JP2002324808A5 - - Google Patents

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Publication number
JP2002324808A5
JP2002324808A5 JP2002009440A JP2002009440A JP2002324808A5 JP 2002324808 A5 JP2002324808 A5 JP 2002324808A5 JP 2002009440 A JP2002009440 A JP 2002009440A JP 2002009440 A JP2002009440 A JP 2002009440A JP 2002324808 A5 JP2002324808 A5 JP 2002324808A5
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JP
Japan
Prior art keywords
semiconductor film
film
forming
crystalline semiconductor
crystalline
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP2002009440A
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English (en)
Japanese (ja)
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JP2002324808A (ja
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Publication date
Application filed filed Critical
Priority to JP2002009440A priority Critical patent/JP2002324808A/ja
Priority claimed from JP2002009440A external-priority patent/JP2002324808A/ja
Publication of JP2002324808A publication Critical patent/JP2002324808A/ja
Publication of JP2002324808A5 publication Critical patent/JP2002324808A5/ja
Withdrawn legal-status Critical Current

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JP2002009440A 2001-01-19 2002-01-18 半導体装置およびその作製方法 Withdrawn JP2002324808A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2002009440A JP2002324808A (ja) 2001-01-19 2002-01-18 半導体装置およびその作製方法

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2001-11085 2001-01-19
JP2001011085 2001-01-19
JP2001022062 2001-01-30
JP2001-22062 2001-01-30
JP2002009440A JP2002324808A (ja) 2001-01-19 2002-01-18 半導体装置およびその作製方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008017705A Division JP4394149B2 (ja) 2001-01-19 2008-01-29 半導体装置の作製方法

Publications (2)

Publication Number Publication Date
JP2002324808A JP2002324808A (ja) 2002-11-08
JP2002324808A5 true JP2002324808A5 (enrdf_load_stackoverflow) 2005-04-14

Family

ID=27345755

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002009440A Withdrawn JP2002324808A (ja) 2001-01-19 2002-01-18 半導体装置およびその作製方法

Country Status (1)

Country Link
JP (1) JP2002324808A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7115903B2 (en) 2001-12-28 2006-10-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and semiconductor device producing system
US7166863B2 (en) 2002-03-15 2007-01-23 Semiconductor Energy Laboratory Co. Ltd. Semiconductor element, semiconductor device, electronic device, TV set and digital camera
US7176490B2 (en) 2001-12-28 2007-02-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7226817B2 (en) 2001-12-28 2007-06-05 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing
US7582162B2 (en) 2002-01-17 2009-09-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and semiconductor device production system

Families Citing this family (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003204067A (ja) 2001-12-28 2003-07-18 Semiconductor Energy Lab Co Ltd 表示装置およびそれを用いた電子機器
TW200302511A (en) 2002-01-28 2003-08-01 Semiconductor Energy Lab Semiconductor device and method of manufacturing the same
TWI261358B (en) 2002-01-28 2006-09-01 Semiconductor Energy Lab Semiconductor device and method of manufacturing the same
US7749818B2 (en) 2002-01-28 2010-07-06 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing the same
CN100350617C (zh) 2002-03-05 2007-11-21 株式会社半导体能源研究所 半导体元件和使用半导体元件的半导体装置
US6841434B2 (en) 2002-03-26 2005-01-11 Semiconductor Energy Laboratory Co., Ltd. Method of fabricating semiconductor device
US6930326B2 (en) 2002-03-26 2005-08-16 Semiconductor Energy Laboratory Co., Ltd. Semiconductor circuit and method of fabricating the same
JP4271413B2 (ja) 2002-06-28 2009-06-03 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4651933B2 (ja) * 2002-11-26 2011-03-16 株式会社半導体エネルギー研究所 半導体装置の作製方法
US7335255B2 (en) 2002-11-26 2008-02-26 Semiconductor Energy Laboratory, Co., Ltd. Manufacturing method of semiconductor device
JP4574261B2 (ja) * 2004-07-16 2010-11-04 株式会社半導体エネルギー研究所 半導体装置の作製方法
KR101061850B1 (ko) * 2004-09-08 2011-09-02 삼성전자주식회사 박막 트랜지스터 표시판 및 그 제조방법
JP4801407B2 (ja) * 2004-09-30 2011-10-26 株式会社半導体エネルギー研究所 表示装置の作製方法
JP4801406B2 (ja) * 2004-09-30 2011-10-26 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
JP4698998B2 (ja) * 2004-09-30 2011-06-08 株式会社半導体エネルギー研究所 液晶表示装置の作製方法
JP4754798B2 (ja) * 2004-09-30 2011-08-24 株式会社半導体エネルギー研究所 表示装置の作製方法
JP4754918B2 (ja) * 2004-09-30 2011-08-24 株式会社半導体エネルギー研究所 半導体装置の作製方法
JP4781066B2 (ja) * 2004-09-30 2011-09-28 株式会社半導体エネルギー研究所 表示装置の作製方法
JP5036173B2 (ja) * 2004-11-26 2012-09-26 株式会社半導体エネルギー研究所 半導体装置の作製方法
US8003449B2 (en) 2004-11-26 2011-08-23 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing a semiconductor device having a reverse staggered thin film transistor
US8115206B2 (en) * 2005-07-22 2012-02-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7115903B2 (en) 2001-12-28 2006-10-03 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and semiconductor device producing system
US7176490B2 (en) 2001-12-28 2007-02-13 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US7226817B2 (en) 2001-12-28 2007-06-05 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing
US7582162B2 (en) 2002-01-17 2009-09-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and semiconductor device production system
US7166863B2 (en) 2002-03-15 2007-01-23 Semiconductor Energy Laboratory Co. Ltd. Semiconductor element, semiconductor device, electronic device, TV set and digital camera

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