JP2002525255A5 - - Google Patents

Download PDF

Info

Publication number
JP2002525255A5
JP2002525255A5 JP2000570400A JP2000570400A JP2002525255A5 JP 2002525255 A5 JP2002525255 A5 JP 2002525255A5 JP 2000570400 A JP2000570400 A JP 2000570400A JP 2000570400 A JP2000570400 A JP 2000570400A JP 2002525255 A5 JP2002525255 A5 JP 2002525255A5
Authority
JP
Japan
Prior art keywords
germanium
layer
temperature
cvd
predetermined temperature
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000570400A
Other languages
English (en)
Japanese (ja)
Other versions
JP4486753B2 (ja
JP2002525255A (ja
Filing date
Publication date
Priority claimed from FR9811313A external-priority patent/FR2783254B1/fr
Application filed filed Critical
Publication of JP2002525255A publication Critical patent/JP2002525255A/ja
Publication of JP2002525255A5 publication Critical patent/JP2002525255A5/ja
Application granted granted Critical
Publication of JP4486753B2 publication Critical patent/JP4486753B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP2000570400A 1998-09-10 1999-09-10 単結晶シリコン基板上に単結晶ゲルマニウム層を得る方法およびそれにより得られた生成物 Expired - Fee Related JP4486753B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR98/11313 1998-09-10
FR9811313A FR2783254B1 (fr) 1998-09-10 1998-09-10 Procede d'obtention d'une couche de germanium monocristallin sur un substrat de silicium monocristallin,et produits obtenus
PCT/FR1999/002154 WO2000015885A1 (fr) 1998-09-10 1999-09-10 Procede d'obtention d'une couche de germanium monocristallin sur un substrat de silicium monocristallin, et produits obtenus

Publications (3)

Publication Number Publication Date
JP2002525255A JP2002525255A (ja) 2002-08-13
JP2002525255A5 true JP2002525255A5 (enExample) 2010-03-18
JP4486753B2 JP4486753B2 (ja) 2010-06-23

Family

ID=9530304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000570400A Expired - Fee Related JP4486753B2 (ja) 1998-09-10 1999-09-10 単結晶シリコン基板上に単結晶ゲルマニウム層を得る方法およびそれにより得られた生成物

Country Status (6)

Country Link
US (1) US6537370B1 (enExample)
EP (1) EP1115920B1 (enExample)
JP (1) JP4486753B2 (enExample)
DE (1) DE69905179D1 (enExample)
FR (1) FR2783254B1 (enExample)
WO (1) WO2000015885A1 (enExample)

