CN104520397B - 粘合剂沉积用方法和设备 - Google Patents
粘合剂沉积用方法和设备 Download PDFInfo
- Publication number
- CN104520397B CN104520397B CN201380040884.7A CN201380040884A CN104520397B CN 104520397 B CN104520397 B CN 104520397B CN 201380040884 A CN201380040884 A CN 201380040884A CN 104520397 B CN104520397 B CN 104520397B
- Authority
- CN
- China
- Prior art keywords
- presoma
- base material
- precursor layer
- tunic
- particle
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000011230 binding agent Substances 0.000 title description 8
- 238000000151 deposition Methods 0.000 title description 7
- 239000002243 precursor Substances 0.000 claims abstract description 66
- 238000000034 method Methods 0.000 claims abstract description 33
- MEYZYGMYMLNUHJ-UHFFFAOYSA-N tunicamycin Natural products CC(C)CCCCCCCCCC=CC(=O)NC1C(O)C(O)C(CC(O)C2OC(C(O)C2O)N3C=CC(=O)NC3=O)OC1OC4OC(CO)C(O)C(O)C4NC(=O)C MEYZYGMYMLNUHJ-UHFFFAOYSA-N 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims description 121
- 239000000203 mixture Substances 0.000 claims description 38
- 239000002245 particle Substances 0.000 claims description 34
- 239000004593 Epoxy Substances 0.000 claims description 33
- 229920000647 polyepoxide Polymers 0.000 claims description 30
- 239000003795 chemical substances by application Substances 0.000 claims description 29
- 125000003700 epoxy group Chemical group 0.000 claims description 29
- 229920001971 elastomer Polymers 0.000 claims description 27
- 239000000806 elastomer Substances 0.000 claims description 24
- 229920000642 polymer Polymers 0.000 claims description 19
- 238000002360 preparation method Methods 0.000 claims description 18
- 230000004913 activation Effects 0.000 claims description 14
- 238000004132 cross linking Methods 0.000 claims description 11
- 229920001169 thermoplastic Polymers 0.000 claims description 11
- 239000007787 solid Substances 0.000 claims description 10
- 239000004416 thermosoftening plastic Substances 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000007711 solidification Methods 0.000 claims description 9
- 230000008023 solidification Effects 0.000 claims description 9
- 230000008018 melting Effects 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 5
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 4
- 150000002148 esters Chemical class 0.000 claims description 4
- 239000010959 steel Substances 0.000 claims description 4
- 238000003860 storage Methods 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 238000010438 heat treatment Methods 0.000 claims description 3
- 239000007769 metal material Substances 0.000 claims description 3
- 229920001568 phenolic resin Polymers 0.000 claims description 3
- 239000005011 phenolic resin Substances 0.000 claims description 3
- 229920001187 thermosetting polymer Polymers 0.000 claims description 3
- 239000004433 Thermoplastic polyurethane Substances 0.000 claims description 2
- 230000005489 elastic deformation Effects 0.000 claims description 2
- 229920001038 ethylene copolymer Polymers 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 229920002803 thermoplastic polyurethane Polymers 0.000 claims description 2
- 150000002739 metals Chemical class 0.000 claims 1
- 239000002904 solvent Substances 0.000 claims 1
- 230000006641 stabilisation Effects 0.000 claims 1
- 238000011105 stabilization Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 31
- 230000001070 adhesive effect Effects 0.000 abstract description 31
- 238000005367 electrostatic precipitation Methods 0.000 abstract description 5
- 239000004615 ingredient Substances 0.000 abstract description 3
- 239000010410 layer Substances 0.000 description 63
- 239000000047 product Substances 0.000 description 25
- -1 polyethylene Polymers 0.000 description 20
- 238000001723 curing Methods 0.000 description 14
- 238000000576 coating method Methods 0.000 description 11
- 229920001577 copolymer Polymers 0.000 description 11
- 239000000945 filler Substances 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 10
- 239000000843 powder Substances 0.000 description 10
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical group C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 8
- 239000011162 core material Substances 0.000 description 8
- 239000002861 polymer material Substances 0.000 description 8
- 239000011257 shell material Substances 0.000 description 8
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 7
- 230000008859 change Effects 0.000 description 7
- 239000004927 clay Substances 0.000 description 5
- 239000011258 core-shell material Substances 0.000 description 5
- 229920002647 polyamide Polymers 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 3
