WO2017038620A1 - 樹脂組成物 - Google Patents
樹脂組成物 Download PDFInfo
- Publication number
- WO2017038620A1 WO2017038620A1 PCT/JP2016/074809 JP2016074809W WO2017038620A1 WO 2017038620 A1 WO2017038620 A1 WO 2017038620A1 JP 2016074809 W JP2016074809 W JP 2016074809W WO 2017038620 A1 WO2017038620 A1 WO 2017038620A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- group
- ene
- hept
- resin composition
- meth
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 79
- 229920005989 resin Polymers 0.000 claims abstract description 107
- 239000011347 resin Substances 0.000 claims abstract description 107
- 150000001875 compounds Chemical class 0.000 claims abstract description 56
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 46
- 150000001491 aromatic compounds Chemical class 0.000 claims abstract description 36
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims abstract description 36
- 239000011230 binding agent Substances 0.000 claims abstract description 27
- 125000001424 substituent group Chemical group 0.000 claims abstract description 12
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 9
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 9
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 9
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims abstract description 4
- -1 quinonediazide compound Chemical class 0.000 claims description 159
- 229920000089 Cyclic olefin copolymer Polymers 0.000 claims description 27
- 125000004432 carbon atom Chemical group C* 0.000 claims description 23
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 14
- 125000003700 epoxy group Chemical group 0.000 claims description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 abstract description 3
- 239000001257 hydrogen Substances 0.000 abstract description 3
- 229910052739 hydrogen Inorganic materials 0.000 abstract description 3
- 239000010408 film Substances 0.000 description 92
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 85
- 239000000178 monomer Substances 0.000 description 47
- 238000000034 method Methods 0.000 description 43
- WLTSXAIICPDFKI-UHFFFAOYSA-N 3-dodecene Chemical compound CCCCCCCCC=CCC WLTSXAIICPDFKI-UHFFFAOYSA-N 0.000 description 30
- 239000002904 solvent Substances 0.000 description 28
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 19
- 239000000126 substance Substances 0.000 description 18
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 18
- 125000000217 alkyl group Chemical group 0.000 description 16
- 230000035939 shock Effects 0.000 description 15
- 125000004849 alkoxymethyl group Chemical group 0.000 description 14
- 238000010438 heat treatment Methods 0.000 description 14
- 229920000642 polymer Polymers 0.000 description 14
- 230000005855 radiation Effects 0.000 description 14
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 12
- 125000003118 aryl group Chemical group 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 10
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 10
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 10
- 229910052757 nitrogen Inorganic materials 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- OTTZHAVKAVGASB-UHFFFAOYSA-N hept-2-ene Chemical compound CCCCC=CC OTTZHAVKAVGASB-UHFFFAOYSA-N 0.000 description 9
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000004132 cross linking Methods 0.000 description 8
- PHCKFVVLVZFFLU-UHFFFAOYSA-N dodec-4-ene Chemical compound CCCCCCCC=CCCC PHCKFVVLVZFFLU-UHFFFAOYSA-N 0.000 description 8
- 239000003822 epoxy resin Substances 0.000 description 8
- 229920000647 polyepoxide Polymers 0.000 description 8
- 239000004642 Polyimide Substances 0.000 description 7
- 229920001721 polyimide Polymers 0.000 description 7
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 6
- YEJRWHAVMIAJKC-UHFFFAOYSA-N 4-Butyrolactone Chemical compound O=C1CCCO1 YEJRWHAVMIAJKC-UHFFFAOYSA-N 0.000 description 6
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 6
- 125000004429 atom Chemical group 0.000 description 6
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 6
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 6
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 6
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 6
- 239000002798 polar solvent Substances 0.000 description 6
- 239000002243 precursor Substances 0.000 description 6
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 5
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 5
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 150000001732 carboxylic acid derivatives Chemical group 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 230000000052 comparative effect Effects 0.000 description 5
- 229920001577 copolymer Polymers 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 238000011156 evaluation Methods 0.000 description 5
- 230000009477 glass transition Effects 0.000 description 5
- 238000005984 hydrogenation reaction Methods 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 229920003986 novolac Polymers 0.000 description 5
- 150000001282 organosilanes Chemical class 0.000 description 5
- 238000000059 patterning Methods 0.000 description 5
- 238000006116 polymerization reaction Methods 0.000 description 5
- 229910000077 silane Inorganic materials 0.000 description 5
- 150000004756 silanes Chemical class 0.000 description 5
- 229910052710 silicon Inorganic materials 0.000 description 5
- 239000010703 silicon Substances 0.000 description 5
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical class O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 5
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 4
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 4
- BNCADMBVWNPPIZ-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n,6-n-hexakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical group COCN(COC)C1=NC(N(COC)COC)=NC(N(COC)COC)=N1 BNCADMBVWNPPIZ-UHFFFAOYSA-N 0.000 description 4
- JFUOAGBSDGCVES-UHFFFAOYSA-N 3-but-2-enyl-4-methylpyrrolidine-2,5-dione Chemical compound CC=CCC1C(C)C(=O)NC1=O JFUOAGBSDGCVES-UHFFFAOYSA-N 0.000 description 4
- ZBCATMYQYDCTIZ-UHFFFAOYSA-N 4-methylcatechol Chemical compound CC1=CC=C(O)C(O)=C1 ZBCATMYQYDCTIZ-UHFFFAOYSA-N 0.000 description 4
- FVCSARBUZVPSQF-UHFFFAOYSA-N 5-(2,4-dioxooxolan-3-yl)-7-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C(C(OC2=O)=O)C2C(C)=CC1C1C(=O)COC1=O FVCSARBUZVPSQF-UHFFFAOYSA-N 0.000 description 4
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 4
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 4
- 125000004018 acid anhydride group Chemical class 0.000 description 4
- 230000002378 acidificating effect Effects 0.000 description 4
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 4
- XXROGKLTLUQVRX-UHFFFAOYSA-N allyl alcohol Chemical compound OCC=C XXROGKLTLUQVRX-UHFFFAOYSA-N 0.000 description 4
- 239000007864 aqueous solution Substances 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- BGTOWKSIORTVQH-UHFFFAOYSA-N cyclopentanone Chemical compound O=C1CCCC1 BGTOWKSIORTVQH-UHFFFAOYSA-N 0.000 description 4
- 238000011161 development Methods 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- JBFHTYHTHYHCDJ-UHFFFAOYSA-N gamma-caprolactone Chemical compound CCC1CCC(=O)O1 JBFHTYHTHYHCDJ-UHFFFAOYSA-N 0.000 description 4
- 125000005462 imide group Chemical group 0.000 description 4
- 239000011261 inert gas Substances 0.000 description 4
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 4
- 238000003475 lamination Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- MKUWVMRNQOOSAT-UHFFFAOYSA-N methylvinylmethanol Natural products CC(O)C=C MKUWVMRNQOOSAT-UHFFFAOYSA-N 0.000 description 4
- 239000012299 nitrogen atmosphere Substances 0.000 description 4
- 125000004430 oxygen atom Chemical group O* 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 238000007142 ring opening reaction Methods 0.000 description 4
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 3
- WTQZSMDDRMKJRI-UHFFFAOYSA-N 4-diazoniophenolate Chemical class [O-]C1=CC=C([N+]#N)C=C1 WTQZSMDDRMKJRI-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 3
- 229920000178 Acrylic resin Polymers 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 239000006087 Silane Coupling Agent Substances 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 3
- 125000002252 acyl group Chemical group 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- GGNQRNBDZQJCCN-UHFFFAOYSA-N benzene-1,2,4-triol Chemical compound OC1=CC=C(O)C(O)=C1 GGNQRNBDZQJCCN-UHFFFAOYSA-N 0.000 description 3
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 3
- 150000004985 diamines Chemical class 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- 238000010894 electron beam technology Methods 0.000 description 3
- 125000005843 halogen group Chemical group 0.000 description 3
- 230000001678 irradiating effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 3
- 125000005395 methacrylic acid group Chemical group 0.000 description 3
- 239000003607 modifier Substances 0.000 description 3
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 3
- 125000001624 naphthyl group Chemical group 0.000 description 3
- JFNLZVQOOSMTJK-UHFFFAOYSA-N norbornene Chemical compound C1C2CCC1C=C2 JFNLZVQOOSMTJK-UHFFFAOYSA-N 0.000 description 3
- JFNLZVQOOSMTJK-KNVOCYPGSA-N norbornene Chemical compound C1[C@@H]2CC[C@H]1C=C2 JFNLZVQOOSMTJK-KNVOCYPGSA-N 0.000 description 3
- 125000003566 oxetanyl group Chemical group 0.000 description 3
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 3
- 230000000737 periodic effect Effects 0.000 description 3
- 229920005575 poly(amic acid) Polymers 0.000 description 3
- 229920002577 polybenzoxazole Polymers 0.000 description 3
- 229920001296 polysiloxane Polymers 0.000 description 3
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 238000004528 spin coating Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 238000003756 stirring Methods 0.000 description 3
- 239000004094 surface-active agent Substances 0.000 description 3
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- 125000006158 tetracarboxylic acid group Chemical group 0.000 description 3
- GGAUUQHSCNMCAU-ZXZARUISSA-N (2s,3r)-butane-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C[C@H](C(O)=O)[C@H](C(O)=O)CC(O)=O GGAUUQHSCNMCAU-ZXZARUISSA-N 0.000 description 2
- QYGBYAQGBVHMDD-XQRVVYSFSA-N (z)-2-cyano-3-thiophen-2-ylprop-2-enoic acid Chemical compound OC(=O)C(\C#N)=C/C1=CC=CS1 QYGBYAQGBVHMDD-XQRVVYSFSA-N 0.000 description 2
- KETQAJRQOHHATG-UHFFFAOYSA-N 1,2-naphthoquinone Chemical compound C1=CC=C2C(=O)C(=O)C=CC2=C1 KETQAJRQOHHATG-UHFFFAOYSA-N 0.000 description 2
- 229940105324 1,2-naphthoquinone Drugs 0.000 description 2
- PRBHEGAFLDMLAL-UHFFFAOYSA-N 1,5-Hexadiene Natural products CC=CCC=C PRBHEGAFLDMLAL-UHFFFAOYSA-N 0.000 description 2
- XWJBRBSPAODJER-UHFFFAOYSA-N 1,7-octadiene Chemical compound C=CCCCCC=C XWJBRBSPAODJER-UHFFFAOYSA-N 0.000 description 2
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 2
- AFFLGGQVNFXPEV-UHFFFAOYSA-N 1-decene Chemical compound CCCCCCCCC=C AFFLGGQVNFXPEV-UHFFFAOYSA-N 0.000 description 2
- CRSBERNSMYQZNG-UHFFFAOYSA-N 1-dodecene Chemical compound CCCCCCCCCCC=C CRSBERNSMYQZNG-UHFFFAOYSA-N 0.000 description 2
- GQEZCXVZFLOKMC-UHFFFAOYSA-N 1-hexadecene Chemical compound CCCCCCCCCCCCCCC=C GQEZCXVZFLOKMC-UHFFFAOYSA-N 0.000 description 2
- LIKMAJRDDDTEIG-UHFFFAOYSA-N 1-hexene Chemical compound CCCCC=C LIKMAJRDDDTEIG-UHFFFAOYSA-N 0.000 description 2
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical compound CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 2
- HIDBROSJWZYGSZ-UHFFFAOYSA-N 1-phenylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=CC=C1 HIDBROSJWZYGSZ-UHFFFAOYSA-N 0.000 description 2
- HFDVRLIODXPAHB-UHFFFAOYSA-N 1-tetradecene Chemical compound CCCCCCCCCCCCC=C HFDVRLIODXPAHB-UHFFFAOYSA-N 0.000 description 2
- GQHTUMJGOHRCHB-UHFFFAOYSA-N 2,3,4,6,7,8,9,10-octahydropyrimido[1,2-a]azepine Chemical compound C1CCCCN2CCCN=C21 GQHTUMJGOHRCHB-UHFFFAOYSA-N 0.000 description 2
- KRIDOPOPBBSDNT-UHFFFAOYSA-N 2,4,5-trimethyl-1,3-benzenediol Natural products CC1=CC(O)=C(C)C(O)=C1C KRIDOPOPBBSDNT-UHFFFAOYSA-N 0.000 description 2
- RJWLXGOSIRVRAR-UHFFFAOYSA-N 2,4-dimethylbenzene-1,3-diol Chemical compound CC1=CC=C(O)C(C)=C1O RJWLXGOSIRVRAR-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- QQZOPKMRPOGIEB-UHFFFAOYSA-N 2-Oxohexane Chemical compound CCCCC(C)=O QQZOPKMRPOGIEB-UHFFFAOYSA-N 0.000 description 2
- ZNQVEEAIQZEUHB-UHFFFAOYSA-N 2-ethoxyethanol Chemical compound CCOCCO ZNQVEEAIQZEUHB-UHFFFAOYSA-N 0.000 description 2
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 2
- XLLIQLLCWZCATF-UHFFFAOYSA-N 2-methoxyethyl acetate Chemical compound COCCOC(C)=O XLLIQLLCWZCATF-UHFFFAOYSA-N 0.000 description 2
- ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 2-octanone Chemical compound CCCCCCC(C)=O ZPVFWPFBNIEHGJ-UHFFFAOYSA-N 0.000 description 2
- WIMJCWOUYMSHBO-UHFFFAOYSA-N 3-hept-4-enyl-4-propylpyrrolidine-2,5-dione Chemical compound CCCC1C(CCCC=CCC)C(NC1=O)=O WIMJCWOUYMSHBO-UHFFFAOYSA-N 0.000 description 2
- HNVRRHSXBLFLIG-UHFFFAOYSA-N 3-hydroxy-3-methylbut-1-ene Chemical compound CC(C)(O)C=C HNVRRHSXBLFLIG-UHFFFAOYSA-N 0.000 description 2
- PGSWEKYNAOWQDF-UHFFFAOYSA-N 3-methylcatechol Chemical compound CC1=CC=CC(O)=C1O PGSWEKYNAOWQDF-UHFFFAOYSA-N 0.000 description 2
- RHLVCLIPMVJYKS-UHFFFAOYSA-N 3-octanone Chemical compound CCCCCC(=O)CC RHLVCLIPMVJYKS-UHFFFAOYSA-N 0.000 description 2
- RBAJWLRQWAFRSP-UHFFFAOYSA-N 4-(2-propylhexyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(CCC)C(CN1C(=O)C2C3C=CC(C2C1=O)C3)CCC RBAJWLRQWAFRSP-UHFFFAOYSA-N 0.000 description 2
- HFLGBNBLMBSXEM-UHFFFAOYSA-N 4-Ethyl-1,2-benzenediol Chemical compound CCC1=CC=C(O)C(O)=C1 HFLGBNBLMBSXEM-UHFFFAOYSA-N 0.000 description 2
- WXYSZTISEJBRHW-UHFFFAOYSA-N 4-[2-[4-[1,1-bis(4-hydroxyphenyl)ethyl]phenyl]propan-2-yl]phenol Chemical compound C=1C=C(C(C)(C=2C=CC(O)=CC=2)C=2C=CC(O)=CC=2)C=CC=1C(C)(C)C1=CC=C(O)C=C1 WXYSZTISEJBRHW-UHFFFAOYSA-N 0.000 description 2
- HCFAJYNVAYBARA-UHFFFAOYSA-N 4-heptanone Chemical compound CCCC(=O)CCC HCFAJYNVAYBARA-UHFFFAOYSA-N 0.000 description 2
- 125000004203 4-hydroxyphenyl group Chemical group [H]OC1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 2
- FUGYGGDSWSUORM-UHFFFAOYSA-N 4-hydroxystyrene Chemical compound OC1=CC=C(C=C)C=C1 FUGYGGDSWSUORM-UHFFFAOYSA-N 0.000 description 2
- WSSSPWUEQFSQQG-UHFFFAOYSA-N 4-methyl-1-pentene Chemical compound CC(C)CC=C WSSSPWUEQFSQQG-UHFFFAOYSA-N 0.000 description 2
- RLOMPKBYKIOKJC-UHFFFAOYSA-N 4-tridecan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 RLOMPKBYKIOKJC-UHFFFAOYSA-N 0.000 description 2
- KNDQHSIWLOJIGP-UHFFFAOYSA-N 826-62-0 Chemical compound C1C2C3C(=O)OC(=O)C3C1C=C2 KNDQHSIWLOJIGP-UHFFFAOYSA-N 0.000 description 2
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 2
- UIERETOOQGIECD-UHFFFAOYSA-N Angelic acid Natural products CC=C(C)C(O)=O UIERETOOQGIECD-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- GHVHDYYKJYXFGU-UHFFFAOYSA-N Beta-Orcinol Chemical compound CC1=CC(O)=C(C)C(O)=C1 GHVHDYYKJYXFGU-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- XTHFKEDIFFGKHM-UHFFFAOYSA-N Dimethoxyethane Chemical compound COCCOC XTHFKEDIFFGKHM-UHFFFAOYSA-N 0.000 description 2
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical compound CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 2
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 2
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 2
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- ZQPPMHVWECSIRJ-UHFFFAOYSA-N Oleic acid Natural products CCCCCCCCC=CCCCCCCCC(O)=O ZQPPMHVWECSIRJ-UHFFFAOYSA-N 0.000 description 2
- LGRFSURHDFAFJT-UHFFFAOYSA-N Phthalic anhydride Natural products C1=CC=C2C(=O)OC(=O)C2=C1 LGRFSURHDFAFJT-UHFFFAOYSA-N 0.000 description 2
- NQRYJNQNLNOLGT-UHFFFAOYSA-N Piperidine Chemical compound C1CCNCC1 NQRYJNQNLNOLGT-UHFFFAOYSA-N 0.000 description 2
- KAESVJOAVNADME-UHFFFAOYSA-N Pyrrole Chemical compound C=1C=CNC=1 KAESVJOAVNADME-UHFFFAOYSA-N 0.000 description 2
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 2
- 239000004115 Sodium Silicate Substances 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 229910052783 alkali metal Inorganic materials 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 230000001588 bifunctional effect Effects 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- NMJJFJNHVMGPGM-UHFFFAOYSA-N butyl formate Chemical compound CCCCOC=O NMJJFJNHVMGPGM-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- 239000006227 byproduct Substances 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 239000012295 chemical reaction liquid Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 2
- 229940018557 citraconic acid Drugs 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 230000005494 condensation Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 125000004093 cyano group Chemical class *C#N 0.000 description 2
- HGCIXCUEYOPUTN-UHFFFAOYSA-N cyclohexene Chemical compound C1CCC=CC1 HGCIXCUEYOPUTN-UHFFFAOYSA-N 0.000 description 2
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 2
- LPIQUOYDBNQMRZ-UHFFFAOYSA-N cyclopentene Chemical compound C1CC=CC1 LPIQUOYDBNQMRZ-UHFFFAOYSA-N 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- ZQPPMHVWECSIRJ-MDZDMXLPSA-N elaidic acid Chemical compound CCCCCCCC\C=C\CCCCCCCC(O)=O ZQPPMHVWECSIRJ-MDZDMXLPSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 125000004185 ester group Chemical class 0.000 description 2
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 2
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 2
- 239000001530 fumaric acid Substances 0.000 description 2
- GAEKPEKOJKCEMS-UHFFFAOYSA-N gamma-valerolactone Chemical compound CC1CCC(=O)O1 GAEKPEKOJKCEMS-UHFFFAOYSA-N 0.000 description 2
- 238000005227 gel permeation chromatography Methods 0.000 description 2
- CATSNJVOTSVZJV-UHFFFAOYSA-N heptan-2-one Chemical compound CCCCCC(C)=O CATSNJVOTSVZJV-UHFFFAOYSA-N 0.000 description 2
- NGAZZOYFWWSOGK-UHFFFAOYSA-N heptan-3-one Chemical compound CCCCC(=O)CC NGAZZOYFWWSOGK-UHFFFAOYSA-N 0.000 description 2
- PYGSKMBEVAICCR-UHFFFAOYSA-N hexa-1,5-diene Chemical compound C=CCCC=C PYGSKMBEVAICCR-UHFFFAOYSA-N 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 125000000959 isobutyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- QXJSBBXBKPUZAA-UHFFFAOYSA-N isooleic acid Natural products CCCCCCCC=CCCCCCCCCC(O)=O QXJSBBXBKPUZAA-UHFFFAOYSA-N 0.000 description 2
- CPJRRXSHAYUTGL-UHFFFAOYSA-N isopentenyl alcohol Chemical compound CC(=C)CCO CPJRRXSHAYUTGL-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000004611 light stabiliser Substances 0.000 description 2
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 2
- 239000011976 maleic acid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- HNEGQIOMVPPMNR-NSCUHMNNSA-N mesaconic acid Chemical compound OC(=O)C(/C)=C/C(O)=O HNEGQIOMVPPMNR-NSCUHMNNSA-N 0.000 description 2
