JP2002527551A5 - - Google Patents
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- Publication number
- JP2002527551A5 JP2002527551A5 JP2000575924A JP2000575924A JP2002527551A5 JP 2002527551 A5 JP2002527551 A5 JP 2002527551A5 JP 2000575924 A JP2000575924 A JP 2000575924A JP 2000575924 A JP2000575924 A JP 2000575924A JP 2002527551 A5 JP2002527551 A5 JP 2002527551A5
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- frame
- composition
- panel
- chain
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000003822 epoxy resin Substances 0.000 description 11
- 229920000647 polyepoxide Polymers 0.000 description 11
- 239000003054 catalyst Substances 0.000 description 6
- 239000004970 Chain extender Substances 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 5
- 230000001070 adhesive effect Effects 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 3
- 229920006332 epoxy adhesive Polymers 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- 239000012745 toughening agent Substances 0.000 description 3
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical group OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- -1 cyclic amidine Chemical class 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 150000003335 secondary amines Chemical class 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/170,597 US6486256B1 (en) | 1998-10-13 | 1998-10-13 | Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst |
| US09/170,597 | 1998-10-13 | ||
| PCT/US1999/022991 WO2000022024A2 (en) | 1998-10-13 | 1999-09-30 | High strength epoxy adhesive and uses thereof |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010255239A Division JP5744485B2 (ja) | 1998-10-13 | 2010-11-15 | 高強度エポキシ接着剤およびその使用 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002527551A JP2002527551A (ja) | 2002-08-27 |
| JP2002527551A5 true JP2002527551A5 (enExample) | 2006-11-24 |
Family
ID=22620518
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000575924A Withdrawn JP2002527551A (ja) | 1998-10-13 | 1999-09-30 | 高強度エポキシ接着剤およびその使用 |
| JP2010255239A Expired - Fee Related JP5744485B2 (ja) | 1998-10-13 | 2010-11-15 | 高強度エポキシ接着剤およびその使用 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010255239A Expired - Fee Related JP5744485B2 (ja) | 1998-10-13 | 2010-11-15 | 高強度エポキシ接着剤およびその使用 |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US6486256B1 (enExample) |
| EP (1) | EP1141071B1 (enExample) |
| JP (2) | JP2002527551A (enExample) |
| KR (1) | KR100644300B1 (enExample) |
| AU (1) | AU6285299A (enExample) |
| CA (1) | CA2344718C (enExample) |
| DE (1) | DE69927289T2 (enExample) |
| ES (1) | ES2249030T3 (enExample) |
| MX (1) | MX222601B (enExample) |
| WO (1) | WO2000022024A2 (enExample) |
Families Citing this family (98)
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| US7521093B2 (en) | 2004-07-21 | 2009-04-21 | Zephyros, Inc. | Method of sealing an interface |
| US7838589B2 (en) | 2004-07-21 | 2010-11-23 | Zephyros, Inc. | Sealant material |
| US7392929B1 (en) | 2004-07-26 | 2008-07-01 | Zephyros, Inc. | Weldable synthetic material |
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| US20060182949A1 (en) * | 2005-02-17 | 2006-08-17 | 3M Innovative Properties Company | Surfacing and/or joining method |
| AU2012201592B2 (en) * | 2005-02-17 | 2014-01-16 | 3M Innovative Properties Company | Surfacing and/or joining method |
| US20060272724A1 (en) * | 2005-04-26 | 2006-12-07 | Borland Robin N | System and method for pipe repair using fiber wrap and polymeric resin |
| US7240821B2 (en) * | 2005-07-21 | 2007-07-10 | The Boeing Company | Method for joining at least two adjoining work-pieces by friction stir and/or friction stir spot welding |
| WO2007054113A1 (de) * | 2005-11-10 | 2007-05-18 | Henkel Ag & Co. Kgaa | Kleb-, dicht- und beschichtungsstoffe mit glaspartikeln als füllstoff |
| EP1945702A1 (de) * | 2005-11-10 | 2008-07-23 | Henkel AG & Co. KGaA | Kleb-, dicht- und beschichtungsstoffe mit glaspartikeln als füllstoff |