- 150000001336 alkenes Chemical class 0.000 description 3
- 230000008021 deposition Effects 0.000 description 3
- 239000000178 monomer Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 3
- 229920000058 polyacrylate Polymers 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229920000573 polyethylene Polymers 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000005060 rubber Substances 0.000 description 3
- KUBDPQJOLOUJRM-UHFFFAOYSA-N 2-(chloromethyl)oxirane;4-[2-(4-hydroxyphenyl)propan-2-yl]phenol Chemical compound ClCC1CO1.C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 KUBDPQJOLOUJRM-UHFFFAOYSA-N 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 2
- SOGAXMICEFXMKE-UHFFFAOYSA-N Butylmethacrylate Chemical compound CCCCOC(=O)C(C)=C SOGAXMICEFXMKE-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 229920002943 EPDM rubber Polymers 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 2
- GLUUGHFHXGJENI-UHFFFAOYSA-N Piperazine Chemical compound C1CNCCN1 GLUUGHFHXGJENI-UHFFFAOYSA-N 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- 229920002367 Polyisobutene Polymers 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- 150000001242 acetic acid derivatives Chemical class 0.000 description 2
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229940106691 bisphenol a Drugs 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 239000007795 chemical reaction product Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229930003836 cresol Natural products 0.000 description 2
- GUJOJGAPFQRJSV-UHFFFAOYSA-N dialuminum;dioxosilane;oxygen(2-);hydrate Chemical compound O.[O-2].[O-2].[O-2].[Al+3].[Al+3].O=[Si]=O.O=[Si]=O.O=[Si]=O.O=[Si]=O GUJOJGAPFQRJSV-UHFFFAOYSA-N 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical class NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- 238000007786 electrostatic charging Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000005415 magnetization Effects 0.000 description 2
- 150000004702 methyl esters Chemical class 0.000 description 2
- 229910052901 montmorillonite Inorganic materials 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229920006287 phenoxy resin Polymers 0.000 description 2
- 239000013034 phenoxy resin Substances 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- 229920001195 polyisoprene Polymers 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 229920000638 styrene acrylonitrile Polymers 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000000454 talc Substances 0.000 description 2
- 229910052623 talc Inorganic materials 0.000 description 2
- 235000012222 talc Nutrition 0.000 description 2
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- MUZDXNQOSGWMJJ-UHFFFAOYSA-N 2-methylprop-2-enoic acid;prop-2-enoic acid Chemical compound OC(=O)C=C.CC(=C)C(O)=O MUZDXNQOSGWMJJ-UHFFFAOYSA-N 0.000 description 1
- XOJWAAUYNWGQAU-UHFFFAOYSA-N 4-(2-methylprop-2-enoyloxy)butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCOC(=O)C(C)=C XOJWAAUYNWGQAU-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical class [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 1
- QGZKDVFQNNGYKY-UHFFFAOYSA-O Ammonium Chemical compound [NH4+] QGZKDVFQNNGYKY-UHFFFAOYSA-O 0.000 description 1
- NOWKCMXCCJGMRR-UHFFFAOYSA-N Aziridine Chemical compound C1CN1 NOWKCMXCCJGMRR-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical class NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical group CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 244000043261 Hevea brasiliensis Species 0.000 description 1
- 229920000271 Kevlar® Polymers 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 1
- 229920001665 Poly-4-vinylphenol Polymers 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 1
- 239000004113 Sepiolite Substances 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- 239000002174 Styrene-butadiene Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 150000008065 acid anhydrides Chemical class 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 229920006243 acrylic copolymer Polymers 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000008360 acrylonitriles Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- WVILKCQOUPGWSM-UHFFFAOYSA-N benzyl(dimethyl)-$l^{3}-chlorane Chemical compound CCl(C)CC1=CC=CC=C1 WVILKCQOUPGWSM-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 description 1
- 210000000988 bone and bone Anatomy 0.000 description 1
- VZIBAPMSKYQDFH-UHFFFAOYSA-N buta-1,3-diene;2-methylprop-2-enoic acid;prop-2-enenitrile;styrene Chemical compound C=CC=C.C=CC#N.CC(=C)C(O)=O.C=CC1=CC=CC=C1 VZIBAPMSKYQDFH-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical compound C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 description 1