Families Citing this family (100)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE60125952T2 (de) * 2000-08-16 2007-08-02 Massachusetts Institute Of Technology, Cambridge Verfahren für die herstellung eines halbleiterartikels mittels graduellem epitaktischen wachsen
GB0111207D0 (en) 2001-05-08 2001-06-27 Btg Int Ltd A method to produce germanium layers
US20030227057A1 (en) * 2002-06-07 2003-12-11 Lochtefeld Anthony J. Strained-semiconductor-on-insulator device structures
US6995430B2 (en) * 2002-06-07 2006-02-07 Amberwave Systems Corporation Strained-semiconductor-on-insulator device structures
US7335545B2 (en) * 2002-06-07 2008-02-26 Amberwave Systems Corporation Control of strain in device layers by prevention of relaxation
US7074623B2 (en) * 2002-06-07 2006-07-11 Amberwave Systems Corporation Methods of forming strained-semiconductor-on-insulator finFET device structures
US6953736B2 (en) * 2002-07-09 2005-10-11 S.O.I.Tec Silicon On Insulator Technologies S.A. Process for transferring a layer of strained semiconductor material
US7510949B2 (en) 2002-07-09 2009-03-31 S.O.I.Tec Silicon On Insulator Technologies Methods for producing a multilayer semiconductor structure
FR2848334A1 (fr) * 2002-12-06 2004-06-11 Soitec Silicon On Insulator Procede de fabrication d'une structure multicouche
JP5047609B2 (ja) * 2003-01-07 2012-10-10 ソワテク 除去構造を含んでなるウェハーの、その薄層を除去した後の、機械的手段による循環使用
CN100483666C (zh) * 2003-01-07 2009-04-29 S.O.I.Tec绝缘体上硅技术公司 施主晶片以及重复利用晶片的方法和剥离有用层的方法
US20090325362A1 (en) * 2003-01-07 2009-12-31 Nabil Chhaimi Method of recycling an epitaxied donor wafer
WO2004081986A2 (en) 2003-03-12 2004-09-23 Asm America Inc. Method to planarize and reduce defect density of silicon germanium
US7238595B2 (en) 2003-03-13 2007-07-03 Asm America, Inc. Epitaxial semiconductor deposition methods and structures
EP1604395A2 (en) * 2003-03-13 2005-12-14 ASM America, Inc. Epitaxial semiconductor deposition methods and structures
US7682947B2 (en) * 2003-03-13 2010-03-23 Asm America, Inc. Epitaxial semiconductor deposition methods and structures
JP4954448B2 (ja) * 2003-04-05 2012-06-13 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. 有機金属化合物
JP4714422B2 (ja) * 2003-04-05 2011-06-29 ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. ゲルマニウムを含有するフィルムを堆積させる方法、及び蒸気送達装置
WO2005010946A2 (en) 2003-07-23 2005-02-03 Asm America, Inc. DEPOSITION OF SiGe ON SILICON-ON-INSULATOR STRUCTURES AND BULK SUBSTRATES
EP1649495A2 (en) 2003-07-30 2006-04-26 ASM America, Inc. Epitaxial growth of relaxed silicon germanium layers
FR2858460B1 (fr) * 2003-07-30 2005-10-14 Soitec Silicon On Insulator Structure semiconducteur-sur-isolant contrainte ayant une tenue des contraintes aux hautes temperatures
US7202166B2 (en) 2003-08-04 2007-04-10 Asm America, Inc. Surface preparation prior to deposition on germanium
US7285308B2 (en) 2004-02-23 2007-10-23 Advanced Technology Materials, Inc. Chemical vapor deposition of high conductivity, adherent thin films of ruthenium
WO2005084231A2 (en) * 2004-02-27 2005-09-15 Asm Aemrica, Inc. Germanium deposition
ES2363089T3 (es) * 2004-04-30 2011-07-20 Dichroic Cell S.R.L. Método para producir sustratos de ge virtuales para la integración iii/v sobre si (001).
JP4950047B2 (ja) * 2004-07-22 2012-06-13 ボード オブ トラスティーズ オブ ザ レランド スタンフォード ジュニア ユニバーシティ ゲルマニウムの成長方法及び半導体基板の製造方法
US7320931B2 (en) * 2004-07-30 2008-01-22 Freescale Semiconductor Inc. Interfacial layer for use with high k dielectric materials
US7247545B2 (en) * 2004-11-10 2007-07-24 Sharp Laboratories Of America, Inc. Fabrication of a low defect germanium film by direct wafer bonding
US7704896B2 (en) 2005-01-21 2010-04-27 Asm International, N.V. Atomic layer deposition of thin films on germanium
US7037856B1 (en) 2005-06-10 2006-05-02 Sharp Laboratories Of America, Inc. Method of fabricating a low-defect strained epitaxial germanium film on silicon
US7678420B2 (en) 2005-06-22 2010-03-16 Sandisk 3D Llc Method of depositing germanium films
US7305157B2 (en) * 2005-11-08 2007-12-04 Massachusetts Institute Of Technology Vertically-integrated waveguide photodetector apparatus and related coupling methods