| KR100762214B1 (ko) * | 2006-02-09 | 2007-10-04 | 제이비드 케미칼 주식회사 | 친환경적인 저점도 에폭시 도료 조성물 |
| US7438782B2 (en) * | 2006-06-07 | 2008-10-21 | Zephyros, Inc. | Activatable material for sealing, baffling or reinforcing and method of forming same |
| US7892396B2 (en) * | 2006-06-07 | 2011-02-22 | Zephyros, Inc. | Toughened activatable material for sealing, baffling or reinforcing and method of forming same |
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| DE102006033368A1 (de) * | 2006-07-19 | 2008-01-24 | Wilhelm Karmann Gmbh | Verfahren zur Herstellung einer Verklebung und Fahrzeugdach mit textilem Verdeckstoff |
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| JP2011506638A (ja) * | 2007-12-05 | 2011-03-03 | スリーエム イノベイティブ プロパティズ カンパニー | 構造用接着剤に結合されたアセンブリ、並びにこれを作製するための方法及びアプリケータ |
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| EP2315741B1 (en) | 2008-07-23 | 2015-04-08 | 3M Innovative Properties Company | Reactive liquid modifiers |
| CN102119201B (zh) * | 2008-08-11 | 2013-07-03 | 陶氏环球技术有限责任公司 | 含有用酚和羟基封端的丙烯酸酯或羟基封端的甲基丙烯酸酯封端的弹性体增韧剂的单组分结构环氧树脂粘合剂 |
| US9745412B2 (en) * | 2009-01-09 | 2017-08-29 | Nagase Chemtex Corporation | Process for production of thermoplastic cured epoxy resin with transparency to visible light, and thermoplastic epoxy resin composition |
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| EP2223966B1 (en) * | 2009-02-25 | 2017-08-16 | 3M Innovative Properties Company | Epoxy adhesive compositions with high mechanical strength over a wide temperature range |
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| JPH04275324A (ja) * | 1991-02-28 | 1992-09-30 | Nippon Steel Chem Co Ltd | 半導体封止用樹脂組成物 |
| JP3017562B2 (ja) * | 1991-05-21 | 2000-03-13 | 株式会社巴川製紙所 | 配線基板用エポキシ樹脂組成物 |
| JPH04306224A (ja) * | 1991-04-03 | 1992-10-29 | Toray Ind Inc | エポキシ樹脂組成物 |
| EP0540027B1 (en) | 1991-10-31 | 1999-06-09 | Daicel Chemical Industries, Ltd. | Compositions, expoxidized compositions, a heat-curable resin composition, an epoxy resin composition, radically polymerized composition, a curable resin composition and a polymer having epoxy groups |
| US5280067A (en) * | 1992-06-18 | 1994-01-18 | Minnesota Mining And Manufacturing Company | Substituted pentafluoroantmonic acid-substituted aniline epoxy curing catalysts |
| JP3465153B2 (ja) * | 1994-08-26 | 2003-11-10 | 東都化成株式会社 | 積層板用エポキシ樹脂組成物 |
| US5629380A (en) | 1994-09-19 | 1997-05-13 | Minnesota Mining And Manufacturing Company | Epoxy adhesive composition comprising a calcium salt and mannich base |
| US5712039A (en) | 1995-04-11 | 1998-01-27 | Minnesota Mining And Manufacturing Company | Epoxy adhesives with dithiooxamide adhesion promoters |
| US5591811A (en) | 1995-09-12 | 1997-01-07 | Ciba-Geigy Corporation | 1-imidazolylmethyl-2-naphthols as catalysts for curing epoxy resins |
| KR19990081839A (ko) * | 1996-11-22 | 1999-11-15 | 고지마 아키로 | 열융착성 조성물 및 그것으로 이루어지는 층을 포함하는 복층성형체 |
| JPH1161073A (ja) * | 1997-08-08 | 1999-03-05 | Mitsui Chem Inc | 接着剤組成物 |
-
1998
- 1998-10-13 US US09/170,597 patent/US6486256B1/en not_active Expired - Lifetime
-
1999
- 1999-09-30 CA CA002344718A patent/CA2344718C/en not_active Expired - Fee Related
- 1999-09-30 ES ES99950127T patent/ES2249030T3/es not_active Expired - Lifetime
- 1999-09-30 AU AU62852/99A patent/AU6285299A/en not_active Abandoned
- 1999-09-30 JP JP2000575924A patent/JP2002527551A/ja not_active Withdrawn
- 1999-09-30 EP EP99950127A patent/EP1141071B1/en not_active Expired - Lifetime
- 1999-09-30 WO PCT/US1999/022991 patent/WO2000022024A2/en not_active Ceased
- 1999-09-30 KR KR1020017004580A patent/KR100644300B1/ko not_active Expired - Fee Related
- 1999-09-30 DE DE69927289T patent/DE69927289T2/de not_active Expired - Lifetime
-
2001
- 2001-04-10 MX MXPA01003703 patent/MX222601B/es not_active IP Right Cessation
-
2002
- 2002-09-16 US US10/244,326 patent/US6800157B2/en not_active Expired - Lifetime
-
2010
- 2010-11-15 JP JP2010255239A patent/JP5744485B2/ja not_active Expired - Fee Related
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