- 229920005549 butyl rubber Polymers 0.000 description 1
- KVNRLNFWIYMESJ-UHFFFAOYSA-N butyronitrile Chemical compound CCCC#N KVNRLNFWIYMESJ-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 229910001919 chlorite Inorganic materials 0.000 description 1
- 229910052619 chlorite group Inorganic materials 0.000 description 1
- QBWCMBCROVPCKQ-UHFFFAOYSA-N chlorous acid Chemical compound OCl=O QBWCMBCROVPCKQ-UHFFFAOYSA-N 0.000 description 1
- 229920006026 co-polymeric resin Polymers 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- 238000000113 differential scanning calorimetry Methods 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 238000006471 dimerization reaction Methods 0.000 description 1
- 238000004924 electrostatic deposition Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000005007 epoxy-phenolic resin Substances 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 239000010433 feldspar Substances 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000003682 fluorination reaction Methods 0.000 description 1
- 238000005755 formation reaction Methods 0.000 description 1
- 238000009472 formulation Methods 0.000 description 1
- 239000003205 fragrance Substances 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 229920002681 hypalon Polymers 0.000 description 1
- 229910052900 illite Inorganic materials 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000004761 kevlar Substances 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000012802 nanoclay Substances 0.000 description 1
- 229920003052 natural elastomer Polymers 0.000 description 1
- 229920001194 natural rubber Polymers 0.000 description 1
- VGIBGUSAECPPNB-UHFFFAOYSA-L nonaaluminum;magnesium;tripotassium;1,3-dioxido-2,4,5-trioxa-1,3-disilabicyclo[1.1.1]pentane;iron(2+);oxygen(2-);fluoride;hydroxide Chemical compound [OH-].[O-2].[O-2].[O-2].[O-2].[O-2].[F-].[Mg+2].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[Al+3].[K+].[K+].[K+].[Fe+2].O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2.O1[Si]2([O-])O[Si]1([O-])O2 VGIBGUSAECPPNB-UHFFFAOYSA-L 0.000 description 1
- 229910000273 nontronite Inorganic materials 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 150000002926 oxygen Chemical class 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001084 poly(chloroprene) Polymers 0.000 description 1
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 1
- 229920002627 poly(phosphazenes) Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920000768 polyamine Polymers 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 239000004926 polymethyl methacrylate Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000005077 polysulfide Substances 0.000 description 1
- 229920001021 polysulfide Polymers 0.000 description 1
- 150000008117 polysulfides Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920002689 polyvinyl acetate Polymers 0.000 description 1
- 239000011118 polyvinyl acetate Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- FBCQUCJYYPMKRO-UHFFFAOYSA-N prop-2-enyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC=C FBCQUCJYYPMKRO-UHFFFAOYSA-N 0.000 description 1
- 229910052903 pyrophyllite Inorganic materials 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000011084 recovery Methods 0.000 description 1
- 238000007142 ring opening reaction Methods 0.000 description 1
- 229910000275 saponite Inorganic materials 0.000 description 1
- 229910000276 sauconite Inorganic materials 0.000 description 1
- 229910052624 sepiolite Inorganic materials 0.000 description 1
- 235000019355 sepiolite Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 239000011115 styrene butadiene Substances 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- 239000004408 titanium dioxide Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 229960001124 trientine Drugs 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 229910052902 vermiculite Inorganic materials 0.000 description 1
- 239000010455 vermiculite Substances 0.000 description 1
- 235000019354 vermiculite Nutrition 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
- B05D1/04—Processes for applying liquids or other fluent materials performed by spraying involving the use of an electrostatic field
- B05D1/06—Applying particulate materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/02—Processes for applying liquids or other fluent materials performed by spraying