US20070104441A1 (en) * 2005-11-08 2007-05-10 Massachusetts Institute Of Technology Laterally-integrated waveguide photodetector apparatus and related coupling methods
US7266263B2 (en) * 2005-11-08 2007-09-04 Massachusetts Institute Of Technology Integrated waveguide photodetector apparatus with matching propagation constants and related coupling methods
JP2007173354A (ja) * 2005-12-20 2007-07-05 Shin Etsu Chem Co Ltd Soi基板およびsoi基板の製造方法
FR2896337A1 (fr) * 2006-01-17 2007-07-20 St Microelectronics Crolles 2 Procede de realisation d'une couche monocristalline sur une couche dielectrique
FR2896338B1 (fr) * 2006-01-17 2008-04-18 St Microelectronics Crolles 2 Procede de realisation d'une couche monocristalline sur une couche dielectrique
US7901968B2 (en) 2006-03-23 2011-03-08 Asm America, Inc. Heteroepitaxial deposition over an oxidized surface
US7785995B2 (en) * 2006-05-09 2010-08-31 Asm America, Inc. Semiconductor buffer structures
US20070262296A1 (en) * 2006-05-11 2007-11-15 Matthias Bauer Photodetectors employing germanium layers
US7648853B2 (en) 2006-07-11 2010-01-19 Asm America, Inc. Dual channel heterostructure
US20080076236A1 (en) * 2006-09-21 2008-03-27 Jih-Shun Chiang Method for forming silicon-germanium epitaxial layer
US7651880B2 (en) * 2006-11-04 2010-01-26 Sharp Laboratories Of America, Inc. Ge short wavelength infrared imager
US8157914B1 (en) 2007-02-07 2012-04-17 Chien-Min Sung Substrate surface modifications for compositional gradation of crystalline materials and associated products
US7799600B2 (en) * 2007-05-31 2010-09-21 Chien-Min Sung Doped diamond LED devices and associated methods
US8237126B2 (en) 2007-08-17 2012-08-07 Csem Centre Suisse D'electronique Et De Mictrotechnique Sa X-ray imaging device and method for the manufacturing thereof
US20110017127A1 (en) * 2007-08-17 2011-01-27 Epispeed Sa Apparatus and method for producing epitaxial layers
US7851378B2 (en) * 2007-09-11 2010-12-14 National Applied Research Laboratories Method for growing Ge expitaxial layer on patterned structure with cyclic annealing
FR2929758B1 (fr) 2008-04-07 2011-02-11 Commissariat Energie Atomique Procede de transfert a l'aide d'un substrat ferroelectrique
JP5583943B2 (ja) * 2008-10-02 2014-09-03 住友化学株式会社 半導体基板、電子デバイス、および半導体基板の製造方法
TWI471910B (zh) 2008-10-02 2015-02-01 Sumitomo Chemical Co 半導體晶圓、電子裝置及半導體晶圓之製造方法
TW201025426A (en) * 2008-10-02 2010-07-01 Sumitomo Chemical Co Semiconductor wafer, electronic device and method for making a semiconductor wafer
US8188512B2 (en) 2008-12-03 2012-05-29 Electronics And Telecommunications Research Institute Growth of germanium epitaxial thin film with negative photoconductance characteristics and photodiode using the same
KR20100064742A (ko) * 2008-12-05 2010-06-15 한국전자통신연구원 낮은 침투전위 밀도를 갖는 순수 게르마늄 박막 성장법
US8663735B2 (en) * 2009-02-13 2014-03-04 Advanced Technology Materials, Inc. In situ generation of RuO4 for ALD of Ru and Ru related materials
TWI562195B (en) 2010-04-27 2016-12-11 Pilegrowth Tech S R L Dislocation and stress management by mask-less processes using substrate patterning and methods for device fabrication
US8466502B2 (en) 2011-03-24 2013-06-18 United Microelectronics Corp. Metal-gate CMOS device
US8445363B2 (en) 2011-04-21 2013-05-21 United Microelectronics Corp. Method of fabricating an epitaxial layer
US8324059B2 (en) 2011-04-25 2012-12-04 United Microelectronics Corp. Method of fabricating a semiconductor structure
US8426284B2 (en) 2011-05-11 2013-04-23 United Microelectronics Corp. Manufacturing method for semiconductor structure
US8481391B2 (en) 2011-05-18 2013-07-09 United Microelectronics Corp. Process for manufacturing stress-providing structure and semiconductor device with such stress-providing structure
US8431460B2 (en) 2011-05-27 2013-04-30 United Microelectronics Corp. Method for fabricating semiconductor device
US8716750B2 (en) 2011-07-25 2014-05-06 United Microelectronics Corp. Semiconductor device having epitaxial structures
US8575043B2 (en) 2011-07-26 2013-11-05 United Microelectronics Corp. Semiconductor device and manufacturing method thereof
US8647941B2 (en) 2011-08-17 2014-02-11 United Microelectronics Corp. Method of forming semiconductor device
US8674433B2 (en) 2011-08-24 2014-03-18 United Microelectronics Corp. Semiconductor process
US8455292B2 (en) 2011-09-09 2013-06-04 International Business Machines Corporation Deposition of germanium film
US8476169B2 (en) 2011-10-17 2013-07-02 United Microelectronics Corp. Method of making strained silicon channel semiconductor structure
US8691659B2 (en) 2011-10-26 2014-04-08 United Microelectronics Corp. Method for forming void-free dielectric layer
US8754448B2 (en) 2011-11-01 2014-06-17 United Microelectronics Corp. Semiconductor device having epitaxial layer
US8647953B2 (en) 2011-11-17 2014-02-11 United Microelectronics Corp. Method for fabricating first and second epitaxial cap layers
US8709930B2 (en) 2011-11-25 2014-04-29 United Microelectronics Corp. Semiconductor process
US9093269B2 (en) 2011-12-20 2015-07-28 Asm America, Inc. In-situ pre-clean prior to epitaxy
US9653639B2 (en) * 2012-02-07 2017-05-16 Apic Corporation Laser using locally strained germanium on silicon for opto-electronic applications
US9214577B2 (en) 2012-02-28 2015-12-15 International Business Machines Corporation Reduced light degradation due to low power deposition of buffer layer
US20130224899A1 (en) * 2012-02-28 2013-08-29 International Business Machines Corporation Enhancing efficiency in solar cells by adjusting deposition power
US9127345B2 (en) 2012-03-06 2015-09-08 Asm America, Inc. Methods for depositing an epitaxial silicon germanium layer having a germanium to silicon ratio greater than 1:1 using silylgermane and a diluent
US9136348B2 (en) 2012-03-12 2015-09-15 United Microelectronics Corp. Semiconductor structure and fabrication method thereof
US9202914B2 (en) 2012-03-14 2015-12-01 United Microelectronics Corporation Semiconductor device and method for fabricating the same
US8664069B2 (en) 2012-04-05 2014-03-04 United Microelectronics Corp. Semiconductor structure and process thereof
US8866230B2 (en) 2012-04-26 2014-10-21 United Microelectronics Corp. Semiconductor devices
US8835243B2 (en) 2012-05-04 2014-09-16 United Microelectronics Corp. Semiconductor process
US8951876B2 (en) 2012-06-20 2015-02-10 United Microelectronics Corp. Semiconductor device and manufacturing method thereof
US8796695B2 (en) 2012-06-22 2014-08-05 United Microelectronics Corp. Multi-gate field-effect transistor and process thereof
US9171715B2 (en) 2012-09-05 2015-10-27 Asm Ip Holding B.V. Atomic layer deposition of GeO2
US8710632B2 (en) 2012-09-07 2014-04-29 United Microelectronics Corp. Compound semiconductor epitaxial structure and method for fabricating the same
US9330899B2 (en) 2012-11-01 2016-05-03 Asm Ip Holding B.V. Method of depositing thin film
US9117925B2 (en) 2013-01-31 2015-08-25 United Microelectronics Corp. Epitaxial process
US8753902B1 (en) 2013-03-13 2014-06-17 United Microelectronics Corp. Method of controlling etching process for forming epitaxial structure
US9034705B2 (en) 2013-03-26 2015-05-19 United Microelectronics Corp. Method of forming semiconductor device
US9064893B2 (en) 2013-05-13 2015-06-23 United Microelectronics Corp. Gradient dopant of strained substrate manufacturing method of semiconductor device
US8853060B1 (en) 2013-05-27 2014-10-07 United Microelectronics Corp. Epitaxial process
US9076652B2 (en) 2013-05-27 2015-07-07 United Microelectronics Corp. Semiconductor process for modifying shape of recess
US8765546B1 (en) 2013-06-24 2014-07-01 United Microelectronics Corp. Method for fabricating fin-shaped field-effect transistor
US8895396B1 (en) 2013-07-11 2014-11-25 United Microelectronics Corp. Epitaxial Process of forming stress inducing epitaxial layers in source and drain regions of PMOS and NMOS structures
US8981487B2 (en) 2013-07-31 2015-03-17 United Microelectronics Corp. Fin-shaped field-effect transistor (FinFET)
US9218963B2 (en) 2013-12-19 2015-12-22 Asm Ip Holding B.V. Cyclical deposition of germanium
FR3028094B1 (fr) * 2014-11-05 2018-02-02 Commissariat A L'energie Atomique Et Aux Energies Alternatives Procede de determination de parametres de depot preferentiels pour une couche mince en materiau iii-v
CN116504828A (zh) 2022-01-19 2023-07-28 联华电子股份有限公司 半导体元件
WO2024005276A1 (ko) * 2022-07-01 2024-01-04 주식회사 비아트론 에피택시 공정을 이용한 반도체 소자 제조 방법 및 이를 위한 제조 장치