- HNEGQIOMVPPMNR-UHFFFAOYSA-N methylfumaric acid Natural products OC(=O)C(C)=CC(O)=O HNEGQIOMVPPMNR-UHFFFAOYSA-N 0.000 description 2
- VAMFXQBUQXONLZ-UHFFFAOYSA-N n-alpha-eicosene Natural products CCCCCCCCCCCCCCCCCCC=C VAMFXQBUQXONLZ-UHFFFAOYSA-N 0.000 description 2
- 125000001280 n-hexyl group Chemical group C(CCCCC)* 0.000 description 2
- 125000000740 n-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 2
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 2
- 125000004433 nitrogen atom Chemical group N* 0.000 description 2
- CCCMONHAUSKTEQ-UHFFFAOYSA-N octadec-1-ene Chemical compound CCCCCCCCCCCCCCCCC=C CCCMONHAUSKTEQ-UHFFFAOYSA-N 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- YWAKXRMUMFPDSH-UHFFFAOYSA-N pentene Chemical compound CCCC=C YWAKXRMUMFPDSH-UHFFFAOYSA-N 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 150000002989 phenols Chemical class 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- 229920000058 polyacrylate Polymers 0.000 description 2
- 230000000379 polymerizing effect Effects 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- ASUAYTHWZCLXAN-UHFFFAOYSA-N prenol Chemical compound CC(C)=CCO ASUAYTHWZCLXAN-UHFFFAOYSA-N 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- 125000002914 sec-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 2
- NTHWMYGWWRZVTN-UHFFFAOYSA-N sodium silicate Chemical compound [Na+].[Na+].[O-][Si]([O-])=O NTHWMYGWWRZVTN-UHFFFAOYSA-N 0.000 description 2
- 229910052911 sodium silicate Inorganic materials 0.000 description 2
- 239000007921 spray Substances 0.000 description 2
- GAONUEUNHBLHPP-UHFFFAOYSA-N stk246934 Chemical compound O=C1C2C(C=C3)CC3C2C(=O)N1C1=CC=CC=C1 GAONUEUNHBLHPP-UHFFFAOYSA-N 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- VDZOOKBUILJEDG-UHFFFAOYSA-M tetrabutylammonium hydroxide Chemical compound [OH-].CCCC[N+](CCCC)(CCCC)CCCC VDZOOKBUILJEDG-UHFFFAOYSA-M 0.000 description 2
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- 239000004711 α-olefin Substances 0.000 description 2
- RRKODOZNUZCUBN-CCAGOZQPSA-N (1z,3z)-cycloocta-1,3-diene Chemical compound C1CC\C=C/C=C\C1 RRKODOZNUZCUBN-CCAGOZQPSA-N 0.000 description 1
- WVJRCSCNOMJNLP-UHFFFAOYSA-N (2-hydroxy-5-trimethoxysilylpentyl) 4-hydroxybenzoate Chemical compound CO[Si](OC)(OC)CCCC(O)COC(=O)C1=CC=C(O)C=C1 WVJRCSCNOMJNLP-UHFFFAOYSA-N 0.000 description 1
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 1
- JAMNSIXSLVPNLC-UHFFFAOYSA-N (4-ethenylphenyl) acetate Chemical compound CC(=O)OC1=CC=C(C=C)C=C1 JAMNSIXSLVPNLC-UHFFFAOYSA-N 0.000 description 1
- ZRDYULMDEGRWRC-UHFFFAOYSA-N (4-hydroxyphenyl)-(2,3,4-trihydroxyphenyl)methanone Chemical compound C1=CC(O)=CC=C1C(=O)C1=CC=C(O)C(O)=C1O ZRDYULMDEGRWRC-UHFFFAOYSA-N 0.000 description 1
- JBVMSEMQJGGOFR-FNORWQNLSA-N (4e)-4-methylhexa-1,4-diene Chemical compound C\C=C(/C)CC=C JBVMSEMQJGGOFR-FNORWQNLSA-N 0.000 description 1
- WNHHRXSVKWWRJY-UHFFFAOYSA-N (5-methyl-5-bicyclo[2.2.1]hept-2-enyl)methanol Chemical compound C1C2C(C)(CO)CC1C=C2 WNHHRXSVKWWRJY-UHFFFAOYSA-N 0.000 description 1
- OJOWICOBYCXEKR-KRXBUXKQSA-N (5e)-5-ethylidenebicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(=C/C)/CC1C=C2 OJOWICOBYCXEKR-KRXBUXKQSA-N 0.000 description 1
- WRIDQFICGBMAFQ-UHFFFAOYSA-N (E)-8-Octadecenoic acid Natural products CCCCCCCCCC=CCCCCCCC(O)=O WRIDQFICGBMAFQ-UHFFFAOYSA-N 0.000 description 1
- XVOUMQNXTGKGMA-OWOJBTEDSA-N (E)-glutaconic acid Chemical compound OC(=O)C\C=C\C(O)=O XVOUMQNXTGKGMA-OWOJBTEDSA-N 0.000 description 1
- 239000001714 (E)-hex-2-en-1-ol Substances 0.000 description 1
- ULPMRIXXHGUZFA-UHFFFAOYSA-N (R)-4-Methyl-3-hexanone Natural products CCC(C)C(=O)CC ULPMRIXXHGUZFA-UHFFFAOYSA-N 0.000 description 1
- 0 *C12C(*)=C(C3C(*)=C(*)C(*)=C(*)C33)C3=C(*)C1C(*)=C2* Chemical compound *C12C(*)=C(C3C(*)=C(*)C(*)=C(*)C33)C3=C(*)C1C(*)=C2* 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- WOAHJDHKFWSLKE-UHFFFAOYSA-N 1,2-benzoquinone Chemical compound O=C1C=CC=CC1=O WOAHJDHKFWSLKE-UHFFFAOYSA-N 0.000 description 1
- LZDKZFUFMNSQCJ-UHFFFAOYSA-N 1,2-diethoxyethane Chemical compound CCOCCOCC LZDKZFUFMNSQCJ-UHFFFAOYSA-N 0.000 description 1
- 150000005206 1,2-dihydroxybenzenes Chemical class 0.000 description 1
- 150000005207 1,3-dihydroxybenzenes Chemical class 0.000 description 1
- SGUVLZREKBPKCE-UHFFFAOYSA-N 1,5-diazabicyclo[4.3.0]-non-5-ene Chemical compound C1CCN=C2CCCN21 SGUVLZREKBPKCE-UHFFFAOYSA-N 0.000 description 1
- FNZRXUAUAJJWSS-UHFFFAOYSA-N 1,5-dibromocyclohexa-3,5-diene-1,2-diol Chemical compound BrC1(C(O)C=CC(=C1)Br)O FNZRXUAUAJJWSS-UHFFFAOYSA-N 0.000 description 1
- WASRVAMMCHZMDA-UHFFFAOYSA-N 1,6-dimethylcyclohexa-3,5-diene-1,2-diol Chemical compound CC1=CC=CC(O)C1(C)O WASRVAMMCHZMDA-UHFFFAOYSA-N 0.000 description 1
- LNOKVKHZEYOLIQ-UHFFFAOYSA-N 1-(2,6-diethylphenyl)pyrrole-2,5-dione Chemical compound CCC1=CC=CC(CC)=C1N1C(=O)C=CC1=O LNOKVKHZEYOLIQ-UHFFFAOYSA-N 0.000 description 1
- VBEKZTMSHKVMAP-UHFFFAOYSA-N 1-(3-methylbutyl)cyclohexa-3,5-diene-1,2-diol Chemical compound C(CC(C)C)C1(C(O)C=CC=C1)O VBEKZTMSHKVMAP-UHFFFAOYSA-N 0.000 description 1
- ISGBKWSEHGAUNF-UHFFFAOYSA-N 1-(4-acetylphenyl)pyrrole-2,5-dione Chemical compound C1=CC(C(=O)C)=CC=C1N1C(=O)C=CC1=O ISGBKWSEHGAUNF-UHFFFAOYSA-N 0.000 description 1
- DUFUXAHBRPMOFG-UHFFFAOYSA-N 1-(4-anilinonaphthalen-1-yl)pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C1=CC=CC=C11)=CC=C1NC1=CC=CC=C1 DUFUXAHBRPMOFG-UHFFFAOYSA-N 0.000 description 1
- NKPPNPJUBLEKAD-UHFFFAOYSA-N 1-(4-hydroxyphenyl)prop-2-en-1-one Chemical compound OC1=CC=C(C(=O)C=C)C=C1 NKPPNPJUBLEKAD-UHFFFAOYSA-N 0.000 description 1
- BLLFPKZTBLMEFG-UHFFFAOYSA-N 1-(4-hydroxyphenyl)pyrrole-2,5-dione Chemical compound C1=CC(O)=CC=C1N1C(=O)C=CC1=O BLLFPKZTBLMEFG-UHFFFAOYSA-N 0.000 description 1
- BGGCPIFVRJFAKF-UHFFFAOYSA-N 1-[4-(1,3-benzoxazol-2-yl)phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=CC=C(C=2OC3=CC=CC=C3N=2)C=C1 BGGCPIFVRJFAKF-UHFFFAOYSA-N 0.000 description 1
- QPYAUURPGVXHFK-UHFFFAOYSA-N 1-[4-(dimethylamino)-3,5-dinitrophenyl]pyrrole-2,5-dione Chemical compound C1=C([N+]([O-])=O)C(N(C)C)=C([N+]([O-])=O)C=C1N1C(=O)C=CC1=O QPYAUURPGVXHFK-UHFFFAOYSA-N 0.000 description 1
- NCFIKBMPEOEIED-UHFFFAOYSA-N 1-acridin-9-ylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1=C(C=CC=C2)C2=NC2=CC=CC=C12 NCFIKBMPEOEIED-UHFFFAOYSA-N 0.000 description 1
- MUVQKFGNPGZBII-UHFFFAOYSA-N 1-anthrol Chemical class C1=CC=C2C=C3C(O)=CC=CC3=CC2=C1 MUVQKFGNPGZBII-UHFFFAOYSA-N 0.000 description 1
- MKRBAPNEJMFMHU-UHFFFAOYSA-N 1-benzylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1CC1=CC=CC=C1 MKRBAPNEJMFMHU-UHFFFAOYSA-N 0.000 description 1
- HNAGHMKIPMKKBB-UHFFFAOYSA-N 1-benzylpyrrolidine-3-carboxamide Chemical compound C1C(C(=O)N)CCN1CC1=CC=CC=C1 HNAGHMKIPMKKBB-UHFFFAOYSA-N 0.000 description 1
- RWNUSVWFHDHRCJ-UHFFFAOYSA-N 1-butoxypropan-2-ol Chemical compound CCCCOCC(C)O RWNUSVWFHDHRCJ-UHFFFAOYSA-N 0.000 description 1
- JNPCNDJVEUEFBO-UHFFFAOYSA-N 1-butylpyrrole-2,5-dione Chemical compound CCCCN1C(=O)C=CC1=O JNPCNDJVEUEFBO-UHFFFAOYSA-N 0.000 description 1
- BQTPKSBXMONSJI-UHFFFAOYSA-N 1-cyclohexylpyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C1CCCCC1 BQTPKSBXMONSJI-UHFFFAOYSA-N 0.000 description 1
- 229940106006 1-eicosene Drugs 0.000 description 1
- FIKTURVKRGQNQD-UHFFFAOYSA-N 1-eicosene Natural products CCCCCCCCCCCCCCCCCC=CC(O)=O FIKTURVKRGQNQD-UHFFFAOYSA-N 0.000 description 1
- XIRPMPKSZHNMST-UHFFFAOYSA-N 1-ethenyl-2-phenylbenzene Chemical group C=CC1=CC=CC=C1C1=CC=CC=C1 XIRPMPKSZHNMST-UHFFFAOYSA-N 0.000 description 1
- GRFNSWBVXHLTCI-UHFFFAOYSA-N 1-ethenyl-4-[(2-methylpropan-2-yl)oxy]benzene Chemical compound CC(C)(C)OC1=CC=C(C=C)C=C1 GRFNSWBVXHLTCI-UHFFFAOYSA-N 0.000 description 1
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 1
- SDXHBDVTZNMBEW-UHFFFAOYSA-N 1-ethoxy-2-(2-hydroxyethoxy)ethanol Chemical compound CCOC(O)COCCO SDXHBDVTZNMBEW-UHFFFAOYSA-N 0.000 description 1
- LIPRQQHINVWJCH-UHFFFAOYSA-N 1-ethoxypropan-2-yl acetate Chemical compound CCOCC(C)OC(C)=O LIPRQQHINVWJCH-UHFFFAOYSA-N 0.000 description 1
- ARXJGSRGQADJSQ-UHFFFAOYSA-N 1-methoxypropan-2-ol Chemical compound COCC(C)O ARXJGSRGQADJSQ-UHFFFAOYSA-N 0.000 description 1
- VEIIEWOTAHXGKS-UHFFFAOYSA-N 1-phenylethenol Chemical compound OC(=C)C1=CC=CC=C1 VEIIEWOTAHXGKS-UHFFFAOYSA-N 0.000 description 1
- IGGDKDTUCAWDAN-UHFFFAOYSA-N 1-vinylnaphthalene Chemical compound C1=CC=C2C(C=C)=CC=CC2=C1 IGGDKDTUCAWDAN-UHFFFAOYSA-N 0.000 description 1
- LEOHSWVNTUYBCE-UHFFFAOYSA-N 2,2,2-trifluoroethyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C)(C(=O)OCC(F)(F)F)CC1C=C2 LEOHSWVNTUYBCE-UHFFFAOYSA-N 0.000 description 1
- JCEBJANJSMTYJD-UHFFFAOYSA-N 2,2,2-trifluoroethyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCC(F)(F)F)CC1C=C2 JCEBJANJSMTYJD-UHFFFAOYSA-N 0.000 description 1
- 125000004206 2,2,2-trifluoroethyl group Chemical group [H]C([H])(*)C(F)(F)F 0.000 description 1
- HTQNYBBTZSBWKL-UHFFFAOYSA-N 2,3,4-trihydroxbenzophenone Chemical compound OC1=C(O)C(O)=CC=C1C(=O)C1=CC=CC=C1 HTQNYBBTZSBWKL-UHFFFAOYSA-N 0.000 description 1
- QKGQHTCUNGPCIA-UHFFFAOYSA-N 2,4,5-Trihydroxytoluene Chemical compound CC1=CC(O)=C(O)C=C1O QKGQHTCUNGPCIA-UHFFFAOYSA-N 0.000 description 1
- UWYCAHQDPTUBEK-UHFFFAOYSA-N 2,4-di(propan-2-yl)benzene-1,3-diol Chemical compound CC(C)C1=CC=C(O)C(C(C)C)=C1O UWYCAHQDPTUBEK-UHFFFAOYSA-N 0.000 description 1
- BGRKRQSDUDWDQB-UHFFFAOYSA-N 2,4-diethylbenzene-1,3-diol Chemical compound CCC1=CC=C(O)C(CC)=C1O BGRKRQSDUDWDQB-UHFFFAOYSA-N 0.000 description 1
- UARIIRCJLHXOBZ-UHFFFAOYSA-N 2,4-dipentylbenzene-1,3-diol Chemical compound C(CCCC)C1=C(O)C=CC(=C1O)CCCCC UARIIRCJLHXOBZ-UHFFFAOYSA-N 0.000 description 1
- HWFMJVJAWHFVJJ-UHFFFAOYSA-N 2,5-dioctylbenzene-1,3-diol Chemical compound C(CCCCCCC)C1=C(O)C=C(C=C1O)CCCCCCCC HWFMJVJAWHFVJJ-UHFFFAOYSA-N 0.000 description 1
- VRMKFAFIVOVETG-UHFFFAOYSA-N 2,6-bis(methoxymethyl)-4-methylphenol Chemical compound COCC1=CC(C)=CC(COC)=C1O VRMKFAFIVOVETG-UHFFFAOYSA-N 0.000 description 1
- ZAOMUMJENGCKAR-UHFFFAOYSA-N 2-(1-phenylbut-3-en-2-yloxy)but-3-enylbenzene Chemical compound C=1C=CC=CC=1CC(C=C)OC(C=C)CC1=CC=CC=C1 ZAOMUMJENGCKAR-UHFFFAOYSA-N 0.000 description 1
- AENZGWONVTXLRC-UHFFFAOYSA-N 2-(2,5-dioxopyrrol-1-yl)benzoic acid Chemical compound OC(=O)C1=CC=CC=C1N1C(=O)C=CC1=O AENZGWONVTXLRC-UHFFFAOYSA-N 0.000 description 1
- XLXYTPFIEKIXSN-UHFFFAOYSA-N 2-(2-ethylbutyl)-3a,4,7,7a-tetrahydro-1h-4,7-methanoisoindole-1,3(2h)-dione Chemical compound C1=CC2CC1C1C2C(=O)N(CC(CC)CC)C1=O XLXYTPFIEKIXSN-UHFFFAOYSA-N 0.000 description 1
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- MEJFVBUCFBLTKO-UHFFFAOYSA-N 2-(4-bicyclo[2.2.1]hept-2-enyl)ethanol Chemical compound C1CC2C=CC1(CCO)C2 MEJFVBUCFBLTKO-UHFFFAOYSA-N 0.000 description 1
- ZWLMSPFIEMHRIM-UHFFFAOYSA-N 2-(5-bicyclo[2.2.1]hept-2-enyl)-1,1,1,3,3,3-hexafluoropropan-2-ol Chemical compound C1C2C(C(O)(C(F)(F)F)C(F)(F)F)CC1C=C2 ZWLMSPFIEMHRIM-UHFFFAOYSA-N 0.000 description 1
- YZRMOQASKCPNAH-UHFFFAOYSA-N 2-(carboxymethyl)bicyclo[2.2.1]hept-5-ene-3-carboxylic acid Chemical compound C1C2C=CC1C(CC(=O)O)C2C(O)=O YZRMOQASKCPNAH-UHFFFAOYSA-N 0.000 description 1
- JJRUAPNVLBABCN-UHFFFAOYSA-N 2-(ethenoxymethyl)oxirane Chemical compound C=COCC1CO1 JJRUAPNVLBABCN-UHFFFAOYSA-N 0.000 description 1
- BXGYYDRIMBPOMN-UHFFFAOYSA-N 2-(hydroxymethoxy)ethoxymethanol Chemical compound OCOCCOCO BXGYYDRIMBPOMN-UHFFFAOYSA-N 0.000 description 1
- AJRZFZKKKGRKLQ-UHFFFAOYSA-N 2-(hydroxymethyl)bicyclo[2.2.1]hept-5-ene-3-carboxylic acid Chemical compound C1C2C=CC1C(CO)C2C(O)=O AJRZFZKKKGRKLQ-UHFFFAOYSA-N 0.000 description 1
- WCASXYBKJHWFMY-NSCUHMNNSA-N 2-Buten-1-ol Chemical compound C\C=C\CO WCASXYBKJHWFMY-NSCUHMNNSA-N 0.000 description 1
- ZCHHRLHTBGRGOT-SNAWJCMRSA-N 2-Hexen-1-ol Natural products CCC\C=C\CO ZCHHRLHTBGRGOT-SNAWJCMRSA-N 0.000 description 1
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 1
- BZAZNULYLRVMSW-UHFFFAOYSA-N 2-Methyl-2-buten-3-ol Natural products CC(C)=C(C)O BZAZNULYLRVMSW-UHFFFAOYSA-N 0.000 description 1
- UIERETOOQGIECD-ARJAWSKDSA-M 2-Methyl-2-butenoic acid Natural products C\C=C(\C)C([O-])=O UIERETOOQGIECD-ARJAWSKDSA-M 0.000 description 1
- PQDNPXPHODJEKV-UHFFFAOYSA-N 2-[(3,5-dioxo-4-azatricyclo[5.2.1.02,6]dec-8-en-4-yl)methyl]propanedioic acid Chemical compound OC(=O)C(CN1C(=O)C2C3C=CC(C2C1=O)C3)C(=O)O PQDNPXPHODJEKV-UHFFFAOYSA-N 0.000 description 1
- ZSYBUHKRLXNWLP-UHFFFAOYSA-N 2-[2-(1-bicyclo[2.2.1]hept-2-enyl)acetyl]oxy-1H-naphthalene-2-carboxylic acid Chemical compound OC(=O)C1(CC2=CC=CC=C2C=C1)OC(=O)CC12CCC(C=C1)C2 ZSYBUHKRLXNWLP-UHFFFAOYSA-N 0.000 description 1
- KBQUYCFJACYUIX-UHFFFAOYSA-N 2-[2-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]dec-8-en-4-yl)ethyl]propanedioic acid Chemical compound OC(=O)C(CCN1C(=O)C2C3C=CC(C2C1=O)C3)C(=O)O KBQUYCFJACYUIX-UHFFFAOYSA-N 0.000 description 1
- MEVBAGCIOOTPLF-UHFFFAOYSA-N 2-[[5-(oxiran-2-ylmethoxy)naphthalen-2-yl]oxymethyl]oxirane Chemical compound C1OC1COC(C=C1C=CC=2)=CC=C1C=2OCC1CO1 MEVBAGCIOOTPLF-UHFFFAOYSA-N 0.000 description 1
- NQBXSWAWVZHKBZ-UHFFFAOYSA-N 2-butoxyethyl acetate Chemical compound CCCCOCCOC(C)=O NQBXSWAWVZHKBZ-UHFFFAOYSA-N 0.000 description 1
- MYVFYVDFTPQNBY-UHFFFAOYSA-N 2-butyl-3a,4,7,7a-tetrahydro-1h-4,7-methanoisoindole-1,3(2h)-dione Chemical compound C1=CC2CC1C1C2C(=O)N(CCCC)C1=O MYVFYVDFTPQNBY-UHFFFAOYSA-N 0.000 description 1
- WLJWDDUTPNYDHW-UHFFFAOYSA-N 2-butylbenzene-1,3-diol Chemical compound CCCCC1=C(O)C=CC=C1O WLJWDDUTPNYDHW-UHFFFAOYSA-N 0.000 description 1
- SBYMUDUGTIKLCR-UHFFFAOYSA-N 2-chloroethenylbenzene Chemical compound ClC=CC1=CC=CC=C1 SBYMUDUGTIKLCR-UHFFFAOYSA-N 0.000 description 1
- ALQPJHSFIXARGX-UHFFFAOYSA-N 2-ethynylaniline Chemical compound NC1=CC=CC=C1C#C ALQPJHSFIXARGX-UHFFFAOYSA-N 0.000 description 1
- ZCHHRLHTBGRGOT-UHFFFAOYSA-N 2-hexen-1-ol Chemical compound CCCC=CCO ZCHHRLHTBGRGOT-UHFFFAOYSA-N 0.000 description 1
- PHSXOZKMZYKHLY-UHFFFAOYSA-N 2-hydroxyethyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCCO)CC1C=C2 PHSXOZKMZYKHLY-UHFFFAOYSA-N 0.000 description 1
- ZNCUUYCDKVNVJH-UHFFFAOYSA-N 2-isopropoxyphenol Chemical compound CC(C)OC1=CC=CC=C1O ZNCUUYCDKVNVJH-UHFFFAOYSA-N 0.000 description 1
- 125000004200 2-methoxyethyl group Chemical group [H]C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- WHRYLXXHLFPFNZ-UHFFFAOYSA-N 2-methyl-3a,4,7,7a-tetrahydro-1h-4,7-methanoisoindole-1,3(2h)-dione Chemical compound C1=CC2CC1C1C2C(=O)N(C)C1=O WHRYLXXHLFPFNZ-UHFFFAOYSA-N 0.000 description 1
- ZTMADXFOCUXMJE-UHFFFAOYSA-N 2-methylbenzene-1,3-diol Chemical compound CC1=C(O)C=CC=C1O ZTMADXFOCUXMJE-UHFFFAOYSA-N 0.000 description 1
- 125000004493 2-methylbut-1-yl group Chemical group CC(C*)CC 0.000 description 1
- 125000003229 2-methylhexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000005916 2-methylpentyl group Chemical group 0.000 description 1
- BYDRTKVGBRTTIT-UHFFFAOYSA-N 2-methylprop-2-en-1-ol Chemical compound CC(=C)CO BYDRTKVGBRTTIT-UHFFFAOYSA-N 0.000 description 1
- LEVZZYOVVQKGOM-UHFFFAOYSA-N 2-n,2-n,4-n,4-n,6-n-pentakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCNC1=NC(N(COC)COC)=NC(N(COC)COC)=N1 LEVZZYOVVQKGOM-UHFFFAOYSA-N 0.000 description 1
- FLYHFZHMELHCRY-UHFFFAOYSA-N 2-n,2-n,4-n,6-n-tetrakis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCNC1=NC(NCOC)=NC(N(COC)COC)=N1 FLYHFZHMELHCRY-UHFFFAOYSA-N 0.000 description 1
- CZFJRMBYCKMYHU-UHFFFAOYSA-N 2-n,4-n,6-n-tris(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCNC1=NC(NCOC)=NC(NCOC)=N1 CZFJRMBYCKMYHU-UHFFFAOYSA-N 0.000 description 1
- DULUPJGRJYHDLJ-UHFFFAOYSA-N 2-n,4-n-bis(methoxymethyl)-1,3,5-triazine-2,4,6-triamine Chemical compound COCNC1=NC(N)=NC(NCOC)=N1 DULUPJGRJYHDLJ-UHFFFAOYSA-N 0.000 description 1
- HHSCZZZCAYSVRK-UHFFFAOYSA-N 2-octylbenzene-1,3-diol Chemical compound CCCCCCCCC1=C(O)C=CC=C1O HHSCZZZCAYSVRK-UHFFFAOYSA-N 0.000 description 1
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- YEYKMVJDLWJFOA-UHFFFAOYSA-N 2-propoxyethanol Chemical compound CCCOCCO YEYKMVJDLWJFOA-UHFFFAOYSA-N 0.000 description 1
- WJQOZHYUIDYNHM-UHFFFAOYSA-N 2-tert-Butylphenol Chemical compound CC(C)(C)C1=CC=CC=C1O WJQOZHYUIDYNHM-UHFFFAOYSA-N 0.000 description 1
- LQJBNNIYVWPHFW-UHFFFAOYSA-N 20:1omega9c fatty acid Natural products CCCCCCCCCCC=CCCCCCCCC(O)=O LQJBNNIYVWPHFW-UHFFFAOYSA-N 0.000 description 1
- SMETXUPBOCFVOE-UHFFFAOYSA-N 3,5-dimethylbenzene-1,2,4-triol Chemical compound CC1=CC(O)=C(O)C(C)=C1O SMETXUPBOCFVOE-UHFFFAOYSA-N 0.000 description 1
- FYZAGOMIGJDFNE-UHFFFAOYSA-N 3-(3,5-dioxo-4-azatricyclo[5.2.1.02,6]dec-8-en-4-yl)-2-phenylpropanoic acid Chemical compound OC(=O)C(CN1C(=O)C2C3C=CC(C2C1=O)C3)C1=CC=CC=C1 FYZAGOMIGJDFNE-UHFFFAOYSA-N 0.000 description 1
- ZSPTYLOMNJNZNG-UHFFFAOYSA-N 3-Buten-1-ol Chemical compound OCCC=C ZSPTYLOMNJNZNG-UHFFFAOYSA-N 0.000 description 1
- NSPPRYXGGYQMPY-UHFFFAOYSA-N 3-Methylbuten-2-ol-1 Natural products CC(C)C(O)=C NSPPRYXGGYQMPY-UHFFFAOYSA-N 0.000 description 1
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 1
- IWTYTFSSTWXZFU-UHFFFAOYSA-N 3-chloroprop-1-enylbenzene Chemical compound ClCC=CC1=CC=CC=C1 IWTYTFSSTWXZFU-UHFFFAOYSA-N 0.000 description 1
- UUCQGNWZASKXNN-UHFFFAOYSA-N 3-ethylcatechol Chemical compound CCC1=CC=CC(O)=C1O UUCQGNWZASKXNN-UHFFFAOYSA-N 0.000 description 1
- OLGHJTHQWQKJQQ-UHFFFAOYSA-N 3-ethylhex-1-ene Chemical compound CCCC(CC)C=C OLGHJTHQWQKJQQ-UHFFFAOYSA-N 0.000 description 1
- YPVPQMCSLFDIKA-UHFFFAOYSA-N 3-ethylpent-1-ene Chemical compound CCC(CC)C=C YPVPQMCSLFDIKA-UHFFFAOYSA-N 0.000 description 1
- NNKQLUVBPJEUOR-UHFFFAOYSA-N 3-ethynylaniline Chemical compound NC1=CC=CC(C#C)=C1 NNKQLUVBPJEUOR-UHFFFAOYSA-N 0.000 description 1
- ABRQMTGILBWGOI-UHFFFAOYSA-N 3-hept-4-enyl-4-propyloxolane-2,5-dione Chemical compound CCCC1C(CCCC=CCC)C(=O)OC1=O ABRQMTGILBWGOI-UHFFFAOYSA-N 0.000 description 1
- PFCHFHIRKBAQGU-UHFFFAOYSA-N 3-hexanone Chemical compound CCCC(=O)CC PFCHFHIRKBAQGU-UHFFFAOYSA-N 0.000 description 1
- QOXOZONBQWIKDA-UHFFFAOYSA-N 3-hydroxypropyl Chemical group [CH2]CCO QOXOZONBQWIKDA-UHFFFAOYSA-N 0.000 description 1
- YHQXBTXEYZIYOV-UHFFFAOYSA-N 3-methylbut-1-ene Chemical compound CC(C)C=C YHQXBTXEYZIYOV-UHFFFAOYSA-N 0.000 description 1
- AYKYXWQEBUNJCN-UHFFFAOYSA-N 3-methylfuran-2,5-dione Chemical compound CC1=CC(=O)OC1=O AYKYXWQEBUNJCN-UHFFFAOYSA-N 0.000 description 1
- OFNISBHGPNMTMS-UHFFFAOYSA-N 3-methylideneoxolane-2,5-dione Chemical class C=C1CC(=O)OC1=O OFNISBHGPNMTMS-UHFFFAOYSA-N 0.000 description 1
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 1
- FQKKBQRXKBNPEW-UHFFFAOYSA-N 3-tricyclo[5.2.1.02,6]deca-4,8-dienylmethanol Chemical compound C1C2C3C(CO)C=CC3C1C=C2 FQKKBQRXKBNPEW-UHFFFAOYSA-N 0.000 description 1
- URDOJQUSEUXVRP-UHFFFAOYSA-N 3-triethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CCO[Si](OCC)(OCC)CCCOC(=O)C(C)=C URDOJQUSEUXVRP-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- GPIUUMROPXDNRH-UHFFFAOYSA-N 3647-74-3 Chemical compound C1C2C3C(=O)NC(=O)C3C1C=C2 GPIUUMROPXDNRH-UHFFFAOYSA-N 0.000 description 1
- UHMARZNHEMRXQH-UHFFFAOYSA-N 3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical class C1=CCCC2C(=O)OC(=O)C21 UHMARZNHEMRXQH-UHFFFAOYSA-N 0.000 description 1
