CN1211862C - 衬底薄膜烧蚀方法及其设备 - Google Patents

衬底薄膜烧蚀方法及其设备 Download PDF

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Publication number
CN1211862C
CN1211862C CNB008059772A CN00805977A CN1211862C CN 1211862 C CN1211862 C CN 1211862C CN B008059772 A CNB008059772 A CN B008059772A CN 00805977 A CN00805977 A CN 00805977A CN 1211862 C CN1211862 C CN 1211862C
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CN
China
Prior art keywords
machining beams
workpiece
light pulse
pulse
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CNB008059772A
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English (en)
Chinese (zh)
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CN1346517A (zh
Inventor
赫尔穆特·沃格特
弗朗茨·卡格
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SolarWorld Industries Deutschland GmbH
Original Assignee
Siemens Solar GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE19933703A external-priority patent/DE19933703B4/de
Application filed by Siemens Solar GmbH filed Critical Siemens Solar GmbH
Publication of CN1346517A publication Critical patent/CN1346517A/zh
Application granted granted Critical
Publication of CN1211862C publication Critical patent/CN1211862C/zh
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08Devices involving relative movement between laser beam and workpiece
    • B23K26/083Devices involving movement of the workpiece in at least one axial direction
    • B23K26/0853Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/361Removing material for deburring or mechanical trimming
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10FINORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F71/00Manufacture or treatment of devices covered by this subclass

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Laser Beam Processing (AREA)
  • Photovoltaic Devices (AREA)
CNB008059772A 1999-04-07 2000-04-07 衬底薄膜烧蚀方法及其设备 Expired - Lifetime CN1211862C (zh)

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
DE19915640.9 1999-04-07
DE19915640 1999-04-07
DE19927529 1999-06-16
DE19927529.7 1999-06-16
DE19933703A DE19933703B4 (de) 1999-04-07 1999-07-19 Vorrichtung und Verfahren zum Abtragen von Schichten auf einer Solarzelle
DE19933703.9 1999-07-19

Publications (2)

Publication Number Publication Date
CN1346517A CN1346517A (zh) 2002-04-24
CN1211862C true CN1211862C (zh) 2005-07-20

Family

ID=27219072

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB008059772A Expired - Lifetime CN1211862C (zh) 1999-04-07 2000-04-07 衬底薄膜烧蚀方法及其设备

Country Status (6)

Country Link
US (1) US6566628B2 (enExample)
EP (1) EP1166358B1 (enExample)
JP (1) JP5079942B2 (enExample)
CN (1) CN1211862C (enExample)
AU (1) AU4398700A (enExample)
WO (1) WO2000060668A1 (enExample)

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US8846431B2 (en) 2011-03-03 2014-09-30 Palo Alto Research Center Incorporated N-type silicon solar cell with contact/protection structures

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CN100591458C (zh) * 2004-09-29 2010-02-24 三菱麻铁里亚尔株式会社 激光加工方法以及激光加工装置
US20070107773A1 (en) 2005-11-17 2007-05-17 Palo Alto Research Center Incorporated Bifacial cell with extruded gridline metallization
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US20070272666A1 (en) * 2006-05-25 2007-11-29 O'brien James N Infrared laser wafer scribing using short pulses
US7928015B2 (en) 2006-12-12 2011-04-19 Palo Alto Research Center Incorporated Solar cell fabrication using extruded dopant-bearing materials
DE102007015767A1 (de) * 2007-03-30 2008-10-02 Oerlikon Optics UK Ltd., Yarnton Methode zum Laserritzen von Solarzellen
US7954449B2 (en) 2007-05-08 2011-06-07 Palo Alto Research Center Incorporated Wiring-free, plumbing-free, cooled, vacuum chuck
EP3333280A1 (en) 2007-09-12 2018-06-13 Flisom AG Method for manufacturing a compound film with compositional grading
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DE102008047675B4 (de) * 2008-06-13 2014-05-15 Ctf Solar Gmbh Recycling-Verfahren für Dünnschichtsolarzellenmodule
US9150966B2 (en) 2008-11-14 2015-10-06 Palo Alto Research Center Incorporated Solar cell metallization using inline electroless plating
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JP4773544B2 (ja) 2009-04-17 2011-09-14 昭和シェル石油株式会社 エッジスペースを備えた太陽電池モジュールの製造方法
JP4773543B2 (ja) 2009-04-17 2011-09-14 昭和シェル石油株式会社 エッジスペースを備えた太陽電池モジュール
JP5340807B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハの加工方法
JP5340806B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
JP5582796B2 (ja) * 2010-01-22 2014-09-03 日立造船株式会社 レーザによる薄膜除去方法
DE102010032958A1 (de) * 2010-07-30 2012-02-02 Messer Cutting & Welding Gmbh Verfahren und Vorrichtung zum thermischen Bearbeiten eines Werkstücks mittels Laserstrahl
KR101282053B1 (ko) * 2010-10-13 2013-07-04 한국표준과학연구원 레이저 다중 선로 공정에 의한 웨이퍼 미세 가공 방법 및 장치
CN102110745B (zh) * 2010-12-20 2012-07-04 东莞宏威薄膜真空技术有限公司 薄膜层边缘清除装置及清除方法
US8461481B2 (en) * 2011-04-19 2013-06-11 Primestar Solar, Inc. Methods and apparatus for reducing variations in the laser intensity during scribing a photovoltaic device
CN102759863B (zh) * 2011-04-27 2015-12-02 瑞世达科技(厦门)有限公司 激光光刻机
CN102692447B (zh) * 2012-06-11 2014-04-02 燕山大学 小型化强脉冲单轨放电烧蚀装置
US20160184926A1 (en) * 2014-12-30 2016-06-30 Suss Microtec Photonic Systems Inc. Laser ablation system including variable energy beam to minimize etch-stop material damage
CN107624086A (zh) * 2015-05-14 2018-01-23 应用材料公司 使用具有低吸收特性的激光波长来移除透明材料的方法
US20170301928A1 (en) 2016-04-14 2017-10-19 Applied Materials, Inc. Device and method for maskless thin film etching
EP3490011A1 (de) * 2017-11-23 2019-05-29 International Solar Energy Research Center Konstanz E.V. Verfahren zur laserablation bei der herstellung von solarzellen
CN108913902A (zh) * 2018-07-17 2018-11-30 成都中建材光电材料有限公司 一种薄膜太阳能电池组件的激光蒸发回收处理方法
CN108807602A (zh) * 2018-07-23 2018-11-13 北京铂阳顶荣光伏科技有限公司 一种薄膜太阳能基板电池材料的回收装置和回收方法
WO2020083970A1 (en) * 2018-10-23 2020-04-30 Hoffmann-La Roche Inc. Distance-based tissue state determination
WO2021237095A1 (en) * 2020-05-22 2021-11-25 Bold Laser Automation, Inc. High velocity vacuum system for laser ablation

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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8426724B2 (en) 2008-09-09 2013-04-23 Palo Alto Research Center Incorporated Interdigitated back contact silicon solar cells with separating grooves
US9054237B2 (en) 2008-09-09 2015-06-09 Palo Alto Research Center Incorporated Interdigitated back contact silicon solar cells fabrication using diffusion barriers
US8846431B2 (en) 2011-03-03 2014-09-30 Palo Alto Research Center Incorporated N-type silicon solar cell with contact/protection structures
US8962424B2 (en) 2011-03-03 2015-02-24 Palo Alto Research Center Incorporated N-type silicon solar cell with contact/protection structures

Also Published As

Publication number Publication date
WO2000060668A1 (de) 2000-10-12
AU4398700A (en) 2000-10-23
CN1346517A (zh) 2002-04-24
US20020074318A1 (en) 2002-06-20
JP5079942B2 (ja) 2012-11-21
JP2002540950A (ja) 2002-12-03
EP1166358B1 (de) 2012-03-14
EP1166358A1 (de) 2002-01-02
US6566628B2 (en) 2003-05-20

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