JP2002530631A - 反射表面のナノメートルスケールの形態測定のための検出システム - Google Patents

反射表面のナノメートルスケールの形態測定のための検出システム

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Publication number
JP2002530631A
JP2002530631A JP2000582761A JP2000582761A JP2002530631A JP 2002530631 A JP2002530631 A JP 2002530631A JP 2000582761 A JP2000582761 A JP 2000582761A JP 2000582761 A JP2000582761 A JP 2000582761A JP 2002530631 A JP2002530631 A JP 2002530631A
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JP
Japan
Prior art keywords
array
elements
sample
weighting
optical
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
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JP2000582761A
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English (en)
Japanese (ja)
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JP2002530631A5 (enExample
Inventor
ハインリック ケイ ニールセン
ライオネル クールマン
マーク ノークス
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ケーエルエー−テンカー コーポレイション
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Application filed by ケーエルエー−テンカー コーポレイション filed Critical ケーエルエー−テンカー コーポレイション
Publication of JP2002530631A publication Critical patent/JP2002530631A/ja
Publication of JP2002530631A5 publication Critical patent/JP2002530631A5/ja
Pending legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/9501—Semiconductor wafers

Landscapes

  • General Health & Medical Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Investigating Or Analysing Materials By Optical Means (AREA)
JP2000582761A 1998-11-18 1999-11-18 反射表面のナノメートルスケールの形態測定のための検出システム Pending JP2002530631A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/195,533 US6999183B2 (en) 1998-11-18 1998-11-18 Detection system for nanometer scale topographic measurements of reflective surfaces
US09/195,533 1998-11-18
PCT/US1999/027464 WO2000029807A2 (en) 1998-11-18 1999-11-18 Detection system for nanometer scale topographic measurements of reflective surfaces

Publications (2)

Publication Number Publication Date
JP2002530631A true JP2002530631A (ja) 2002-09-17
JP2002530631A5 JP2002530631A5 (enExample) 2006-07-20

Family

ID=22721777

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000582761A Pending JP2002530631A (ja) 1998-11-18 1999-11-18 反射表面のナノメートルスケールの形態測定のための検出システム

Country Status (6)

Country Link
US (3) US6999183B2 (enExample)
EP (1) EP1131623B1 (enExample)
JP (1) JP2002530631A (enExample)
AU (1) AU1738600A (enExample)
DE (1) DE69940702D1 (enExample)
WO (1) WO2000029807A2 (enExample)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006133026A (ja) * 2004-11-04 2006-05-25 Hitachi High-Technologies Corp 外観検査装置
WO2015107795A1 (ja) * 2014-01-20 2015-07-23 株式会社日立ハイテクノロジーズ 検査装置および計測装置
CN108844488A (zh) * 2018-06-20 2018-11-20 中国科学院上海光学精密机械研究所 环形抛光沥青盘表面面形在线监控装置及监控方法
JP2022502676A (ja) * 2018-09-04 2022-01-11 ケーエルエー コーポレイション 多波長インタフェロメトリによる欠陥分類

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US9097645B2 (en) * 2013-08-23 2015-08-04 Kla-Tencor Corporation Method and system for high speed height control of a substrate surface within a wafer inspection system
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CN107430263B (zh) 2014-12-23 2020-12-01 苹果公司 具有平均照明路径和平均收集路径的共焦检查系统
KR102615932B1 (ko) 2015-09-01 2023-12-21 애플 인크. 물질의 비접촉 감지를 위한 레퍼런스 스위치 아키텍처
US9958257B2 (en) 2015-09-21 2018-05-01 Kla-Tencor Corporation Increasing dynamic range of a height sensor for inspection and metrology
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US10504805B2 (en) * 2017-08-24 2019-12-10 Applied Materials Israel Ltd. Method of examining defects in a semiconductor specimen and system thereof
EP3688446A2 (en) 2017-09-29 2020-08-05 Apple Inc. Resolve path optical sampling architectures
CN114545550B (zh) 2018-02-13 2024-05-28 苹果公司 具有集成边缘外耦合器的集成光子装置
US11852318B2 (en) 2020-09-09 2023-12-26 Apple Inc. Optical system for noise mitigation
CN119334880A (zh) * 2024-12-24 2025-01-21 上海优睿谱半导体设备有限公司 晶圆缺陷检测系统及方法

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Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006133026A (ja) * 2004-11-04 2006-05-25 Hitachi High-Technologies Corp 外観検査装置
WO2015107795A1 (ja) * 2014-01-20 2015-07-23 株式会社日立ハイテクノロジーズ 検査装置および計測装置
JP2015135300A (ja) * 2014-01-20 2015-07-27 株式会社日立ハイテクノロジーズ 検査装置および計測装置
US9779912B2 (en) 2014-01-20 2017-10-03 Hitachi High-Technologies Corporation Inspection device and measurement device
CN108844488A (zh) * 2018-06-20 2018-11-20 中国科学院上海光学精密机械研究所 环形抛光沥青盘表面面形在线监控装置及监控方法
JP2022502676A (ja) * 2018-09-04 2022-01-11 ケーエルエー コーポレイション 多波長インタフェロメトリによる欠陥分類
JP7219818B2 (ja) 2018-09-04 2023-02-08 ケーエルエー コーポレイション 多波長インタフェロメトリによる欠陥分類

Also Published As

Publication number Publication date
WO2000029807A3 (en) 2000-11-23
WO2000029807A2 (en) 2000-05-25
US20010013936A1 (en) 2001-08-16
US20080225275A1 (en) 2008-09-18
US20060092427A1 (en) 2006-05-04
US7342672B2 (en) 2008-03-11
EP1131623A2 (en) 2001-09-12
EP1131623B1 (en) 2009-04-08
DE69940702D1 (de) 2009-05-20
US6999183B2 (en) 2006-02-14
US8384903B2 (en) 2013-02-26
AU1738600A (en) 2000-06-05

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