- SUJVAMIXNUAJEY-UHFFFAOYSA-N 4,4-dimethylhex-1-ene Chemical compound CCC(C)(C)CC=C SUJVAMIXNUAJEY-UHFFFAOYSA-N 0.000 description 1
- KLCNJIQZXOQYTE-UHFFFAOYSA-N 4,4-dimethylpent-1-ene Chemical compound CC(C)(C)CC=C KLCNJIQZXOQYTE-UHFFFAOYSA-N 0.000 description 1
- RBLPVXMAVRBHLI-UHFFFAOYSA-N 4,5,6-trimethylbenzene-1,2,3-triol Chemical compound CC1=C(C)C(O)=C(O)C(O)=C1C RBLPVXMAVRBHLI-UHFFFAOYSA-N 0.000 description 1
- GYBSXVSGJLAHDV-UHFFFAOYSA-N 4,6-dibromobenzene-1,3-diol Chemical compound OC1=CC(O)=C(Br)C=C1Br GYBSXVSGJLAHDV-UHFFFAOYSA-N 0.000 description 1
- POEXSFVHNQVOLQ-UHFFFAOYSA-N 4,6-dibutylbenzene-1,3-diol Chemical compound CCCCC1=CC(CCCC)=C(O)C=C1O POEXSFVHNQVOLQ-UHFFFAOYSA-N 0.000 description 1
- GRLQBYQELUWBIO-UHFFFAOYSA-N 4,6-dichlorobenzene-1,3-diol Chemical compound OC1=CC(O)=C(Cl)C=C1Cl GRLQBYQELUWBIO-UHFFFAOYSA-N 0.000 description 1
- IYDQSPIOJHDHHO-UHFFFAOYSA-N 4,6-dimethylbenzene-1,3-diol Chemical compound CC1=CC(C)=C(O)C=C1O IYDQSPIOJHDHHO-UHFFFAOYSA-N 0.000 description 1
- CMJCWFKZHGHDNW-UHFFFAOYSA-N 4-(2-ethyloctyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(C)C(CN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCCC CMJCWFKZHGHDNW-UHFFFAOYSA-N 0.000 description 1
- QVVNNKZXILVKSQ-UHFFFAOYSA-N 4-(2-methylbutyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CN1C(=O)C2C3C=CC(C2C1=O)C3)CC QVVNNKZXILVKSQ-UHFFFAOYSA-N 0.000 description 1
- GPIZMZGBOPYEFG-UHFFFAOYSA-N 4-(2-methylheptyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCC GPIZMZGBOPYEFG-UHFFFAOYSA-N 0.000 description 1
- XVNWPSBUDSYSPF-UHFFFAOYSA-N 4-(2-methylhexyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CCCCC(C)CN1C(=O)C2C3CC(C=C3)C2C1=O XVNWPSBUDSYSPF-UHFFFAOYSA-N 0.000 description 1
- DKIHIDZXAAYMRP-UHFFFAOYSA-N 4-(2-methylnonyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCCCC DKIHIDZXAAYMRP-UHFFFAOYSA-N 0.000 description 1
- ABYLFIWJNQVLEU-UHFFFAOYSA-N 4-(2-methyloctyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCCC ABYLFIWJNQVLEU-UHFFFAOYSA-N 0.000 description 1
- WTTOVGGVLUMVGF-UHFFFAOYSA-N 4-(2-propylpentyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(CC)C(CN1C(=O)C2C3C=CC(C2C1=O)C3)CCC WTTOVGGVLUMVGF-UHFFFAOYSA-N 0.000 description 1
- XXKJURMSOICRCK-UHFFFAOYSA-N 4-(2-trimethoxysilylethyl)phenol Chemical compound CO[Si](OC)(OC)CCC1=CC=C(O)C=C1 XXKJURMSOICRCK-UHFFFAOYSA-N 0.000 description 1
- NSKDPULTYYBMOB-UHFFFAOYSA-N 4-(3-ethylheptyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(C)C(CCN1C(=O)C2C3C=CC(C2C1=O)C3)CCCC NSKDPULTYYBMOB-UHFFFAOYSA-N 0.000 description 1
- MLUFSDJPPXGHJS-UHFFFAOYSA-N 4-(3-ethyloctyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(C)C(CCN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCC MLUFSDJPPXGHJS-UHFFFAOYSA-N 0.000 description 1
- SWINLNKPVRNQKU-UHFFFAOYSA-N 4-(3-methylhexyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCN1C(=O)C2C3C=CC(C2C1=O)C3)CCC SWINLNKPVRNQKU-UHFFFAOYSA-N 0.000 description 1
- PLOOZRWPXCQWLG-UHFFFAOYSA-N 4-(3-methylnonyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCCC PLOOZRWPXCQWLG-UHFFFAOYSA-N 0.000 description 1
- VVMWMWSLCQVFLM-UHFFFAOYSA-N 4-(3-methyloctyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCN1C(=O)C2C3C=CC(C2C1=O)C3)CCCCC VVMWMWSLCQVFLM-UHFFFAOYSA-N 0.000 description 1
- HINDSULEOFNHEL-UHFFFAOYSA-N 4-(3-propylhexyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(CC)C(CCN1C(=O)C2C3C=CC(C2C1=O)C3)CCC HINDSULEOFNHEL-UHFFFAOYSA-N 0.000 description 1
- HJMMPZPVDNIHLX-UHFFFAOYSA-N 4-(4-ethyloctyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(C)C(CCCN1C(=O)C2C3C=CC(C2C1=O)C3)CCCC HJMMPZPVDNIHLX-UHFFFAOYSA-N 0.000 description 1
- QYHFGPGOSLYVIB-UHFFFAOYSA-N 4-(4-methylheptyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCN1C(=O)C2C3C=CC(C2C1=O)C3)CCC QYHFGPGOSLYVIB-UHFFFAOYSA-N 0.000 description 1
- CZGCPAYJJYAUOL-UHFFFAOYSA-N 4-(5-bicyclo[2.2.1]hept-2-enyl)phenol Chemical compound C1=CC(O)=CC=C1C1C(C=C2)CC2C1 CZGCPAYJJYAUOL-UHFFFAOYSA-N 0.000 description 1
- DLLSVQVOYYQPNY-UHFFFAOYSA-N 4-(5-methyl-5-bicyclo[2.2.1]hept-2-enyl)phenol Chemical compound C1C(C=C2)CC2C1(C)C1=CC=C(O)C=C1 DLLSVQVOYYQPNY-UHFFFAOYSA-N 0.000 description 1
- WVBUFQVRTAAVGH-UHFFFAOYSA-N 4-(5-methylnonyl)-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCN1C(=O)C2C3C=CC(C2C1=O)C3)CCCC WVBUFQVRTAAVGH-UHFFFAOYSA-N 0.000 description 1
- FIGVNZUQNIUGPD-UHFFFAOYSA-N 4-[1,1-bis(4-hydroxy-3-methylphenyl)ethyl]-2-methylphenol Chemical compound C1=C(O)C(C)=CC(C(C)(C=2C=C(C)C(O)=CC=2)C=2C=C(C)C(O)=CC=2)=C1 FIGVNZUQNIUGPD-UHFFFAOYSA-N 0.000 description 1
- HDPBBNNDDQOWPJ-UHFFFAOYSA-N 4-[1,2,2-tris(4-hydroxyphenyl)ethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 HDPBBNNDDQOWPJ-UHFFFAOYSA-N 0.000 description 1
- KALPHJNECRDONO-UHFFFAOYSA-N 4-[1-[4-hydroxy-3,5-bis(methoxymethyl)phenyl]-1-phenylethyl]-2,6-bis(methoxymethyl)phenol Chemical compound COCC1=C(O)C(COC)=CC(C(C)(C=2C=CC=CC=2)C=2C=C(COC)C(O)=C(COC)C=2)=C1 KALPHJNECRDONO-UHFFFAOYSA-N 0.000 description 1
- CJBUQOXMWGPKGP-UHFFFAOYSA-N 4-[3,3-bis(4-hydroxy-2,5-dimethylphenyl)-1-phenylpropyl]-2,5-dimethylphenol Chemical compound C1=C(O)C(C)=CC(C(CC(C=2C(=CC(O)=C(C)C=2)C)C=2C(=CC(O)=C(C)C=2)C)C=2C=CC=CC=2)=C1C CJBUQOXMWGPKGP-UHFFFAOYSA-N 0.000 description 1
- JHIUAEPQGMOWHS-UHFFFAOYSA-N 4-[4-hydroxy-3,5-bis(methoxymethyl)phenyl]-2,6-bis(methoxymethyl)phenol Chemical group COCC1=C(O)C(COC)=CC(C=2C=C(COC)C(O)=C(COC)C=2)=C1 JHIUAEPQGMOWHS-UHFFFAOYSA-N 0.000 description 1
- WFCQTAXSWSWIHS-UHFFFAOYSA-N 4-[bis(4-hydroxyphenyl)methyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 WFCQTAXSWSWIHS-UHFFFAOYSA-N 0.000 description 1
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 1
- JQVAPEJNIZULEK-UHFFFAOYSA-N 4-chlorobenzene-1,3-diol Chemical class OC1=CC=C(Cl)C(O)=C1 JQVAPEJNIZULEK-UHFFFAOYSA-N 0.000 description 1
- PSBZHRVZVAQBNS-UHFFFAOYSA-N 4-decan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 PSBZHRVZVAQBNS-UHFFFAOYSA-N 0.000 description 1
- GQZWYWSJOOGEMG-UHFFFAOYSA-N 4-decan-3-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(C)C(CCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 GQZWYWSJOOGEMG-UHFFFAOYSA-N 0.000 description 1
- ULJAQZCVBREZBM-UHFFFAOYSA-N 4-dodecan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 ULJAQZCVBREZBM-UHFFFAOYSA-N 0.000 description 1
- IRQWEODKXLDORP-UHFFFAOYSA-N 4-ethenylbenzoic acid Chemical compound OC(=O)C1=CC=C(C=C)C=C1 IRQWEODKXLDORP-UHFFFAOYSA-N 0.000 description 1
- OPMUAJRVOWSBTP-UHFFFAOYSA-N 4-ethyl-1-hexene Chemical compound CCC(CC)CC=C OPMUAJRVOWSBTP-UHFFFAOYSA-N 0.000 description 1
- KZJOWXTTXLYUIU-UHFFFAOYSA-N 4-hexadecan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCCCCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 KZJOWXTTXLYUIU-UHFFFAOYSA-N 0.000 description 1
- HWCRRWJQBDTOBJ-UHFFFAOYSA-N 4-hexan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 HWCRRWJQBDTOBJ-UHFFFAOYSA-N 0.000 description 1
- NHYDATXTNUFKBQ-UHFFFAOYSA-N 4-hexan-3-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(C)C(CCC)N1C(=O)C2C3C=CC(C2C1=O)C3 NHYDATXTNUFKBQ-UHFFFAOYSA-N 0.000 description 1
- SXIFAEWFOJETOA-UHFFFAOYSA-N 4-hydroxy-butyl Chemical group [CH2]CCCO SXIFAEWFOJETOA-UHFFFAOYSA-N 0.000 description 1
- PHZREHARUPHHCU-UHFFFAOYSA-N 4-methylbenzene-1,2,3-triol Chemical compound CC1=CC=C(O)C(O)=C1O PHZREHARUPHHCU-UHFFFAOYSA-N 0.000 description 1
- FNYDIAAMUCQQDE-UHFFFAOYSA-N 4-methylbenzene-1,3-diol Chemical compound CC1=CC=C(O)C=C1O FNYDIAAMUCQQDE-UHFFFAOYSA-N 0.000 description 1
- DWPMBDKQFRROGO-UHFFFAOYSA-N 4-methylbicyclo[2.2.1]hept-2-en-5-ol Chemical compound C1C2CC(O)C1(C)C=C2 DWPMBDKQFRROGO-UHFFFAOYSA-N 0.000 description 1
- SUWJESCICIOQHO-UHFFFAOYSA-N 4-methylhex-1-ene Chemical compound CCC(C)CC=C SUWJESCICIOQHO-UHFFFAOYSA-N 0.000 description 1
- LOFHPLKGPULNQP-UHFFFAOYSA-N 4-methylpent-4-en-1-ol Chemical compound CC(=C)CCCO LOFHPLKGPULNQP-UHFFFAOYSA-N 0.000 description 1
- KMRUSNXCFCQYQT-UHFFFAOYSA-N 4-nonan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 KMRUSNXCFCQYQT-UHFFFAOYSA-N 0.000 description 1
- KIEUXOQJDQXOBT-UHFFFAOYSA-N 4-nonan-4-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(CC)C(CCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 KIEUXOQJDQXOBT-UHFFFAOYSA-N 0.000 description 1
- VVAWKJLGEMNVRZ-UHFFFAOYSA-N 4-nonan-5-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(CCC)C(CCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 VVAWKJLGEMNVRZ-UHFFFAOYSA-N 0.000 description 1
- INFNBXDBZIXTFM-UHFFFAOYSA-N 4-octan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 INFNBXDBZIXTFM-UHFFFAOYSA-N 0.000 description 1
- YBRGYSWRJLVQDM-UHFFFAOYSA-N 4-octan-3-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C1=CC2CC1C1C2C(=O)N(C(CC)CCCCC)C1=O YBRGYSWRJLVQDM-UHFFFAOYSA-N 0.000 description 1
- VOPVZNGZEHESJM-UHFFFAOYSA-N 4-octan-4-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C(CC)C(CCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 VOPVZNGZEHESJM-UHFFFAOYSA-N 0.000 description 1
- QQPIBBMHRAVLLM-UHFFFAOYSA-N 4-pentadecan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCCCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 QQPIBBMHRAVLLM-UHFFFAOYSA-N 0.000 description 1
- ZMFDZBUPZYNJKC-UHFFFAOYSA-N 4-pentan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCC)N1C(=O)C2C3C=CC(C2C1=O)C3 ZMFDZBUPZYNJKC-UHFFFAOYSA-N 0.000 description 1
- JAGRUUPXPPLSRX-UHFFFAOYSA-N 4-prop-1-en-2-ylphenol Chemical compound CC(=C)C1=CC=C(O)C=C1 JAGRUUPXPPLSRX-UHFFFAOYSA-N 0.000 description 1
- RQGOXSVAQXFULZ-UHFFFAOYSA-N 4-propyl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound C1=CC2CC1C1C2C(=O)N(CCC)C1=O RQGOXSVAQXFULZ-UHFFFAOYSA-N 0.000 description 1
- HLRIPFBLDKQDJL-UHFFFAOYSA-N 4-trimethoxysilylphenol Chemical compound CO[Si](OC)(OC)C1=CC=C(O)C=C1 HLRIPFBLDKQDJL-UHFFFAOYSA-N 0.000 description 1
- SBNZNTVKMMJAPP-UHFFFAOYSA-N 4-undecan-2-yl-4-azatricyclo[5.2.1.02,6]dec-8-ene-3,5-dione Chemical compound CC(CCCCCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3 SBNZNTVKMMJAPP-UHFFFAOYSA-N 0.000 description 1
- FVGZTLTUKDGALJ-UHFFFAOYSA-N 5-(2-cyclohexyloxy-2-oxoethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C(C=C2)CC2C1(C(=O)O)CC(=O)OC1CCCCC1 FVGZTLTUKDGALJ-UHFFFAOYSA-N 0.000 description 1
- UGWKKYZTZPIIEE-UHFFFAOYSA-N 5-(2-ethoxy-2-oxoethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(CC(=O)OCC)(C(O)=O)CC1C=C2 UGWKKYZTZPIIEE-UHFFFAOYSA-N 0.000 description 1
- WVEJJHFWQOXHMD-UHFFFAOYSA-N 5-(2-hexoxy-2-oxoethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(CC(=O)OCCCCCC)(C(O)=O)CC1C=C2 WVEJJHFWQOXHMD-UHFFFAOYSA-N 0.000 description 1
- DWLJZAPLOBUYFF-UHFFFAOYSA-N 5-(2-methoxy-2-oxoethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(CC(=O)OC)(C(O)=O)CC1C=C2 DWLJZAPLOBUYFF-UHFFFAOYSA-N 0.000 description 1
- DMMFRQYGTQAUDN-UHFFFAOYSA-N 5-(2-oxo-2-pentoxyethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(CC(=O)OCCCCC)(C(O)=O)CC1C=C2 DMMFRQYGTQAUDN-UHFFFAOYSA-N 0.000 description 1
- WVUIAMCXSQNTDG-UHFFFAOYSA-N 5-(2-oxo-2-phenoxyethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C(C=C2)CC2C1(C(=O)O)CC(=O)OC1=CC=CC=C1 WVUIAMCXSQNTDG-UHFFFAOYSA-N 0.000 description 1
- YOPJLKWCZXKVFZ-UHFFFAOYSA-N 5-(2-oxo-2-propoxyethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(CC(=O)OCCC)(C(O)=O)CC1C=C2 YOPJLKWCZXKVFZ-UHFFFAOYSA-N 0.000 description 1
- YZGFGXBZXHCJPU-UHFFFAOYSA-N 5-(carboxymethyl)bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(CC(=O)O)(C(O)=O)CC1C=C2 YZGFGXBZXHCJPU-UHFFFAOYSA-N 0.000 description 1
- UVFFMASFIIKUOD-UHFFFAOYSA-N 5-(chloromethyl)bicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CCl)CC1C=C2 UVFFMASFIIKUOD-UHFFFAOYSA-N 0.000 description 1
- XTBDKGVIIRTLAY-UHFFFAOYSA-N 5-[2-oxo-2-(2-phenylphenoxy)ethyl]bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C(C=C2)CC2C1(C(=O)O)CC(=O)OC1=CC=CC=C1C1=CC=CC=C1 XTBDKGVIIRTLAY-UHFFFAOYSA-N 0.000 description 1
- DRWRVXAXXGJZIO-UHFFFAOYSA-N 5-bicyclo[2.2.1]hept-2-enyl acetate Chemical compound C1C2C(OC(=O)C)CC1C=C2 DRWRVXAXXGJZIO-UHFFFAOYSA-N 0.000 description 1
- JHPLUQZQEHCSIP-UHFFFAOYSA-N 5-bicyclo[2.2.1]hept-2-enylmethyl acetate Chemical compound C1C2C(COC(=O)C)CC1C=C2 JHPLUQZQEHCSIP-UHFFFAOYSA-N 0.000 description 1
- IYYQMHXKCORAJN-UHFFFAOYSA-N 5-butylbenzene-1,2,3-triol Chemical compound CCCCC1=CC(O)=C(O)C(O)=C1 IYYQMHXKCORAJN-UHFFFAOYSA-N 0.000 description 1
- YSWATWCBYRBYBO-UHFFFAOYSA-N 5-butylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(CCCC)CC1C=C2 YSWATWCBYRBYBO-UHFFFAOYSA-N 0.000 description 1
- PSCJIEZOAFAQRM-UHFFFAOYSA-N 5-chlorobicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(Cl)CC1C=C2 PSCJIEZOAFAQRM-UHFFFAOYSA-N 0.000 description 1
- INYHZQLKOKTDAI-UHFFFAOYSA-N 5-ethenylbicyclo[2.2.1]hept-2-ene Chemical compound C1C2C(C=C)CC1C=C2 INYHZQLKOKTDAI-UHFFFAOYSA-N 0.000 description 1
- YLSRLICOTNISRM-UHFFFAOYSA-N 5-methylbicyclo[2.2.1]hept-2-ene-5-carbonitrile Chemical compound C1C2C(C)(C#N)CC1C=C2 YLSRLICOTNISRM-UHFFFAOYSA-N 0.000 description 1
- JIHFJSOMLKXSSQ-UHFFFAOYSA-N 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(C)(C(O)=O)CC1C=C2 JIHFJSOMLKXSSQ-UHFFFAOYSA-N 0.000 description 1
- VSQLAQKFRFTMNS-UHFFFAOYSA-N 5-methylhexa-1,4-diene Chemical compound CC(C)=CCC=C VSQLAQKFRFTMNS-UHFFFAOYSA-N 0.000 description 1
- UNYPZTGYAGVVPY-UHFFFAOYSA-N 5-tert-butyl-2-methylbenzene-1,3-diol Chemical compound CC1=C(O)C=C(C(C)(C)C)C=C1O UNYPZTGYAGVVPY-UHFFFAOYSA-N 0.000 description 1
- RBHIUNHSNSQJNG-UHFFFAOYSA-N 6-methyl-3-(2-methyloxiran-2-yl)-7-oxabicyclo[4.1.0]heptane Chemical compound C1CC2(C)OC2CC1C1(C)CO1 RBHIUNHSNSQJNG-UHFFFAOYSA-N 0.000 description 1
- SIRXYHBXRXZGJQ-UHFFFAOYSA-N 6814-80-8 Chemical compound C1C2C3C(O)C=CC3C1C=C2 SIRXYHBXRXZGJQ-UHFFFAOYSA-N 0.000 description 1
- FYYIUODUDSPAJQ-UHFFFAOYSA-N 7-oxabicyclo[4.1.0]heptan-4-ylmethyl 2-methylprop-2-enoate Chemical compound C1C(COC(=O)C(=C)C)CCC2OC21 FYYIUODUDSPAJQ-UHFFFAOYSA-N 0.000 description 1
- LPEKGGXMPWTOCB-UHFFFAOYSA-N 8beta-(2,3-epoxy-2-methylbutyryloxy)-14-acetoxytithifolin Natural products COC(=O)C(C)O LPEKGGXMPWTOCB-UHFFFAOYSA-N 0.000 description 1
- PCFMUWBCZZUMRX-UHFFFAOYSA-N 9,10-Dihydroxyanthracene Chemical compound C1=CC=C2C(O)=C(C=CC=C3)C3=C(O)C2=C1 PCFMUWBCZZUMRX-UHFFFAOYSA-N 0.000 description 1
- QSBYPNXLFMSGKH-UHFFFAOYSA-N 9-Heptadecensaeure Natural products CCCCCCCC=CCCCCCCCC(O)=O QSBYPNXLFMSGKH-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 description 1
- DPUOLQHDNGRHBS-UHFFFAOYSA-N Brassidinsaeure Natural products CCCCCCCCC=CCCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 1
- YECWYVHKYFQNBG-UHFFFAOYSA-N C(C)C(CCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3.CC(CCCN3C(=O)C1C2C=CC(C1C3=O)C2)CCCC Chemical compound C(C)C(CCCCCC)N1C(=O)C2C3C=CC(C2C1=O)C3.CC(CCCN3C(=O)C1C2C=CC(C1C3=O)C2)CCCC YECWYVHKYFQNBG-UHFFFAOYSA-N 0.000 description 1
- VWMKUZYJGUVNJX-UHFFFAOYSA-L C(C1=CC=CC=C1)=[Ru](Cl)Cl.C1(=C(C(=CC(=C1)C)C)N1C(N(CC1)C1=C(C=C(C=C1C)C)C)=C1C(CCCC1)P(C1CCCCC1)C1CCCCC1)C Chemical compound C(C1=CC=CC=C1)=[Ru](Cl)Cl.C1(=C(C(=CC(=C1)C)C)N1C(N(CC1)C1=C(C=C(C=C1C)C)C)=C1C(CCCC1)P(C1CCCCC1)C1CCCCC1)C VWMKUZYJGUVNJX-UHFFFAOYSA-L 0.000 description 1
- CLJIBHYYSDHPOU-UHFFFAOYSA-N C1=CC2CC1C1C2C(=O)N(CC(CC)CCCCC)C1=O Chemical compound C1=CC2CC1C1C2C(=O)N(CC(CC)CCCCC)C1=O CLJIBHYYSDHPOU-UHFFFAOYSA-N 0.000 description 1
- NYSFUWJAVUDRIT-UHFFFAOYSA-N CC(C)(CO)O.C(C(C)O)O Chemical class CC(C)(CO)O.C(C(C)O)O NYSFUWJAVUDRIT-UHFFFAOYSA-N 0.000 description 1
- OEIKAJZLTCHQOT-UHFFFAOYSA-N CC(CCCN1C(=O)C2=C3CCC(C2C1=O)C3)CCCCC Chemical compound CC(CCCN1C(=O)C2=C3CCC(C2C1=O)C3)CCCCC OEIKAJZLTCHQOT-UHFFFAOYSA-N 0.000 description 1
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- URXZXNYJPAJJOQ-UHFFFAOYSA-N Erucic acid Natural products CCCCCCC=CCCCCCCCCCCCC(O)=O URXZXNYJPAJJOQ-UHFFFAOYSA-N 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- JGFBQFKZKSSODQ-UHFFFAOYSA-N Isothiocyanatocyclopropane Chemical compound S=C=NC1CC1 JGFBQFKZKSSODQ-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- RJUFJBKOKNCXHH-UHFFFAOYSA-N Methyl propionate Chemical compound CCC(=O)OC RJUFJBKOKNCXHH-UHFFFAOYSA-N 0.000 description 1
- GYCMBHHDWRMZGG-UHFFFAOYSA-N Methylacrylonitrile Chemical compound CC(=C)C#N GYCMBHHDWRMZGG-UHFFFAOYSA-N 0.000 description 1
- UEEJHVSXFDXPFK-UHFFFAOYSA-N N-dimethylaminoethanol Chemical compound CN(C)CCO UEEJHVSXFDXPFK-UHFFFAOYSA-N 0.000 description 1
- GHAZCVNUKKZTLG-UHFFFAOYSA-N N-ethyl-succinimide Natural products CCN1C(=O)CCC1=O GHAZCVNUKKZTLG-UHFFFAOYSA-N 0.000 description 1
- HDFGOPSGAURCEO-UHFFFAOYSA-N N-ethylmaleimide Chemical compound CCN1C(=O)C=CC1=O HDFGOPSGAURCEO-UHFFFAOYSA-N 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- GRSMWKLPSNHDHA-UHFFFAOYSA-N Naphthalic anhydride Chemical compound C1=CC(C(=O)OC2=O)=C3C2=CC=CC3=C1 GRSMWKLPSNHDHA-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- HCNNPFPPLDNQMO-UHFFFAOYSA-N OC1=C(C=CC=C1)CC(C(=O)O)N1C(=O)C2C3C=CC(C2C1=O)C3 Chemical compound OC1=C(C=CC=C1)CC(C(=O)O)N1C(=O)C2C3C=CC(C2C1=O)C3 HCNNPFPPLDNQMO-UHFFFAOYSA-N 0.000 description 1
- 239000005642 Oleic acid Substances 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 1
- 239000005062 Polybutadiene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- XSTXAVWGXDQKEL-UHFFFAOYSA-N Trichloroethylene Chemical group ClC=C(Cl)Cl XSTXAVWGXDQKEL-UHFFFAOYSA-N 0.000 description 1
- GSEJCLTVZPLZKY-UHFFFAOYSA-N Triethanolamine Chemical compound OCCN(CCO)CCO GSEJCLTVZPLZKY-UHFFFAOYSA-N 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- YMOONIIMQBGTDU-VOTSOKGWSA-N [(e)-2-bromoethenyl]benzene Chemical compound Br\C=C\C1=CC=CC=C1 YMOONIIMQBGTDU-VOTSOKGWSA-N 0.000 description 1
- IGHHPVIMEQGKNE-UHFFFAOYSA-N [3-(hydroxymethyl)-2-bicyclo[2.2.1]hept-5-enyl]methanol Chemical compound C1C2C=CC1C(CO)C2CO IGHHPVIMEQGKNE-UHFFFAOYSA-N 0.000 description 1
- RQVFGTYFBUVGOP-UHFFFAOYSA-N [acetyloxy(dimethyl)silyl] acetate Chemical compound CC(=O)O[Si](C)(C)OC(C)=O RQVFGTYFBUVGOP-UHFFFAOYSA-N 0.000 description 1
- KXETVEDTUWAYHA-UHFFFAOYSA-N ac1l7sbv Chemical compound C1=CC2CC1C1C2C(=O)N(CC(=O)O)C1=O KXETVEDTUWAYHA-UHFFFAOYSA-N 0.000 description 1
- JAWZRFZAOPGTPT-UHFFFAOYSA-N ac1mdjjn Chemical compound C1=CC2CC1C1C2C(=O)N(CCCCCC(=O)O)C1=O JAWZRFZAOPGTPT-UHFFFAOYSA-N 0.000 description 1
- WXAMJXJYUHAUQT-UHFFFAOYSA-N ac1mffmi Chemical compound O=C1C2C(C=C3)CC3C2C(=O)N1C1CCCCC1 WXAMJXJYUHAUQT-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 125000002777 acetyl group Chemical group [H]C([H])([H])C(*)=O 0.000 description 1
- 239000003377 acid catalyst Substances 0.000 description 1
- 125000005073 adamantyl group Chemical group C12(CC3CC(CC(C1)C3)C2)* 0.000 description 1
- 238000012644 addition polymerization Methods 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- XYLMUPLGERFSHI-UHFFFAOYSA-N alpha-Methylstyrene Chemical compound CC(=C)C1=CC=CC=C1 XYLMUPLGERFSHI-UHFFFAOYSA-N 0.000 description 1
- 235000011114 ammonium hydroxide Nutrition 0.000 description 1
- 150000003863 ammonium salts Chemical class 0.000 description 1
- UIERETOOQGIECD-ARJAWSKDSA-N angelic acid Chemical compound C\C=C(\C)C(O)=O UIERETOOQGIECD-ARJAWSKDSA-N 0.000 description 1
- QSYYLCHYRULSFV-UHFFFAOYSA-N anthracene-1,4-diol Chemical compound C1=CC=C2C=C3C(O)=CC=C(O)C3=CC2=C1 QSYYLCHYRULSFV-UHFFFAOYSA-N 0.000 description 1
- 239000012736 aqueous medium Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000007611 bar coating method Methods 0.000 description 1
- MKOSBHNWXFSHSW-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-en-5-ol Chemical compound C1C2C(O)CC1C=C2 MKOSBHNWXFSHSW-UHFFFAOYSA-N 0.000 description 1
- BMAXQTDMWYDIJX-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-5-carbonitrile Chemical compound C1C2C(C#N)CC1C=C2 BMAXQTDMWYDIJX-UHFFFAOYSA-N 0.000 description 1
- FYGUSUBEMUKACF-UHFFFAOYSA-N bicyclo[2.2.1]hept-2-ene-5-carboxylic acid Chemical compound C1C2C(C(=O)O)CC1C=C2 FYGUSUBEMUKACF-UHFFFAOYSA-N 0.000 description 1
- DJNPQHBMESQZIP-UHFFFAOYSA-N bicyclo[2.2.1]hept-5-ene-2,3-dicarbonitrile Chemical compound C1C2C=CC1C(C#N)C2C#N DJNPQHBMESQZIP-UHFFFAOYSA-N 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- OBNCKNCVKJNDBV-UHFFFAOYSA-N butanoic acid ethyl ester Natural products CCCC(=O)OCC OBNCKNCVKJNDBV-UHFFFAOYSA-N 0.000 description 1
- JHIWVOJDXOSYLW-UHFFFAOYSA-N butyl 2,2-difluorocyclopropane-1-carboxylate Chemical compound CCCCOC(=O)C1CC1(F)F JHIWVOJDXOSYLW-UHFFFAOYSA-N 0.000 description 1
- ABDSKYPMIZRTDX-UHFFFAOYSA-N butyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCCCC)(C)CC1C=C2 ABDSKYPMIZRTDX-UHFFFAOYSA-N 0.000 description 1
- 229940043232 butyl acetate Drugs 0.000 description 1
- RFIHUFUZAHTZOQ-UHFFFAOYSA-N butyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCCCC)CC1C=C2 RFIHUFUZAHTZOQ-UHFFFAOYSA-N 0.000 description 1
- XGZGKDQVCBHSGI-UHFFFAOYSA-N butyl(triethoxy)silane Chemical compound CCCC[Si](OCC)(OCC)OCC XGZGKDQVCBHSGI-UHFFFAOYSA-N 0.000 description 1
- SXPLZNMUBFBFIA-UHFFFAOYSA-N butyl(trimethoxy)silane Chemical compound CCCC[Si](OC)(OC)OC SXPLZNMUBFBFIA-UHFFFAOYSA-N 0.000 description 1
- PWLNAUNEAKQYLH-UHFFFAOYSA-N butyric acid octyl ester Natural products CCCCCCCCOC(=O)CCC PWLNAUNEAKQYLH-UHFFFAOYSA-N 0.000 description 1
- 239000004202 carbamide Substances 0.000 description 1
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 1
- 150000001735 carboxylic acids Chemical class 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 125000000068 chlorophenyl group Chemical group 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- HDNAENGLYCLHFK-UHFFFAOYSA-N cis-endo-n-ethyl-5-norbornene-2,3-dicarboximide Chemical compound C1=CC2CC1C1C2C(=O)N(CC)C1=O HDNAENGLYCLHFK-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 125000000753 cycloalkyl group Chemical group 0.000 description 1
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 description 1
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- ZXIJMRYMVAMXQP-UHFFFAOYSA-N cycloheptene Chemical compound C1CCC=CCC1 ZXIJMRYMVAMXQP-UHFFFAOYSA-N 0.000 description 1
- 125000000582 cycloheptyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- GNQDOFSOPLSHLF-UHFFFAOYSA-N cyclohexyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C(C=C2)CC2C1(C)C(=O)OC1CCCCC1 GNQDOFSOPLSHLF-UHFFFAOYSA-N 0.000 description 1
- MSPIWBYBMMBCEX-UHFFFAOYSA-N cyclohexyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C(C=C2)CC2C1C(=O)OC1CCCCC1 MSPIWBYBMMBCEX-UHFFFAOYSA-N 0.000 description 1
- 125000006547 cyclononyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- URYYVOIYTNXXBN-UPHRSURJSA-N cyclooctene Chemical compound C1CCC\C=C/CC1 URYYVOIYTNXXBN-UPHRSURJSA-N 0.000 description 1
- 239000004913 cyclooctene Substances 0.000 description 1
- 125000000640 cyclooctyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C([H])([H])C1([H])[H] 0.000 description 1
- 125000001511 cyclopentyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 1
- 125000001559 cyclopropyl group Chemical group [H]C1([H])C([H])([H])C1([H])* 0.000 description 1
- 229960002887 deanol Drugs 0.000 description 1
- HIPQYVJOMHDTRF-UHFFFAOYSA-N deca-2,7-diene Chemical compound CCC=CCCCC=CC HIPQYVJOMHDTRF-UHFFFAOYSA-N 0.000 description 1
- 125000002704 decyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- CSYSRRCOBYEGPI-UHFFFAOYSA-N diazo(sulfonyl)methane Chemical class [N-]=[N+]=C=S(=O)=O CSYSRRCOBYEGPI-UHFFFAOYSA-N 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 229940019778 diethylene glycol diethyl ether Drugs 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 229940105990 diglycerin Drugs 0.000 description 1
- GPLRAVKSCUXZTP-UHFFFAOYSA-N diglycerol Chemical compound OCC(O)COCC(O)CO GPLRAVKSCUXZTP-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 1
- HANKSFAYJLDDKP-UHFFFAOYSA-N dihydrodicyclopentadiene Chemical compound C12CC=CC2C2CCC1C2 HANKSFAYJLDDKP-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- AHUXYBVKTIBBJW-UHFFFAOYSA-N dimethoxy(diphenyl)silane Chemical compound C=1C=CC=CC=1[Si](OC)(OC)C1=CC=CC=C1 AHUXYBVKTIBBJW-UHFFFAOYSA-N 0.000 description 1
- YYLGKUPAFFKGRQ-UHFFFAOYSA-N dimethyldiethoxysilane Chemical compound CCO[Si](C)(C)OCC YYLGKUPAFFKGRQ-UHFFFAOYSA-N 0.000 description 1
- 239000012972 dimethylethanolamine Substances 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- WEHWNAOGRSTTBQ-UHFFFAOYSA-N dipropylamine Chemical compound CCCNCCC WEHWNAOGRSTTBQ-UHFFFAOYSA-N 0.000 description 1
- 238000004821 distillation Methods 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 229940069096 dodecene Drugs 0.000 description 1
- ODQWQRRAPPTVAG-GZTJUZNOSA-N doxepin Chemical compound C1OC2=CC=CC=C2C(=C/CCN(C)C)/C2=CC=CC=C21 ODQWQRRAPPTVAG-GZTJUZNOSA-N 0.000 description 1
- 239000000975 dye Substances 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 239000003480 eluent Substances 0.000 description 1
- 238000010556 emulsion polymerization method Methods 0.000 description 1
- 238000006735 epoxidation reaction Methods 0.000 description 1
- DPUOLQHDNGRHBS-KTKRTIGZSA-N erucic acid Chemical compound CCCCCCCC\C=C/CCCCCCCCCCCC(O)=O DPUOLQHDNGRHBS-KTKRTIGZSA-N 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- GNGHYFMQCBTLSA-UHFFFAOYSA-N ethyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCC)(C)CC1C=C2 GNGHYFMQCBTLSA-UHFFFAOYSA-N 0.000 description 1
- FCCGTJAGEHZPBF-UHFFFAOYSA-N ethyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCC)CC1C=C2 FCCGTJAGEHZPBF-UHFFFAOYSA-N 0.000 description 1
- 229940116333 ethyl lactate Drugs 0.000 description 1
- FKRCODPIKNYEAC-UHFFFAOYSA-N ethyl propionate Chemical class CCOC(=O)CC FKRCODPIKNYEAC-UHFFFAOYSA-N 0.000 description 1
- IHZKNQZATVICQG-UHFFFAOYSA-N ethyl tricyclo[5.2.1.02,6 ]deca-8-ene-2-carboxylate Chemical compound C1=CC2CC1C1(C(=O)OCC)C2CCC1 IHZKNQZATVICQG-UHFFFAOYSA-N 0.000 description 1
- MYEJNNDSIXAGNK-UHFFFAOYSA-N ethyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](CC)(OC(C)C)OC(C)C MYEJNNDSIXAGNK-UHFFFAOYSA-N 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000004088 foaming agent Substances 0.000 description 1
- 125000002485 formyl group Chemical class [H]C(*)=O 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 125000000457 gamma-lactone group Chemical group 0.000 description 1
- WCASXYBKJHWFMY-UHFFFAOYSA-N gamma-methylallyl alcohol Natural products CC=CCO WCASXYBKJHWFMY-UHFFFAOYSA-N 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 238000007429 general method Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 239000004845 glycidylamine epoxy resin Substances 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 125000003187 heptyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- AHAREKHAZNPPMI-UHFFFAOYSA-N hexa-1,3-diene Chemical compound CCC=CC=C AHAREKHAZNPPMI-UHFFFAOYSA-N 0.000 description 1
- GNOIPBMMFNIUFM-UHFFFAOYSA-N hexamethylphosphoric triamide Chemical compound CN(C)P(=O)(N(C)C)N(C)C GNOIPBMMFNIUFM-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-M hexanoate Chemical compound CCCCCC([O-])=O FUZZWVXGSFPDMH-UHFFFAOYSA-M 0.000 description 1
- 125000004051 hexyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- 150000002430 hydrocarbons Chemical group 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- ORTFAQDWJHRMNX-UHFFFAOYSA-N hydroxidooxidocarbon(.) Chemical group O[C]=O ORTFAQDWJHRMNX-UHFFFAOYSA-N 0.000 description 1
- 125000002768 hydroxyalkyl group Chemical group 0.000 description 1
- 125000004464 hydroxyphenyl group Chemical group 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 150000002484 inorganic compounds Chemical class 0.000 description 1
- 229910010272 inorganic material Inorganic materials 0.000 description 1
- 125000001972 isopentyl group Chemical group [H]C([H])([H])C([H])(C([H])([H])[H])C([H])([H])C([H])([H])* 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 229910052743 krypton Inorganic materials 0.000 description 1
- DNNSSWSSYDEUBZ-UHFFFAOYSA-N krypton atom Chemical compound [Kr] DNNSSWSSYDEUBZ-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 125000005439 maleimidyl group Chemical group C1(C=CC(N1*)=O)=O 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005649 metathesis reaction Methods 0.000 description 1
- POPACFLNWGUDSR-UHFFFAOYSA-N methoxy(trimethyl)silane Chemical compound CO[Si](C)(C)C POPACFLNWGUDSR-UHFFFAOYSA-N 0.000 description 1
- 125000004184 methoxymethyl group Chemical group [H]C([H])([H])OC([H])([H])* 0.000 description 1
- AEBDJCUTXUYLDC-UHFFFAOYSA-N methyl 5-methylbicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OC)(C)CC1C=C2 AEBDJCUTXUYLDC-UHFFFAOYSA-N 0.000 description 1
- 229940057867 methyl lactate Drugs 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- 229940017219 methyl propionate Drugs 0.000 description 1
- ARLYLDLNVQPCQY-UHFFFAOYSA-N methyl tricyclo[5.2.1.02,6]dec-8-ene-2-carboxylate Chemical compound COC(=O)C12C3C=CC(C2CCC1)C3 ARLYLDLNVQPCQY-UHFFFAOYSA-N 0.000 description 1
- KNRCVAANTQNTPT-UHFFFAOYSA-N methyl-5-norbornene-2,3-dicarboxylic anhydride Chemical class O=C1OC(=O)C2C1C1(C)C=CC2C1 KNRCVAANTQNTPT-UHFFFAOYSA-N 0.000 description 1
- HLXDKGBELJJMHR-UHFFFAOYSA-N methyl-tri(propan-2-yloxy)silane Chemical compound CC(C)O[Si](C)(OC(C)C)OC(C)C HLXDKGBELJJMHR-UHFFFAOYSA-N 0.000 description 1
- 125000000250 methylamino group Chemical group [H]N(*)C([H])([H])[H] 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 238000006011 modification reaction Methods 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N n-Octanol Natural products CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- YKYONYBAUNKHLG-UHFFFAOYSA-N n-Propyl acetate Natural products CCCOC(C)=O YKYONYBAUNKHLG-UHFFFAOYSA-N 0.000 description 1
- UUIQMZJEGPQKFD-UHFFFAOYSA-N n-butyric acid methyl ester Natural products CCCC(=O)OC UUIQMZJEGPQKFD-UHFFFAOYSA-N 0.000 description 1
- GNVRJGIVDSQCOP-UHFFFAOYSA-N n-ethyl-n-methylethanamine Chemical compound CCN(C)CC GNVRJGIVDSQCOP-UHFFFAOYSA-N 0.000 description 1
- VMXAIJCDNKFKPO-UHFFFAOYSA-N n-ethynylaniline Chemical compound C#CNC1=CC=CC=C1 VMXAIJCDNKFKPO-UHFFFAOYSA-N 0.000 description 1
- 125000003136 n-heptyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- SEEYREPSKCQBBF-UHFFFAOYSA-N n-methylmaleimide Chemical compound CN1C(=O)C=CC1=O SEEYREPSKCQBBF-UHFFFAOYSA-N 0.000 description 1
- VJKBQUJCCYLNCM-UHFFFAOYSA-N n-octyl-5-norbornene-2,3-dicarboximide Chemical compound C1=CC2CC1C1C2C(=O)N(C(CC)CCCC)C1=O VJKBQUJCCYLNCM-UHFFFAOYSA-N 0.000 description 1
- XOOMNEFVDUTJPP-UHFFFAOYSA-N naphthalene-1,3-diol Chemical compound C1=CC=CC2=CC(O)=CC(O)=C21 XOOMNEFVDUTJPP-UHFFFAOYSA-N 0.000 description 1
- FZZQNEVOYIYFPF-UHFFFAOYSA-N naphthalene-1,6-diol Chemical compound OC1=CC=CC2=CC(O)=CC=C21 FZZQNEVOYIYFPF-UHFFFAOYSA-N 0.000 description 1
- ZUVBIBLYOCVYJU-UHFFFAOYSA-N naphthalene-1,7-diol Chemical compound C1=CC=C(O)C2=CC(O)=CC=C21 ZUVBIBLYOCVYJU-UHFFFAOYSA-N 0.000 description 1
- JRNGUTKWMSBIBF-UHFFFAOYSA-N naphthalene-2,3-diol Chemical compound C1=CC=C2C=C(O)C(O)=CC2=C1 JRNGUTKWMSBIBF-UHFFFAOYSA-N 0.000 description 1
- MNZMMCVIXORAQL-UHFFFAOYSA-N naphthalene-2,6-diol Chemical compound C1=C(O)C=CC2=CC(O)=CC=C21 MNZMMCVIXORAQL-UHFFFAOYSA-N 0.000 description 1
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 1
- 229910052754 neon Inorganic materials 0.000 description 1
- GKAOGPIIYCISHV-UHFFFAOYSA-N neon atom Chemical compound [Ne] GKAOGPIIYCISHV-UHFFFAOYSA-N 0.000 description 1
- 125000001400 nonyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 125000002868 norbornyl group Chemical group C12(CCC(CC1)C2)* 0.000 description 1
- YWXLSHOWXZUMSR-UHFFFAOYSA-N octan-4-one Chemical compound CCCCC(=O)CCC YWXLSHOWXZUMSR-UHFFFAOYSA-N 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 150000002896 organic halogen compounds Chemical class 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- LQAVWYMTUMSFBE-UHFFFAOYSA-N pent-4-en-1-ol Chemical compound OCCCC=C LQAVWYMTUMSFBE-UHFFFAOYSA-N 0.000 description 1
- WNBDFALPKHFDJO-UHFFFAOYSA-N pentadec-3-ene Chemical compound CCCCCCCCCCCC=CCC WNBDFALPKHFDJO-UHFFFAOYSA-N 0.000 description 1
- OHVKVVAUWQFKQY-UHFFFAOYSA-N pentadeca-2,7,9,11-tetraene Chemical compound CCCC=CC=CC=CCCCC=CC OHVKVVAUWQFKQY-UHFFFAOYSA-N 0.000 description 1
- LTBKJTHWKYUMTA-UHFFFAOYSA-N pentadeca-3,10-diene Chemical compound CCCCC=CCCCCCC=CCC LTBKJTHWKYUMTA-UHFFFAOYSA-N 0.000 description 1
- RGSFGYAAUTVSQA-UHFFFAOYSA-N pentamethylene Natural products C1CCCC1 RGSFGYAAUTVSQA-UHFFFAOYSA-N 0.000 description 1
- 125000005359 phenoxyalkyl group Chemical group 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical class OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001515 polyalkylene glycol Polymers 0.000 description 1
- 229920002857 polybutadiene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 125000001749 primary amide group Chemical group 0.000 description 1
- 150000003141 primary amines Chemical class 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- HJWLCRVIBGQPNF-UHFFFAOYSA-N prop-2-enylbenzene Chemical compound C=CCC1=CC=CC=C1 HJWLCRVIBGQPNF-UHFFFAOYSA-N 0.000 description 1
- 229940090181 propyl acetate Drugs 0.000 description 1
- LKKVMVMKNLULSL-UHFFFAOYSA-N propyl bicyclo[2.2.1]hept-2-ene-5-carboxylate Chemical compound C1C2C(C(=O)OCCC)CC1C=C2 LKKVMVMKNLULSL-UHFFFAOYSA-N 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- QMTZQLNTTKDRKC-UHFFFAOYSA-N propyl tricyclo[5.2.1.02,6]dec-8-ene-2-carboxylate Chemical compound C(CC)OC(=O)C12C3C=CC(C2CCC1)C3 QMTZQLNTTKDRKC-UHFFFAOYSA-N 0.000 description 1
- QQONPFPTGQHPMA-UHFFFAOYSA-N propylene Natural products CC=C QQONPFPTGQHPMA-UHFFFAOYSA-N 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000007152 ring opening metathesis polymerisation reaction Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 125000003548 sec-pentyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 125000003156 secondary amide group Chemical group 0.000 description 1
- 125000000467 secondary amino group Chemical group [H]N([*:1])[*:2] 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- 229910000029 sodium carbonate Inorganic materials 0.000 description 1
- 235000019795 sodium metasilicate Nutrition 0.000 description 1
- WUNGPAHZQWNPEL-UHFFFAOYSA-N st50032131 Chemical compound C1=CC2CC1C1C2C(=O)N(CCO)C1=O WUNGPAHZQWNPEL-UHFFFAOYSA-N 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 229940124530 sulfonamide Drugs 0.000 description 1
- 150000003456 sulfonamides Chemical class 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 125000004434 sulfur atom Chemical group 0.000 description 1
- 238000010558 suspension polymerization method Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- XBFJAVXCNXDMBH-UHFFFAOYSA-N tetracyclo[6.2.1.1(3,6).0(2,7)]dodec-4-ene Chemical compound C1C(C23)C=CC1C3C1CC2CC1 XBFJAVXCNXDMBH-UHFFFAOYSA-N 0.000 description 1
- PVJHFVMRMWVWAX-UHFFFAOYSA-N tetradeca-2,7,9,11-tetraene Chemical compound CCC=CC=CC=CCCCC=CC PVJHFVMRMWVWAX-UHFFFAOYSA-N 0.000 description 1
- 229940073455 tetraethylammonium hydroxide Drugs 0.000 description 1
- LRGJRHZIDJQFCL-UHFFFAOYSA-M tetraethylazanium;hydroxide Chemical compound [OH-].CC[N+](CC)(CC)CC LRGJRHZIDJQFCL-UHFFFAOYSA-M 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- LFQCEHFDDXELDD-UHFFFAOYSA-N tetramethyl orthosilicate Chemical compound CO[Si](OC)(OC)OC LFQCEHFDDXELDD-UHFFFAOYSA-N 0.000 description 1
- ADLSSRLDGACTEX-UHFFFAOYSA-N tetraphenyl silicate Chemical compound C=1C=CC=CC=1O[Si](OC=1C=CC=CC=1)(OC=1C=CC=CC=1)OC1=CC=CC=C1 ADLSSRLDGACTEX-UHFFFAOYSA-N 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 125000003396 thiol group Chemical group [H]S* 0.000 description 1
- UIERETOOQGIECD-ONEGZZNKSA-N tiglic acid Chemical compound C\C=C(/C)C(O)=O UIERETOOQGIECD-ONEGZZNKSA-N 0.000 description 1
- UAXOELSVPTZZQG-UHFFFAOYSA-N tiglic acid Natural products CC(C)=C(C)C(O)=O UAXOELSVPTZZQG-UHFFFAOYSA-N 0.000 description 1
- CNHDIAIOKMXOLK-UHFFFAOYSA-N toluquinol Chemical compound CC1=CC(O)=CC=C1O CNHDIAIOKMXOLK-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 230000002463 transducing effect Effects 0.000 description 1
- YZVRVDPMGYFCGL-UHFFFAOYSA-N triacetyloxysilyl acetate Chemical compound CC(=O)O[Si](OC(C)=O)(OC(C)=O)OC(C)=O YZVRVDPMGYFCGL-UHFFFAOYSA-N 0.000 description 1
- 125000005409 triarylsulfonium group Chemical group 0.000 description 1
- GIHPVQDFBJMUAO-UHFFFAOYSA-N tributoxy(ethyl)silane Chemical compound CCCCO[Si](CC)(OCCCC)OCCCC GIHPVQDFBJMUAO-UHFFFAOYSA-N 0.000 description 1
- GYZQBXUDWTVJDF-UHFFFAOYSA-N tributoxy(methyl)silane Chemical compound CCCCO[Si](C)(OCCCC)OCCCC GYZQBXUDWTVJDF-UHFFFAOYSA-N 0.000 description 1
- ZQJYXISBATZORI-UHFFFAOYSA-N tributyl(ethoxy)silane Chemical compound CCCC[Si](CCCC)(CCCC)OCC ZQJYXISBATZORI-UHFFFAOYSA-N 0.000 description 1
- UBOXGVDOUJQMTN-UHFFFAOYSA-N trichloroethylene Natural products ClCC(Cl)Cl UBOXGVDOUJQMTN-UHFFFAOYSA-N 0.000 description 1
- YOKZJDRCZXTECO-UHFFFAOYSA-N tricyclo[5.2.1.02,6]deca-3,8-diene-2-carboxylic acid Chemical compound C1=CC2CC1C1(C(=O)O)C2CC=C1 YOKZJDRCZXTECO-UHFFFAOYSA-N 0.000 description 1
- DENFJSAFJTVPJR-UHFFFAOYSA-N triethoxy(ethyl)silane Chemical compound CCO[Si](CC)(OCC)OCC DENFJSAFJTVPJR-UHFFFAOYSA-N 0.000 description 1
- WUMSTCDLAYQDNO-UHFFFAOYSA-N triethoxy(hexyl)silane Chemical compound CCCCCC[Si](OCC)(OCC)OCC WUMSTCDLAYQDNO-UHFFFAOYSA-N 0.000 description 1
- CPUDPFPXCZDNGI-UHFFFAOYSA-N triethoxy(methyl)silane Chemical compound CCO[Si](C)(OCC)OCC CPUDPFPXCZDNGI-UHFFFAOYSA-N 0.000 description 1
- JCVQKRGIASEUKR-UHFFFAOYSA-N triethoxy(phenyl)silane Chemical compound CCO[Si](OCC)(OCC)C1=CC=CC=C1 JCVQKRGIASEUKR-UHFFFAOYSA-N 0.000 description 1
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 1
- BOVWGKNFLVZRDU-UHFFFAOYSA-N triethoxy(trifluoromethyl)silane Chemical compound CCO[Si](OCC)(OCC)C(F)(F)F BOVWGKNFLVZRDU-UHFFFAOYSA-N 0.000 description 1
- 125000002023 trifluoromethyl group Chemical group FC(F)(F)* 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- JLGNHOJUQFHYEZ-UHFFFAOYSA-N trimethoxy(3,3,3-trifluoropropyl)silane Chemical compound CO[Si](OC)(OC)CCC(F)(F)F JLGNHOJUQFHYEZ-UHFFFAOYSA-N 0.000 description 1