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5259918A (en) 1991-06-12 1993-11-09 International Business Machines Corporation Heteroepitaxial growth of germanium on silicon by UHV/CVD
FR2678647A1 (fr) 1991-07-05 1993-01-08 Centre Nat Rech Scient Procede de fabrication d'un cristal a gradient de maille.
DE19650058A1 (de) * 1996-12-03 1998-06-04 Deere & Co Häckseltrommel
US6180480B1 (en) * 1998-09-28 2001-01-30 International Business Machines Corporation Germanium or silicon-germanium deep trench fill by melt-flow process

Similar Documents

Publication Publication Date Title
JP2002525255A5 (enExample)
JP4486753B2 (ja) 単結晶シリコン基板上に単結晶ゲルマニウム層を得る方法およびそれにより得られた生成物
JP5013859B2 (ja) 半導体装置、および薄層歪緩和バッファ成長方法
JP4117156B2 (ja) Iii族窒化物半導体基板の製造方法
US7550370B2 (en) Method of forming thin SGOI wafers with high relaxation and low stacking fault defect density
US5037774A (en) Process for the production of semiconductor devices utilizing multi-step deposition and recrystallization of amorphous silicon
KR100832152B1 (ko) 반도체 헤테로구조, 반도체 헤테로구조의 형성방법 및 반도체 헤테로구조를 포함하는 절연층 위의 스트레인층 웨이퍼
US9147734B2 (en) High quality GaN high-voltage HFETs on silicon
US7968438B2 (en) Ultra-thin high-quality germanium on silicon by low-temperature epitaxy and insulator-capped annealing
JP5175471B2 (ja) マルチ−フリースタンディング窒化ガリウム基板の製造方法
JP2010141272A5 (enExample)
JP2023089079A (ja) Soiウェーハ
JP2009505938A (ja) 半導体基板並びにハイドライド気相成長法により自立半導体基板を製造するための方法及びそれに使用されるマスク層
EP2045836B1 (en) Method for producing semiconductor substrate
JP4213896B2 (ja) 半導体基板の製造方法
KR100742680B1 (ko) 실리콘-게르마늄층을 가진 반도체 웨이퍼 및 그 제조 방법
JP2006080497A (ja) 化合物半導体デバイス、及び化合物半導体デバイスの製造方法
JP2005203666A (ja) 化合物半導体デバイスの製造方法
JP2006319310A (ja) 積層層構造およびその形成方法
US9972688B2 (en) Post growth defect reduction for heteroepitaxial materials
US7696533B2 (en) Indium nitride layer production
CN114373672A (zh) 一种外延结构、制作方法及半导体器件
JP3758528B2 (ja) Iii族窒化物系化合物半導体の製造装置及びそれを用いたiii族窒化物系化合物半導体の製造方法
JP2008218655A (ja) 窒素化物半導体形成用基板、該基板を用いてなる窒化物半導体及びその製造法
US20160225641A1 (en) Defect reduction in iii-v semiconductor epitaxy through capped high temperature annealing