JP2003092471A - 多層配線板、多層配線用基材及びその製造方法 - Google Patents

多層配線板、多層配線用基材及びその製造方法

Info

Publication number
JP2003092471A
JP2003092471A JP2002188664A JP2002188664A JP2003092471A JP 2003092471 A JP2003092471 A JP 2003092471A JP 2002188664 A JP2002188664 A JP 2002188664A JP 2002188664 A JP2002188664 A JP 2002188664A JP 2003092471 A JP2003092471 A JP 2003092471A
Authority
JP
Japan
Prior art keywords
resin film
copper foil
multilayer wiring
conductive paste
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002188664A
Other languages
English (en)
Japanese (ja)
Other versions
JP2003092471A5 (enExample
Inventor
Reiji Higuchi
令史 樋口
Shoji Ito
彰二 伊藤
Satoru Nakao
知 中尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP2002188664A priority Critical patent/JP2003092471A/ja
Priority to TW091115224A priority patent/TW569653B/zh
Priority to US10/190,496 priority patent/US6768064B2/en
Priority to CNB021261636A priority patent/CN1301045C/zh
Priority to KR10-2002-0039998A priority patent/KR100522385B1/ko
Publication of JP2003092471A publication Critical patent/JP2003092471A/ja
Priority to US10/832,433 priority patent/US7122746B2/en
Priority to US10/832,436 priority patent/US6914200B2/en
Publication of JP2003092471A5 publication Critical patent/JP2003092471A5/ja
Pending legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP2002188664A 2001-07-10 2002-06-27 多層配線板、多層配線用基材及びその製造方法 Pending JP2003092471A (ja)

Priority Applications (7)

Application Number Priority Date Filing Date Title
JP2002188664A JP2003092471A (ja) 2001-07-10 2002-06-27 多層配線板、多層配線用基材及びその製造方法
TW091115224A TW569653B (en) 2001-07-10 2002-07-09 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
US10/190,496 US6768064B2 (en) 2001-07-10 2002-07-09 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
CNB021261636A CN1301045C (zh) 2001-07-10 2002-07-10 多层接线板组件制造方法及多层接线板组件
KR10-2002-0039998A KR100522385B1 (ko) 2001-07-10 2002-07-10 다층 회로 기판 어셈블리, 다층 회로 기판 어셈블리 부품및 그들의 제조 방법
US10/832,433 US7122746B2 (en) 2001-07-10 2004-04-27 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof
US10/832,436 US6914200B2 (en) 2001-07-10 2004-04-27 Multilayer wiring board assembly, multilayer wiring board assembly component and method of manufacture thereof

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2001-209595 2001-07-10
JP2001209595 2001-07-10
JP2002188664A JP2003092471A (ja) 2001-07-10 2002-06-27 多層配線板、多層配線用基材及びその製造方法

Publications (2)

Publication Number Publication Date
JP2003092471A true JP2003092471A (ja) 2003-03-28
JP2003092471A5 JP2003092471A5 (enExample) 2005-09-08

Family

ID=26618449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002188664A Pending JP2003092471A (ja) 2001-07-10 2002-06-27 多層配線板、多層配線用基材及びその製造方法

Country Status (1)

Country Link
JP (1) JP2003092471A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014034472A1 (ja) * 2012-08-29 2014-03-06 住友電工プリントサーキット株式会社 両面プリント配線板及びその製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2014034472A1 (ja) * 2012-08-29 2014-03-06 住友電工プリントサーキット株式会社 両面プリント配線板及びその製造方法

Similar Documents

Publication Publication Date Title
KR100573999B1 (ko) 다층 배선판, 다층 배선판용 기재 및 그 제조 방법
KR100522385B1 (ko) 다층 회로 기판 어셈블리, 다층 회로 기판 어셈블리 부품및 그들의 제조 방법
WO2004066697A1 (ja) 多層配線板およびその製造方法
JP2002064270A (ja) 回路基板とその製造方法
JP4305399B2 (ja) 多層プリント配線板の製造方法及び多層プリント配線板
JP2004228165A (ja) 多層配線板およびその製造方法
JP3996521B2 (ja) 多層配線基板用基材の製造方法
JP4121339B2 (ja) 多層配線板の製造方法
JP2003017856A (ja) 多層プリント配線板及びその製造方法
JP2003092471A (ja) 多層配線板、多層配線用基材及びその製造方法
JP2002353619A (ja) 多層配線板、多層配線用基材及びその製造方法
JP2002353622A (ja) 多層配線板、多層配線用基材及びその製造方法
JP2003092469A (ja) 多層配線板、多層配線用基材及びその製造方法
JP2002246745A (ja) 三次元実装パッケージ及びその製造方法、三次元実装パッケージ製造用接着材
JP2003092473A (ja) 多層配線板、多層配線用基材及びその製造方法
JP2004241427A (ja) 配線基板の製造方法
JP2003229665A (ja) 多層フレキシブル配線板及びその製造方法
JP2003092470A (ja) 多層配線板、多層配線用基材及びその製造方法
JP2006237232A (ja) 複合配線基板構造体及びその製造方法
JP2006100703A (ja) リジッド−フレキシブル基板及びその製造方法
JP2005064357A (ja) 多層配線板およびその製造方法
JP2007109697A (ja) 多層プリント配線板及びその製造方法
JP2004281667A (ja) 多層配線板の製造方法
JP2002353621A (ja) 多層配線板、多層配線用基材及びその製造方法
JP2003133674A (ja) 配線基板及び配線基板の製造方法

Legal Events

Date Code Title Description
A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20050316

A621 Written request for application examination

Effective date: 20050316

Free format text: JAPANESE INTERMEDIATE CODE: A621

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070911

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071109

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20071211