- B05D1/12—Applying particulate materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/28—Processes for applying liquids or other fluent materials performed by transfer from the surfaces of elements carrying the liquid or other fluent material, e.g. brushes, pads, rollers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D5/00—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures
- B05D5/10—Processes for applying liquids or other fluent materials to surfaces to obtain special surface effects, finishes or structures to obtain an adhesive surface
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/002—Joining methods not otherwise provided for
- B29C65/008—Joining methods not otherwise provided for making use of electrostatic charges
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/486—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by their physical form being non-liquid, e.g. in the form of granules or powders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/48—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding
- B29C65/52—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor using adhesives, i.e. using supplementary joining material; solvent bonding characterised by the way of applying the adhesive
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4014—Nitrogen containing compounds
- C08G59/4021—Ureas; Thioureas; Guanidines; Dicyandiamides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
- C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2202/00—Metallic substrate
- B05D2202/10—Metallic substrate based on Fe
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2503/00—Polyurethanes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D2504/00—Epoxy polymers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D7/00—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials
- B05D7/14—Processes, other than flocking, specially adapted for applying liquids or other fluent materials to particular surfaces or for applying particular liquids or other fluent materials to metal, e.g. car bodies
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1238—Heat-activated adhesive in the form of powder
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2400/00—Presence of inorganic and organic materials
- C09J2400/10—Presence of inorganic materials
- C09J2400/16—Metal
- C09J2400/163—Metal in the substrate
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2463/00—Presence of epoxy resin
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Laminated Bodies (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
公开了一种改善可活化的粘合剂成分的静电沉积的方法。形成所述可活化的粘合剂成分以用于将干燥的粉末状前驱体层转变为前驱体层膜。
Description
技术领域
本发明通常涉及可活化的粘合剂成分的静电沉积。
背景技术
热固性材料的静电沉积提供了能够有精确和一致的层厚度的粉末涂布工艺。对于包括墨、环氧类、聚酯、陶瓷和能够在沉积后短时间固化的其它材料的各种可固化材料,该沉积工艺是共通的。然而,粘合剂材料的静电沉积已经面对大量的挑战,具体地涉及创造适宜粉末形式的粘合剂和创造粘合剂的固化周期的延迟以致固化延迟至期望的活化阶段的问题。粘合剂粉末可以具有形成聚集体和导致发粘基材的趋势,这两种均降低了粘合层的有效性和使用性。进一步,对于静电沉积的材料是共通的即刻的固化,将要求基材即刻粘合至第二基材,这在制造期间不一直是期望的。
发明内容
本技术通过提供一种粘合地结合的制品的形成方法来满足一种以上的上述需要,所述方法包括以下步骤:提供具有至少一个第一表面的至少一个第一基材,并且将用于形成前驱体层(precursor layer)的颗粒静电输送至至少一个第一表面。所述颗粒可以包括用于限定在固化时展示出粘合特性的潜在固化性聚合物材料(latent curing polymericmaterial)的前驱体,其中前驱体层的颗粒具有在约20至约150(50至100)μm的范围内的平均粒径。所述颗粒可以进一步具有的特征在于:包含均一组成(one component)的实质上固体的前驱体配制品(precursor formulation)。然后可以将前驱体层的颗粒物理地转变从而形成实质上非定向熔融(non-oriented fused)的前驱体层膜(precursor layer film),所述实质上非定向熔融的前驱体层膜当在至少一个第一表面上时并且基本上完全地贯穿其保持未暴露至反应活化条件(reaction activation condition)的时期无粘性并且触感干燥。前驱体层膜可以具有小于约0.3mm的大体均一的厚度。然后第二基材可以施加至第一基材的至少一个第一表面从而覆盖前驱体层膜的至少一部分。前驱体层膜可以经历反应活化条件从而引起交联并且限定将至少一个第一基材与至少一个第二基材粘合地结合的交联反应产物材料。
第一基材或第二基材的至少之一可以是金属材料。第一基材和第二基材都可以是金属材料。第一基材或第二基材的至少之一可以是聚合物或复合物材料。第一基材和第二基材都可以是聚合物或复合物材料。第一基材或第二基材中的之一或两者可以具有能够支撑其自重而没有可见的可检测的弹性变形的足够的刚性。第一基材或第二基材的至少之一可以是钢材料。第一基材和第二基材都可以是钢材料。静电输送的步骤(step ofelectrostatically delivering)可包括将前驱体层使用电磁刷印刷设备输送。所述方法可以包括将前驱体层输送至第一基材的轮廓表面(contoured surface)。静电输送的步骤可以包括将足量的前驱体层输送至第一基材以致所得固化和交联的反应产物材料的厚度小于约1mm(小于0.5mm、小于0.1mm或甚至小于0.05mm)。
在静电输送的步骤期间,前驱体配制品可以保持在干燥的固体状态。在一个以上的形成、贮存和沉积期间,前驱体配制品可以保持在粉末状形式。将前驱体配制品静电输送的步骤可以在第一基材和任何分配器(dispenser)之间不存在任何接触下进行,前驱体配制品通过所述分配器输送。将前驱体层膜经历反应活化条件的步骤可以包括将所述膜加热至在用于交联前驱体层膜的交联活化温度(cross-linking activation temperature)之上的温度。将颗粒物理地转变的步骤可以包括将所述颗粒加热至比用于加热所述前驱体层膜的步骤的温度低至少60-80℃的温度的步骤。将颗粒物理地转变的步骤可以包括将所述颗粒加热至前驱体组合物(precursor composition)作为热塑性材料软化和流动、但低于所述前驱体组合物将交联来形成热固性材料的温度。潜在固化性聚合物材料可以包括乙烯共聚物或三元聚合物;苯氧基树脂、酚醛树脂、环氧类、丙烯酸酯类、封端热塑性聚氨酯,或其任意的组合。
将前驱体配制品静电输送的步骤可以重复以致前驱体层膜的厚度增加。将前驱体配制品静电输送的步骤可以在第一基材的一个以上的规定区域中重复以致前驱体层膜的厚度在一个以上的规定区域中增加。可选择地,可以将第二组合物施加至第一组合物。例如调节要结合两种不同基材时的粘合剂的最大性能,这是令人感兴趣的。前驱体配制品从初始形成至物理地转变步骤可以稳定贮存至少六个月、至少一年、或甚至至少五年。前驱体配制品从初始形成至静电输送步骤可以是干燥粉末状形式。
在另一个方面中,此处的教导提供了此处讨论的所述方法的用途,其用于制成结合的汽车组件。其实例公开于2012年7月30日提交的美国申请序列号13/561,442并且在此以参考的方式并入以用于所有目的。在又一个方面中,此处的教导提供了根据此处公开的方法制成的结合的制品。
此处公开的结合方法思考到粘合剂组合物和粘合剂沉积的方法,其中将粉末状粘合剂材料静电地沉积在基材上从而形成前驱体层。然后可以将前驱体层的粉末颗粒物理地转变从而形成实质上非定向熔融的前驱体层膜,所述实质上非定向熔融的前驱体层膜可以随后经历反应活化条件从而引起交联并且限定能够将两个以上基材粘合地结合的交联反应产物材料。