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 1
- HQYALQRYBUJWDH-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical compound CCC[Si](OC)(OC)OC HQYALQRYBUJWDH-UHFFFAOYSA-N 0.000 description 1
- ORVBHOQTQDOUIW-UHFFFAOYSA-N trimethoxy(trifluoromethyl)silane Chemical compound CO[Si](OC)(OC)C(F)(F)F ORVBHOQTQDOUIW-UHFFFAOYSA-N 0.000 description 1
- VNTPGSZQKARKHG-UHFFFAOYSA-N trimethyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound C[Si](C)(C)CCCOCC1CO1 VNTPGSZQKARKHG-UHFFFAOYSA-N 0.000 description 1
- 125000002948 undecyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- NQPDZGIKBAWPEJ-UHFFFAOYSA-N valeric acid Chemical compound CCCCC(O)=O NQPDZGIKBAWPEJ-UHFFFAOYSA-N 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/04—Oxygen-containing compounds
- C08K5/13—Phenols; Phenolates
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
- C08F2/50—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light with sensitising agents
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
- C08G61/02—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes
- C08G61/04—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms
- C08G61/06—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds
- C08G61/08—Macromolecular compounds containing only carbon atoms in the main chain of the macromolecule, e.g. polyxylylenes only aliphatic carbon atoms prepared by ring-opening of carbocyclic compounds of carbocyclic compounds containing one or more carbon-to-carbon double bonds in the ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
- C08J5/18—Manufacture of films or sheets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/0008—Organic ingredients according to more than one of the "one dot" groups of C08K5/01 - C08K5/59
- C08K5/0025—Crosslinking or vulcanising agents; including accelerators
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/16—Nitrogen-containing compounds
- C08K5/22—Compounds containing nitrogen bound to another nitrogen atom
- C08K5/27—Compounds containing a nitrogen atom bound to two other nitrogen atoms, e.g. diazoamino-compounds
- C08K5/28—Azides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L45/00—Compositions of homopolymers or copolymers of compounds having no unsaturated aliphatic radicals in side chain, and having one or more carbon-to-carbon double bonds in a carbocyclic or in a heterocyclic ring system; Compositions of derivatives of such polymers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/0226—Quinonediazides characterised by the non-macromolecular additives
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/038—Macromolecular compounds which are rendered insoluble or differentially wettable
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/039—Macromolecular compounds which are photodegradable, e.g. positive electron resists
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
- C08J2365/00—Characterised by the use of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Derivatives of such polymers
Definitions
- the present invention relates to a resin composition and an electronic component including a resin film made of the resin composition. More specifically, the present invention can provide a resin film excellent in heat resistance, water resistance, thermal shock resistance and solvent resistance.
- the present invention relates to a resin composition and an electronic component including a resin film made of the resin composition.
- Various display elements such as organic EL elements and liquid crystal display elements, integrated circuit elements, solid-state imaging elements, color filters, black matrixes and other electronic parts have surface protective films, element surfaces and wiring to prevent their deterioration and damage
- Various resin films are provided as a flattening film for flattening, an interlayer insulating film for insulating between wirings arranged in layers, and the like.
- thermosetting resin materials such as epoxy resin, polyimide, and polybenzoxazole have been widely used as resin materials for forming these resin films.
- resin materials such as epoxy resin, polyimide, and polybenzoxazole
- development of new resin materials excellent in electrical characteristics such as low dielectric properties has been demanded for these resin materials.
- Patent Document 1 includes a cyclic olefin polymer (A) having a protic polar group, a crosslinking agent (B), and a radiation-sensitive compound (C).
- a resin composition in which the content of (C) is 10 to 45 parts by weight with respect to 100 parts by weight of the cyclic olefin polymer (A) is disclosed.
- the radiation sensitive resin composition described in Patent Document 1 although it is possible to form a resin film having excellent electrical characteristics such as low dielectric properties and excellent heat resistance and solvent resistance, water resistance and heat resistance The impact resistance is not sufficient, and therefore improvement in water resistance and thermal shock resistance has been desired.
- the present invention provides a resin composition that can provide a resin film excellent in heat resistance, water resistance, thermal shock resistance, and solvent resistance, and an electronic component including the resin film made of such a resin composition. With the goal.
- the present inventors have obtained a resin composition obtained by blending a binder resin with a specific aromatic compound having two or more phenolic hydroxyl groups and a crosslinking agent. The inventors have found that the above object can be achieved and have completed the present invention.
- the resin composition according to [1] further including a photoacid generator (D), [3]
- D photoacid generator
- the resin composition according to [5], which is a compound, [7] The resin composition according to any one of [1] to [6], wherein the content of the aromatic compound (B) is 0.01 to 30 parts by weight with respect to 100 parts by weight of the binder resin (A).
- a resin composition that can provide a resin film excellent in heat resistance, water resistance, thermal shock resistance, and solvent resistance, and an electronic component including the resin film made of such a resin composition are provided. can do.
- the resin composition of the present invention comprises a binder resin (A), an aromatic compound (B) represented by the general formula (1) described later, and a crosslinking agent (C).
- Binder resin (A) Although it does not specifically limit as binder resin (A) used by this invention, Cyclic olefin polymer (A1) which has a protic polar group, acrylic resin (A2), a polyimide, or its precursor (A3), polybenzoxazole Or a precursor thereof (A4), a polysiloxane (A5), or a phenol resin (A6). Among these, from the viewpoint of further increasing the water resistance of the resin composition of the present invention, the protic polarity A cyclic olefin polymer (A1) having a group is particularly preferred. These binder resins (A) may be used alone or in combination of two or more.
- the cyclic olefin polymer (A1) having a protic polar group is a polymer of one or more cyclic olefin monomers, or 1 Or a copolymer of two or more cyclic olefin monomers and a monomer copolymerizable therewith.
- a monomer for forming the cyclic olefin polymer (A1) It is preferable to use a cyclic olefin monomer (a) having at least a protic polar group.
- the protic polar group means a group containing an atom in which a hydrogen atom is directly bonded to an atom belonging to Group 15 or Group 16 of the Periodic Table.
- atoms belonging to Group 15 or Group 16 of the periodic table atoms belonging to Group 1 or 2 of Group 15 or Group 16 of the Periodic Table are preferable, and more preferably oxygen atom, nitrogen atom or sulfur An atom, particularly preferably an oxygen atom.
- protic polar groups include polar groups having oxygen atoms such as hydroxyl groups, carboxy groups (hydroxycarbonyl groups), sulfonic acid groups, phosphoric acid groups; primary amino groups, secondary amino groups A polar group having a nitrogen atom such as a primary amide group or a secondary amide group (imide group); a polar group having a sulfur atom such as a thiol group; Among these, those having an oxygen atom are preferable, and a carboxy group is more preferable.
- the number of protic polar groups bonded to the cyclic olefin resin having a protic polar group is not particularly limited, and different types of protic polar groups may be included.
- cyclic olefin monomer (a) having a protic polar group examples include 2-hydroxycarbonylbicyclo [2.2.1] hept- 5-ene, 2-methyl-2-hydroxycarbonylbicyclo [2.2.1] hept-5-ene, 2-carboxymethyl-2-hydroxycarbonylbicyclo [2.2.1] hept-5-ene, 2 -Hydroxycarbonyl-2-methoxycarbonylmethylbicyclo [2.2.1] hept-5-ene, 2-hydroxycarbonyl-2-ethoxycarbonylmethylbicyclo [2.2.1] hept-5-ene, 2-hydroxy Carbonyl-2-propoxycarbonylmethylbicyclo [2.2.1] hept-5-ene, 2-hydroxycarbonyl-2-butoxycarbonyl Tyrbicyclo [2.2.1] hept-5-ene, 2-hydroxycarbonyl-2-pentyloxycarbonylmethyl bicyclo [2.
- dodec-9-ene 4-hydroxymethyltetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 4,5-dihydroxymethyltetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 4- (hydroxyethoxycarbonyl) tetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 4-methyl-4- (hydroxyethoxycarbonyl) tetracyclo [6.2.1.1 3,6 .
- the content ratio of the monomer (a) unit in the cyclic olefin polymer (A1) is preferably 10 to 90 mol%, preferably 20 to 80 mol%, more preferably relative to the total monomer units. Is 30 to 70 mol%.
- the cyclic olefin polymer (A1) used in the present invention is obtained by copolymerizing a cyclic olefin monomer (a) having a protic polar group and a monomer (b) copolymerizable therewith. It may be a copolymer. Examples of such copolymerizable monomers include cyclic olefin monomers (b1) having polar groups other than protic polar groups, cyclic olefin monomers having no polar groups (b2), and cyclic olefins. Monomer (b3) (hereinafter referred to as “monomer (b1)”, “monomer (b2)”, “monomer (b3)” as appropriate).
- Examples of the cyclic olefin monomer (b1) having a polar group other than the protic polar group include N-substituted imide groups, ester groups, cyano groups, acid anhydride groups, and cyclic olefins having a halogen atom.
- Examples of the cyclic olefin having an N-substituted imide group include a monomer represented by the following general formula (3).
- R 9 represents a hydrogen atom, an alkyl group having 1 to 16 carbon atoms, or an aryl group.
- N represents an integer of 1 to 2.
- R 9 is an alkyl group or aryl group having 1 to 16 carbon atoms.
- the alkyl group include a methyl group, an ethyl group, an n-propyl group, an n-butyl group, n-pentyl group, n-hexyl group, n-heptyl group, n-octyl group, n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group, n-tridecyl group, n-tetradecyl group, linear alkyl groups such as n-pentadecyl group and n-hexadecyl group; cyclopropyl group, cyclobutyl group, cyclopentyl group, cyclohexyl group, cycloheptyl group, cyclooctyl group, cyclononyl
- Alkyl group 2-propyl group, 2-butyl group, 2-methyl-1-propyl group, 2-methyl-2-propyl group, 1-methylbutyl group, 2-methylbutyl group, 1-methylpentyl group, 1- And branched alkyl groups such as ethylbutyl group, 2-methylhexyl group, 2-ethylhexyl group, 4-methylheptyl group, 1-methylnonyl group, 1-methyltridecyl group and 1-methyltetradecyl group.
- Specific examples of the aryl group include a phenyl group and a benzyl group.
- an alkyl group and an aryl group having 6 to 14 carbon atoms are preferable and an alkyl group and an aryl group having 6 to 10 carbon atoms are more preferable because of excellent heat resistance and solubility in a polar solvent.
- the carbon number is 4 or less, the solubility in a polar solvent is poor, when the carbon number is 17 or more, the heat resistance is poor, and when the resin film is patterned, the pattern is lost by melting with heat. There is a problem.
- the monomer represented by the general formula (3) include bicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N-phenyl-bicyclo [2.2 .1] Hept-5-ene-2,3-dicarboximide, N-methylbicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N-ethylbicyclo [2.2 .1] Hept-5-ene-2,3-dicarboximide, N-propylbicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N-butylbicyclo [2.2 .1] Hept-5-ene-2,3-dicarboximide, N-cyclohexylbicyclo [2.2.1] hept-5-ene-2,3-dicarboximide, N-adamantylbicyclo [2.2 .1] Hept-5-ene-2,3-di Ruboxyimide, N- (1-methylmethyl
- dodec-9-ene-4,5-dicarboximide N- (2,4-dimethoxyphenyl) -tetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene-4,5-dicarboximide and the like. These may be used alone or in combination of two or more.
- the monomer represented by the general formula (3) can be obtained by, for example, an imidization reaction between a corresponding amine and 5-norbornene-2,3-dicarboxylic acid anhydride.
- the obtained monomer can be efficiently isolated by separating and purifying the reaction solution of the imidization reaction by a known method.
- Examples of the cyclic olefin having an ester group include 2-acetoxybicyclo [2.2.1] hept-5-ene, 2-acetoxymethylbicyclo [2.2.1] hept-5-ene, and 2-methoxycarbonyl.
- cyclic olefin having a cyano group for example, 4-cyanotetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 4-methyl-4-cyanotetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 4,5-dicyanotetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 2-cyanobicyclo [2.2.1] hept-5-ene, 2-methyl-2-cyanobicyclo [2.2.1] hept-5-ene, 2 , 3-dicyanobicyclo [2.2.1] hept-5-ene, and the like.
- cyclic olefin having an acid anhydride group examples include, for example, tetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene-4,5-dicarboxylic anhydride, bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylic anhydride, 2-carboxymethyl-2- Hydroxycarbonylbicyclo [2.2.1] hept-5-ene anhydride, and the like.
- Examples of the cyclic olefin having a halogen atom include 2-chlorobicyclo [2.2.1] hept-5-ene, 2-chloromethylbicyclo [2.2.1] hept-5-ene, 2- (chlorophenyl). ) Bicyclo [2.2.1] hept-5-ene, 4-chlorotetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene, 4-methyl-4-chlorotetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-9-ene and the like.
- These monomers (b1) may be used alone or in combination of two or more.
- cyclic olefin monomer (b2) having no polar group examples include bicyclo [2.2.1] hept-2-ene (also referred to as “norbornene”), 5-ethyl-bicyclo [2.2.1]. Hept-2-ene, 5-butyl-bicyclo [2.2.1] hept-2-ene, 5-ethylidene-bicyclo [2.2.1] hept-2-ene, 5-methylidene-bicyclo [2.
- hept-2-ene 5-vinyl-bicyclo [2.2.1] hept-2-ene, tricyclo [5.2.1.0 2,6 ] deca-3,8-diene (conventional name: dicyclopentadiene), tetracyclo [10.2.1.0 2,11. 0 4,9 ] pentadeca-4,6,8,13-tetraene, tetracyclo [6.2.1.1 3,6 . 0 2,7 ] dodec-4-ene (also referred to as “tetracyclododecene”), 9-methyl-tetracyclo [6.2.1.1 3,6 .
- dodec-4-ene pentacyclo [9.2.1.1 3,9 . 0 2,10 . 0 4,8 ] pentadeca-5,12-diene, cyclobutene, cyclopentene, cyclopentadiene, cyclohexene, cycloheptene, cyclooctene, cyclooctadiene, indene, 3a, 5,6,7a-tetrahydro-4,7-methano-1H -Indene, 9-phenyl-tetracyclo [6.2.1.1 3,6 . 0 2,7] dodeca-4-ene, tetracyclo [9.2.1.0 2,10.
- the monomer (b3) other than the cyclic olefin include ethylene; propylene, 1-butene, 1-pentene, 1-hexene, 3-methyl-1-butene, 3-methyl-1-pentene, 3- Ethyl-1-pentene, 4-methyl-1-pentene, 4-methyl-1-hexene, 4,4-dimethyl-1-hexene, 4,4-dimethyl-1-pentene, 4-ethyl-1-hexene, ⁇ -olefins having 2 to 20 carbon atoms such as 3-ethyl-1-hexene, 1-octene, 1-decene, 1-dodecene, 1-tetradecene, 1-hexadecene, 1-octadecene, 1-eicosene; Non-conjugated dienes such as hexadiene, 1,5-hexadiene, 4-methyl-1,4-hexadiene, 5-methyl-1,4-hexa
- the cyclic olefin monomer (b1) having a polar group other than the protic polar group is preferable from the viewpoint that the effect of the present invention becomes more remarkable.
- a cyclic olefin having an N-substituted imide group is particularly preferred.
- the content ratio of the copolymerizable monomer (b) unit in the cyclic olefin polymer (A1) is preferably 10 to 90 mol%, more preferably 20 to 80%, based on all monomer units.
- the mol% is more preferably 30 to 70 mol%.
- a cyclic olefin polymer (A1) by introduce
- the polymer having no protic polar group is obtained by polymerizing at least one of the above-described monomers (b1) and (b2) and an optional combination of the monomer (b3) as necessary. be able to.
- a compound having a protic polar group and a reactive carbon-carbon unsaturated bond in one molecule is usually used.
- Specific examples of such compounds include acrylic acid, methacrylic acid, angelic acid, tiglic acid, oleic acid, elaidic acid, erucic acid, brassic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid, atropaic acid.
- Unsaturated carboxylic acids such as acid and cinnamic acid; allyl alcohol, methyl vinyl methanol, crotyl alcohol, methallyl alcohol, 1-phenylethen-1-ol, 2-propen-1-ol, 3-butene-1- All, 3-buten-2-ol, 3-methyl-3-buten-1-ol, 3-methyl-2-buten-1-ol, 2-methyl-3-buten-2-ol, 2-methyl- Unsatisfactory such as 3-buten-1-ol, 4-penten-1-ol, 4-methyl-4-penten-1-ol, 2-hexen-1-ol Alcohol; and the like.
- the modification reaction of the polymer using these modifiers may be performed according to a conventional method, and is usually performed in the presence of a radical generator.
- the cyclic olefin polymer (A1) used in the present invention may be a ring-opening polymer obtained by ring-opening polymerization of the above-described monomer, or an addition polymer obtained by addition polymerization of the above-described monomer. Although it may be a polymer, it is preferably a ring-opening polymer from the viewpoint that the effect of the present invention becomes more remarkable.
- the ring-opening polymer comprises a ring-opening metathesis polymerization of a cyclic olefin monomer having a protic polar group (a) and a copolymerizable monomer (b) used as necessary in the presence of a metathesis reaction catalyst.
- a cyclic olefin monomer having a protic polar group
- b copolymerizable monomer used as necessary in the presence of a metathesis reaction catalyst.
- As the production method for example, methods described in [0039] to [0079] of International Publication No. 2010/110323 can be used.
- the cyclic olefin polymer (A1) used in the present invention is a ring-opening polymer
- a hydrogenation reaction is further performed, and a hydrogenation in which a carbon-carbon double bond contained in the main chain is hydrogenated is performed. It is preferable to use a product.
- the ratio of hydrogenated carbon-carbon double bonds (hydrogenation rate) is usually 50% or more, and 70% from the viewpoint of heat resistance. Preferably, it is 90% or more, more preferably 95% or more.
