JP2002518567A - 樹脂系 - Google Patents

樹脂系

Info

Publication number
JP2002518567A
JP2002518567A JP2000555963A JP2000555963A JP2002518567A JP 2002518567 A JP2002518567 A JP 2002518567A JP 2000555963 A JP2000555963 A JP 2000555963A JP 2000555963 A JP2000555963 A JP 2000555963A JP 2002518567 A JP2002518567 A JP 2002518567A
Authority
JP
Japan
Prior art keywords
anhydride
resin system
group
formula
component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2000555963A
Other languages
English (en)
Japanese (ja)
Other versions
JP2002518567A5 (https=
Inventor
フォーヴィンケル・フリードリヒ
フェルスター・シュテファン
ロックス・イェンス
Original Assignee
アーベーベー・コーポレイト・リサーチ・リミテッド
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by アーベーベー・コーポレイト・リサーチ・リミテッド filed Critical アーベーベー・コーポレイト・リサーチ・リミテッド
Publication of JP2002518567A publication Critical patent/JP2002518567A/ja
Publication of JP2002518567A5 publication Critical patent/JP2002518567A5/ja
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32Epoxy compounds containing three or more epoxy groups
    • C08G59/3227Compounds containing acyclic nitrogen atoms
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49227Insulator making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00Stock material or miscellaneous articles
    • Y10T428/31504Composite [nonstructural laminate]
    • Y10T428/31511Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Indole Compounds (AREA)
  • Valve Housings (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Paints Or Removers (AREA)
JP2000555963A 1998-06-25 1999-06-25 樹脂系 Pending JP2002518567A (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19828248.6 1998-06-25
DE19828248A DE19828248A1 (de) 1998-06-25 1998-06-25 Bei niedriger Temperatur härtende Epoxidharzsysteme aus Aminoglycidylverbindungen und cyclischen Carbonsäureanhydriden
PCT/CH1999/000275 WO1999067315A1 (de) 1998-06-25 1999-06-25 Harzsystem

Publications (2)

Publication Number Publication Date
JP2002518567A true JP2002518567A (ja) 2002-06-25
JP2002518567A5 JP2002518567A5 (https=) 2006-08-10

Family

ID=7871932

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000555963A Pending JP2002518567A (ja) 1998-06-25 1999-06-25 樹脂系

Country Status (11)

Country Link
US (1) US6468659B1 (https=)
EP (1) EP1091992B1 (https=)
JP (1) JP2002518567A (https=)
KR (1) KR20010071583A (https=)
CN (1) CN1142960C (https=)
AT (1) ATE255611T1 (https=)
AU (1) AU764356B2 (https=)
CA (1) CA2334824C (https=)
DE (2) DE19828248A1 (https=)
WO (1) WO1999067315A1 (https=)
ZA (1) ZA200007392B (https=)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006348102A (ja) * 2005-06-14 2006-12-28 Hitachi Chem Co Ltd 電気絶縁用樹脂組成物及びそれを用いた電気機器
JP2011052224A (ja) * 2010-10-25 2011-03-17 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びその硬化物
JP2014019868A (ja) * 2012-07-12 2014-02-03 Samsung Electro-Mechanics Co Ltd ビルドアップ絶縁フィルム用エポキシ樹脂組成物、これから製造された絶縁フィルム、及びこれを備えた多層プリント基板

Families Citing this family (29)

* Cited by examiner, † Cited by third party
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EP1213314A1 (de) * 2000-12-07 2002-06-12 Abb Research Ltd. Härterkomponente zum Härten von Epoxyharzen
US6617698B2 (en) * 2001-03-09 2003-09-09 International Business Machines Corporation Reworkable and thermally conductive adhesive and use thereof
EP1331234B1 (de) 2002-01-28 2004-09-22 ABB Research Ltd. Vergussmasse auf der Basis duroplastischer Epoxidharze
US7129318B2 (en) * 2003-09-02 2006-10-31 I.S.T. (Ma) Corporation RTM and RI processable polyimide resins
KR100570209B1 (ko) * 2003-10-15 2006-04-12 주식회사 하이닉스반도체 유기 반사방지막용 광 흡수제 중합체 및 이의 제조 방법과상기 중합체를 포함하는 유기 반사 방지막 조성물
CN100451080C (zh) * 2004-05-26 2009-01-14 北京韩创科建筑材料科技有限公司 改性双组份环氧树脂涂料
TWI414519B (zh) * 2006-08-09 2013-11-11 Mitsubishi Gas Chemical Co 酸酐酯與其組成物、熱硬化性樹脂組成物及其硬化物
DE102008000517B4 (de) * 2008-03-05 2018-04-26 Robert Bosch Automotive Steering Gmbh Verfahren zum druckdichten Fügen eines metallischen Lenkgetriebegehäuses mit einem Kunststoffgehäusedeckel
JP4395547B1 (ja) * 2008-11-06 2010-01-13 地方独立行政法人 岩手県工業技術センター 偏光レンズ及び偏光レンズの製造方法
CN102725802B (zh) * 2010-02-03 2016-04-06 Abb研究有限公司 电绝缘体系
FR2960472B1 (fr) * 2010-05-31 2012-09-28 Arkema France Procede d'assemblage et de reparation d'objets a base de resine epoxy
CN101935388B (zh) * 2010-09-16 2012-04-25 中国人民解放军国防科学技术大学 树脂组合物及其在复合材料线芯制备中的应用
WO2012158291A1 (en) 2011-05-13 2012-11-22 Dow Global Technologies Llc Insulation formulations
US9196412B2 (en) 2011-05-13 2015-11-24 Dow Global Technologies Llc Insulation formulations
DE102012211323A1 (de) 2012-06-29 2014-01-02 Evonik Industries Ag Härter für Epoxidharzsysteme und deren Verwendung
US20150189745A1 (en) * 2012-09-14 2015-07-02 Shengyi Technology Co., Ltd. Epoxy resin composition, and, prepreg and copper clad laminate manufactured using the composition
WO2014040261A1 (zh) * 2012-09-14 2014-03-20 广东生益科技股份有限公司 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板
FR2997401B1 (fr) * 2012-10-25 2016-01-29 Univ Montpellier Ii Resines epoxydes reticulables a temperature ambiante
DE102013226601A1 (de) * 2013-12-19 2015-06-25 Evonik Industries Ag Verarbeitungsfreundlicher Dianhydridhärter für Epoxidharzsysteme basierend auf 5,5'-Carbonylbis(isobenzofuran-1,3-dion)
DE102013226613A1 (de) 2013-12-19 2015-06-25 Evonik Industries Ag Verarbeitungsfreundlicher Dianhydridhärter für Epoxidharzsysteme basierend auf 5,5'-Oxybis(isobenzofuran-1,3-dion)
DE102014216437A1 (de) * 2014-08-19 2016-02-25 Siemens Aktiengesellschaft Epoxidharz-Formulierung, Epoxidharz daraus und Verwendungen dazu
WO2016145647A1 (en) * 2015-03-19 2016-09-22 Ablestik (Shanghai) Ltd. Epoxy molding compound using anhydride hardener, manufacturing process and use thereof
CN107163695A (zh) * 2017-07-16 2017-09-15 镇江市神龙电器管件有限公司 一种用于高安全性托盘式电缆桥架的防火涂料
CN107189559B (zh) * 2017-07-16 2019-05-24 镇江市神龙电器管件有限公司 一种具有防火功能的电缆桥架
RU2739463C1 (ru) * 2019-12-13 2020-12-24 Публичное акционерное общество "ОДК-Уфимское моторостроительное производственное объединение" (ПАО "ОДК-УМПО") Способ подготовки клеевой композиции перед нанесением на рабочую поверхность
AT523758B1 (de) * 2020-04-17 2022-02-15 Polymer Competence Center Leoben Gmbh Aushärtbare Zusammensetzung zur Herstellung eines Vitrimers und daraus erhältliches Vitrimer und Verfahren zu dessen Herstellung
CN117355556A (zh) * 2021-07-15 2024-01-05 汉高股份有限及两合公司 双组分可固化组合物
CN113999492A (zh) * 2021-11-22 2022-02-01 无锡嘉联电子材料有限公司 一种耐uv耐老化高性能led环氧树脂组合物及其制备方法
EP4549485A1 (en) * 2023-10-30 2025-05-07 Centre National de la Recherche Scientifique Biobased epoxy thermoset materials

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NL210860A (https=) * 1955-10-04
DE1019083B (de) 1956-01-28 1957-11-07 Bayer Ag Verfahren zur Herstellung von Kunststoffen durch Haerten von Epoxyverbindungen
DE1251036B (de) 1961-05-12 1967-09-28 General Aniline &. Film Corpora tion New York, N Y (V St A) Verfahren zur Herstellung von Formkorpern
US3222321A (en) 1962-08-16 1965-12-07 Soto Chemical Coatings Inc De Modified acrylamide interpolymers containing interpolymerized unsaturated epoxy resins
US3683044A (en) 1969-12-29 1972-08-08 Japan Gas Chemical Co Heat-curable composition comprising polyglycidyl xylylene-diamine and process for preparation of polyglycidyl xylylenediamine
JPS5111897A (ja) * 1974-07-19 1976-01-30 Hitachi Chemical Co Ltd Kokaseiehokishijushisoseibutsu
US4002599A (en) 1975-11-06 1977-01-11 Lord Corporation Epoxy resin compositions from glycidyl derivatives of aminophenols cured with tetracarboxylic dianhydrides
JPS6038421A (ja) 1983-08-11 1985-02-28 Mitsubishi Petrochem Co Ltd エポキシ樹脂組成物
US4595623A (en) * 1984-05-07 1986-06-17 Hughes Aircraft Company Fiber-reinforced syntactic foam composites and method of forming same
US4559272A (en) 1984-05-09 1985-12-17 Hughes Aircraft Company Heat curable polyglycidyl aromatic amine encapsulants
US4916202A (en) * 1987-09-17 1990-04-10 University Of Dayton Epoxy resin
GB9010221D0 (en) 1990-05-05 1990-06-27 Ciba Geigy Ag N-glycidyl compounds
DE4040471A1 (de) * 1990-08-01 1992-02-06 Bayer Ag Haertbare mischungen zur herstellung von epoxidnetzwerken, verfahren zu deren herstellung und verwendung
US5111897A (en) 1990-09-27 1992-05-12 Bridge Weighing Systems, Inc. Bridge weigh-in-motion system
US5629379A (en) * 1994-09-27 1997-05-13 Harper; John D. Anhydride-hardened epoxy resin with polybutadiene-maleic anhydride adduct

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006348102A (ja) * 2005-06-14 2006-12-28 Hitachi Chem Co Ltd 電気絶縁用樹脂組成物及びそれを用いた電気機器
JP2011052224A (ja) * 2010-10-25 2011-03-17 Nippon Kayaku Co Ltd エポキシ樹脂組成物及びその硬化物
JP2014019868A (ja) * 2012-07-12 2014-02-03 Samsung Electro-Mechanics Co Ltd ビルドアップ絶縁フィルム用エポキシ樹脂組成物、これから製造された絶縁フィルム、及びこれを備えた多層プリント基板

Also Published As

Publication number Publication date
ZA200007392B (en) 2001-06-21
CN1313872A (zh) 2001-09-19
CA2334824A1 (en) 1999-12-29
DE19828248A1 (de) 1999-12-30
AU4254999A (en) 2000-01-10
AU764356B2 (en) 2003-08-14
CN1142960C (zh) 2004-03-24
EP1091992A1 (de) 2001-04-18
CA2334824C (en) 2008-01-29
DE59907948D1 (de) 2004-01-15
EP1091992B1 (de) 2003-12-03
WO1999067315A1 (de) 1999-12-29
US6468659B1 (en) 2002-10-22
ATE255611T1 (de) 2003-12-15
KR20010071583A (ko) 2001-07-28

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