具体实施方式
本申请涉及并且要求于2012年7月30日申请日提交的美国临时申请序列号61/677,234的权益。该申请的内容在此以参考的方式包括以用于所有目的。通常,此处的教导提供了粘合剂组合物,所述粘合剂组合物在贮存期间保持在粉末状形式,并且通过静电沉积过程沉积随后进行多个固化(例如,物理地转变)步骤。粘合剂组合物在其生料(green)(未固化)状态时可以是粉末状形式,沉积在基材上从而形成前驱体层,物理地转变从而形成前驱体层膜,随后经历反应活化条件从而引起交联并且限定为交联反应产物。
在静电沉积过程期间,将粘合剂粉末静电地沉积然后熔融至基材表面上从而形成前驱体层,其实质上是固体膜前驱体层。为了充分地初始粘合至基材并且熔融从而形成前躯体膜,粉末形式的粘合剂可以由颗粒形成,所述颗粒在特定范围(例如,颗粒具有在25μm和125μm之间的直径)内并且具有当粘合剂在其生料状态时促进颗粒对基材表面的充分的粘附的组成,因此要求粉末粘合剂在固化步骤之前粘附。进一步,在粘附至基材并且熔融从而形成前驱体膜层时,粘合剂粉末的组成必须是这样:前驱体膜层实质上无粘性并且触感干燥。粘合剂材料的组成必须是这样:粘合剂可以以粉末状形式形成并且其可以在运输和贮存期间保持粉末状形式。
粘合剂的组成可以是这样:在生料状态时,具有可用于交联的基团的粘合剂的大于50重量%、60重量%、70重量%、80重量%或甚至90重量%(如由差示扫描量热法确定)保持未固化。这是必要的以致粘合剂可以发展对其将要最终结合在一起的基材的适宜的长期耐久粘合性。
通过电磁刷涂布技术可以用于将相对牢固的粘合剂前驱体的相对薄的层沉积至装置的组件上的出人意料的发现,根据本教导,使得实现上述结合的能力是可行的。粘合剂前驱体(即,在其生料状态的粘合剂)是这样:其形成了通常无粘性并且触感干燥的薄膜,因此当组装多个组件时,促进了子组件的操作。
电磁刷沉积技术的普通教导提供于美国专利申请公布20080268166(以参考的方式并入)。见例如第4-6段。将颗粒电磁施涂至基材上的其它实例参照美国专利7,481,884来说明。
简言之,涂布材料的颗粒可以通过使用一个以上的磁刷转移至电活性基材(例如静电带电的一种基材)。涂布材料的颗粒与可具有吸引力的载体颗粒混合。例如,涂布材料的颗粒可以变得静电带电,或相反使其吸引至且粘附至载体颗粒。将所得载体/涂布材料颗粒聚集体转移至一个以上的刷辊,期望地磁化以致磁化载体颗粒与粘附至其的涂布材料颗粒一起有效地吸引到辊上。适宜的电荷可以施加至该体系(例如,刷设备和/或支持基材的设备)从而导致涂布材料颗粒与磁化载体颗粒分离并且转移至基材(例如,当基材接地时)。相应地,载体颗粒保持在辊上,以用于对其它涂布材料颗粒的回收和再使用。
涂布材料颗粒可以包含作为层施涂至一个以上的基材表面的一部分的前驱体材料。前驱体层可以由平均直径为至少约5μm的颗粒组成。前驱体层可以由平均直径为小于约200μm的颗粒组成。前驱体层可以由平均直径为至少约25μm且小于约125μm的颗粒组成。前驱体层可以由平均直径为至少约20μm且小于约150μm的颗粒组成。前驱体层可以由平均直径为至少约20μm且小于约300μm的颗粒组成。前驱体层可以包含可以进行物理转变从而形成结合至前驱体层初始位于的基材的前驱体膜层(例如,实质上固体的前驱体膜层)的材料。如此,涂布材料颗粒可以熔融在一起从而形成前驱体膜层。前驱体层膜可以随后活化从而限定将前驱体层初始位于的基材结合至相邻的基材的交联反应产物。
为了形成首先以粉末状形式存在、然后可以熔融从而形成膜层、随后活化从而固化的期望的粘合剂,粘合剂(例如,前驱体层)可以包括环氧系材料。环氧类可以是含有至少一个环氧官能团的任何二聚、低聚或共聚环氧类材料。此外,术语环氧类可以用于表示一种环氧类或多种环氧类的组合。聚合物系材料可以是通过开环反应可聚合的具有一个以上环氧乙烷环的含环氧材料。前驱体层可以包括多达约80%以上的环氧类。前驱体层可以包括在约2重量%和70重量%之间的环氧类,在约4重量%和30重量%之间的环氧类,或甚至在约7重量%和18重量%之间的环氧类。粘合剂可以实质上没有环氧类材料(除了以环氧类/弹性体加成物的形式供给的任何环氧类以外)。环氧类可以是脂族、脂环族或芳香族等。环氧类可以作为固体(例如,作为粒料、块状或片状等)或液体供给。环氧类可以包括可具有α-烯烃的乙烯共聚物或三元聚合物。优选地,将环氧类添加至前驱体层从而增加前驱体层的粘合性、流动性或这两种。环氧类可以包括酚醛树脂,其可以是酚醛清漆型(例如,环氧线性酚醛树脂、环氧甲酚甲醛树脂或其组合等)或其它类型的树脂。其它优选的含有环氧类的材料包括双酚A表氯醇醚聚合物、或可以由丁二烯或其它聚合物添加剂改性的双酚A环氧树脂。此外,也可以使用几种不同的环氧类的各种混合物。适宜的环氧类的实例在从DowChemical Company,Midland,Michigan可购的商品名(例如,DER 331、DER 661、DER662)下销售。
环氧类可以与热塑性组分组合,所述热塑性组分可以包括苯乙烯类、丙烯腈类、丙烯酸酯类、乙酸酯类、聚酰胺类、聚乙烯类或苯氧基树脂等。热塑性组分可以以前驱体层的至少约5重量%的量存在。热塑性组分可以以前驱体层的至少约20重量%的量存在。热塑性组分可以以前驱体层的至少约60重量%的量存在。热塑性组分可以以前驱体层的小于约80重量%的量存在。热塑性组分可以以前驱体层的小于约30重量%的量存在。
当根据本发明沉思可以使用各种聚合物/弹性体加成物时,一种优选的加成物是环氧类/弹性体加成物。前驱体层可以因此包括含弹性体的加成物。环氧类/弹性体混合物或加成物可以以前驱体层的多达约80重量%的量包括。含弹性体的加成物可以是前驱体层的约至少5重量%,更典型地至少7重量%,并且甚至更典型地至少10重量%。加成物可以是多达前驱体层的60重量%以上,但优选是约10重量%至30重量%。当然,含弹性体的加成物可以是两种以上的特定加成物的组合,并且加成物在23℃的温度下可以是固体加成物或液体加成物或也可以是其组合。加成物可以由实质上完全地(即,至少70%、至少80%、至少90%)的在23℃的温度下是固体的一种以上的加成物组成。
加成物本身通常包括约1:8至3:1(份)的环氧类或其它聚合物与弹性体,并且更优选约1:5至1:6(份)的环氧类与弹性体。更典型地,加成物包括至少约5%,更典型地至少约12%和甚至仍更典型地至少约18%的弹性体,并且也典型地包括不大于约50%,甚至更典型地不大于约40%并且更典型地不大于约35%的弹性体,尽管略高或略低的百分比是可行的。弹性体化合物可以是热固性弹性体。没有限制,示例性弹性体包括:天然橡胶、苯乙烯-丁二烯橡胶、聚异戊二烯、聚异丁烯、聚丁二烯、异戊二烯-丁二烯共聚物、氯丁橡胶、丁腈橡胶(例如,丁基腈类,例如羧基末端的丁基腈类)、丁基橡胶、聚硫弹性体、丙烯酸类弹性体、丙烯腈弹性体、硅橡胶、聚硅氧烷、聚酯橡胶、二异氰酸酯连接的缩合弹性体、EPDM(乙烯-丙烯二烯橡胶)、氯磺化聚乙烯、和氟化烃类等。优选的环氧类/弹性体加成物的实例在从CVCChemical可购的商品名HYPOX下销售。适合用于本发明的另外或可选择的环氧类/弹性体或其它的加成物的实例公开于美国专利公布2004/0204551,在此以参考的方式并入以用于所有目的。
当添加至粘合剂材料时,含弹性体的加成物可以将粘合剂材料的结构性能例如强度、韧性、硬度、或弯曲模量等改变。
粘合剂也可以包括一种以上另外的聚合物和/或共聚物材料,例如热塑性塑料、弹性体、塑性体、或其组合等。没有限制,可以适当地引入粘合剂的聚合物包括:聚烯烃(例如,聚乙烯、聚丙烯)、聚苯乙烯、聚丙烯酸酯、聚(环氧乙烷)、聚(乙烯亚胺)、聚酯、聚氨酯、聚硅氧烷、聚醚、聚膦嗪(polyphosphazine)、聚酰胺、聚酰亚胺、聚异丁烯、聚丙烯腈、聚(氯乙烯)、聚(甲基丙烯酸甲酯)、聚(乙酸乙烯酯)、聚(偏二氯乙烯)、聚四氟乙烯、聚异戊二烯、聚丙烯酰胺、聚丙烯酸或聚甲基丙烯酸酯类。
前驱体层也可以包括至少一种冲击改性剂。各种冲击改性剂可以用于本发明的实践中并且经常包括一种以上的弹性体。冲击改性剂可以是前驱体层的至少4重量%、至少7重量%、至少10重量%、少13重量%和甚至又更典型地至少16重量%。冲击改性剂可以是前驱体层的小于90重量%、小于40重量%或甚至小于约30重量%。
冲击改性剂可以包括至少一种核/壳型冲击改性剂。冲击改性剂可以由至少60%、至少80%或甚至至少95%的核/壳型冲击改性剂组成。如此处使用,术语核/壳型冲击改性剂表示其中其实质的部分(例如,大于30重量%、大于50重量%、大于70重量%)由实质上完全被第二聚合物材料(即,第二材料或壳材料)包裹的第一聚合物材料(即,第一材料或核材料)组成的冲击改性剂。如此处使用,第一、第二聚合物材料可以由组合和/或反应在一起(例如,顺序聚合)的一种、两种、三种以上的聚合物组成,或可以是分开或相同的核/壳体系的一部分。
核/壳型冲击改性剂的第一、第二聚合物材料可以包括弹性体、聚合物、热塑性塑料、共聚物、其它组分、或其组合等。核/壳型冲击改性剂的第一聚合物材料、第二聚合物材料、或二者可以包括或可以实质上完全地(例如,至少70重量%、至少80重量%、至少90重量%)由一种以上的热塑性塑料组成。没有限制,示例性热塑性塑料包括:苯乙烯类、丙烯腈类、丙烯酸酯类、乙酸酯类、聚酰胺类或聚乙烯类等。
有用的核-壳型接枝共聚物的实例是其中将含有例如苯乙烯、丙烯腈或甲基丙烯酸甲酯等的化合物的硬段接枝到由含有例如丁二烯或丙烯酸丁酯等的化合物的软质或弹性的聚合物制成的核上的那些。核聚合物也可以包括含有例如苯乙烯、乙酸乙烯酯、甲基丙烯酸甲酯、丁二烯、或异戊二烯等的化合物的其它共聚物。核聚合物材料也可以包括例如二丙烯酸乙二醇酯和二甲基丙烯酸丁二醇酯等的具有大致相等的反应性的两个以上非共轭双键的交联单体。核聚合物材料也可以包括例如马来酸二烯丙酯和甲基丙烯酸烯丙酯等的具有不等的反应性的两个以上非共轭双键的接枝连接单体。壳部分可以由甲基丙烯酸甲酯和任意的其它甲基丙烯酸烷基酯,例如甲基丙烯酸乙酯、甲基丙烯酸丁酯或其混合物聚合。可用于本发明的实施方案的另外的核-壳型接枝共聚物记载于美国专利号3,984,497;4,096,202;4,034,013;3,944,631;4,306,040;4,495,324;4,304,709;4,536,436和7,892,396,其全部在此以参考的方式并入本文中。适宜的核-壳型接枝共聚物的实例包括,但不限于,“MBS”(甲基丙烯酸酯-丁二烯-苯乙烯)聚合物,其由将甲基丙烯酸甲酯在聚丁二烯或聚丁二烯共聚物橡胶的存在下聚合来制成。MBS接枝共聚物树脂通常具有苯乙烯丁二烯橡胶的核和丙烯酸类聚合物或共聚物的壳。其它有用的核-壳型接枝共聚物树脂的实例包括:ABS(丙烯腈-丁二烯-苯乙烯)、MABS(甲基丙烯酸酯-丙烯腈-丁二烯-苯乙烯)、ASA(丙烯酸酯-苯乙烯-丙烯腈)、全部的丙烯酸树脂类、SA EPDM(接枝到乙烯-丙烯二烯单体的弹性骨架上的苯乙烯-丙烯腈)、和MAS(甲基丙烯酸-丙烯酸橡胶苯乙烯)等,和其混合物。