- the acrylic resin (A2) used in the present invention is not particularly limited, but is selected from carboxylic acid having an acrylic group, carboxylic acid anhydride having an acrylic group, or an epoxy group-containing acrylate compound and an oxetane group-containing acrylate compound.
- a homopolymer or copolymer having at least one essential component is preferred.
- carboxylic acid having an acrylic group examples include (meth) acrylic acid [meaning acrylic acid and / or methacrylic acid. The same applies to methyl (meth) acrylate. ], Crotonic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, glutaconic acid, phthalic acid mono- (2-((meth) acryloyloxy) ethyl), N- (carboxyphenyl) maleimide, N- (carboxyphenyl) ) (Meth) acrylamide and the like.
- carboxylic acid anhydride having an acrylic group include maleic anhydride and citraconic anhydride.
- epoxy group-containing acrylate compound examples include glycidyl acrylate, glycidyl methacrylate, glycidyl ⁇ -ethyl acrylate, glycidyl ⁇ -n-propyl acrylate, glycidyl ⁇ -n-butyl acrylate, acrylate 3,4 -Epoxybutyl, methacrylic acid-3,4-epoxybutyl, acrylic acid-6,7-epoxyheptyl, methacrylic acid-6,7-epoxyheptyl, ⁇ -ethylacrylic acid-6,7-epoxyheptyl, acrylic acid- Examples include 3,4-epoxycyclohexylmethyl and 3,4-epoxycyclohexylmethyl methacrylate.
- oxetane group-containing acrylate compound examples include (meth) acrylic acid (3-methyloxetane-3-yl) methyl, (meth) acrylic acid (3-ethyloxetane-3-yl) methyl, and (meth) acrylic acid.
- the acrylic resin (A2) is composed of at least one selected from unsaturated carboxylic acid, unsaturated carboxylic acid anhydride and epoxy group-containing unsaturated compound, and other acrylate monomers or copolymerizable monomers other than acrylate And a copolymer thereof.
- acrylate monomers include methyl (meth) acrylate, ethyl (meth) acrylate, propyl (meth) acrylate, isopropyl (meth) acrylate, butyl (meth) acrylate, isobutyl (meth) acrylate, t-butyl ( (Meth) acrylate, amyl (meth) acrylate, isoamyl (meth) acrylate, hexyl (meth) acrylate, heptyl (meth) acrylate, octyl (meth) acrylate, isooctyl (meth) acrylate, ethylhexyl (meth) acrylate, nonyl (meth) Acrylate, decyl (meth) acrylate, isodecyl (meth) acrylate, undecyl (meth) acrylate, dodecyl (meth) acrylate, lauryl (
- methyl (meth) acrylate, butyl (meth) acrylate, cyclohexyl (meth) acrylate, 2-methylcyclohexyl (meth) acrylate, benzyl (meth) acrylate, tricyclo [5.2.1.0 2, 6 Decan-8-yl (meth) acrylate, N-phenylmaleimide and N-cyclohexylmaleimide are preferred.
- the copolymerizable monomer other than the acrylate is not particularly limited as long as it is a compound copolymerizable with the carboxylic acid having an acrylic group, a carboxylic acid anhydride having an acrylic group, or an epoxy group-containing acrylate compound.
- the monomer polymerization method may be in accordance with a conventional method, and for example, a suspension polymerization method, an emulsion polymerization method, a solution polymerization method and the like are employed.
- the polyimide used in the present invention or its precursor (A3) is obtained by reacting tetracarboxylic dianhydride and diamine, and may be heat-treated as necessary.
- the precursor for obtaining polyimide include polyamic acid, polyamic acid ester, polyisoimide, and polyamic acid sulfonamide.
- the polyimide used in the present invention or its precursor (A3) is synthesized by a known method. That is, a tetracarboxylic dianhydride and a diamine are selectively combined, and these are combined with N-methyl-2-pyrrolidone, N, N-dimethylacetamide, N, N-dimethylformamide, dimethyl sulfoxide, hexamethylphosphorotriamide, It is synthesized by a known method such as reacting in a polar solvent such as ⁇ -butyrolactone and cyclopentanone.
- the terminal amino group of the produced polyimide (A3) can be reacted with a carboxylic acid anhydride to protect the terminal amino group.
- an amine compound can be made to react with the terminal acid anhydride group of the produced
- carboxylic anhydrides examples include phthalic anhydride, trimellitic anhydride, maleic anhydride, naphthalic anhydride, hydrogenated phthalic anhydride, methyl-5-norbornene-2,3-dicarboxylic acid
- Anhydrides, itaconic anhydrides, tetrahydrophthalic anhydrides and the like are exemplified by amine compounds such as aniline, 2-hydroxyaniline, 3-hydroxyaniline, 4-hydroxyaniline, 2-ethynylaniline, 3-ethynylaniline, 4- And ethynylaniline.
- Polybenzoxazole or its precursor (A4) is obtained by reacting a bis (ortho-aminophenol) compound with a dicarboxylic acid, a dicarboxylic acid ester, or a carboxylic acid dichloride. You may go.
- polysiloxane (A5) used by this invention Preferably the polymer obtained by mixing and making 1 type (s) or 2 or more types of the organosilane represented by following General formula (4) become. Can be mentioned. (R 10 ) p -Si- (OR 11 ) 4-p (4)
- R 10 is a hydrogen atom, an alkyl group having 1 to 10 carbon atoms, an alkenyl group, or an aryl group having 6 to 15 carbon atoms of 2 to 10 carbon atoms, more R 10 each They may be the same or different.
- These alkyl groups, alkenyl groups, and aryl groups may all have a substituent, or may be unsubstituted without a substituent, depending on the characteristics of the composition. You can choose.
- alkyl group examples include methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, t-butyl group, n-hexyl group, n-decyl group, trifluoromethyl group, 2,2 , 2-trifluoroethyl group, 3,3,3-trifluoropropyl group, 3-glycidoxypropyl group, 2- (3,4-epoxycyclohexyl) ethyl group, 3-aminopropyl group, 3-mercaptopropyl Group, 3-isocyanatopropyl group.
- alkenyl group examples include a vinyl group, a 3-acryloxypropyl group, and a 3-methacryloxypropyl group.
- aryl group examples include phenyl, tolyl, p-hydroxyphenyl, 1- (p-hydroxyphenyl) ethyl, 2- (p-hydroxyphenyl) ethyl, 4-hydroxy-5- (p -Hydroxyphenylcarbonyloxy) pentyl group, naphthyl group.
- R 11 is a hydrogen atom, an alkyl group having 1 to 6 carbon atoms, an acyl group having 1 to 6 carbon atoms, or an aryl group having 6 to 15 carbon atoms, and a plurality of R 11 May be the same or different.
- Each of these alkyl groups and acyl groups may have a substituent, or may be an unsubstituted product having no substituent, and can be selected according to the characteristics of the composition.
- Specific examples of the alkyl group include a methyl group, an ethyl group, an n-propyl group, an isopropyl group, and an n-butyl group.
- Specific examples of the acyl group include an acetyl group.
- Specific examples of the aryl group include a phenyl group.
- organosilane represented by the general formula (4) include tetrafunctional silanes such as tetramethoxysilane, tetraethoxysilane, tetraacetoxysilane, and tetraphenoxysilane; methyltrimethoxysilane, methyltriethoxysilane, Methyltriisopropoxysilane, methyltrin-butoxysilane, ethyltrimethoxysilane, ethyltriethoxysilane, ethyltriisopropoxysilane, ethyltrin-butoxysilane, n-propyltrimethoxysilane, n-propyltriethoxysilane, n- Butyltrimethoxysilane, n-butyltriethoxysilane, n-hexyltrimethoxysilane, n-hexyltriethoxysilane, n-
- the polysiloxane (A5) used in the present invention is obtained by hydrolyzing and partially condensing the organosilane described above.
- a general method can be used for hydrolysis and partial condensation. For example, a solvent, water and, if necessary, a catalyst are added to the mixture, and the mixture is heated and stirred. During stirring, if necessary, hydrolysis by-products (alcohols such as methanol) and condensation by-products (water) may be distilled off by distillation.
- the phenol resin (A6) used in the present invention can be obtained, for example, by reacting a phenol compound with an aldehyde, a dimethylol compound, a dialkoxymethyl compound, or a dihalomethyl compound in the presence of an acid catalyst.
- the weight average molecular weight (Mw) of the binder resin (A) used in the present invention is usually 1,000 to 1,000,000, preferably 1,500 to 100,000, more preferably 2,000 to 30. , 000.
- the molecular weight distribution of the binder resin (A) is usually 4 or less, preferably 3 or less, and more preferably 2.5 or less, as a weight average molecular weight / number average molecular weight (Mw / Mn) ratio.
- the weight average molecular weight (Mw) and molecular weight distribution (Mw / Mn) of the binder resin (A) are values determined as polystyrene equivalent values by gel permeation chromatography (GPC) using a solvent such as tetrahydrofuran as an eluent. It is.
- the resin composition of the present invention contains an aromatic compound (B) represented by the following general formula (1) (hereinafter abbreviated as “aromatic compound (B)” as appropriate). It is considered that the aromatic compound (B) can react with the crosslinking agent (C) to increase the crosslinking density of the resin composition of the present invention and increase the water resistance and solvent resistance.
- R 1 to R 8 are each independently a hydrogen atom, a hydroxyl group, a carboxyl group, an optionally substituted aliphatic hydrocarbon group having 1 to 12 carbon atoms or a substituted group. And an aromatic hydrocarbon group having 6 to 12 carbon atoms which may have a group.
- n is an integer of 0 to 2
- R 1 to R 4 , R 6 , and R 7 are hydroxyl groups
- R 1 to R 8 When at least two are hydroxyl groups and m is 2 or more, regardless of the structure represented by the general formula (1), three or more benzene rings may be condensed with each other at any position. Good.
- R 1 to R 8 are each an optionally substituted aliphatic hydrocarbon group having 1 to 12 carbon atoms or an aromatic carbon atom having 6 to 12 carbon atoms that may have a substituent.
- the substituent in the case of a hydrogen group is not particularly limited, and examples thereof include a hydroxyl group, a carboxyl group, and a halogen atom.
- R 1 to R 8 are preferably a hydrogen atom, a hydroxyl group, or an aliphatic hydrocarbon group having 1 to 6 carbon atoms.
- m 0. That is, as the aromatic compound (B), a compound represented by the following general formula (2) is more preferable.
- R 1 to R 4 , R 6 and R 7 are the same as in the general formula (1), and at least two of R 1 to R 4 , R 6 and R 7 are hydroxyl groups. is there.
- R 1 to R 4 , R 6 , and R 7 are hydroxyl groups from the viewpoint that the effects of the present invention can be made more remarkable.
- One of which is an aliphatic hydrocarbon group having 1 to 12 carbon atoms and the remaining is a hydrogen atom
- three of R 1 to R 4 , R 6 and R 7 are hydroxyl groups and the remaining is hydrogen More preferred are compounds that are atoms.
- the position of the hydroxyl group contained in two or more is not particularly limited. However, for example, the hydroxyl group is, for example, from the point that the effect of the present invention can be made more remarkable.
- resorcinols When there are two, it is preferable that they are present at the meta position (ie, resorcinols), and when there are three hydroxyl groups, they are at the first, third, and fifth positions. Preferably they are present (ie 1,3,5-trihydroxybenzenes). It is considered that the position of the hydroxyl group on the benzene ring can be hardly affected by the steric hindrance of each hydroxyl group, and an efficient crosslinking reaction can be promoted.
- the aromatic compound (B) used in the present invention preferably has a molecular weight in the range of 90 to 500, more preferably in the range of 100 to 300.
- aromatic compound (B) examples include catechol, 3-methylcatechol, 3-ethylcatechol, 4-methylcatechol, 4-ethylcatechol, 2-isopentylpyrocatechol, 2,3-dimethylcatechol, 2, 3-diethyl catechol, 2,3-diisopentyl catechol, 2-methyl 3-octyl catechol, 2-butyl 3-tert-butyl catechol, 2,3-dibromo catechol, 2,4-diisopropyl catechol, 2-pentyl 4 -Octyl catechol, 2,4-dibromocatechol, 2,5-diethyl catechol, 2,5-ditert-pentyl catechol, 2-butyl 5-bromo catechol, 2,5-dichloro catechol, 3,4,6-tri Catechols such as isopropyl catechol; Resorcinol, 2-methylresorcinol, 2-butylresorcinol, 2-octylresorcinol, 2-
- the content of the aromatic compound (B) in the resin composition of the present invention is preferably 0.01 to 30 parts by weight, more preferably 0.1 to 100 parts by weight of the binder resin (A). -20 parts by weight, more preferably 0.5-15 parts by weight, particularly preferably 2-10 parts by weight.
- the resin film obtained using the resin composition of the present invention has higher heat resistance, water resistance, thermal shock resistance, and solvent resistance. Can be balanced.
- the resin composition of the present invention contains a crosslinking agent (C) in addition to the binder resin (A) and the aromatic compound (B).
- a crosslinking agent (C) examples include those that form a crosslinked structure between the crosslinking agent molecules by heating, and those that react with the binder resin (A) to form a crosslinked structure between the resin molecules. Examples include compounds having two or more reactive groups.
- a crosslinking agent (C) can raise the crosslinking density of the resin composition of this invention by reacting with an aromatic compound (B).
- an epoxy group containing crosslinking agent an alkoxymethyl group containing crosslinking agent, a methylol group containing crosslinking agent, an oxetane group containing crosslinking agent, an isocyanate group containing crosslinking agent , Blocked isocyanate group-containing crosslinking agents, oxazoline group-containing crosslinking agents, maleimide group-containing crosslinking agents, (meth) acrylate group-containing crosslinking agents, and the like.
- an epoxy group-containing crosslinking agent is preferable.
- epoxy group-containing crosslinking agent examples include, for example, an epoxy compound having a dicyclopentadiene skeleton (trade name “HP-7200”, manufactured by DIC), 1 of 2,2-bis (hydroxymethyl) 1-butanol. , 2-Epoxy-4- (2-oxiranyl) cyclohexane adduct (15-functional alicyclic epoxy resin having cyclohexane skeleton and terminal epoxy group, trade name “EHPE3150”, manufactured by Daicel Chemical Industries, Ltd.), epoxidation 3 -Cyclohexene-1,2-dicarboxylate bis (3-cyclohexenylmethyl) -modified ⁇ -caprolactone (aliphatic cyclic trifunctional epoxy resin, trade name “Epolide GT301”, manufactured by Daicel Chemical Industries), epoxidized butanetetra Tetrakis (3-cyclohexenylmethyl) modified ⁇ -caprolactone (Aliphatic cyclic tetrafunctional epoxy resin
- Bisphenol A type epoxy compounds (trade names “jER 825”, “jER 827”, “jER 828”, “jER YL980”, manufactured by Mitsubishi Chemical Corporation, trade names “EPICLON 840”, “EPICLON 850”, manufactured by DIC), Bisphenol F type epoxy compounds (trade names “jER 806”, “jER 807”, “jER YL983U”, manufactured by Mitsubishi Chemical Corporation, trade names “EPICLON 830”, “EPICLON 835”, manufactured by DIC), hydrogenated bisphenol A type Epoxy compounds (trade names “jER YX8000”, “jER YX8034” manufactured by Mitsubishi Chemical Co., Ltd., product name “ST-3000” manufactured by Nippon Steel & Sumikin Co., Ltd., trade name “Licar Resin HBE-100” manufactured by Shin Nippon Rika Co., Ltd.
- the alkoxymethyl group-containing crosslinking agent is not particularly limited as long as it is a compound having two or more alkoxymethyl groups, and a phenol compound in which two or more alkoxymethyl groups are directly bonded to an aromatic ring, or an amino group Melamine compounds in which is substituted with two or more methoxymethyl groups.
- two or more alkoxymethyl group compounds in such a molecule include phenol compounds in which two or more alkoxymethyl groups are directly bonded to an aromatic ring, such as 2,6-dimethoxymethyl-4- Dimethoxymethyl-substituted phenolic compounds such as t-butylphenol and 2,6-dimethoxymethyl-p-cresol, 3,3 ′, 5,5′-tetramethoxymethyl-4,4′- dihydroxybiphenyl (for example, trade name “TMOM” -BP "(manufactured by Honshu Chemical Industry Co., Ltd.), tetramethoxymethyl-substituted biphenyl compounds such as 1,1-bis [3,5-di (methoxymethyl) -4-hydroxyphenyl] -1-phenylethane, 4, 4 ' , 4 ′ ′-(ethylidene) trisphenol and other hexamethoxymethyl-substituted compounds (for example, the trade name “H
- a melamine compound in which an amino group is substituted with two or more alkoxymethyl groups as a compound containing two or more alkoxymethyl groups in the molecule, for example, N, N′-dimethoxymethylmelamine, N, N ′, N ′ '-Trimethoxymethylmelamine, N, N, N', N ''-tetramethoxymethylmelamine, N, N, N ', N', N ''-pentamethoxymethylmelamine, N, N, N ', N Examples include ', N ′′, N ′′ -hexamethoxymethylmelamine (for example, “Nicarak MW-390LM”, “Nicarac MW-100LM”, manufactured by Sanwa Chemical Co., Ltd.), or polymers thereof.
- urea compound substituted with two or more alkoxymethyl groups as a compound containing two or more alkoxymethyl groups in the molecule, “Nicalak MX270”, manufactured by Sanwa Chemical Co., Ltd., “Nicalak MX280”, Sanwa Chemical Co., Ltd. Nicarax MX290 "manufactured by Sanwa Chemical Co., Ltd.
- Compounds containing two or more alkoxymethyl groups or methylol groups in the molecule can be used alone or in combination of two or more.
- N, N, N ′, N ′, N ′′, N ′′ -hexamethoxymethylmelamine is preferable from the viewpoint of high reactivity.
- the molecular weight of two or more alkoxymethyl group compounds in the molecule is not particularly limited, but is usually 50 to 100,000, preferably 80 to 10,000, and more preferably 100 to 5,000.
- Compounds containing two or more alkoxymethyl groups or methylol groups in the molecule can be used alone or in combination of two or more.
- the molecular weight of the crosslinking agent (C) is not particularly limited, but is usually 100 to 100,000, preferably 300 to 50,000, more preferably 500 to 10,000.
- a crosslinking agent can be used individually or in combination of 2 types or more, respectively.
- the content of the crosslinking agent (C) in the resin composition of the present invention is preferably 5 to 80 parts by weight, more preferably 10 to 75 parts by weight, with respect to 100 parts by weight of the binder resin (A). More preferably, it is 15 to 70 parts by weight.
- the resin composition of the present invention may further contain a photoacid generator (D) in addition to the binder resin (A), the aromatic compound (B), and the crosslinking agent (C).
- a photoacid generator (D) in addition to the binder resin (A), the aromatic compound (B), and the crosslinking agent (C).
- the photoacid generator (D) causes a chemical reaction when irradiated with radiation such as ultraviolet rays or electron beams, so that the alkali of the resin film formed from the resin composition is obtained.
- the solubility can be changed, and the resulting resin film can be patterned.
- Examples of the photoacid generator (D) include azide compounds such as acetophenone compounds, triarylsulfonium salts, quinonediazide compounds, and the like, preferably azide compounds, and particularly preferably quinonediazide compounds.
- quinonediazide compound for example, an ester compound of a quinonediazidesulfonic acid halide and a compound having a phenolic hydroxyl group can be used.
- the quinone diazide sulfonic acid halide include 1,2-naphthoquinone diazide-5-sulfonic acid chloride, 1,2-naphthoquinone diazide-4-sulfonic acid chloride, 1,2-benzoquinone diazide-5-sulfonic acid chloride, and the like. Can be mentioned.
- Representative examples of the compound having a phenolic hydroxyl group include 1,1,3-tris (2,5-dimethyl-4-hydroxyphenyl) -3-phenylpropane, 4,4 ′-[1- [4- [1 -[4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol and the like.
- phenolic hydroxyl group examples include 2,3,4-trihydroxybenzophenone, 2,3,4,4′-tetrahydroxybenzophenone, 2-bis (4-hydroxyphenyl) propane, tris (4- Hydroxyphenyl) methane, 1,1,1-tris (4-hydroxy-3-methylphenyl) ethane, 1,1,2,2-tetrakis (4-hydroxyphenyl) ethane, novolak resin oligomer, phenolic hydroxyl group Examples thereof include oligomers obtained by copolymerizing one or more compounds and dicyclopentadiene.
- Examples of the photoacid generator (D) include quinonediazide compounds, onium salts, halogenated organic compounds, ⁇ , ⁇ ′-bis (sulfonyl) diazomethane compounds, ⁇ -carbonyl- ⁇ ′-sulfonyldiazomethane compounds, Known compounds such as sulfone compounds, organic acid ester compounds, organic acid amide compounds, and organic acid imide compounds can be used. These photoacid generators (D) can be used alone or in combination of two or more.
- the content of the photoacid generator (D) in the resin composition of the present invention is preferably 5 to 100 parts by weight, more preferably 10 to 60 parts by weight with respect to 100 parts by weight of the binder resin (A). More preferably, it is 15 to 40 parts by weight. If the content of the photoacid generator (D) is within this range, when the resin film made of the resin composition is patterned, the difference in solubility in the developer between the radiation irradiated part and the radiation non-irradiated part becomes large. The radiation sensitivity is also high, and it is preferable because patterning by development is easy.
- the resin composition of the present invention may further contain a solvent.
- the solvent is not particularly limited, and is known as a resin composition solvent such as acetone, methyl ethyl ketone, cyclopentanone, 2-hexanone, 3-hexanone, 2-heptanone, 3-heptanone, 4-heptanone, 2- Linear ketones such as octanone, 3-octanone and 4-octanone; alcohols such as n-propyl alcohol, isopropyl alcohol, n-butyl alcohol and cyclohexanol; ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether and dioxane Alcohol alcohols such as ethylene glycol monomethyl ether and ethylene glycol monoethyl ether; propyl formate, butyl formate, propyl acetate, butyl acetate, methyl propionate, ethyl propionate Esters
- solvents may be used alone or in combination of two or more.
- the content of the solvent is preferably in the range of 10 to 10,000 parts by weight, more preferably 50 to 5000 parts by weight, and still more preferably 100 to 1000 parts by weight with respect to 100 parts by weight of the binder resin (A).
- a solvent will be normally removed after resin film formation.
- the resin composition of the present invention has an acidic group or a heat-latent acidic group-containing compound, a surfactant, a sensitizer, a light stabilizer, an extinguishing agent, as long as the effects of the present invention are not inhibited.
- Other compounding agents such as foaming agents, pigments, dyes, fillers and the like may be contained.
- the compound having an acidic group or a heat-latent acidic group those described in JP-A-2014-29766 can be used, and surfactants, sensitizers, light stabilizers can be used.
- those described in JP2011-75609A can be used.
- the preparation method of the resin composition of this invention is not specifically limited, What is necessary is just to mix each component which comprises a resin composition by a well-known method.
- the mixing method is not particularly limited, but it is preferable to mix a solution or dispersion obtained by dissolving or dispersing each component constituting the resin composition in a solvent. Thereby, a resin composition is obtained with the form of a solution or a dispersion liquid.
- the method for dissolving or dispersing each component constituting the resin composition in a solvent may be in accordance with a conventional method. Specifically, stirring using a stirrer and a magnetic stirrer, a high-speed homogenizer, a disper, a planetary stirrer, a twin-screw stirrer, a ball mill, a three-roll, etc. can be used. Further, after each component is dissolved or dispersed in a solvent, it may be filtered using, for example, a filter having a pore size of about 0.5 ⁇ m.
- the solid content concentration of the resin composition of the present invention is usually 1 to 70% by weight, preferably 5 to 60% by weight, more preferably 10 to 50% by weight. If the solid content concentration is within this range, dissolution stability, coating properties, film thickness uniformity of the formed resin film, flatness, and the like can be highly balanced.
- the electronic component of the present invention has a resin film made of the above-described resin composition of the present invention.
- the electronic component of the present invention is not particularly limited, but the resin film made of the resin composition of the present invention is excellent in heat resistance, water resistance, thermal shock resistance and solvent resistance.
- the resin film made of the resin composition of the present invention insulates wirings arranged in layers in an electronic component manufactured by the wafer level package technology. More preferably, it is used for forming an interlayer insulating film.
- the method for forming the resin film is not particularly limited, and for example, a coating method, a film lamination method, or the like can be used.
- the coating method is, for example, a method of removing a solvent by applying a resin composition and then drying by heating.
- the method for applying the resin composition include various methods such as a spray method, a spin coating method, a roll coating method, a die coating method, a doctor blade method, a spin coating method, a bar coating method, a screen printing method, and an inkjet method. Can be adopted.
- the heating and drying conditions vary depending on the type and mixing ratio of each component, but are usually 30 to 150 ° C., preferably 60 to 120 ° C., usually 0.5 to 90 minutes, preferably 1 to 60 minutes, and more. Preferably, it may be performed in 1 to 30 minutes.
- the resin composition is applied onto a B-stage film-forming substrate such as a resin film or a metal film, and then the solvent is removed by heating and drying to obtain a B-stage film. It is a method of laminating.
- the heating and drying conditions can be appropriately selected according to the type and mixing ratio of each component, but the heating temperature is usually 30 to 150 ° C., and the heating time is usually 0.5 to 90 minutes.
- Film lamination can be performed using a pressure laminator, a press, a vacuum laminator, a vacuum press, a roll laminator or the like.
- the thickness of the resin film is not particularly limited and may be appropriately set depending on the application, but is preferably 0.1 to 100 ⁇ m, more preferably 0.5 to 50 ⁇ m, and further preferably 0.5 to 30 ⁇ m. is there.
- a crosslinking reaction is performed on the resin film formed by the above-described coating method or film lamination method.
- Such crosslinking may be appropriately selected depending on the type of the crosslinking agent (C), but is usually performed by heating.
- the heating method can be performed using, for example, a hot plate or an oven.
- the heating temperature is usually 150 to 250 ° C.
- the heating time is appropriately selected depending on the area and thickness of the resin film, the equipment used, etc.
- the oven is usually run for 5 to 60 minutes. When used, it is usually in the range of 30 to 300 minutes.
- Heating may be performed in an inert gas atmosphere as necessary. Any inert gas may be used as long as it does not contain oxygen and does not oxidize the resin film.
- Examples thereof include nitrogen, argon, helium, neon, xenon, and krypton.
- nitrogen and argon are preferable, and nitrogen is particularly preferable.
- an inert gas having an oxygen content of 0.1% by volume or less, preferably 0.01% by volume or less, particularly nitrogen is suitable. These inert gases can be used alone or in combination of two or more.
- a resin film containing a photoacid generator (D) in the resin composition and using the resin composition containing the photoacid generator (D) is used.
- And forming a latent image pattern by irradiating the resin film before patterning with actinic radiation, and then bringing the developer film into contact with the resin film having the latent image pattern.
- a method other than the method using the photoacid generator (D), a method using laser processing using a CO 2 laser, a UV-YAG laser, or the like, or a mask pattern on the resin film A method of forming and dry-edging, and a direct drawing method such as an inkjet method can also be used.
- the actinic radiation is particularly limited as long as it can activate the photoacid generator (D) contained in the resin composition and change the alkali solubility of the resin composition containing the photoacid generator (D).
- ultraviolet rays ultraviolet rays having a single wavelength such as g-h-i rays, light rays such as KrF excimer laser light and ArF excimer laser light; particle beams such as electron beams; and the like can be used.
- a method for forming a latent image pattern by selectively irradiating these actinic radiations in a pattern may be in accordance with an ordinary method.
- ultraviolet rays, gh-i lines, KrFs can be obtained by a reduction projection exposure apparatus or the like.
- a method of irradiating a light beam such as excimer laser light or ArF excimer laser light through a desired mask pattern, a method of drawing with a particle beam such as an electron beam, or the like can be used.
- the active radiation it may be single wavelength light or mixed wavelength light.
- Irradiation conditions are appropriately selected depending on the actinic radiation to be used. For example, when a light beam having a wavelength of 200 to 450 nm is used, the irradiation amount is usually 10 to 1,000 mJ / cm 2 , preferably 50 to 500 mJ / cm 2 . It is a range of cm 2 and is determined according to irradiation time and illuminance.
- the resin film is heat-treated at a temperature of about 60 to 130 ° C. for about 1 to 2 minutes as necessary.
- an aqueous solution of an alkaline compound is usually used.
- an alkaline compound for example, an alkali metal salt, an amine, or an ammonium salt can be used.
- the alkaline compound may be an inorganic compound or an organic compound.
- alkali metal salts such as sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate and sodium metasilicate; ammonia water; primary amines such as ethylamine and n-propylamine; diethylamine Secondary amines such as di-n-propylamine; tertiary amines such as triethylamine and methyldiethylamine; quaternary ammonium salts such as tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetrabutylammonium hydroxide and choline Alcohol alcohols such as dimethylethanolamine and triethanolamine; pyrrole, piperidine, 1,8-diazabicyclo [5.4.0] undec-7-ene, 1,5-diazabicyclo [4.3.0] nona-5 -En, N-Me Cyclic amines such as Rupiroridon; and the like.
- alkaline compounds can be
- aqueous medium of the alkaline aqueous solution water; water-soluble organic solvents such as methanol and ethanol can be used.
- the alkaline aqueous solution may have a surfactant added in an appropriate amount.
- a paddle method, a spray method, a dipping method, or the like is used as a method of bringing the developer into contact with the resin film having the latent image pattern.
- the development is usually appropriately selected in the range of 0 to 100 ° C., preferably 5 to 55 ° C., more preferably 10 to 30 ° C., and usually 30 to 180 seconds.
- the resin film on which the target pattern is formed in this manner can be rinsed with a rinsing liquid in order to remove the development residue, if necessary. After the rinse treatment, the remaining rinse liquid is removed with compressed air or compressed nitrogen. Furthermore, if necessary, in order to deactivate the photoacid generator (D) contained in the resin composition, the entire surface of the electronic component can be irradiated with actinic radiation. For irradiation with actinic radiation, the method exemplified in the formation of the latent image pattern can be used.
- the resin film may be heated simultaneously with irradiation or after irradiation. Examples of the heating method include a method of heating an electronic component in a hot plate or an oven. The temperature is usually in the range of 100 to 300 ° C, preferably 120 to 200 ° C.
- the resin film can be subjected to a crosslinking reaction after being patterned.
- Crosslinking may be performed according to the method described above.
- the resin composition of the present invention contains the binder resin (A), the aromatic compound (B) represented by the general formula (1), and the crosslinking agent (C).
- the resin film obtained using this resin composition is excellent in heat resistance, water resistance, thermal shock resistance and solvent resistance. Therefore, the resin film obtained using such a resin composition of the present invention can be suitably used for electronic components, particularly electronic components manufactured by wafer level package technology.
- a resin composition was spin-coated on a silicon wafer on which an aluminum thin film was formed to a thickness of 100 nm, and then heated at 120 ° C. for 2 minutes using a hot plate, and then in a nitrogen atmosphere, By curing at 200 ° C. for 60 minutes, a resin film having a thickness of 10 ⁇ m was formed to obtain a laminate. And after cutting the obtained laminated body into a predetermined
- the glass transition temperature (degreeC) of a resin film is measured using a viscoelastic spectrometer (SII nanotechnology company, DMS6100 standard type), and heat resistance is evaluated on the following references
- C Glass transition temperature is lower than 150 ° C.
- a resin composition was spin-coated on a silicon wafer having a thickness of 100 nm on a 50 nm thick titanium film, and then heated at 120 ° C. for 2 minutes using a hot plate. Then, a laminate was obtained by forming a resin film having a thickness of 10 ⁇ m by curing under a nitrogen atmosphere at 200 ° C. for 60 minutes. And after putting the obtained laminated body in a high-temperature high-humidity tank with a temperature of 130 ° C. and a humidity of 85 RH% for 200 hours, the laminated body was taken out and a cross-cut test was performed on the resin film forming the laminated body. .
- a resin composition is spin coated on a thermal shock evaluation substrate having a patterned copper wiring on a silicon wafer, heated at 120 ° C. for 2 minutes, and then at 200 ° C. for 60 minutes in a nitrogen atmosphere.
- a sample for evaluation was obtained by forming a resin film having a film thickness of 10 ⁇ m by curing under the above conditions.
- the obtained sample for evaluation was subjected to a thermal shock test using a thermal shock tester (manufactured by Tabai Especs) at -55 ° C / 30 minutes and 150 ° C / 30 minutes as one cycle to obtain a resin film. The number of cycles until cracks occurred was confirmed, and the thermal shock resistance was evaluated according to the following criteria.
- C Cracks occurred before reaching 1000 cycles.
- the polymerization reaction liquid was obtained by charging into a pressure-resistant reactor and making it react at 80 degreeC for 4 hours, stirring.
- the obtained polymerization reaction liquid was put in an autoclave and stirred for 5 hours at 150 ° C. under a hydrogen pressure of 4 MPa to perform a hydrogenation reaction, thereby obtaining a polymer solution containing the cyclic olefin polymer (A-1). .
- the resulting cyclic olefin polymer (A-1) had a polymerization conversion rate of 99.7%, a polystyrene-equivalent weight average molecular weight of 7,150, a number average molecular weight of 4,690, a molecular weight distribution of 1.52, and a hydrogenation rate. was 99.7%.
- the solid content concentration of the obtained polymer solution of the cyclic olefin polymer (A-1) was 34.4% by weight.
- Comparative Examples 1 to 3 A resin composition was prepared and evaluated in the same manner as in Example 1 except that the compounds shown in Table 1 were used in the amounts shown in Table 1. The results are shown in Table 1.
- each compound shown in Table 1 is as follows.
- a resin film obtained using a resin composition containing a binder resin (A), an aromatic compound (B) represented by the general formula (1), and a crosslinking agent (C) was excellent in all of heat resistance, water resistance, thermal shock resistance, and solvent resistance (Examples 1 to 4).
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
Abstract
Description
〔1〕バインダー樹脂(A)、下記一般式(1)で表される芳香族化合物(B)、及び架橋剤(C)を含有する樹脂組成物、
〔2〕光酸発生剤(D)をさらに含有する前記〔1〕に記載の樹脂組成物、
〔3〕前記光酸発生剤(D)が、キノンジアジド化合物である前記〔2〕に記載の樹脂組成物、
〔4〕前記バインダー樹脂(A)が、プロトン性極性基を有する環状オレフィン重合体である前記〔1〕~〔3〕のいずれかに記載の樹脂組成物、
〔5〕前記芳香族化合物(B)が、下記一般式(2)で表される化合物である前記〔1〕~〔4〕のいずれかに記載の樹脂組成物、
〔6〕前記芳香族化合物(B)が、前記一般式(2)において、R1~R4,R6,R7のうち、2つが水酸基であり、1つが炭素数1~12の脂肪族炭化水素基であり、残りが水素原子である化合物、または、前記一般式(2)において、R1~R4,R6,R7のうち、3つが水酸基であり、残りが水素原子である化合物である前記〔5〕に記載の樹脂組成物、
〔7〕前記バインダー樹脂(A)100重量部に対する、前記芳香族化合物(B)の含有量が0.01~30重量部である前記〔1〕~〔6〕のいずれかに記載の樹脂組成物、
〔8〕前記架橋剤(C)が、エポキシ基含有架橋剤である前記〔1〕~〔7〕のいずれかに記載の樹脂組成物、ならびに、
〔9〕前記〔1〕~〔8〕のいずれかに記載の樹脂組成物からなる樹脂膜を備える電子部品、
が提供される。
本発明で用いるバインダー樹脂(A)としては、特に限定されないが、プロトン性極性基を有する環状オレフィン重合体(A1)、アクリル樹脂(A2)、ポリイミド、またはその前駆体(A3)、ポリベンゾオキサゾール、またはその前駆体(A4)、ポリシロキサン(A5)、又はフェノール樹脂(A6)であることが好ましく、これらの中でも、本発明の樹脂組成物の耐水性をより高くする観点から、プロトン性極性基を有する環状オレフィン重合体(A1)が特に好ましい。
これらのバインダー樹脂(A)は、それぞれ単独で用いてもよく、又は2種以上を併用してもよい。
本発明において、プロトン性極性基を有する環状オレフィン樹脂に結合しているプロトン性極性基の数に特に限定はなく、また、相異なる種類のプロトン性極性基が含まれていてもよい。
これら単量体(b2)は、それぞれ単独で用いてもよく、2種以上を組み合わせて用いてもよい。
これら単量体(b3)は、それぞれ単独で用いてもよく、2種以上を組み合わせて用いてもよい。
プロトン性極性基を有しない重合体は、上述した単量体(b1)及び(b2)のうち少なくとも一種と、必要に応じて単量体(b3)とを任意に組み合わせて重合することによって得ることができる。
このような化合物の具体例としては、アクリル酸、メタクリル酸、アンゲリカ酸、チグリン酸、オレイン酸、エライジン酸、エルカ酸、ブラシジン酸、マレイン酸、フマル酸、シトラコン酸、メサコン酸、イタコン酸、アトロパ酸、ケイ皮酸等の不飽和カルボン酸;アリルアルコール、メチルビニルメタノール、クロチルアルコール、メタリルアルコール、1-フェニルエテン-1-オール、2-プロペン-1-オール、3-ブテン-1-オール、3-ブテン-2-オール、3-メチル-3-ブテン-1-オール、3-メチル-2-ブテン-1-オール、2-メチル-3-ブテン-2-オール、2-メチル-3-ブテン-1-オール、4-ペンテン-1-オール、4-メチル-4-ぺンテン-1-オール、2-ヘキセン-1-オール等の不飽和アルコール;等が挙げられる。
これら変性剤を用いた重合体の変性反応は、常法に従えばよく、通常、ラジカル発生剤の存在下で行われる。
アクリル基を有するカルボン酸無水物の具体例としては、無水マレイン酸、シトラコン酸無水物等が挙げられる。
エポキシ基含有アクリレート化合物の具体例としては、アクリル酸グリシジル、メタクリル酸グリシジル、α-エチルアクリル酸グリシジル、α-n-プロピルアクリル酸グリシジル、α-n-ブチルアクリル酸グリシジル、アクリル酸-3,4-エポキシブチル、メタクリル酸-3,4-エポキシブチル、アクリル酸-6,7-エポキシヘプチル、メタクリル酸-6,7-エポキシヘプチル、α-エチルアクリル酸-6,7-エポキシヘプチル、アクリル酸-3,4-エポキシシクロヘキシルメチル、メタクリル酸-3,4-エポキシシクロヘキシルメチル等が挙げられる。
オキセタン基含有アクリレート化合物の具体例としては、(メタ)アクリル酸(3-メチルオキセタン-3-イル)メチル、(メタ)アクリル酸(3-エチルオキセタン-3-イル)メチル、(メタ)アクリル酸(3-メチルオキセタン-3-イル)エチル、(メタ)アクリル酸(3-エチルオキセタン-3-イル)エチル、(メタ)アクリル酸(3-クロロメチルオキセタン-3-イル)メチル、(メタ)アクリル酸(オキセタン-2-イル)メチル、(メタ)アクリル酸(2-メチルオキセタン-2-イル)メチル、(メタ)アクリル酸(2-エチルオキセタン-2-イル)メチル、(1-メチル-1-オキセタニル-2-フェニル)-3-(メタ)アクリレート、(1-メチル-1-オキセタニル)-2-トリフロロメチル-3-(メタ)アクリレート、及び(1-メチル-1-オキセタニル)-4-トリフロロメチル-2-(メタ)アクリレート等が挙げられる。
これらのうち、(メタ)アクリル酸、無水マレイン酸、(メタ)アクリル酸グリシジル、メタクリル酸-6,7-エポキシヘプチル等が好ましい。
これらのなかでも、メチル(メタ)アクリレート、ブチル(メタ)アクリレート、シクロヘキシル(メタ)アクリレート、2-メチルシクロヘキシル(メタ)アクリレート、ベンジル(メタ)アクリレート、トリシクロ[5.2.1.0 2 , 6 ]デカン-8-イル(メタ)アクリレート、N-フェニルマレイミド及びN-シクロヘキシルマレイミド等が好ましい。
これらの化合物は、それぞれ単独で用いてもよく、2種以上を組み合わせて用いてもよい。
上記単量体の重合方法は、常法に従えばよく、例えば、懸濁重合法、乳化重合法、溶液重合法等が採用される。
(R10)p-Si-(OR11)4-p (4)
これらのオルガノシランのうち、得られる樹脂膜の耐クラック性や硬度の点から3官能性シランが好ましく用いられる。これらのオルガノシランは単独で使用しても、2種以上を組み合わせて使用してもよい。
また、バインダー樹脂(A)の分子量分布は、重量平均分子量/数平均分子量(Mw/Mn)比で、通常、4以下、好ましくは3以下、より好ましくは2.5以下である。
バインダー樹脂(A)の重量平均分子量(Mw)や分子量分布(Mw/Mn)は、テトラヒドロフラン等の溶媒を溶離液としたゲル・パーミエーション・クロマトグラフィー(GPC)により、ポリスチレン換算値として求められる値である。
本発明の樹脂組成物は、下記一般式(1)で表される芳香族化合物(B)(以下、適宜、「芳香族化合物(B)」と略記する。)を含有する。当該芳香族化合物(B)は、架橋剤(C)と反応して、本発明の樹脂組成物の架橋密度を上げて耐水性や耐溶剤性を高めることができると考えられる。
レゾルシノール、2-メチルレゾルシノール、2-ブチルレゾルシノール、2-オクチルレゾルシノール、2,4-ジメチルレゾルシノール、2,4-ジエチルレゾルシノール、2,4-ジペンチルレゾルシノール、2,4-ジイソプロピルレゾルシノール、2,5-ジメチルレゾルシノール、2-メチル5-tert-ブチルレゾルシノール、2,5-ジオクチルレゾルシノール、4,6-ジメチルレゾルシノール、4,6-ジブチルレゾルシノール、4,6-ジクロロレゾルシノール、4,6-ジブロモレゾルシノール、4-クロロ6-メチルレゾルシノール、2,4,5-トリメチルレゾルシノールなどのレゾルシノール類;
p-ヒドロキノン、2-メチルp-ヒドロキノン、2-エチルp-ヒドロキノン、2-ヘキシルp-ヒドロキノン、2-イソプロピルp-ヒドロキノン、2,5-ジメチルp-ヒドロキノン、2,5-ジエチルp-ヒドロキノン、2,5-ジtert-ブチルp-ヒドロキノン、2,5-ジオクチルp-ヒドロキノン、2,3-ジメチルp-ヒドロキノン、2,6-ジエチルp-ヒドロキノン、2,4-ジペンチルp-ヒドロキノン、2,5-ジクロロp-ヒドロキノン、2,5-ジブロモp-ヒドロキノン、2-メチル5-エチルp-ヒドロキノン、2-メチル5-tert-ブチルp-ヒドロキノンなどのp-ヒドロキノン類;
フロログリシノール、2-メチルフロログリシノール、2,4-ジブチルフロログリシノール、2,4,6-トリブロモフロログリシノール、2,4,6-トリクロロフロログリシノールなどのフロログリシノール類;
1,2,3-トリヒドロキシベンゼン、1,2,3-トリヒドロキシ4-メチルベンゼン、1,2,3-トリヒドロキシ5-ブチルベンゼン、1,2,3-トリヒドロキシ4,6-ジブロモベンゼン、1,2,3-トリヒドロキシ4,5,6-トリメチルベンゼンなどの1,2,3-トリヒドロキシベンゼン類;
1,2,4-トリヒドロキシベンゼン、1,2,4-トリヒドロキシ5-メチルベンゼン、1,2,4-トリヒドロキシ3,5-ジメチルベンゼン、1,2,4-トリヒドロキシ3,5,6-トリブロモベンゼンなどの1,2,4-トリヒドロキシベンゼン類;
1,2-ジヒドロキシナフタレン、1,3-ジヒドロキシナフタレン、2,3-ジヒドロキシナフタレン、1,6-ジヒドロキシナフタレン、2,6-ジヒドロキシナフタレン、1,7-ジヒドロキシナフタレン、2,7-ジヒドロキシナフタレンなどのジヒドロキシナフタレン類;
1,4-ジヒドロキシアントラセン、9,10-ジヒドロキシアントラセンなどのヒドロキシアントラセン類;
などが挙げられる。
本発明の樹脂組成物は、バインダー樹脂(A)及び芳香族化合物(B)に加えて、架橋剤(C)を含有する。架橋剤(C)としては、加熱により架橋剤分子間に架橋構造を形成するものや、バインダー樹脂(A)と反応して樹脂分子間に架橋構造を形成するものであり、具体的には、2以上の反応性基を有する化合物が挙げられる。また、上述の通り、架橋剤(C)は、芳香族化合物(B)と反応して、本発明の樹脂組成物の架橋密度を上げることができると考えられる。
