JP2003088976A5 - - Google Patents

Download PDF

Info

Publication number
JP2003088976A5
JP2003088976A5 JP2001277186A JP2001277186A JP2003088976A5 JP 2003088976 A5 JP2003088976 A5 JP 2003088976A5 JP 2001277186 A JP2001277186 A JP 2001277186A JP 2001277186 A JP2001277186 A JP 2001277186A JP 2003088976 A5 JP2003088976 A5 JP 2003088976A5
Authority
JP
Japan
Prior art keywords
workpiece
modified region
region
laser beam
cutting line
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2001277186A
Other languages
English (en)
Japanese (ja)
Other versions
JP4659301B2 (ja
JP2003088976A (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP2001277186A priority Critical patent/JP4659301B2/ja
Priority claimed from JP2001277186A external-priority patent/JP4659301B2/ja
Priority to TW092105294A priority patent/TWI296554B/zh
Publication of JP2003088976A publication Critical patent/JP2003088976A/ja
Publication of JP2003088976A5 publication Critical patent/JP2003088976A5/ja
Application granted granted Critical
Publication of JP4659301B2 publication Critical patent/JP4659301B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

JP2001277186A 2001-09-12 2001-09-12 レーザ加工方法 Expired - Lifetime JP4659301B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2001277186A JP4659301B2 (ja) 2001-09-12 2001-09-12 レーザ加工方法
TW092105294A TWI296554B (en) 2001-09-12 2003-03-12 Laser processing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2001277186A JP4659301B2 (ja) 2001-09-12 2001-09-12 レーザ加工方法

Publications (3)

Publication Number Publication Date
JP2003088976A JP2003088976A (ja) 2003-03-25
JP2003088976A5 true JP2003088976A5 (enExample) 2009-02-19
JP4659301B2 JP4659301B2 (ja) 2011-03-30

Family

ID=19101756

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2001277186A Expired - Lifetime JP4659301B2 (ja) 2001-09-12 2001-09-12 レーザ加工方法

Country Status (2)

Country Link
JP (1) JP4659301B2 (enExample)
TW (1) TWI296554B (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004012402B3 (de) * 2004-03-13 2005-08-25 Schott Ag Verfahren zum Freiformschneiden von gewölbten Substraten aus sprödbrüchigem Material
DE102004014277A1 (de) * 2004-03-22 2005-10-20 Fraunhofer Ges Forschung Verfahren zum laserthermischen Trennen von Flachgläsern
JP4631044B2 (ja) * 2004-05-26 2011-02-16 国立大学法人北海道大学 レーザ加工方法および装置
US7662668B2 (en) * 2005-11-16 2010-02-16 Denso Corporation Method for separating a semiconductor substrate into a plurality of chips along with a cutting line on the semiconductor substrate
KR20120073249A (ko) 2009-08-28 2012-07-04 코닝 인코포레이티드 화학적으로 강화된 유리 기판으로부터 제품을 레이저 절단하기 위한 방법
JP5862088B2 (ja) * 2011-07-22 2016-02-16 アイシン精機株式会社 レーザによる割断方法、およびレーザ割断装置
US9828278B2 (en) 2012-02-28 2017-11-28 Electro Scientific Industries, Inc. Method and apparatus for separation of strengthened glass and articles produced thereby
US10357850B2 (en) 2012-09-24 2019-07-23 Electro Scientific Industries, Inc. Method and apparatus for machining a workpiece
KR20150045957A (ko) * 2012-08-21 2015-04-29 아사히 가라스 가부시키가이샤 복합 시트의 절단 방법, 유리 시트의 절단 방법, 복합 시트의 절단편
JP6320261B2 (ja) * 2014-09-26 2018-05-09 株式会社ディスコ ウエーハの加工方法
JP2016129203A (ja) * 2015-01-09 2016-07-14 株式会社ディスコ ウエーハの加工方法
KR101812209B1 (ko) * 2016-02-16 2017-12-26 주식회사 이오테크닉스 레이저 마킹 장치 및 레이저 마킹 방법
JP7217585B2 (ja) * 2017-04-13 2023-02-03 株式会社ディスコ 分割方法
JP7210910B2 (ja) * 2017-08-22 2023-01-24 日本電気硝子株式会社 ガラス物品の製造方法及びガラス物品の製造装置
US10576585B1 (en) 2018-12-29 2020-03-03 Cree, Inc. Laser-assisted method for parting crystalline material
US10562130B1 (en) 2018-12-29 2020-02-18 Cree, Inc. Laser-assisted method for parting crystalline material
US11024501B2 (en) 2018-12-29 2021-06-01 Cree, Inc. Carrier-assisted method for parting crystalline material along laser damage region
US10611052B1 (en) 2019-05-17 2020-04-07 Cree, Inc. Silicon carbide wafers with relaxed positive bow and related methods
JP7370881B2 (ja) * 2020-01-24 2023-10-30 株式会社ディスコ ウエーハ加工方法、及びウエーハ加工装置

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2810151B2 (ja) * 1989-10-07 1998-10-15 ホーヤ株式会社 レーザマーキング方法
JPH04167985A (ja) * 1990-10-31 1992-06-16 Nagasaki Pref Gov ウェハの割断方法
JP3660741B2 (ja) * 1996-03-22 2005-06-15 株式会社日立製作所 電子回路装置の製造方法
JP3449201B2 (ja) * 1997-11-28 2003-09-22 日亜化学工業株式会社 窒化物半導体素子の製造方法

Similar Documents

Publication Publication Date Title
JP2003088976A5 (enExample)
CN101227999B (zh) 激光加工方法及激光加工装置
JP5449665B2 (ja) レーザ加工方法
CN102489883B (zh) 激光加工方法和激光加工装置
Kautek et al. Femtosecond pulse laser ablation of metallic, semiconducting, ceramic, and biological materials
JP4478184B2 (ja) レーザ割断方法およびレーザ加工装置
CN100355031C (zh) 基板的分割方法
CN101242927B (zh) 激光加工方法
CN101100018B (zh) 激光加工方法和芯片
CN101461039B (zh) 激光加工方法
KR101754186B1 (ko) 취성 재료의 레이저 싱귤레이션을 위한 개선된 방법 및 장치
JP2004343008A (ja) レーザ光線を利用した被加工物分割方法
JP2002205180A5 (ja) レーザ加工方法及びレーザ加工装置
JP5322418B2 (ja) レーザ加工方法及びレーザ加工装置
CN1938827A (zh) 激光加工方法及半导体芯片
EP2204254A3 (en) Laser processing apparatus and method with focusing adjustments achieved with low laser power output
CN1938828A (zh) 激光加工方法及半导体芯片
JP2002192369A5 (enExample)
JP2003334675A5 (enExample)
JP2004268104A5 (enExample)
WO2015168276A1 (en) High speed laser cutting of amorphous metals
JP5122161B2 (ja) 加工対象物切断方法
JP2004351477A (ja) レーザ加工方法
JP2003010991A5 (enExample)
JP2007105888A (ja) 脆性材料の初亀裂形成方法