前驱体层也可以包括一种以上的固化剂和/或固化剂促进剂。固化剂和固化剂促进剂的量可以根据耗用的固化的类型和期望的交联密度和期望的前驱体层的结构性能而在前驱体层中变化。存在于前驱体层中的固化剂和固化剂促进剂的示例性范围在约0.001重量%至约7重量%的范围。固化剂通过聚合物、环氧树脂或二者的交联帮助前驱体层固化。固化剂也可以帮助热固化前驱体层。固化剂有用的种类是选自以下的材料:脂族或芳香族胺或其各个加成物、酰胺基胺、聚酰胺、脂环族胺、酸酐、聚羧酸、聚酯、异氰酸酯、酚系树脂(例如,苯酚或甲酚酚醛清漆树脂,共聚物例如酚萜、聚乙烯基苯酚、或双酚A甲醛共聚物、或双羟基苯基烷等的那些)、或其混合物。固化剂可以包括改性或未改性聚胺或聚酰胺例如三亚乙基四胺、二亚乙基三胺、四亚乙基五胺、氰基胍、和双氰胺等。也可以提供固化剂促进剂(例如,改性或未改性尿素例如亚甲基二苯基双脲、咪唑或其组合)以用于制备前驱体层。
前驱体层也可以包括一种以上的填料,包括但不限于,颗粒状材料(例如粉末)、珠子或微球等。前驱体层也可以实质上没有任何填料材料。填料能对降低未固化的粘合剂粉末的结块趋势、降低成本、并且降低固化材料的热膨胀系数是有用的。前驱体层可以包括构成前驱体材料的小于25重量%的填料。理想地,填料可以构成前驱体层的小于约2.5重量%。任何存在的填料可以包括与存在于前驱体层的其它组分通常没有反应性的材料。
填料的实例包括二氧化硅、硅藻土、玻璃、粘土(例如,包括纳米粘土)、滑石、颜料、着色剂、玻璃珠或气泡、玻璃、碳或陶瓷纤维、尼龙或聚酰胺纤维(例如,凯夫拉(Kevlar)),和抗氧化剂等。这样的填料,特别是粘土,可以在材料流动期间有助于可活化材料使其本身流平(leveling)。可以用作填料的粘土可以包括来自可以被煅烧的高岭土、伊利石、绿泥石(chloritem)、蒙脱石或海泡石的组的粘土。没有限制,适宜的填料的实例包括:滑石、蛭石、叶蜡石、锌蒙脱石、皂石、绿脱石、蒙脱土或其混合物。粘土也可以包括较小量的其它成分例如碳酸盐、长石、云母和石英。填料也可以包括氯化铵类例如二甲基氯化铵和二甲基苄基氯化铵。也可以使用二氧化钛。
有利地,本教导的前驱体层可以展示出相对高的耐冲击性。前驱体层,特别是对于此处公开的特定的组合和量的成分(例如,特定量的加成物、特定量的冲击改性剂或二者的组合),可以展示出期望的韧性和/或T剥离强度。作为实例,根据ASTM D 1876-01,已经发现本发明的粘合剂材料展示出T剥离强度为至少约2N/mm,至少约3.7N/mm或甚至至少约5.5N/mm。
前驱体层的搭接剪切强度可根据ASTM D1002-01来测定。在73.4°F下的前驱体层的搭接剪切强度可以大于约1000psi,经常大于约2000psi,可以大于3000psi并且可以甚至大于约3500psi。在-67°F下的粘合剂材料的搭接剪切强度经常大于约1000psi,经常大于约2000psi,可以大于2200psi并且可以甚至大于约3000psi。
此处公开的粘合剂组合物的非限定性实例的成分在以下表1中列出。量以重量百分比列出。
表1
此处列举的任何数值包括以一个单位的增量从下限值至上限值的全部值,条件是任何下限值和任何上限值之间存在至少2个单位的间距。作为实例,如果规定的是组分的量或例如温度、压力和时间等的工艺变量的值是例如1至90,优选20至80,更优选30至70,则想要的是在本说明书中明确地枚举例如15至85,22至68,43至51,30至32等的值。对于小于1的值,一个单位适当地认为是0.0001、0.001、0.01或0.1。这些仅是特别想要的实例,并且在枚举的最小值和最大值之间的数值的全部可能的组合将被认为以相似的方式在本申请中特别规定。如可见的,此处表达为“重量份”的量的教导也考虑到以重量百分比计表达的相同的范围。因此,在以“所得聚合物共混组合物的x重量份”计的范围内的本发明的具体实施方案中的表述也考虑到了“所得聚合物共混组合物的x重量百分比”的相同的列举量的范围的教导。
除非另有规定,全部范围同时包括端点和端点之间的所有数值。与范围相关的“约”或“大致”的使用适用于范围的两端。因此,“约20至30”意欲覆盖包括至少规定的端点的“约20至约30”。
包括专利申请和公布的全部文章和参考的公布以参考的方式并入以用于所有目的。描述组合的术语“基本上由…组成”应该包括指定的要素、组成部分、组分或步骤,以及不实质上影响组合的基本和新型特性的此类其它要素、组成部分、组分或步骤。描述此处的要素、组成部分、组分或步骤的组合的术语“包含”或“包括”的使用也考虑到以下方案:基本上由要素、组成部分、组分或步骤组成,或甚至由要素、组成部分、组分或步骤组成。通过此处术语“可以”的使用,想要的是“可以”包括的任何描述的属性是可选的。
多个要素、组成部分、组分或步骤可以通过单一整合的要素、组成部分、组分或步骤来提供。可选择地,单一整合的要素、组成部分、组分或步骤可以分为单独的多个要素、组成部分、组分或步骤。描述要素、组成部分、组分或步骤的“一种”或“一个”的公开不意欲排除另外的要素、组成部分、组分或步骤。属于特定族的元素或金属的此处的全部参考是指由CRC Press,Inc.,1989出版并且取得版权的元素周期表。族或多个族的任何参考应该是在使用IUPAC系统来将族编号的该元素周期表中的元素反映的族或多个族。
将要领会的是可以使用此处列举的量浓缩物或稀释物。通常,列举的成分的相对比例将保持相同。因此,通过实施例的方式,如果该教导需要30重量份的组分A和10重量份的组分B,则技术人员将认为这样的教导也构成以相对比3:1的组分A和组分B的使用的教导。实施例中浓度的教导可以在规定值的约25%(以上)之内变化,并且预期相似的结果。此外,实施例的这样的组成可以成功地用于本方法。
要理解的是以上说明书意欲是说明性的而不是限制性的。除了提供的实施例以外的很多实施方案以及很多应用对阅读以上说明书的本领域的技术人员将是明显的。因此,该教导的范围应该不参照以上说明书决定,而是应该与授权这样的权利要求的相当的全部范围一起,参照附加的权利要求来决定。包括专利申请和公布的全部文章和参考的公布以参考的方式并入以用于所有目的。在此处公开的主旨的任何方面的以下权利要求中的省略不是这样的主旨的放弃权项,也不应该是本发明人不重视的。要理解的是以上说明书意欲是说明性的而不是限制性的。除了提供的实施例以外的很多实施方案以及很多应用对阅读以上说明书的本领域的技术人员将是明显的。
此处存在的解释和说明意欲使本领域的其他技术人员熟悉本发明、其原则和其实际应用。本领域的技术人员可以采用并且以其很多形式应用本教导,因为可以最适用于特别使用的要求。因此,如前述的本教导的具体的实施方案不意欲作为详细或限制的教导。因此,该教导的范围不应该参照以上说明书决定,而是应该与授权这样的权利要求的相当的全部范围一起,参照附加的权利要求决定。包括专利申请和公布的全部文章和参考的公布以参考的方式并入以用于所有目的。如要从以下权利要求收集的,其它组合也是可能的,其也据此以参考的方式并入本书面的说明书。
Claims (20)
1.一种粘合地结合的制品的形成方法,所述方法包括以下步骤:
(a)提供具有至少一个第一表面的至少一个第一基材;
(b)使用电磁刷印刷设备将用于形成前驱体层的颗粒静电输送至所述至少一个第一表面,所述颗粒包括用于限定在固化时展示出粘合特性的潜在固化性聚合物材料的前驱体,其中所述前驱体层的所述颗粒具有在20至300μm的范围内的平均粒径;并且所述颗粒的特征为没有任何溶剂的均一组成的固体的前驱体配制品;
(c)将所述前驱体层的所述颗粒物理地转变从而形成非定向熔融的前驱体层膜,所述非定向熔融的前驱体层膜当在所述至少一个第一表面上和完全地贯穿其保持未暴露至反应活化条件的时期时无粘性并且触感干燥,并且具有小于0.3mm的大体均一的厚度;
(d)施加至少一个第二基材从而接触所述前驱体层膜的至少一部分;和
(e)将所述前驱体层膜经历反应活化条件从而引起交联并且限定将所述至少一个第一基材与所述至少一个第二基材粘合地结合的交联反应产物材料,
其中将颗粒物理地转变的步骤包括将所述颗粒加热至所述前驱体配制品作为热塑性材料软化和流动、但低于所述前驱体配制品将交联来形成热固性材料的温度;以及
其中所述用于形成前驱体层的颗粒包括环氧类/弹性体加成物,所述加成物包括以份计为1:5至1:6的环氧类与弹性体。
2.根据权利要求1所述的方法,其中所述第一基材或所述第二基材的至少之一是金属材料。
3.根据权利要求1所述的方法,其中所述第一基材和所述第二基材都是金属材料。
4.根据权利要求1所述的方法,其中所述第一基材或所述第二基材中的之一或两者具有能够支撑其自重而没有可见的可检测的弹性变形的足够的刚性。
5.根据权利要求1所述的方法,其中所述第一基材或所述第二基材的至少之一是钢材料。
6.根据权利要求1所述的方法,其中所述第一基材和所述第二基材都是钢材料。
7.根据权利要求1所述的方法,其中所述方法包括将所述前驱体层输送至所述第一基材的轮廓表面。
8.根据权利要求1所述的方法,其中所述静电输送的步骤包括将足量的所述前驱体层输送至所述第一基材以致所得固化和交联的反应产物材料的厚度小于1mm。
9.根据权利要求1所述的方法,其中在所述静电输送的步骤中,所述前驱体配制品保持在干燥的固体状态。
10.根据权利要求1所述的方法,其中将前驱体配制品静电输送的步骤在所述第一基材和任何分配器之间不存在任何接触下进行,通过所述分配器来输送所述前驱体配制品。
11.根据权利要求1所述的方法,其中将前驱体层膜经历反应活化条件的步骤包括将所述膜加热至在用于将所述前驱体层膜交联的交联活化温度之上的温度。
12.根据权利要求1所述的方法,其中将颗粒物理地转变的步骤包括将所述颗粒加热至比用于加热所述前驱体层膜的步骤的温度低至少60-70℃的温度的步骤。
13.根据权利要求1所述的方法,其中所述潜在固化性聚合物材料包括乙烯共聚物或三元聚合物、酚醛树脂、环氧类、丙烯酸酯类、封端热塑性聚氨酯,或其任意的组合。
14.根据权利要求1所述的方法,其中将前驱体配制品静电输送的步骤重复以致所述前驱体层膜的厚度增加。
15.根据权利要求1所述的方法,其中将前驱体配制品静电输送的步骤在所述第一基材的一个以上的规定区域中重复以致在所述一个以上的规定区域中的所述前驱体层膜的厚度增加。
16.根据权利要求1所述的方法,其中所述前驱体配制品从初始形成至所述物理地转变步骤稳定贮存至少一年。
17.根据权利要求1所述的方法,其中所述前驱体配制品从初始形成至所述静电输送步骤是干燥粉末状形式。
18.一种根据权利要求1至17任一项所述的方法的用途,其用于制成结合的汽车组件。
19.一种结合的制品,其根据权利要求1至17任一项所述的方法制成。
20.根据权利要求1所述的方法,其中所述前驱体层包括冲击改性剂,所述冲击改性剂包括至少70重量%的一种以上热塑性塑料。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261677234P | 2012-07-30 | 2012-07-30 | |
