KR20010071583A - 수지계 - Google Patents

수지계 Download PDF

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Publication number
KR20010071583A
KR20010071583A KR1020007014672A KR20007014672A KR20010071583A KR 20010071583 A KR20010071583 A KR 20010071583A KR 1020007014672 A KR1020007014672 A KR 1020007014672A KR 20007014672 A KR20007014672 A KR 20007014672A KR 20010071583 A KR20010071583 A KR 20010071583A
Authority
KR
South Korea
Prior art keywords
anhydride
radical
formula
resin system
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
KR1020007014672A
Other languages
English (en)
Korean (ko)
Inventor
보빈켈프리드리히
포에르스터슈테판
록스옌스
Original Assignee
추후제출
에이비비 코포레이트 리써치 리미티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 추후제출, 에이비비 코포레이트 리써치 리미티드 filed Critical 추후제출
Publication of KR20010071583A publication Critical patent/KR20010071583A/ko
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/3227—Compounds containing acyclic nitrogen atoms
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49169—Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171—Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49227—Insulator making
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Epoxy Resins (AREA)
  • Indole Compounds (AREA)
  • Valve Housings (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)
  • Paints Or Removers (AREA)
KR1020007014672A 1998-06-25 1999-06-25 수지계 Withdrawn KR20010071583A (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE19828248.6 1998-06-25
DE19828248A DE19828248A1 (de) 1998-06-25 1998-06-25 Bei niedriger Temperatur härtende Epoxidharzsysteme aus Aminoglycidylverbindungen und cyclischen Carbonsäureanhydriden
PCT/CH1999/000275 WO1999067315A1 (de) 1998-06-25 1999-06-25 Harzsystem

Publications (1)

Publication Number Publication Date
KR20010071583A true KR20010071583A (ko) 2001-07-28

Family

ID=7871932

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020007014672A Withdrawn KR20010071583A (ko) 1998-06-25 1999-06-25 수지계

Country Status (11)

Country Link
US (1) US6468659B1 (https=)
EP (1) EP1091992B1 (https=)
JP (1) JP2002518567A (https=)
KR (1) KR20010071583A (https=)
CN (1) CN1142960C (https=)
AT (1) ATE255611T1 (https=)
AU (1) AU764356B2 (https=)
CA (1) CA2334824C (https=)
DE (2) DE19828248A1 (https=)
WO (1) WO1999067315A1 (https=)
ZA (1) ZA200007392B (https=)

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EP1213314A1 (de) * 2000-12-07 2002-06-12 Abb Research Ltd. Härterkomponente zum Härten von Epoxyharzen
US6617698B2 (en) * 2001-03-09 2003-09-09 International Business Machines Corporation Reworkable and thermally conductive adhesive and use thereof
EP1331234B1 (de) 2002-01-28 2004-09-22 ABB Research Ltd. Vergussmasse auf der Basis duroplastischer Epoxidharze
US7129318B2 (en) * 2003-09-02 2006-10-31 I.S.T. (Ma) Corporation RTM and RI processable polyimide resins
KR100570209B1 (ko) * 2003-10-15 2006-04-12 주식회사 하이닉스반도체 유기 반사방지막용 광 흡수제 중합체 및 이의 제조 방법과상기 중합체를 포함하는 유기 반사 방지막 조성물
CN100451080C (zh) * 2004-05-26 2009-01-14 北京韩创科建筑材料科技有限公司 改性双组份环氧树脂涂料
JP4711119B2 (ja) * 2005-06-14 2011-06-29 日立化成工業株式会社 電気絶縁用樹脂組成物及びそれを用いた電気機器
TWI414519B (zh) * 2006-08-09 2013-11-11 Mitsubishi Gas Chemical Co 酸酐酯與其組成物、熱硬化性樹脂組成物及其硬化物
DE102008000517B4 (de) * 2008-03-05 2018-04-26 Robert Bosch Automotive Steering Gmbh Verfahren zum druckdichten Fügen eines metallischen Lenkgetriebegehäuses mit einem Kunststoffgehäusedeckel
JP4395547B1 (ja) * 2008-11-06 2010-01-13 地方独立行政法人 岩手県工業技術センター 偏光レンズ及び偏光レンズの製造方法
CN102725802B (zh) * 2010-02-03 2016-04-06 Abb研究有限公司 电绝缘体系
FR2960472B1 (fr) * 2010-05-31 2012-09-28 Arkema France Procede d'assemblage et de reparation d'objets a base de resine epoxy
CN101935388B (zh) * 2010-09-16 2012-04-25 中国人民解放军国防科学技术大学 树脂组合物及其在复合材料线芯制备中的应用
JP5606870B2 (ja) * 2010-10-25 2014-10-15 日本化薬株式会社 エポキシ樹脂組成物及びその硬化物
WO2012158291A1 (en) 2011-05-13 2012-11-22 Dow Global Technologies Llc Insulation formulations
US9196412B2 (en) 2011-05-13 2015-11-24 Dow Global Technologies Llc Insulation formulations
DE102012211323A1 (de) 2012-06-29 2014-01-02 Evonik Industries Ag Härter für Epoxidharzsysteme und deren Verwendung
KR20140008871A (ko) * 2012-07-12 2014-01-22 삼성전기주식회사 빌드업 절연필름용 에폭시 수지 조성물, 이로부터 제조된 절연 필름 및 이를 구비한 다층 인쇄회로기판
US20150189745A1 (en) * 2012-09-14 2015-07-02 Shengyi Technology Co., Ltd. Epoxy resin composition, and, prepreg and copper clad laminate manufactured using the composition
WO2014040261A1 (zh) * 2012-09-14 2014-03-20 广东生益科技股份有限公司 环氧树脂组合物以及使用其制作的半固化片与覆铜箔层压板
FR2997401B1 (fr) * 2012-10-25 2016-01-29 Univ Montpellier Ii Resines epoxydes reticulables a temperature ambiante
DE102013226601A1 (de) * 2013-12-19 2015-06-25 Evonik Industries Ag Verarbeitungsfreundlicher Dianhydridhärter für Epoxidharzsysteme basierend auf 5,5'-Carbonylbis(isobenzofuran-1,3-dion)
DE102013226613A1 (de) 2013-12-19 2015-06-25 Evonik Industries Ag Verarbeitungsfreundlicher Dianhydridhärter für Epoxidharzsysteme basierend auf 5,5'-Oxybis(isobenzofuran-1,3-dion)
DE102014216437A1 (de) * 2014-08-19 2016-02-25 Siemens Aktiengesellschaft Epoxidharz-Formulierung, Epoxidharz daraus und Verwendungen dazu
WO2016145647A1 (en) * 2015-03-19 2016-09-22 Ablestik (Shanghai) Ltd. Epoxy molding compound using anhydride hardener, manufacturing process and use thereof
CN107163695A (zh) * 2017-07-16 2017-09-15 镇江市神龙电器管件有限公司 一种用于高安全性托盘式电缆桥架的防火涂料
CN107189559B (zh) * 2017-07-16 2019-05-24 镇江市神龙电器管件有限公司 一种具有防火功能的电缆桥架
RU2739463C1 (ru) * 2019-12-13 2020-12-24 Публичное акционерное общество "ОДК-Уфимское моторостроительное производственное объединение" (ПАО "ОДК-УМПО") Способ подготовки клеевой композиции перед нанесением на рабочую поверхность
AT523758B1 (de) * 2020-04-17 2022-02-15 Polymer Competence Center Leoben Gmbh Aushärtbare Zusammensetzung zur Herstellung eines Vitrimers und daraus erhältliches Vitrimer und Verfahren zu dessen Herstellung
CN117355556A (zh) * 2021-07-15 2024-01-05 汉高股份有限及两合公司 双组分可固化组合物
CN113999492A (zh) * 2021-11-22 2022-02-01 无锡嘉联电子材料有限公司 一种耐uv耐老化高性能led环氧树脂组合物及其制备方法
EP4549485A1 (en) * 2023-10-30 2025-05-07 Centre National de la Recherche Scientifique Biobased epoxy thermoset materials

Family Cites Families (15)

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NL210860A (https=) * 1955-10-04
DE1019083B (de) 1956-01-28 1957-11-07 Bayer Ag Verfahren zur Herstellung von Kunststoffen durch Haerten von Epoxyverbindungen
DE1251036B (de) 1961-05-12 1967-09-28 General Aniline &. Film Corpora tion New York, N Y (V St A) Verfahren zur Herstellung von Formkorpern
US3222321A (en) 1962-08-16 1965-12-07 Soto Chemical Coatings Inc De Modified acrylamide interpolymers containing interpolymerized unsaturated epoxy resins
US3683044A (en) 1969-12-29 1972-08-08 Japan Gas Chemical Co Heat-curable composition comprising polyglycidyl xylylene-diamine and process for preparation of polyglycidyl xylylenediamine
JPS5111897A (ja) * 1974-07-19 1976-01-30 Hitachi Chemical Co Ltd Kokaseiehokishijushisoseibutsu
US4002599A (en) 1975-11-06 1977-01-11 Lord Corporation Epoxy resin compositions from glycidyl derivatives of aminophenols cured with tetracarboxylic dianhydrides
JPS6038421A (ja) 1983-08-11 1985-02-28 Mitsubishi Petrochem Co Ltd エポキシ樹脂組成物
US4595623A (en) * 1984-05-07 1986-06-17 Hughes Aircraft Company Fiber-reinforced syntactic foam composites and method of forming same
US4559272A (en) 1984-05-09 1985-12-17 Hughes Aircraft Company Heat curable polyglycidyl aromatic amine encapsulants
US4916202A (en) * 1987-09-17 1990-04-10 University Of Dayton Epoxy resin
GB9010221D0 (en) 1990-05-05 1990-06-27 Ciba Geigy Ag N-glycidyl compounds
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US5629379A (en) * 1994-09-27 1997-05-13 Harper; John D. Anhydride-hardened epoxy resin with polybutadiene-maleic anhydride adduct

Also Published As

Publication number Publication date
ZA200007392B (en) 2001-06-21
CN1313872A (zh) 2001-09-19
CA2334824A1 (en) 1999-12-29
DE19828248A1 (de) 1999-12-30
AU4254999A (en) 2000-01-10
AU764356B2 (en) 2003-08-14
CN1142960C (zh) 2004-03-24
EP1091992A1 (de) 2001-04-18
CA2334824C (en) 2008-01-29
DE59907948D1 (de) 2004-01-15
EP1091992B1 (de) 2003-12-03
WO1999067315A1 (de) 1999-12-29
JP2002518567A (ja) 2002-06-25
US6468659B1 (en) 2002-10-22
ATE255611T1 (de) 2003-12-15

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Legal Events

Date Code Title Description
PA0105 International application

Patent event date: 20001222

Patent event code: PA01051R01D

Comment text: International Patent Application

PG1501 Laying open of application
N231 Notification of change of applicant
PN2301 Change of applicant

Patent event date: 20020723

Comment text: Notification of Change of Applicant

Patent event code: PN23011R01D

PC1203 Withdrawal of no request for examination
WITN Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid