JP4486753B2 - 単結晶シリコン基板上に単結晶ゲルマニウム層を得る方法およびそれにより得られた生成物 - Google Patents
単結晶シリコン基板上に単結晶ゲルマニウム層を得る方法およびそれにより得られた生成物 Download PDFInfo
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- JP4486753B2 JP4486753B2 JP2000570400A JP2000570400A JP4486753B2 JP 4486753 B2 JP4486753 B2 JP 4486753B2 JP 2000570400 A JP2000570400 A JP 2000570400A JP 2000570400 A JP2000570400 A JP 2000570400A JP 4486753 B2 JP4486753 B2 JP 4486753B2
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- germanium
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- temperature
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- 229910052732 germanium Inorganic materials 0.000 title claims description 88
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 title claims description 88
- 238000000034 method Methods 0.000 title claims description 77
- 239000000758 substrate Substances 0.000 title claims description 29
- 229910021421 monocrystalline silicon Inorganic materials 0.000 title claims description 13
- 238000005229 chemical vapour deposition Methods 0.000 claims description 38
- 239000007789 gas Substances 0.000 claims description 22
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 18
- 229910052710 silicon Inorganic materials 0.000 claims description 18
- 239000010703 silicon Substances 0.000 claims description 18
- 229910045601 alloy Inorganic materials 0.000 claims description 17
- 239000000956 alloy Substances 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 16
- 238000000137 annealing Methods 0.000 claims description 15
- 239000002243 precursor Substances 0.000 claims description 14
- 238000005498 polishing Methods 0.000 claims description 12
- 239000001257 hydrogen Substances 0.000 claims description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims description 7
- 239000000126 substance Substances 0.000 claims description 7
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 6
- 230000000087 stabilizing effect Effects 0.000 claims description 5
- 229910001218 Gallium arsenide Inorganic materials 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 3
- 230000000737 periodic effect Effects 0.000 claims description 3
- 230000007704 transition Effects 0.000 claims description 2
- 229910021478 group 5 element Inorganic materials 0.000 claims 1
- 239000010410 layer Substances 0.000 description 78
- 238000000151 deposition Methods 0.000 description 39
- 230000008021 deposition Effects 0.000 description 34
- 235000012431 wafers Nutrition 0.000 description 22
- 230000007547 defect Effects 0.000 description 10
- 239000012159 carrier gas Substances 0.000 description 9
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 7
- 230000006641 stabilisation Effects 0.000 description 7
- 238000011105 stabilization Methods 0.000 description 7
- 238000001534 heteroepitaxy Methods 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- 238000001035 drying Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003746 surface roughness Effects 0.000 description 3
- 238000011282 treatment Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000001627 detrimental effect Effects 0.000 description 2
- 238000000635 electron micrograph Methods 0.000 description 2
- 238000000407 epitaxy Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000000644 propagated effect Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 239000012686 silicon precursor Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- MYMOFIZGZYHOMD-UHFFFAOYSA-N Dioxygen Chemical compound O=O MYMOFIZGZYHOMD-UHFFFAOYSA-N 0.000 description 1
- 229910003902 SiCl 4 Inorganic materials 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 229910000905 alloy phase Inorganic materials 0.000 description 1
- 150000007514 bases Chemical class 0.000 description 1
- 230000001680 brushing effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- SLLGVCUQYRMELA-UHFFFAOYSA-N chlorosilicon Chemical compound Cl[Si] SLLGVCUQYRMELA-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 229910001882 dioxygen Inorganic materials 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000011065 in-situ storage Methods 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000012713 reactive precursor Substances 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000002040 relaxant effect Effects 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007788 roughening Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B25/00—Single-crystal growth by chemical reaction of reactive gases, e.g. chemical vapour-deposition growth
- C30B25/02—Epitaxial-layer growth
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/08—Germanium
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/10—Inorganic compounds or compositions
- C30B29/52—Alloys
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Chemical Vapour Deposition (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
- Recrystallisation Techniques (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR98/11313 | 1998-09-10 | ||
| FR9811313A FR2783254B1 (fr) | 1998-09-10 | 1998-09-10 | Procede d'obtention d'une couche de germanium monocristallin sur un substrat de silicium monocristallin,et produits obtenus |
| PCT/FR1999/002154 WO2000015885A1 (fr) | 1998-09-10 | 1999-09-10 | Procede d'obtention d'une couche de germanium monocristallin sur un substrat de silicium monocristallin, et produits obtenus |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002525255A JP2002525255A (ja) | 2002-08-13 |
| JP2002525255A5 JP2002525255A5 (enExample) | 2010-03-18 |
| JP4486753B2 true JP4486753B2 (ja) | 2010-06-23 |
Family
ID=9530304
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000570400A Expired - Fee Related JP4486753B2 (ja) | 1998-09-10 | 1999-09-10 | 単結晶シリコン基板上に単結晶ゲルマニウム層を得る方法およびそれにより得られた生成物 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6537370B1 (enExample) |
| EP (1) | EP1115920B1 (enExample) |
| JP (1) | JP4486753B2 (enExample) |
| DE (1) | DE69905179D1 (enExample) |
| FR (1) | FR2783254B1 (enExample) |
| WO (1) | WO2000015885A1 (enExample) |
Families Citing this family (100)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE60125952T2 (de) * | 2000-08-16 | 2007-08-02 | Massachusetts Institute Of Technology, Cambridge | Verfahren für die herstellung eines halbleiterartikels mittels graduellem epitaktischen wachsen |
| GB0111207D0 (en) | 2001-05-08 | 2001-06-27 | Btg Int Ltd | A method to produce germanium layers |
| US20030227057A1 (en) * | 2002-06-07 | 2003-12-11 | Lochtefeld Anthony J. | Strained-semiconductor-on-insulator device structures |
| US6995430B2 (en) * | 2002-06-07 | 2006-02-07 | Amberwave Systems Corporation | Strained-semiconductor-on-insulator device structures |
| US7335545B2 (en) * | 2002-06-07 | 2008-02-26 | Amberwave Systems Corporation | Control of strain in device layers by prevention of relaxation |
| US7074623B2 (en) * | 2002-06-07 | 2006-07-11 | Amberwave Systems Corporation | Methods of forming strained-semiconductor-on-insulator finFET device structures |
| US6953736B2 (en) * | 2002-07-09 | 2005-10-11 | S.O.I.Tec Silicon On Insulator Technologies S.A. | Process for transferring a layer of strained semiconductor material |
| US7510949B2 (en) | 2002-07-09 | 2009-03-31 | S.O.I.Tec Silicon On Insulator Technologies | Methods for producing a multilayer semiconductor structure |
| FR2848334A1 (fr) * | 2002-12-06 | 2004-06-11 | Soitec Silicon On Insulator | Procede de fabrication d'une structure multicouche |
| JP5047609B2 (ja) * | 2003-01-07 | 2012-10-10 | ソワテク | 除去構造を含んでなるウェハーの、その薄層を除去した後の、機械的手段による循環使用 |
| CN100483666C (zh) * | 2003-01-07 | 2009-04-29 | S.O.I.Tec绝缘体上硅技术公司 | 施主晶片以及重复利用晶片的方法和剥离有用层的方法 |
| US20090325362A1 (en) * | 2003-01-07 | 2009-12-31 | Nabil Chhaimi | Method of recycling an epitaxied donor wafer |
| WO2004081986A2 (en) | 2003-03-12 | 2004-09-23 | Asm America Inc. | Method to planarize and reduce defect density of silicon germanium |
| US7238595B2 (en) | 2003-03-13 | 2007-07-03 | Asm America, Inc. | Epitaxial semiconductor deposition methods and structures |
| EP1604395A2 (en) * | 2003-03-13 | 2005-12-14 | ASM America, Inc. | Epitaxial semiconductor deposition methods and structures |
| US7682947B2 (en) * | 2003-03-13 | 2010-03-23 | Asm America, Inc. | Epitaxial semiconductor deposition methods and structures |
| JP4954448B2 (ja) * | 2003-04-05 | 2012-06-13 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | 有機金属化合物 |
| JP4714422B2 (ja) * | 2003-04-05 | 2011-06-29 | ローム・アンド・ハース・エレクトロニック・マテリアルズ,エル.エル.シー. | ゲルマニウムを含有するフィルムを堆積させる方法、及び蒸気送達装置 |
| WO2005010946A2 (en) | 2003-07-23 | 2005-02-03 | Asm America, Inc. | DEPOSITION OF SiGe ON SILICON-ON-INSULATOR STRUCTURES AND BULK SUBSTRATES |
| EP1649495A2 (en) | 2003-07-30 | 2006-04-26 | ASM America, Inc. | Epitaxial growth of relaxed silicon germanium layers |
| FR2858460B1 (fr) * | 2003-07-30 | 2005-10-14 | Soitec Silicon On Insulator | Structure semiconducteur-sur-isolant contrainte ayant une tenue des contraintes aux hautes temperatures |
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| ES2363089T3 (es) * | 2004-04-30 | 2011-07-20 | Dichroic Cell S.R.L. | Método para producir sustratos de ge virtuales para la integración iii/v sobre si (001). |
| JP4950047B2 (ja) * | 2004-07-22 | 2012-06-13 | ボード オブ トラスティーズ オブ ザ レランド スタンフォード ジュニア ユニバーシティ | ゲルマニウムの成長方法及び半導体基板の製造方法 |
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| US7305157B2 (en) * | 2005-11-08 | 2007-12-04 | Massachusetts Institute Of Technology | Vertically-integrated waveguide photodetector apparatus and related coupling methods |
| US20070104441A1 (en) * | 2005-11-08 | 2007-05-10 | Massachusetts Institute Of Technology | Laterally-integrated waveguide photodetector apparatus and related coupling methods |
| US7266263B2 (en) * | 2005-11-08 | 2007-09-04 | Massachusetts Institute Of Technology | Integrated waveguide photodetector apparatus with matching propagation constants and related coupling methods |
| JP2007173354A (ja) * | 2005-12-20 | 2007-07-05 | Shin Etsu Chem Co Ltd | Soi基板およびsoi基板の製造方法 |
| FR2896337A1 (fr) * | 2006-01-17 | 2007-07-20 | St Microelectronics Crolles 2 | Procede de realisation d'une couche monocristalline sur une couche dielectrique |
| FR2896338B1 (fr) * | 2006-01-17 | 2008-04-18 | St Microelectronics Crolles 2 | Procede de realisation d'une couche monocristalline sur une couche dielectrique |
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| US7799600B2 (en) * | 2007-05-31 | 2010-09-21 | Chien-Min Sung | Doped diamond LED devices and associated methods |
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| US20110017127A1 (en) * | 2007-08-17 | 2011-01-27 | Epispeed Sa | Apparatus and method for producing epitaxial layers |
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| JP5583943B2 (ja) * | 2008-10-02 | 2014-09-03 | 住友化学株式会社 | 半導体基板、電子デバイス、および半導体基板の製造方法 |
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| US9064893B2 (en) | 2013-05-13 | 2015-06-23 | United Microelectronics Corp. | Gradient dopant of strained substrate manufacturing method of semiconductor device |
| US8853060B1 (en) | 2013-05-27 | 2014-10-07 | United Microelectronics Corp. | Epitaxial process |
| US9076652B2 (en) | 2013-05-27 | 2015-07-07 | United Microelectronics Corp. | Semiconductor process for modifying shape of recess |
| US8765546B1 (en) | 2013-06-24 | 2014-07-01 | United Microelectronics Corp. | Method for fabricating fin-shaped field-effect transistor |
| US8895396B1 (en) | 2013-07-11 | 2014-11-25 | United Microelectronics Corp. | Epitaxial Process of forming stress inducing epitaxial layers in source and drain regions of PMOS and NMOS structures |
| US8981487B2 (en) | 2013-07-31 | 2015-03-17 | United Microelectronics Corp. | Fin-shaped field-effect transistor (FinFET) |
| US9218963B2 (en) | 2013-12-19 | 2015-12-22 | Asm Ip Holding B.V. | Cyclical deposition of germanium |
| FR3028094B1 (fr) * | 2014-11-05 | 2018-02-02 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de determination de parametres de depot preferentiels pour une couche mince en materiau iii-v |
| CN116504828A (zh) | 2022-01-19 | 2023-07-28 | 联华电子股份有限公司 | 半导体元件 |
| WO2024005276A1 (ko) * | 2022-07-01 | 2024-01-04 | 주식회사 비아트론 | 에피택시 공정을 이용한 반도체 소자 제조 방법 및 이를 위한 제조 장치 |
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| US5259918A (en) | 1991-06-12 | 1993-11-09 | International Business Machines Corporation | Heteroepitaxial growth of germanium on silicon by UHV/CVD |
| FR2678647A1 (fr) | 1991-07-05 | 1993-01-08 | Centre Nat Rech Scient | Procede de fabrication d'un cristal a gradient de maille. |
| DE19650058A1 (de) * | 1996-12-03 | 1998-06-04 | Deere & Co | Häckseltrommel |
| US6180480B1 (en) * | 1998-09-28 | 2001-01-30 | International Business Machines Corporation | Germanium or silicon-germanium deep trench fill by melt-flow process |
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- 1999-09-10 EP EP99941731A patent/EP1115920B1/fr not_active Expired - Lifetime
- 1999-09-10 WO PCT/FR1999/002154 patent/WO2000015885A1/fr not_active Ceased
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2000015885A1 (fr) | 2000-03-23 |
| FR2783254A1 (fr) | 2000-03-17 |
| DE69905179D1 (de) | 2003-03-06 |
| US6537370B1 (en) | 2003-03-25 |
| FR2783254B1 (fr) | 2000-11-10 |
| JP2002525255A (ja) | 2002-08-13 |
| EP1115920B1 (fr) | 2003-01-29 |
| EP1115920A1 (fr) | 2001-07-18 |
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