MX222601B - High strength epoxy adhesive and uses thereof - Google Patents
High strength epoxy adhesive and uses thereofInfo
- Publication number
- MX222601B MX222601B MXPA01003703A MX222601B MX 222601 B MX222601 B MX 222601B MX PA01003703 A MXPA01003703 A MX PA01003703A MX 222601 B MX222601 B MX 222601B
- Authority
- MX
- Mexico
- Prior art keywords
- high strength
- epoxy adhesive
- strength epoxy
- adhesive
- strength
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
- C08G59/686—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/182—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing using pre-adducts of epoxy compounds with curing agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2666/00—Composition of polymers characterized by a further compound in the blend, being organic macromolecular compounds, natural resins, waxes or and bituminous materials, non-macromolecular organic substances, inorganic substances or characterized by their function in the composition
- C08L2666/02—Organic macromolecular compounds, natural resins, waxes or and bituminous materials
- C08L2666/04—Macromolecular compounds according to groups C08L7/00 - C08L49/00, or C08L55/00 - C08L57/00; Derivatives thereof
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Epoxy Resins (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US09/170,597 US6486256B1 (en) | 1998-10-13 | 1998-10-13 | Composition of epoxy resin, chain extender and polymeric toughener with separate base catalyst |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| MXPA01003703A MXPA01003703A (es) | 2001-07-01 |
| MX222601B true MX222601B (en) | 2004-09-09 |
Family
ID=22620518
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| MXPA01003703 MX222601B (en) | 1998-10-13 | 2001-04-10 | High strength epoxy adhesive and uses thereof |
Country Status (10)
| Country | Link |
|---|---|
| US (2) | US6486256B1 (enExample) |
| EP (1) | EP1141071B1 (enExample) |
| JP (2) | JP2002527551A (enExample) |
| KR (1) | KR100644300B1 (enExample) |
| AU (1) | AU6285299A (enExample) |
| CA (1) | CA2344718C (enExample) |
| DE (1) | DE69927289T2 (enExample) |
| ES (1) | ES2249030T3 (enExample) |
| MX (1) | MX222601B (enExample) |
| WO (1) | WO2000022024A2 (enExample) |
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| US20040131844A1 (en) * | 2001-05-08 | 2004-07-08 | Kotaro Shinozaki | Sealant composition, sealant and laminated structure containing same |
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| JPH066621B2 (ja) | 1990-04-16 | 1994-01-26 | 富士化成工業株式会社 | 一成分系加熱硬化性エポキシド組成物 |
| JP2858160B2 (ja) | 1990-05-11 | 1999-02-17 | 本田技研工業株式会社 | Al合金製プレス成形板の接着構造 |
| GB9028037D0 (en) * | 1990-12-24 | 1991-02-13 | Dow Rheinmuenster | Stable amine advanced epoxy resin compositions |
| JPH04275324A (ja) * | 1991-02-28 | 1992-09-30 | Nippon Steel Chem Co Ltd | 半導体封止用樹脂組成物 |
| JP3017562B2 (ja) * | 1991-05-21 | 2000-03-13 | 株式会社巴川製紙所 | 配線基板用エポキシ樹脂組成物 |
| JPH04306224A (ja) * | 1991-04-03 | 1992-10-29 | Toray Ind Inc | エポキシ樹脂組成物 |
| DE69229383D1 (de) | 1991-10-31 | 1999-07-15 | Daicel Chem | Epoxydharzzusammensetzungen |
| US5280067A (en) * | 1992-06-18 | 1994-01-18 | Minnesota Mining And Manufacturing Company | Substituted pentafluoroantmonic acid-substituted aniline epoxy curing catalysts |
| JP3465153B2 (ja) * | 1994-08-26 | 2003-11-10 | 東都化成株式会社 | 積層板用エポキシ樹脂組成物 |
| US5629380A (en) | 1994-09-19 | 1997-05-13 | Minnesota Mining And Manufacturing Company | Epoxy adhesive composition comprising a calcium salt and mannich base |
| US5712039A (en) | 1995-04-11 | 1998-01-27 | Minnesota Mining And Manufacturing Company | Epoxy adhesives with dithiooxamide adhesion promoters |
| US5591811A (en) | 1995-09-12 | 1997-01-07 | Ciba-Geigy Corporation | 1-imidazolylmethyl-2-naphthols as catalysts for curing epoxy resins |
| CN1209829A (zh) * | 1996-11-22 | 1999-03-03 | 大瑟路化学工业株式会社 | 热熔性组合物及含有由此组合物而成的层之复层成型体 |
| JPH1161073A (ja) * | 1997-08-08 | 1999-03-05 | Mitsui Chem Inc | 接着剤組成物 |
-
1998
- 1998-10-13 US US09/170,597 patent/US6486256B1/en not_active Expired - Lifetime
-
1999
- 1999-09-30 ES ES99950127T patent/ES2249030T3/es not_active Expired - Lifetime
- 1999-09-30 WO PCT/US1999/022991 patent/WO2000022024A2/en not_active Ceased
- 1999-09-30 EP EP99950127A patent/EP1141071B1/en not_active Expired - Lifetime
- 1999-09-30 DE DE69927289T patent/DE69927289T2/de not_active Expired - Lifetime
- 1999-09-30 JP JP2000575924A patent/JP2002527551A/ja not_active Withdrawn
- 1999-09-30 KR KR1020017004580A patent/KR100644300B1/ko not_active Expired - Fee Related
- 1999-09-30 AU AU62852/99A patent/AU6285299A/en not_active Abandoned
- 1999-09-30 CA CA002344718A patent/CA2344718C/en not_active Expired - Fee Related
-
2001
- 2001-04-10 MX MXPA01003703 patent/MX222601B/es not_active IP Right Cessation
-
2002
- 2002-09-16 US US10/244,326 patent/US6800157B2/en not_active Expired - Lifetime
-
2010
- 2010-11-15 JP JP2010255239A patent/JP5744485B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CA2344718A1 (en) | 2000-04-20 |
| WO2000022024A3 (en) | 2000-09-08 |
| US6800157B2 (en) | 2004-10-05 |
| ES2249030T3 (es) | 2006-03-16 |
| CA2344718C (en) | 2009-02-03 |
| AU6285299A (en) | 2000-05-01 |
| MXPA01003703A (es) | 2001-07-01 |
| DE69927289D1 (de) | 2005-10-20 |
| US6486256B1 (en) | 2002-11-26 |
| WO2000022024A2 (en) | 2000-04-20 |
| JP5744485B2 (ja) | 2015-07-08 |
| DE69927289T2 (de) | 2006-08-17 |
| KR100644300B1 (ko) | 2006-11-10 |
| KR20010085910A (ko) | 2001-09-07 |
| EP1141071A2 (en) | 2001-10-10 |
| US20030144416A1 (en) | 2003-07-31 |
| JP2011122147A (ja) | 2011-06-23 |
| EP1141071B1 (en) | 2005-09-14 |
| JP2002527551A (ja) | 2002-08-27 |
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| FG | Grant or registration | ||
| MM | Annulment or lapse due to non-payment of fees |