JP2002246395A5 - - Google Patents

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JP2002246395A5
JP2002246395A5 JP2001040848A JP2001040848A JP2002246395A5 JP 2002246395 A5 JP2002246395 A5 JP 2002246395A5 JP 2001040848 A JP2001040848 A JP 2001040848A JP 2001040848 A JP2001040848 A JP 2001040848A JP 2002246395 A5 JP2002246395 A5 JP 2002246395A5
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JP
Japan
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JP2001040848A
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JP5088993B2 (ja
JP2002246395A (ja
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Priority to JP2001040848A priority Critical patent/JP5088993B2/ja
Priority claimed from JP2001040848A external-priority patent/JP5088993B2/ja
Priority to US10/074,050 priority patent/US6808968B2/en
Publication of JP2002246395A publication Critical patent/JP2002246395A/ja
Priority to US10/940,821 priority patent/US7306982B2/en
Publication of JP2002246395A5 publication Critical patent/JP2002246395A5/ja
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Publication of JP5088993B2 publication Critical patent/JP5088993B2/ja
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JP2001040848A 2001-02-16 2001-02-16 半導体装置の作製方法 Expired - Fee Related JP5088993B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2001040848A JP5088993B2 (ja) 2001-02-16 2001-02-16 半導体装置の作製方法
US10/074,050 US6808968B2 (en) 2001-02-16 2002-02-14 Method of manufacturing a semiconductor device
US10/940,821 US7306982B2 (en) 2001-02-16 2004-09-15 Method of manufacturing a semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001040848A JP5088993B2 (ja) 2001-02-16 2001-02-16 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2002246395A JP2002246395A (ja) 2002-08-30
JP2002246395A5 true JP2002246395A5 (ja) 2008-03-13
JP5088993B2 JP5088993B2 (ja) 2012-12-05

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JP2001040848A Expired - Fee Related JP5088993B2 (ja) 2001-02-16 2001-02-16 半導体装置の作製方法

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US (2) US6808968B2 (ja)
JP (1) JP5088993B2 (ja)

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