このような反応性基を有する化合物としては、特に限定されないが、例えば、エポキシ基含有架橋剤や、アルコキシメチル基含有架橋剤、メチロール基含有架橋剤、オキセタン基含有架橋剤、イソシアネート基含有架橋剤、ブロックイソシアネート基含有架橋剤、オキサゾリン基含有架橋剤、マレイミド基含有架橋剤、(メタ)アクリレート基含有架橋剤などが挙げられる。これらの中でも、エポキシ基含有架橋剤が好ましい。
分子内に2つ以上のアルコキシメチル基、またはメチロール基を含む化合物は、それぞれ単独で、又は2種以上を組み合わせて用いることができる。
これらのなかでも、反応性が高いという点より、N,N,N’,N’,N’’,N’’-ヘキサメトキシメチルメラミンが好ましい。
また、本発明の樹脂組成物は、バインダー樹脂(A)、芳香族化合物(B)及び架橋剤(C)に加えて、光酸発生剤(D)をさらに含有するものであってもよい。光酸発生剤(D)を含有させることで、紫外線や電子線等の放射線の照射により、光酸発生剤(D)が化学反応を引き起こすことで、樹脂組成物により形成される樹脂膜のアルカリ溶解性を変化させることができ、これにより得られる樹脂膜をパターン化可能なものとすることができる。
これらの光酸発生剤(D)は、それぞれ単独で、又は2種以上を組み合わせて用いることができる。
また、本発明の樹脂組成物には、さらに、溶剤が含有されていてもよい。溶剤としては、特に限定されず、樹脂組成物の溶剤として公知のもの、例えばアセトン、メチルエチルケトン、シクロペンタノン、2-ヘキサノン、3-ヘキサノン、2-ヘプタノン、3-ヘプタノン、4-ヘプタノン、2-オクタノン、3-オクタノン、4-オクタノンなどの直鎖のケトン類;n-プロピルアルコール、イソプロピルアルコール、n-ブチルアルコール、シクロヘキサノールなどのアルコール類;エチレングリコールジメチルエーテル、エチレングリコールジエチルエーテル、ジオキサンなどのエーテル類;エチレングリコールモノメチルエーテル、エチレングリコールモノエチルエーテルなどのアルコールエーテル類;ギ酸プロピル、ギ酸ブチル、酢酸プロピル、酢酸ブチル、プロピオン酸メチル、プロピオン酸エチル、酪酸メチル、酪酸エチル、乳酸メチル、乳酸エチルなどのエステル類;セロソルブアセテート、メチルセロソルブアセテート、エチルセロソルブアセテート、プロピルセロソルブアセテート、ブチルセロソルブアセテートなどのセロソルブエステル類;プロピレングリコール、プロピレングリコールモノメチルエーテル、プロピレングリコールモノメチルエーテルアセテート、プロピレングリコールモノエチルエーテルアセテート、プロピレングリコールモノブチルエーテルなどのプロピレングリコール類;ジエチレングリコールモノメチルエーテル、ジエチレングリコールモノエチルエーテル、ジエチレングリコールジメチルエーテル、ジエチレングリコールジエチルエーテル、ジエチレングリコールメチルエチルエーテルなどのジエチレングリコール類;γ-ブチロラクトン、γ-バレロラクトン、γ-カプロラクトン、γ-カプリロラクトンなどの飽和γ-ラクトン類;トリクロロエチレンなどのハロゲン化炭化水素類;トルエン、キシレンなどの芳香族炭化水素類;ジメチルアセトアミド、ジメチルホルムアミド、N-メチルアセトアミドなどの極性溶媒などが挙げられる。これらの溶剤は、単独でも2種以上を組み合わせて用いてもよい。溶剤の含有量は、バインダー樹脂(A)100重量部に対して、好ましくは10~10000重量部、より好ましくは50~5000重量部、さらに好ましくは100~1000重量部の範囲である。なお、樹脂組成物に溶剤を含有させる場合には、溶剤は、通常、樹脂膜形成後に除去されることとなる。
混合の方法は特に限定されないが、樹脂組成物を構成する各成分を溶剤に溶解又は分散して得られる溶液又は分散液を混合するのが好ましい。これにより、樹脂組成物は、溶液又は分散液の形態で得られる。
本発明の電子部品は、上述した本発明の樹脂組成物からなる樹脂膜を有する。
潜像パターンを有する樹脂膜に現像液を接触させる方法としては、例えば、パドル法、スプレー法、ディッピング法等の方法が用いられる。現像は、通常、0~100℃、好ましくは5~55℃、より好ましくは10~30℃の範囲で、通常、30~180秒間の範囲で適宜選択される。
さらに、必要に応じて、樹脂組成物に含有させた光酸発生剤(D)を失活させるために、電子部品全面に、活性放射線を照射することもできる。活性放射線の照射には、上記潜像パターンの形成に例示した方法を利用できる。照射と同時に、又は照射後に樹脂膜を加熱してもよい。加熱方法としては、例えば、電子部品をホットプレートやオーブン内で加熱する方法が挙げられる。温度は、通常、100~300℃、好ましくは120~200℃の範囲である。
なお、各特性の定義及び評価方法は、以下のとおりである。
スパッタリング装置を用いて、アルミニウム薄膜が100nmの膜厚で形成されたシリコンウエハ上に、樹脂組成物をスピンコートしたのち、ホットプレートを用いて120℃で2分間加熱し、次いで、窒素雰囲気下、200℃で60分間の条件で硬化させることで、膜厚10μmの樹脂膜を形成させ、積層体を得た。そして、得られた積層体を、所定の大きさに切断した後、アルミニウム薄膜を0.1mol/Lの塩酸水溶液にて溶解させて剥離させ、剥離したフィルムを乾燥させることで樹脂膜を得た。そして、得られた樹脂膜について、粘弾性スペクトロメータ(SIIナノテクノロジー社、DMS6100標準型)を用いて、樹脂膜のガラス転移温度(℃)を測定し、以下の基準にて、耐熱性を評価した。ガラス転移温度が高いほど、耐熱性に優れていると判断できる。
A:ガラス転移温度が160℃以上
B:ガラス転移温度が150℃以上、160℃未満
C:ガラス転移温度が150℃未満
スパッタリング装置を用いて、50nm厚のチタン膜上に、銅を100nmの膜厚で形成されたシリコンウエハ上に、樹脂組成物をスピンコートしたのち、ホットプレートを用いて120℃で2分間加熱し、次いで、窒素雰囲気下、200℃で60分間の条件で硬化させることで、膜厚10μmの樹脂膜を形成することで、積層体を得た。そして、得られた積層体を、温度130℃、湿度85RH%の高温高湿槽中に、200時間入れた後、積層体を取り出し、積層体を形成する樹脂膜について、クロスカット試験を行った。具体的には、まず、カッターナイフを用いて、積層体を形成する樹脂膜に1mm×1mmの大きさにて、10×10=100個の碁盤目を形成した。そして、碁盤目部分にセロハンテープを強く圧着して、セロハンテープの端を45°の角度で一気に剥がし、樹脂膜の残存割合(スパッタリング装置を用いて、50nm厚のチタン膜上に、銅を100nmの膜厚で形成されたシリコンウエハ上に残った樹脂膜の割合)を求め、以下の基準にて、耐水性(高温高湿試験後の密着性)を評価した。
A:樹脂膜の残存割合が90%以上
B:樹脂膜の残存割合が80%以上、90%未満
C:樹脂膜の残存割合が80%未満
シリコンウエハ上にパターン状の銅配線を有する熱衝撃用の評価基板の上に、樹脂組成物をスピンコートしたのち、120℃で2分間加熱して、次いで、窒素雰囲気下、200℃で60分間の条件で硬化させることで、膜厚10μmの樹脂膜を形成することで、評価用サンプルを得た。そして、得られた評価用サンプルについて、熱衝撃試験器(タバイエスペックス社製)を用いて、-55℃/30分及び150℃/30分を1サイクルとして、熱衝撃試験を行い、樹脂膜にクラックが発生するまでのサイクル数を確認し、以下の基準にて、耐熱衝撃性を評価した。
A:1000サイクル経過後もクラックの発生なし。
C:1000サイクル到達前にクラックが発生。
シリコンウエハ上に、樹脂組成物をスピンコートしたのち、ホットプレートを用いて120℃で2分間加熱し、次いで、窒素雰囲気下、200℃で60分間の条件で硬化させることで、膜厚10μmの樹脂膜を形成することで、積層体を得た。そして、得られた積層体を、N-メチル-2ピロリドン中に、室温下、10分間浸漬させた後、浸漬後の樹脂膜について、膜厚の変化の測定及びクラックの有無の確認を行い、以下の基準にて、耐溶剤性を評価した。
A:樹脂膜の膜厚の変化量が1%未満、かつ、樹脂膜にクラックが発生していない。
B:樹脂膜の膜厚の変化量が1%以上、かつ、樹脂膜にクラックが発生していない。
C:樹脂膜にクラックが発生。
<環状オレフィン重合体(A-1)の調製>
N-フェニル-ビシクロ[2.2.1]ヘプト-5-エン-2,3-ジカルボキシイミド(NBPI)40モル%、及び4-ヒドロキシカルボニルテトラシクロ[6.2.1.13,6.02,7]ドデカ-9-エン(TCDC)60モル%からなる単量体混合物100部、1,5-ヘキサジエン2.0部、(1,3-ジメシチルイミダゾリン-2-イリデン)(トリシクロヘキシルホスフィン)ベンジリデンルテニウムジクロリド(Org.Lett.,第1巻,953頁,1999年 に記載された方法で合成した)0.02部、及びジエチレングリコールエチルメチルエーテル200部を、窒素置換したガラス製耐圧反応器に仕込み、攪拌しつつ80℃にて4時間反応させて重合反応液を得た。
バインダー樹脂(A)として、合成例1で得られた環状オレフィン重合体(A-1)の重合体溶液291部(環状オレフィン重合体(A-1)として100部)、芳香族化合物(B)として、4-メチルカテコール(上記一般式(2)において、R1=OH、R2=OH、R3=H、R4=CH3、R6=H、R7=Hである化合物)5部、架橋剤(C)として、エポキシ化ブタンテトラカルボン酸テトラキス(3-シクロヘキセニルメチル)修飾ε-カプロラクトン(商品名「エポリードGT401」、ダイセル化学工業社製、脂肪族環状4官能性のエポキシ樹脂)30部、同じく架橋剤(C)として、N,N,N’,N’,N’’,N’’-ヘキサメトキシメチルメラミン(商品名「ニカラックMW-100LM」、三和ケミカル社製)10部、シランカップリング剤として、γ-グリシドキシプロピルトリメトキシシラン(商品名「Z6040」、東レ・ダウコーニング社製)3部、及び、溶剤として、ジエチレングリコールエチルメチルエーテル160部を混合し、溶解させた後、孔径0.45μmのポリテトラフルオロエチレン製フィルターでろ過して樹脂組成物を調製した。
表1に示す化合物を、表1に示す量使用した以外は、実施例1と同様にして、樹脂組成物を調製し、同様に評価を行った。結果を表1に示す。
表1に示す化合物を、表1に示す量使用した以外は、実施例1と同様にして、樹脂組成物を調製し、同様に評価を行った。結果を表1に示す。
・バインダー樹脂(A)「環状オレフィン重合体(A-1)」;製造例1で得られた環状オレフィン重合体(A-1)
・バインダー樹脂(A)「アクリル重合体(マルカリンカーCMM)」;アクリル重合体(商品名「マルカリンカーCMM」、丸善石油化学社製、p-ヒドロキシスチレンとメチルメタクリレートとの共重合体)
・芳香族化合物(B)「4-メチルカテコール」;4-メチルカテコール(上記一般式(2)において、R1=OH、R2=OH、R3=H、R4=CH3、R6=H、R7=Hである化合物)
・芳香族化合物(B)「1,2,3-トリヒドロキシベンゼン」;1,2,3-トリヒドロキシベンゼン(上記一般式(2)において、R1=OH、R2=OH、R3=OH、R4=H、R6=H、R7=Hである化合物)
・芳香族化合物(B)「フロログリシノール」;フロログリシノール(上記一般式(2)において、R1=OH、R2=H、R3=OH、R4=H、R6=OH、R7=Hである化合物)
・芳香族化合物(B)以外の芳香族化合物「2,5-ジメチルフェノール」;2,5-ジメチルフェノール(上記一般式(2)において、R1=OH、R2=CH3、R3=H、R4=H、R6=CH3、R7=Hである化合物)
・芳香族化合物(B)以外の芳香族化合物「フェノールノボラック樹脂(PAPS-PN2)」;フェノールノボラック樹脂(商品名「PAPS-PN2」、旭有機材工業社製、中分子量タイプ)
・架橋剤(C)「エポリード GT401」;エポキシ化ブタンテトラカルボン酸テトラキス(3-シクロヘキセニルメチル)修飾ε-カプロラクトン(商品名「エポリードGT401」、ダイセル化学工業社製、脂肪族環状4官能性のエポキシ樹脂)
・架橋剤(C)「セロキサイド 2081」;ε-カプロラクトン変性3’,4’-エポキシシクロヘキシルメチル-3,4-エポキシシクロヘキサンカルボキシレート(商品名「セロキサイド 2081」、ダイセル化学工業社製)
・架橋剤(C)「EXA-4816」;長鎖ビスフェノールA型エポキシ樹脂(商品名「EXA-4816」、DIC社製)
・架橋剤(C)「ニカラック MW100LM」;N,N,N’,N’,N’’,N’’-ヘキサメトキシメチルメラミン(商品名「ニカラックMW-100LM」、三和ケミカル社製)
・架橋剤(C)「HMOM-TPHAP-GB」;4, 4’,4’ ’‐(エチリデン)トリスフェノールなどのヘキサメトキシメチル置換化合物(商品名「HMOM-TPHAP-GB」、本州化学工業社製)
・光酸発生剤「TS200」;4,4’-[1-[4-[1-[4-ヒドロキシフェニル]-1-メチルエチル]フェニル]エチリデン]ビスフェノール(1モル)と1,2-ナフトキノンジアジド-5-スルホン酸クロライド(2.0モル)との縮合物(商品名「TS200」、東洋合成株式会社製)
・シランカップリング剤「Z6040」;γ-グリシドキシプロピルトリメトキシシラン(商品名「Z6040」、東レ・ダウコーニング社製)
・シランカップリング剤「Z6883」;3-フェニルアミノプロピルトリメトキシシラン(商品名「Z6883」、東レ・ダウコーニング社製)
また、上記一般式(1)で表される芳香族化合物(B)を配合しなかった場合には、得られる樹脂膜は、耐水性に劣るものであった(比較例2)。
さらに、上記一般式(1)で表される芳香族化合物(B)の代わりに、フェノールノボラック樹脂を使用した場合には、得られる樹脂膜は、耐熱衝撃性に劣るものであった(比較例3)。
Claims (9)
- バインダー樹脂(A)、下記一般式(1)で表される芳香族化合物(B)、及び架橋剤(C)を含有する樹脂組成物。
- 光酸発生剤(D)をさらに含有する請求項1に記載の樹脂組成物。
- 前記光酸発生剤(D)が、キノンジアジド化合物である請求項2に記載の樹脂組成物。
- 前記バインダー樹脂(A)が、プロトン性極性基を有する環状オレフィン重合体である請求項1~3のいずれかに記載の樹脂組成物。
- 前記芳香族化合物(B)が、
前記一般式(2)において、R1~R4,R6,R7のうち、2つが水酸基であり、1つが炭素数1~12の脂肪族炭化水素基であり、残りが水素原子である化合物、または、
前記一般式(2)において、R1~R4,R6,R7のうち、3つが水酸基であり、残りが水素原子である化合物
である請求項5に記載の樹脂組成物。 - 前記バインダー樹脂(A)100重量部に対する、前記芳香族化合物(B)の含有量が0.01~30重量部である請求項1~6のいずれかに記載の樹脂組成物。
- 前記架橋剤(C)が、エポキシ基含有架橋剤である請求項1~7のいずれかに記載の樹脂組成物。
- 請求項1~8のいずれかに記載の樹脂組成物からなる樹脂膜を備える電子部品。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2017537798A JPWO2017038620A1 (ja) | 2015-08-31 | 2016-08-25 | 樹脂組成物 |
EP16841652.7A EP3345971A4 (en) | 2015-08-31 | 2016-08-25 | RESIN COMPOSITION |
US15/755,110 US20180273722A1 (en) | 2015-08-31 | 2016-08-25 | Resin composition |
CN201680046815.0A CN107922741A (zh) | 2015-08-31 | 2016-08-25 | 树脂组合物 |
KR1020187005713A KR20180048651A (ko) | 2015-08-31 | 2016-08-25 | 수지 조성물 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015170554 | 2015-08-31 | ||
JP2015-170554 | 2015-08-31 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2017038620A1 true WO2017038620A1 (ja) | 2017-03-09 |
Family
ID=58188862
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2016/074809 WO2017038620A1 (ja) | 2015-08-31 | 2016-08-25 | 樹脂組成物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20180273722A1 (ja) |
EP (1) | EP3345971A4 (ja) |
JP (1) | JPWO2017038620A1 (ja) |
KR (1) | KR20180048651A (ja) |
CN (1) | CN107922741A (ja) |
TW (1) | TW201716318A (ja) |
WO (1) | WO2017038620A1 (ja) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019104900A (ja) * | 2017-12-13 | 2019-06-27 | キヤノン株式会社 | 硬化性樹脂組成物 |
KR20200029339A (ko) * | 2018-09-10 | 2020-03-18 | 쇼와 덴코 가부시키가이샤 | 감광성 수지 조성물, 유기 el 소자 격벽, 및 유기 el 소자 |
KR20200096859A (ko) * | 2019-02-06 | 2020-08-14 | 쇼와 덴코 가부시키가이샤 | 감광성 수지 조성물, 유기 el 소자 격벽, 및 유기 el 소자 |
Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03137179A (ja) * | 1989-10-23 | 1991-06-11 | Toagosei Chem Ind Co Ltd | 接着剤 |
JPH0623582A (ja) * | 1992-07-09 | 1994-02-01 | Asahi Chem Ind Co Ltd | リフローはんだ付け可能な導電性ペースト |
JPH11103173A (ja) * | 1997-09-26 | 1999-04-13 | Hitachi Chem Co Ltd | 特定の還元剤を含む絶縁樹脂を用いた多層配線板の製造方法 |
JP2000244132A (ja) * | 1999-02-19 | 2000-09-08 | Hitachi Chem Co Ltd | 特定の重合安定剤を含む感光性樹脂を用いた多層配線板の製造方法 |
JP2002527551A (ja) * | 1998-10-13 | 2002-08-27 | スリーエム イノベイティブ プロパティズ カンパニー | 高強度エポキシ接着剤およびその使用 |
WO2004067601A1 (ja) * | 2003-01-31 | 2004-08-12 | Zeon Corporation | 重合性組成物、熱可塑性樹脂組成物、架橋樹脂及び架橋樹脂複合材料 |
JP2004244609A (ja) * | 2002-07-29 | 2004-09-02 | Nippon Zeon Co Ltd | 熱可塑性樹脂、架橋樹脂及び架橋樹脂複合材料の製造方法 |
JP2006182985A (ja) * | 2004-12-28 | 2006-07-13 | Nippon Zeon Co Ltd | 重合性組成物、及びそれを用いてなる成形体 |
WO2006078062A1 (ja) * | 2005-01-20 | 2006-07-27 | Sumitomo Bakelite Co., Ltd. | エポキシ樹脂組成物、その潜伏化方法、及び半導体装置 |
JP2006199851A (ja) * | 2005-01-21 | 2006-08-03 | Nippon Kayaku Co Ltd | 加熱硬化型エポキシ樹脂組成物及びその硬化接着層を有する物品 |
JP2007079120A (ja) * | 2005-09-14 | 2007-03-29 | Fujifilm Corp | 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法 |
JP2009295374A (ja) * | 2008-06-04 | 2009-12-17 | Nippon Zeon Co Ltd | 樹脂組成物、隔壁及び有機エレクトロルミネッセンス素子 |
JP2010224533A (ja) * | 2009-02-26 | 2010-10-07 | Nippon Zeon Co Ltd | 感放射線性樹脂組成物、樹脂膜及び電子部品 |
WO2015029930A1 (ja) * | 2013-08-27 | 2015-03-05 | 日本ゼオン株式会社 | 感放射線樹脂組成物、樹脂膜および電子部品 |
JP2016043496A (ja) * | 2014-08-19 | 2016-04-04 | 国立大学法人名古屋大学 | 導電性フィルム |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06235852A (ja) * | 1993-02-09 | 1994-08-23 | Minolta Camera Co Ltd | レンズ保持装置 |
US20030014441A1 (en) * | 2001-06-29 | 2003-01-16 | Akira Suzuki | Document data structure, information recording medium, information processing apparatus, information processing system and information processing method |
JP3850767B2 (ja) * | 2002-07-25 | 2006-11-29 | 富士通株式会社 | レジストパターン厚肉化材料、レジストパターン及びその製造方法、並びに、半導体装置及びその製造方法 |
US20060018972A1 (en) * | 2002-11-26 | 2006-01-26 | Upm Pharmaceuticals, Inc. | Aqueous sustained-release drug delivery system for highly water-soluble electrolytic drugs |
CN1961261B (zh) * | 2004-03-31 | 2010-12-15 | 日本瑞翁株式会社 | 放射线敏感性组合物、叠层体及其制造方法和电子部件 |
TW200604226A (en) * | 2004-03-31 | 2006-02-01 | Zeon Corp | Radiation-sensitive composition, multilayer body and method for producing same, and electronic component |
JP5413097B2 (ja) * | 2009-09-29 | 2014-02-12 | 日本ゼオン株式会社 | 感放射線性樹脂組成物、及び積層体 |
SG187955A1 (en) * | 2010-09-02 | 2013-03-28 | Merck Patent Gmbh | Gate insulator layer for electronic devices |
TWI632163B (zh) * | 2013-02-04 | 2018-08-11 | 日商日本傑恩股份有限公司 | Radiation-sensitive resin composition and electronic component |
TWI591087B (zh) * | 2013-04-26 | 2017-07-11 | 住友電木股份有限公司 | 感光組成物及其應用 |
US9696623B2 (en) * | 2013-04-26 | 2017-07-04 | Promerus, Llc | Photosensitive compositions and applications thereof |
EP2976965A1 (en) * | 2014-07-22 | 2016-01-27 | Braun GmbH | Fastenable device for oral cavity position detection |
-
2016
- 2016-08-25 US US15/755,110 patent/US20180273722A1/en not_active Abandoned
- 2016-08-25 EP EP16841652.7A patent/EP3345971A4/en not_active Withdrawn
- 2016-08-25 JP JP2017537798A patent/JPWO2017038620A1/ja active Pending
- 2016-08-25 CN CN201680046815.0A patent/CN107922741A/zh active Pending
- 2016-08-25 KR KR1020187005713A patent/KR20180048651A/ko unknown
- 2016-08-25 WO PCT/JP2016/074809 patent/WO2017038620A1/ja active Application Filing
- 2016-08-26 TW TW105127396A patent/TW201716318A/zh unknown
Patent Citations (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH03137179A (ja) * | 1989-10-23 | 1991-06-11 | Toagosei Chem Ind Co Ltd | 接着剤 |
JPH0623582A (ja) * | 1992-07-09 | 1994-02-01 | Asahi Chem Ind Co Ltd | リフローはんだ付け可能な導電性ペースト |
JPH11103173A (ja) * | 1997-09-26 | 1999-04-13 | Hitachi Chem Co Ltd | 特定の還元剤を含む絶縁樹脂を用いた多層配線板の製造方法 |
JP2002527551A (ja) * | 1998-10-13 | 2002-08-27 | スリーエム イノベイティブ プロパティズ カンパニー | 高強度エポキシ接着剤およびその使用 |
JP2000244132A (ja) * | 1999-02-19 | 2000-09-08 | Hitachi Chem Co Ltd | 特定の重合安定剤を含む感光性樹脂を用いた多層配線板の製造方法 |
JP2004244609A (ja) * | 2002-07-29 | 2004-09-02 | Nippon Zeon Co Ltd | 熱可塑性樹脂、架橋樹脂及び架橋樹脂複合材料の製造方法 |
WO2004067601A1 (ja) * | 2003-01-31 | 2004-08-12 | Zeon Corporation | 重合性組成物、熱可塑性樹脂組成物、架橋樹脂及び架橋樹脂複合材料 |
JP2006182985A (ja) * | 2004-12-28 | 2006-07-13 | Nippon Zeon Co Ltd | 重合性組成物、及びそれを用いてなる成形体 |
WO2006078062A1 (ja) * | 2005-01-20 | 2006-07-27 | Sumitomo Bakelite Co., Ltd. | エポキシ樹脂組成物、その潜伏化方法、及び半導体装置 |
JP2006199851A (ja) * | 2005-01-21 | 2006-08-03 | Nippon Kayaku Co Ltd | 加熱硬化型エポキシ樹脂組成物及びその硬化接着層を有する物品 |
JP2007079120A (ja) * | 2005-09-14 | 2007-03-29 | Fujifilm Corp | 感光性組成物、パターン形成材料、感光性積層体、並びにパターン形成装置及びパターン形成方法 |
JP2009295374A (ja) * | 2008-06-04 | 2009-12-17 | Nippon Zeon Co Ltd | 樹脂組成物、隔壁及び有機エレクトロルミネッセンス素子 |
JP2010224533A (ja) * | 2009-02-26 | 2010-10-07 | Nippon Zeon Co Ltd | 感放射線性樹脂組成物、樹脂膜及び電子部品 |
WO2015029930A1 (ja) * | 2013-08-27 | 2015-03-05 | 日本ゼオン株式会社 | 感放射線樹脂組成物、樹脂膜および電子部品 |
JP2016043496A (ja) * | 2014-08-19 | 2016-04-04 | 国立大学法人名古屋大学 | 導電性フィルム |
Non-Patent Citations (1)
Title |
---|
See also references of EP3345971A4 * |
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2019104900A (ja) * | 2017-12-13 | 2019-06-27 | キヤノン株式会社 | 硬化性樹脂組成物 |
JP7207973B2 (ja) | 2017-12-13 | 2023-01-18 | キヤノン株式会社 | 硬化性樹脂組成物 |
KR20200029339A (ko) * | 2018-09-10 | 2020-03-18 | 쇼와 덴코 가부시키가이샤 | 감광성 수지 조성물, 유기 el 소자 격벽, 및 유기 el 소자 |
JP2020042150A (ja) * | 2018-09-10 | 2020-03-19 | 昭和電工株式会社 | 感光性樹脂組成物、有機el素子隔壁、及び有機el素子 |
KR20210153012A (ko) * | 2018-09-10 | 2021-12-16 | 쇼와 덴코 가부시키가이샤 | 감광성 수지 조성물, 유기 el 소자 격벽, 및 유기 el 소자 |
KR102353011B1 (ko) * | 2018-09-10 | 2022-01-19 | 쇼와 덴코 가부시키가이샤 | 감광성 수지 조성물, 유기 el 소자 격벽, 및 유기 el 소자 |
KR102479154B1 (ko) * | 2018-09-10 | 2022-12-20 | 쇼와 덴코 가부시키가이샤 | 감광성 수지 조성물, 유기 el 소자 격벽, 및 유기 el 소자 |
US11599023B2 (en) | 2018-09-10 | 2023-03-07 | Showa Denko K.K. | Photosensitive resin composition, organic EL element barrier rib, and organic EL element |
KR20200096859A (ko) * | 2019-02-06 | 2020-08-14 | 쇼와 덴코 가부시키가이샤 | 감광성 수지 조성물, 유기 el 소자 격벽, 및 유기 el 소자 |
KR102373040B1 (ko) * | 2019-02-06 | 2022-03-11 | 쇼와 덴코 가부시키가이샤 | 감광성 수지 조성물, 유기 el 소자 격벽, 및 유기 el 소자 |
Also Published As
Publication number | Publication date |
---|---|
TW201716318A (zh) | 2017-05-16 |
EP3345971A1 (en) | 2018-07-11 |
EP3345971A4 (en) | 2019-04-17 |
KR20180048651A (ko) | 2018-05-10 |
US20180273722A1 (en) | 2018-09-27 |
JPWO2017038620A1 (ja) | 2018-06-14 |
CN107922741A (zh) | 2018-04-17 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6471745B2 (ja) | 感放射線樹脂組成物及び電子部品 | |
JP6524996B2 (ja) | 感放射線樹脂組成物及び電子部品 | |
JP6601394B2 (ja) | 感放射線性樹脂組成物、樹脂膜、および電子部品 | |
JP6791145B2 (ja) | 樹脂組成物 | |
WO2017038620A1 (ja) | 樹脂組成物 | |
JP6844115B2 (ja) | 感放射線樹脂組成物及び電子部品 | |
JP6665627B2 (ja) | 樹脂組成物及び電子部品 | |
JP6825217B2 (ja) | 感放射線樹脂組成物及び電子部品 | |
JP6819674B2 (ja) | 感放射線樹脂組成物及び電子部品 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 16841652 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2017537798 Country of ref document: JP Kind code of ref document: A |
|
WWE | Wipo information: entry into national phase |
Ref document number: 15755110 Country of ref document: US |
|
ENP | Entry into the national phase |
Ref document number: 20187005713 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |