JP2002540950A5 - - Google Patents

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Publication number
JP2002540950A5
JP2002540950A5 JP2000610068A JP2000610068A JP2002540950A5 JP 2002540950 A5 JP2002540950 A5 JP 2002540950A5 JP 2000610068 A JP2000610068 A JP 2000610068A JP 2000610068 A JP2000610068 A JP 2000610068A JP 2002540950 A5 JP2002540950 A5 JP 2002540950A5
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JP
Japan
Prior art keywords
layer
pulse
support
thin
optical
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000610068A
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English (en)
Japanese (ja)
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JP5079942B2 (ja
JP2002540950A (ja
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Publication date
Priority claimed from DE19933703A external-priority patent/DE19933703B4/de
Application filed filed Critical
Priority claimed from PCT/EP2000/003132 external-priority patent/WO2000060668A1/de
Publication of JP2002540950A publication Critical patent/JP2002540950A/ja
Publication of JP2002540950A5 publication Critical patent/JP2002540950A5/ja
Application granted granted Critical
Publication of JP5079942B2 publication Critical patent/JP5079942B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000610068A 1999-04-07 2000-04-07 担体材料上の薄層の剥離のための装置及び方法 Expired - Lifetime JP5079942B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
DE19915640.9 1999-04-07
DE19915640 1999-04-07
DE19927529.7 1999-06-16
DE19927529 1999-06-16
DE19933703A DE19933703B4 (de) 1999-04-07 1999-07-19 Vorrichtung und Verfahren zum Abtragen von Schichten auf einer Solarzelle
DE19933703.9 1999-07-19
PCT/EP2000/003132 WO2000060668A1 (de) 1999-04-07 2000-04-07 Vorrichtung und verfahren zum abtragen von dünnen schichten auf einem trägermaterial

Publications (3)

Publication Number Publication Date
JP2002540950A JP2002540950A (ja) 2002-12-03
JP2002540950A5 true JP2002540950A5 (enExample) 2011-07-07
JP5079942B2 JP5079942B2 (ja) 2012-11-21

Family

ID=27219072

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000610068A Expired - Lifetime JP5079942B2 (ja) 1999-04-07 2000-04-07 担体材料上の薄層の剥離のための装置及び方法

Country Status (6)

Country Link
US (1) US6566628B2 (enExample)
EP (1) EP1166358B1 (enExample)
JP (1) JP5079942B2 (enExample)
CN (1) CN1211862C (enExample)
AU (1) AU4398700A (enExample)
WO (1) WO2000060668A1 (enExample)

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JP5340807B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハの加工方法
JP5340806B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
JP5582796B2 (ja) * 2010-01-22 2014-09-03 日立造船株式会社 レーザによる薄膜除去方法
DE102010032958A1 (de) * 2010-07-30 2012-02-02 Messer Cutting & Welding Gmbh Verfahren und Vorrichtung zum thermischen Bearbeiten eines Werkstücks mittels Laserstrahl
KR101282053B1 (ko) * 2010-10-13 2013-07-04 한국표준과학연구원 레이저 다중 선로 공정에 의한 웨이퍼 미세 가공 방법 및 장치
CN102110745B (zh) * 2010-12-20 2012-07-04 东莞宏威薄膜真空技术有限公司 薄膜层边缘清除装置及清除方法
US8962424B2 (en) 2011-03-03 2015-02-24 Palo Alto Research Center Incorporated N-type silicon solar cell with contact/protection structures
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US20160184926A1 (en) * 2014-12-30 2016-06-30 Suss Microtec Photonic Systems Inc. Laser ablation system including variable energy beam to minimize etch-stop material damage
JP2018526217A (ja) * 2015-05-14 2018-09-13 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ 低吸収特性を有するレーザー波長を利用した透過性材料の除去方法
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