system interface
US20060224272A1 (en) * 2005-03-31 2006-10-05 Bo Li Method for managing the storage of semiconductor material
US20070059153A1 (en) * 2005-09-14 2007-03-15 Applied Materials, Inc. Methods and apparatus for a transport lift assembly
US7637708B2 (en) * 2006-01-09 2009-12-29 Sumco Corporation Production system for wafer
US7720564B2 (en) * 2006-02-21 2010-05-18 Taiwan Semiconductor Manufacturing Co., Ltd. Systems and methods for cross-intrabay transport
WO2007107983A2 (en) * 2006-03-17 2007-09-27 Shlomo Shmuelov Storage and purge system for semiconductor wafers
JPWO2008075404A1 (ja) * 2006-12-19 2010-04-02 株式会社システムブイマネジメント 半導体製造システム
US7684888B2 (en) * 2007-05-08 2010-03-23 Taiwan Semiconductor Manufacturing Company, Ltd. Extendable MES for Cross-AMHS Transportation
JP2009087138A (ja) * 2007-10-01 2009-04-23 Elpida Memory Inc 搬送システム、搬送車管理装置、および搬送制御方法
US20110073534A1 (en) * 2009-09-28 2011-03-31 Niels Linge Sorting Installation and Method for Sorting Articles
ATE543759T1 (de) * 2009-11-27 2012-02-15 Psb Intralogistics Gmbh Kommissioniereinrichtung und verfahren zum kommissionieren
JP5748452B2 (ja) * 2010-11-15 2015-07-15 キヤノン株式会社 部品組立システム
CN110967502B (zh) * 2018-09-30 2024-08-13 深圳迈瑞生物医疗电子股份有限公司 进样调度方法、装置、分析检测系统和存储介质

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5024570A (en) * 1988-09-14 1991-06-18 Fujitsu Limited Continuous semiconductor substrate processing system
JPH08339497A (ja) 1995-06-09 1996-12-24 Nippon Steel Corp 車両の運行管理方法
JP3105544B2 (ja) * 1996-03-18 2000-11-06 株式会社小松製作所 ワーク搬送システムの制御装置
JPH1094947A (ja) 1996-09-25 1998-04-14 Calsonic Corp 工場物流システム
JP3055522B2 (ja) 1998-03-19 2000-06-26 日本電気株式会社 無人搬送車異常処理制御方法
US6035245A (en) * 1998-03-24 2000-03-07 Advanced Micro Devices, Inc. Automated material handling system method and arrangement
US6417014B1 (en) * 1999-10-19 2002-07-09 Advanced Micro Devices, Inc. Method and apparatus for reducing wafer to wafer deposition variation

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006310330A (ja) * 2004-02-28 2006-11-09 Applied Materials Inc 電子デバイス製造設備内において、基板キャリアを搬送するための方法及び装置
JP2011119749A (ja) * 2004-02-28 2011-06-16 Applied Materials Inc 電子デバイス製造設備内において、基板キャリアを搬送するための方法及び装置
US8024065B2 (en) 2004-02-28 2011-09-20 Applied Materials, Inc. Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility
JP2006298562A (ja) * 2005-04-20 2006-11-02 Matsushita Electric Ind Co Ltd 搬送システムの制御方法および搬送システム
JP2007161353A (ja) * 2005-12-09 2007-06-28 Murata Mach Ltd 搬送システム
JP2012009584A (ja) * 2010-06-24 2012-01-12 Denso Corp 搬送システムおよびその制御方法
JP2012231117A (ja) * 2011-04-11 2012-11-22 Hitachi Kokusai Electric Inc 基板処理装置、基板処理装置制御プログラム、及び半導体装置の製造方法
JP2013105844A (ja) * 2011-11-11 2013-05-30 Denso Corp 搬送システムおよびその制御方法
TWI476813B (zh) * 2011-11-11 2015-03-11 Denso Corp 轉送系統及其控制方法
JP2018093131A (ja) * 2016-12-07 2018-06-14 株式会社デンソー 搬送システム
JP2021176161A (ja) * 2020-05-01 2021-11-04 パナソニックＩｐマネジメント株式会社 搬送方法および搬送管理装置
JP7417841B2 (ja) 2020-05-01 2024-01-19 パナソニックＩｐマネジメント株式会社 搬送方法および搬送管理装置

Also Published As

Publication number Publication date
TW536514B (en) 2003-06-11
US6733243B2 (en) 2004-05-11
US20030108407A1 (en) 2003-06-12

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