JP2002192369A5 - - Google Patents

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Publication number
JP2002192369A5
JP2002192369A5 JP2001278752A JP2001278752A JP2002192369A5 JP 2002192369 A5 JP2002192369 A5 JP 2002192369A5 JP 2001278752 A JP2001278752 A JP 2001278752A JP 2001278752 A JP2001278752 A JP 2001278752A JP 2002192369 A5 JP2002192369 A5 JP 2002192369A5
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JP
Japan
Prior art keywords
workpiece
along
laser beam
elliptically polarized
laser
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JP2001278752A
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English (en)
Japanese (ja)
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JP2002192369A (ja
JP3722731B2 (ja
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Priority to JP2001278752A priority Critical patent/JP3722731B2/ja
Priority claimed from JP2001278752A external-priority patent/JP3722731B2/ja
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Publication of JP2002192369A5 publication Critical patent/JP2002192369A5/ja
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Publication of JP3722731B2 publication Critical patent/JP3722731B2/ja
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JP2001278752A 2000-09-13 2001-09-13 レーザ加工方法 Expired - Lifetime JP3722731B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001278752A JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000-278306 2000-09-13
JP2000278306 2000-09-13
JP2001278752A JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2002097725A Division JP3867003B2 (ja) 2000-09-13 2002-03-29 レーザ加工方法
JP2005207559A Division JP4837320B2 (ja) 2000-09-13 2005-07-15 加工対象物切断方法

Publications (3)

Publication Number Publication Date
JP2002192369A JP2002192369A (ja) 2002-07-10
JP2002192369A5 true JP2002192369A5 (enExample) 2005-09-02
JP3722731B2 JP3722731B2 (ja) 2005-11-30

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ID=26599877

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JP2001278752A Expired - Lifetime JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

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JP (1) JP3722731B2 (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7566635B2 (en) 2002-03-12 2009-07-28 Hamamatsu Photonics K.K. Substrate dividing method
US7592238B2 (en) 2000-09-13 2009-09-22 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US8361883B2 (en) 2002-03-12 2013-01-29 Hamamatsu Photonics K.K. Laser processing method

Families Citing this family (28)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPWO2003038880A1 (ja) 2001-10-31 2005-02-24 三星ダイヤモンド工業株式会社 半導体ウエハのスクライブ線の形成方法およびスクライブ線の形成装置
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
TWI520269B (zh) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
CN1758985A (zh) 2003-03-12 2006-04-12 浜松光子学株式会社 激光加工方法
JP2004299969A (ja) * 2003-03-31 2004-10-28 Toshiba Ceramics Co Ltd シリカガラスのスライス方法
WO2004100240A1 (ja) * 2003-05-12 2004-11-18 Tokyo Seimitsu Co., Ltd. 板状部材の分割方法及び分割装置
KR101058800B1 (ko) 2003-05-22 2011-08-23 가부시키가이샤 토쿄 세이미쯔 레이저 다이싱장치
JP4563097B2 (ja) 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
JP2007235068A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
JP2007235069A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
US9346130B2 (en) 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
US8341976B2 (en) 2009-02-19 2013-01-01 Corning Incorporated Method of separating strengthened glass
US8327666B2 (en) * 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
CN102326232B (zh) 2009-02-25 2016-01-20 日亚化学工业株式会社 半导体元件的制造方法
JP5340808B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
JP5340806B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
JP5340807B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハの加工方法
JP2013503105A (ja) 2009-08-28 2013-01-31 コーニング インコーポレイテッド 化学強化ガラス基板からガラス品をレーザ割断するための方法
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
JP2015511571A (ja) 2012-02-28 2015-04-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 強化ガラスの分離のための方法及び装置並びにこれにより生成された製品
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
CN104125934A (zh) * 2012-02-28 2014-10-29 伊雷克托科学工业股份有限公司 用于分离强化玻璃的方法及装置及由该强化玻璃生产的物品
WO2013130608A1 (en) * 2012-02-29 2013-09-06 Electro Scientific Industries, Inc. Methods and apparatus for machining strengthened glass and articles produced thereby
US9776906B2 (en) 2014-03-28 2017-10-03 Electro Scientific Industries, Inc. Laser machining strengthened glass
JP2016058429A (ja) * 2014-09-05 2016-04-21 株式会社ディスコ ウエーハの加工方法
CN109791303A (zh) * 2016-07-15 2019-05-21 特拉迪欧德公司 利用可变光束形状的激光的材料加工
CN114227957B (zh) * 2021-12-20 2024-03-26 常州时创能源股份有限公司 硅棒切割方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7592238B2 (en) 2000-09-13 2009-09-22 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US7825350B2 (en) 2000-09-13 2010-11-02 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US8227724B2 (en) 2000-09-13 2012-07-24 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US8283595B2 (en) 2000-09-13 2012-10-09 Hamamatsu Photonics K.K. Laser processing method and laser processing apparatus
US8946589B2 (en) 2000-09-13 2015-02-03 Hamamatsu Photonics K.K. Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
US7566635B2 (en) 2002-03-12 2009-07-28 Hamamatsu Photonics K.K. Substrate dividing method
US8268704B2 (en) 2002-03-12 2012-09-18 Hamamatsu Photonics K.K. Method for dicing substrate
US8304325B2 (en) 2002-03-12 2012-11-06 Hamamatsu-Photonics K.K. Substrate dividing method
US8361883B2 (en) 2002-03-12 2013-01-29 Hamamatsu Photonics K.K. Laser processing method

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