US61/677,234 | 2012-07-30 | ||
PCT/US2013/051973 WO2014022182A2 (en) | 2012-07-30 | 2013-07-25 | Method and apparatus for adhesive deposition |
Publications (2)
Publication Number | Publication Date |
---|---|
CN104520397A CN104520397A (zh) | 2015-04-15 |
CN104520397B true CN104520397B (zh) | 2017-06-13 |
Family
ID=48918477
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201380040884.7A Active CN104520397B (zh) | 2012-07-30 | 2013-07-25 | 粘合剂沉积用方法和设备 |
Country Status (5)
Country | Link |
---|---|
US (1) | US9422458B2 (zh) |
EP (2) | EP3916062B1 (zh) |
CN (1) | CN104520397B (zh) |
BR (1) | BR112015001866A2 (zh) |
WO (1) | WO2014022182A2 (zh) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB201405637D0 (en) * | 2014-03-28 | 2014-05-14 | Zephyros Inc | Powdered adhesive materials and their use |
US10004292B2 (en) | 2014-04-09 | 2018-06-26 | Nike, Inc. | Selectively applied adhesive particulate on nonmetallic substrates |
US9707727B2 (en) | 2014-04-09 | 2017-07-18 | Nike, Inc. | Selectively applied adhesive particulate on nonmetallic substrates |
WO2015158654A1 (en) * | 2014-04-15 | 2015-10-22 | Agfa Graphics Nv | Aqueous resin based inkjet inks |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3707583A (en) * | 1971-06-04 | 1972-12-26 | Minnesota Mining & Mfg | Adhesive |
Family Cites Families (44)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1223413A (en) | 1967-01-04 | 1971-02-24 | Evode Ltd | Adhesive compositions and methods of use |
US3984497A (en) | 1971-12-13 | 1976-10-05 | Rohm And Haas Company | Acrylic modifiers for polycarbonamides |
US3944631A (en) | 1974-02-01 | 1976-03-16 | Stauffer Chemical Company | Acrylate-styrene-acrylonitrile composition and method of making the same |
US4034013A (en) | 1975-11-13 | 1977-07-05 | Rohm And Haas Company | Impact and melt strength improvement of poly(alkylene terephthalate) |
US4096202A (en) | 1976-06-09 | 1978-06-20 | Rohm And Haas Company | Impact modified poly(alkylene terephthalates) |
US4304709A (en) | 1979-11-01 | 1981-12-08 | Hooker Chemicals & Plastics Corp. | Polymer blends with improved hydrolytic stability |
US4306040A (en) | 1980-11-03 | 1981-12-15 | Monsanto Company | Multiphase core//shell polymers |
JPS58156899A (ja) | 1982-03-15 | 1983-09-17 | 化成オプトニクス株式会社 | 放射線像変換スクリ−ン |
US4495324A (en) | 1983-10-24 | 1985-01-22 | Allied Corporation | Glass reinforced polyamide composition containing acrylic core/shell polymer |
US5281481A (en) * | 1992-02-28 | 1994-01-25 | Borg-Warner Automotive Transmission & Engine Components Corporation | Powder coating of thermosetting adhesives onto metal substrates to enable a friction material to be bonded to the metal substrate |
US5628861A (en) | 1995-01-25 | 1997-05-13 | Abb Power T&D Company Inc. | Method for adhesively bonded laminate for use in an electrical apparatus such as a transformer, generator, or motor |
AUPO370896A0 (en) | 1996-11-19 | 1996-12-12 | Tonejet Corporation Pty Ltd | Electrostatic deposition |
US6479560B2 (en) | 1997-05-21 | 2002-11-12 | Denovus Llc | Foaming compositions and methods for making and using the composition |
US20030195268A1 (en) | 1998-05-20 | 2003-10-16 | Freitag James W. | Novel foaming compositions and methods for making and using the composition |
US6486256B1 (en) | 1998-10-13 | 2002-11-26 | 3M Innovative Properties Company | Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst |
TWI332024B (en) | 2000-03-31 | 2010-10-21 | Hitachi Chemical Co Ltd | Method for making a semiconductor device |
US6475316B1 (en) | 2000-07-07 | 2002-11-05 | 3M Innovative Properties Company | Methods of enhancing adhesion |
US6509128B1 (en) | 2000-10-25 | 2003-01-21 | 3M Innovative Properties Company | Imagewise printing of adhesives and limited coalescence polymerization method |
US6660352B2 (en) | 2001-01-09 | 2003-12-09 | 3M Innovative Properties Company | Adhesive electrostatic sheets |
US20020182955A1 (en) | 2001-03-29 | 2002-12-05 | Weglewski James T. | Structural bonding tapes and articles containing the same |
US20040204551A1 (en) | 2003-03-04 | 2004-10-14 | L&L Products, Inc. | Epoxy/elastomer adduct, method of forming same and materials and articles formed therewith |
US7070876B2 (en) | 2003-03-24 | 2006-07-04 | Ballard Power Systems, Inc. | Membrane electrode assembly with integrated seal |
EP1479742A1 (en) | 2003-05-23 | 2004-11-24 | Vantico GmbH | Adhesive deposits |
US6942941B2 (en) | 2003-08-06 | 2005-09-13 | General Motors Corporation | Adhesive bonds for metalic bipolar plates |
EP1723474A2 (en) * | 2004-03-09 | 2006-11-22 | Eastman Kodak Company | Powder coating using an electromagnetic brush |
US20050208700A1 (en) | 2004-03-19 | 2005-09-22 | Chippac, Inc. | Die to substrate attach using printed adhesive |
US7749636B2 (en) | 2004-09-21 | 2010-07-06 | Reinz-Dichtungs-Gmbh | Fuel cell arrangement and method of manufacturing a fuel cell arrangement |
DE102004046744B4 (de) | 2004-09-27 | 2007-05-24 | Atotech Deutschland Gmbh | Verfahren zur Übertragung von Pulvern und Pulverlacken auf Substrate und Verwendung zur Herstellung von Leiterplatten und Solarzellen |
US7824821B2 (en) | 2004-12-28 | 2010-11-02 | Daimler Ag | Fuel cell metallic separator |
WO2007006633A1 (en) | 2005-07-08 | 2007-01-18 | Cypak Ab | Use of heat-activated adhesive for manufacture and a device so manufactured |
US7914943B2 (en) | 2005-08-19 | 2011-03-29 | Daimler Ag | Integrated seal for fuel cell assembly and fuel cell stack |
TWI288959B (en) | 2006-03-17 | 2007-10-21 | Chipmos Technologies Inc | Chip package and wafer treating method for making adhesive chips |
WO2008133607A2 (en) | 2006-04-03 | 2008-11-06 | Bloom Energy Corporation | Fuel cell stack components and materials |
US7892396B2 (en) | 2006-06-07 | 2011-02-22 | Zephyros, Inc. | Toughened activatable material for sealing, baffling or reinforcing and method of forming same |
US7438782B2 (en) * | 2006-06-07 | 2008-10-21 | Zephyros, Inc. | Activatable material for sealing, baffling or reinforcing and method of forming same |
EP2152828B1 (en) * | 2007-05-24 | 2011-07-06 | Lord Corporation | Powder adhesives for bonding elastomers |
DE102007024161A1 (de) | 2007-05-24 | 2008-11-27 | Daimler Ag | Bipolarplatte für Brennstoffzellen |
US8702889B2 (en) | 2007-06-12 | 2014-04-22 | Zephyros, Inc. | Method of forming a toughened adhesive material |
DE502008001517D1 (de) * | 2008-01-30 | 2010-11-25 | Sika Technology Ag | Auswaschbeständige hitzehärtende Epoxidharzklebstoffe |
JP5344212B2 (ja) | 2008-03-24 | 2013-11-20 | 地方独立行政法人 岩手県工業技術センター | 樹脂皮膜の形成方法 |
US8623166B2 (en) | 2008-11-18 | 2014-01-07 | Wacker Chemical Corporation | Flexographic application of adhesive dispersions |
DE102009026988A1 (de) * | 2009-05-27 | 2010-12-02 | Evonik Degussa Gmbh | Hybridbauteile mit reaktiven Schmelzklebstoffen |
US8399150B2 (en) | 2010-06-23 | 2013-03-19 | GM Global Technology Operations LLC | Integrated fuel cell assembly and method of making |
JP5721988B2 (ja) * | 2010-09-29 | 2015-05-20 | 曙ブレーキ工業株式会社 | 接着剤 |
-
2013
- 2013-07-25 US US13/950,550 patent/US9422458B2/en active Active
- 2013-07-25 WO PCT/US2013/051973 patent/WO2014022182A2/en active Application Filing
- 2013-07-25 EP EP21181634.3A patent/EP3916062B1/en active Active
- 2013-07-25 EP EP13745760.2A patent/EP2880113B1/en active Active
- 2013-07-25 CN CN201380040884.7A patent/CN104520397B/zh active Active
- 2013-07-25 BR BR112015001866A patent/BR112015001866A2/pt not_active IP Right Cessation
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3707583A (en) * | 1971-06-04 | 1972-12-26 | Minnesota Mining & Mfg | Adhesive |
Also Published As
Publication number | Publication date |
---|---|
EP2880113A2 (en) | 2015-06-10 |
EP3916062B1 (en) | 2024-11-06 |
WO2014022182A2 (en) | 2014-02-06 |
BR112015001866A2 (pt) | 2017-07-04 |
US9422458B2 (en) | 2016-08-23 |
CN104520397A (zh) | 2015-04-15 |
US20140027039A1 (en) | 2014-01-30 |
EP3916062A1 (en) | 2021-12-01 |
EP2880113B1 (en) | 2021-06-30 |
WO2014022182A3 (en) | 2014-11-20 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN101547990B (zh) | 可泵送的耐洗掉的环氧膏状粘合剂 | |
US10570317B2 (en) | Powdered adhesives | |
US10106205B2 (en) | Reinforcement structure | |
TWI554585B (zh) | 高效能黏著劑組合物 | |
CN105001798B (zh) | 热固性树脂组合物、热固化树脂层 | |
CN104520397B (zh) | 粘合剂沉积用方法和设备 | |
CN101772532B (zh) | 韧性粘合材料 | |
CA2703907C (en) | Epoxy paste adhesives resistant to wash-off | |
CN103459539A (zh) | 改进的结构粘合剂 | |
WO2007025007A1 (en) | Epoxy compositions having improved impact resistance | |
CN107532056A (zh) | 单组分可固化粘合剂组合物及其用途 | |
US20200109280A1 (en) | Epoxy composition containing copolyamide and block copolymer with polyamide and polyether blocks | |
CN109153901A (zh) | 可热熔融施加的结构粘合剂 | |
CN108778709A (zh) | 非连续网结构 | |
JP2021508747A (ja) | 強化された接着剤及びそれを用いた接着方法 | |
KR20210035344A (ko) | 구조용 접착제 조성물 | |
JP6690809B2 (ja) | エポキシ樹脂接着剤 | |
CN107735257A (zh) | 低能耗表面基材的热粘合 | |
JP2011001523A (ja) | 熱硬化性エポキシ樹脂組成物 | |
EP4450581A2 (en) | Improved structural bonding adhesive | |
CN108602470A (zh) | 用于复合材料及胶带的粘合剂树脂和薄膜,及其使用方法 | |
JP2023130019A (ja) | 接着剤セット及び接着体 | |
JP2003276403A (ja) | 分別回収可能なゴム車輪 | |
JPS62220528A (ja) | 構造部材 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
EXSB | Decision made by sipo to initiate substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |