JP3722731B2 - レーザ加工方法 - Google Patents

レーザ加工方法 Download PDF

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Publication number
JP3722731B2
JP3722731B2 JP2001278752A JP2001278752A JP3722731B2 JP 3722731 B2 JP3722731 B2 JP 3722731B2 JP 2001278752 A JP2001278752 A JP 2001278752A JP 2001278752 A JP2001278752 A JP 2001278752A JP 3722731 B2 JP3722731 B2 JP 3722731B2
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Japan
Prior art keywords
workpiece
laser
along
region
laser beam
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Expired - Lifetime
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JP2001278752A
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English (en)
Japanese (ja)
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JP2002192369A5 (enExample
JP2002192369A (ja
Inventor
文嗣 福世
憲志 福満
直己 内山
敏光 和久田
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Hamamatsu Photonics KK
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Hamamatsu Photonics KK
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Priority to JP2001278752A priority Critical patent/JP3722731B2/ja
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Publication of JP2002192369A5 publication Critical patent/JP2002192369A5/ja
Application granted granted Critical
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/40—Semiconductor devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
JP2001278752A 2000-09-13 2001-09-13 レーザ加工方法 Expired - Lifetime JP3722731B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2001278752A JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2000278306 2000-09-13
JP2000-278306 2000-09-13
JP2001278752A JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

Related Child Applications (2)

Application Number Title Priority Date Filing Date
JP2002097725A Division JP3867003B2 (ja) 2000-09-13 2002-03-29 レーザ加工方法
JP2005207559A Division JP4837320B2 (ja) 2000-09-13 2005-07-15 加工対象物切断方法

Publications (3)

Publication Number Publication Date
JP2002192369A JP2002192369A (ja) 2002-07-10
JP2002192369A5 JP2002192369A5 (enExample) 2005-09-02
JP3722731B2 true JP3722731B2 (ja) 2005-11-30

Family

ID=26599877

Family Applications (1)

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JP2001278752A Expired - Lifetime JP3722731B2 (ja) 2000-09-13 2001-09-13 レーザ加工方法

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JP (1) JP3722731B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8314013B2 (en) 2002-03-12 2012-11-20 Hamamatsu Photonics K.K. Semiconductor chip manufacturing method

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4659300B2 (ja) 2000-09-13 2011-03-30 浜松ホトニクス株式会社 レーザ加工方法及び半導体チップの製造方法
JPWO2003038880A1 (ja) 2001-10-31 2005-02-24 三星ダイヤモンド工業株式会社 半導体ウエハのスクライブ線の形成方法およびスクライブ線の形成装置
JP4606741B2 (ja) 2002-03-12 2011-01-05 浜松ホトニクス株式会社 加工対象物切断方法
TWI326626B (en) 2002-03-12 2010-07-01 Hamamatsu Photonics Kk Laser processing method
TWI520269B (zh) 2002-12-03 2016-02-01 濱松赫德尼古斯股份有限公司 Cutting method of semiconductor substrate
FR2852250B1 (fr) 2003-03-11 2009-07-24 Jean Luc Jouvin Fourreau de protection pour canule, un ensemble d'injection comportant un tel fourreau et aiguille equipee d'un tel fourreau
DE60315515T2 (de) 2003-03-12 2007-12-13 Hamamatsu Photonics K.K., Hamamatsu Laserstrahlbearbeitungsverfahren
JP2004299969A (ja) * 2003-03-31 2004-10-28 Toshiba Ceramics Co Ltd シリカガラスのスライス方法
JP4599631B2 (ja) * 2003-05-12 2010-12-15 株式会社東京精密 板状部材の分割方法及び分割装置
JP4640174B2 (ja) * 2003-05-22 2011-03-02 株式会社東京精密 レーザーダイシング装置
JP4563097B2 (ja) 2003-09-10 2010-10-13 浜松ホトニクス株式会社 半導体基板の切断方法
JP2007235068A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
JP2007235069A (ja) 2006-03-03 2007-09-13 Tokyo Seimitsu Co Ltd ウェーハ加工方法
US9346130B2 (en) 2008-12-17 2016-05-24 Electro Scientific Industries, Inc. Method for laser processing glass with a chamfered edge
US8327666B2 (en) * 2009-02-19 2012-12-11 Corning Incorporated Method of separating strengthened glass
US8341976B2 (en) 2009-02-19 2013-01-01 Corning Incorporated Method of separating strengthened glass
WO2010098186A1 (ja) 2009-02-25 2010-09-02 日亜化学工業株式会社 半導体素子の製造方法
JP5340806B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
JP5340807B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハの加工方法
JP5340808B2 (ja) * 2009-05-21 2013-11-13 株式会社ディスコ 半導体ウエーハのレーザ加工方法
JP2013503105A (ja) 2009-08-28 2013-01-31 コーニング インコーポレイテッド 化学強化ガラス基板からガラス品をレーザ割断するための方法
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
JP2015511571A (ja) 2012-02-28 2015-04-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 強化ガラスの分離のための方法及び装置並びにこれにより生成された製品
JP2015511572A (ja) * 2012-02-28 2015-04-20 エレクトロ サイエンティフィック インダストリーズ インコーポレーテッド 強化ガラスの分離のための方法及び装置並びにこれにより生成された製品
US10357850B2 (en) * 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
KR20140131520A (ko) 2012-02-29 2014-11-13 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 강화 유리를 기계가공하기 위한 방법과 장치, 및 이에 의해 제조된 물품
US9776906B2 (en) 2014-03-28 2017-10-03 Electro Scientific Industries, Inc. Laser machining strengthened glass
JP2016058429A (ja) * 2014-09-05 2016-04-21 株式会社ディスコ ウエーハの加工方法
DE112017003592T5 (de) * 2016-07-15 2019-03-28 TeraDiode, Inc. Materialbearbeitung unter Verwendung eines Lasers mit variabler Strahlform
JP7736676B2 (ja) * 2020-04-28 2025-09-09 浜松ホトニクス株式会社 レーザ加工装置
CN114227957B (zh) * 2021-12-20 2024-03-26 常州时创能源股份有限公司 硅棒切割方法

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8314013B2 (en) 2002-03-12 2012-11-20 Hamamatsu Photonics K.K. Semiconductor chip manufacturing method
US8519511B2 (en) 2002-03-12 2013-08-27 Hamamatsu Photonics K.K. Substrate dividing method
US8518801B2 (en) 2002-03-12 2013-08-27 Hamamatsu Photonics K.K. Substrate dividing method
US8518800B2 (en) 2002-03-12 2013-08-27 Hamamatsu Photonics K.K. Substrate dividing method
US8889525B2 (en) 2002-03-12 2014-11-18 Hamamatsu Photonics K.K. Substrate dividing method
US9142458B2 (en) 2002-03-12 2015-09-22 Hamamatsu Photonics K.K. Substrate dividing method
US9287177B2 (en) 2002-03-12 2016-03-15 Hamamatsu Photonics K.K. Substrate dividing method
US9543207B2 (en) 2002-03-12 2017-01-10 Hamamatsu Photonics K.K. Substrate dividing method
US9543256B2 (en) 2002-03-12 2017-01-10 Hamamatsu Photonics K.K. Substrate dividing method
US9548246B2 (en) 2002-03-12 2017-01-17 Hamamatsu Photonics K.K. Substrate dividing method
US9553023B2 (en) 2002-03-12 2017-01-24 Hamamatsu Photonics K.K. Substrate dividing method
US9711405B2 (en) 2002-03-12 2017-07-18 Hamamatsu Photonics K.K. Substrate dividing method
US10068801B2 (en) 2002-03-12 2018-09-04 Hamamatsu Photonics K.K. Substrate dividing method
US10622255B2 (en) 2002-03-12 2020-04-14 Hamamatsu Photonics K.K. Substrate dividing method
US11424162B2 (en) 2002-03-12 2022-08-23 Hamamatsu Photonics K.K. Substrate dividing method

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JP2002192369A (ja) 2002-07-10

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