JP2002144220A5 - - Google Patents

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Publication number
JP2002144220A5
JP2002144220A5 JP2001285787A JP2001285787A JP2002144220A5 JP 2002144220 A5 JP2002144220 A5 JP 2002144220A5 JP 2001285787 A JP2001285787 A JP 2001285787A JP 2001285787 A JP2001285787 A JP 2001285787A JP 2002144220 A5 JP2002144220 A5 JP 2002144220A5
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JP
Japan
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JP2001285787A
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JP4926351B2 (ja
JP2002144220A (ja
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JP2001285787A 2000-09-19 2001-09-19 ミクロ−テクスチャーを備えた研磨パッド Expired - Lifetime JP4926351B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US23374700P 2000-09-19 2000-09-19
US60/233,747 2000-09-19

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JP2002144220A JP2002144220A (ja) 2002-05-21
JP2002144220A5 true JP2002144220A5 (enExample) 2008-10-23
JP4926351B2 JP4926351B2 (ja) 2012-05-09

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JP2001285787A Expired - Lifetime JP4926351B2 (ja) 2000-09-19 2001-09-19 ミクロ−テクスチャーを備えた研磨パッド

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US (1) US6641471B1 (enExample)
EP (1) EP1320443B1 (enExample)
JP (1) JP4926351B2 (enExample)
KR (1) KR100571448B1 (enExample)
DE (1) DE60110820T2 (enExample)
TW (1) TW491755B (enExample)
WO (1) WO2002024415A1 (enExample)

Families Citing this family (138)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6832950B2 (en) * 2002-10-28 2004-12-21 Applied Materials, Inc. Polishing pad with window
EP1052062A1 (en) 1999-05-03 2000-11-15 Applied Materials, Inc. Pré-conditioning fixed abrasive articles
US6869343B2 (en) * 2001-12-19 2005-03-22 Toho Engineering Kabushiki Kaisha Turning tool for grooving polishing pad, apparatus and method of producing polishing pad using the tool, and polishing pad produced by using the tool
US7516536B2 (en) * 1999-07-08 2009-04-14 Toho Engineering Kabushiki Kaisha Method of producing polishing pad
US7303662B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Contacts for electrochemical processing
US7077721B2 (en) 2000-02-17 2006-07-18 Applied Materials, Inc. Pad assembly for electrochemical mechanical processing
US7670468B2 (en) 2000-02-17 2010-03-02 Applied Materials, Inc. Contact assembly and method for electrochemical mechanical processing
US7125477B2 (en) 2000-02-17 2006-10-24 Applied Materials, Inc. Contacts for electrochemical processing
US7374644B2 (en) 2000-02-17 2008-05-20 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6991528B2 (en) 2000-02-17 2006-01-31 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7029365B2 (en) 2000-02-17 2006-04-18 Applied Materials Inc. Pad assembly for electrochemical mechanical processing
US7678245B2 (en) 2000-02-17 2010-03-16 Applied Materials, Inc. Method and apparatus for electrochemical mechanical processing
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US6979248B2 (en) 2002-05-07 2005-12-27 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US6962524B2 (en) 2000-02-17 2005-11-08 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7303462B2 (en) 2000-02-17 2007-12-04 Applied Materials, Inc. Edge bead removal by an electro polishing process
US8485862B2 (en) * 2000-05-19 2013-07-16 Applied Materials, Inc. Polishing pad for endpoint detection and related methods
US7137879B2 (en) 2001-04-24 2006-11-21 Applied Materials, Inc. Conductive polishing article for electrochemical mechanical polishing
US7344432B2 (en) 2001-04-24 2008-03-18 Applied Materials, Inc. Conductive pad with ion exchange membrane for electrochemical mechanical polishing
JP2004537175A (ja) * 2001-08-02 2004-12-09 エスケーシー カンパニー,リミテッド レーザーを使用した化学的機械的研磨パッドの製造方法
US6632026B2 (en) * 2001-08-24 2003-10-14 Nihon Microcoating Co., Ltd. Method of polishing optical fiber connector
US7050605B2 (en) * 2002-01-02 2006-05-23 Jonas Elliott Gerson Designing tread with fractal characteristics
US20030224678A1 (en) * 2002-05-31 2003-12-04 Applied Materials, Inc. Web pad design for chemical mechanical polishing
DE60308946T2 (de) * 2002-06-03 2007-05-10 Jsr Corp. Polierkissen und Verfahren zur Herstellung eines Polierkissens
JP4266579B2 (ja) 2002-06-28 2009-05-20 株式会社ノリタケカンパニーリミテド 研磨体およびその製造方法
US7267607B2 (en) * 2002-10-28 2007-09-11 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7435165B2 (en) * 2002-10-28 2008-10-14 Cabot Microelectronics Corporation Transparent microporous materials for CMP
US7311862B2 (en) * 2002-10-28 2007-12-25 Cabot Microelectronics Corporation Method for manufacturing microporous CMP materials having controlled pore size
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
US6960120B2 (en) * 2003-02-10 2005-11-01 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6832947B2 (en) * 2003-02-10 2004-12-21 Cabot Microelectronics Corporation CMP pad with composite transparent window
US6899612B2 (en) * 2003-02-25 2005-05-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Polishing pad apparatus and methods
JP4168839B2 (ja) 2003-03-06 2008-10-22 日産自動車株式会社 金属ベルト
US7704125B2 (en) * 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
JP4532077B2 (ja) * 2003-03-27 2010-08-25 ニッタ・ハース株式会社 仕上げ研磨用研磨布
US7238097B2 (en) * 2003-04-11 2007-07-03 Nihon Microcoating Co., Ltd. Polishing pad and method of producing same
US6997777B2 (en) * 2003-06-17 2006-02-14 Cabot Microelectronics Corporation Ultrasonic welding method for the manufacture of a polishing pad comprising an optically transmissive region
EP1498222B1 (en) * 2003-07-17 2014-12-17 JSR Corporation Chemical mechanical polishing pad and chemical mechanical polishing method
WO2005035194A2 (en) * 2003-10-09 2005-04-21 Thomas West, Inc. Stacked pad and method of use
US6986705B2 (en) * 2004-04-05 2006-01-17 Rimpad Tech Ltd. Polishing pad and method of making same
JP2005333121A (ja) * 2004-04-21 2005-12-02 Jsr Corp 化学機械研磨パッド及びその製造方法並びに化学機械研磨方法
KR100640141B1 (ko) * 2004-04-21 2006-10-31 제이에스알 가부시끼가이샤 화학 기계 연마 패드 및 그 제조 방법 및 화학 기계 연마방법
JP2005340271A (ja) * 2004-05-24 2005-12-08 Jsr Corp 化学機械研磨用パッド
US8075372B2 (en) * 2004-09-01 2011-12-13 Cabot Microelectronics Corporation Polishing pad with microporous regions
US7520968B2 (en) 2004-10-05 2009-04-21 Applied Materials, Inc. Conductive pad design modification for better wafer-pad contact
JP2006110665A (ja) * 2004-10-14 2006-04-27 Nihon Micro Coating Co Ltd 研磨パッド
US20090061744A1 (en) * 2007-08-28 2009-03-05 Rajeev Bajaj Polishing pad and method of use
SG160369A1 (en) 2005-03-08 2010-04-29 Toyo Tire & Rubber Co Polishing pad and process for producing the same
US7427340B2 (en) 2005-04-08 2008-09-23 Applied Materials, Inc. Conductive pad
JP4979200B2 (ja) * 2005-05-17 2012-07-18 東洋ゴム工業株式会社 研磨パッド
JP2006320982A (ja) * 2005-05-17 2006-11-30 Toyo Tire & Rubber Co Ltd 研磨パッド
US8304467B2 (en) 2005-05-17 2012-11-06 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP4897238B2 (ja) * 2005-05-17 2012-03-14 東洋ゴム工業株式会社 研磨パッド
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
EP1943056A1 (fr) * 2005-10-11 2008-07-16 RM Distribution Galet de polissage de revetement mural et procede de fabrication
US7290471B2 (en) * 2005-11-15 2007-11-06 3M Innovative Properties Company Cutting tool having variable rotation about a y-direction transversely across a work piece for making microstructures
US20070161720A1 (en) * 2005-11-30 2007-07-12 Applied Materials, Inc. Polishing Pad with Surface Roughness
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
JP2007255277A (ja) * 2006-03-23 2007-10-04 Jtekt Corp カムフォロア
US7445847B2 (en) * 2006-05-25 2008-11-04 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
AU2007272779B2 (en) * 2006-07-14 2010-08-26 Saint-Gobain Abrasifs Backingless abrasive article
KR101107043B1 (ko) 2006-08-28 2012-01-25 도요 고무 고교 가부시키가이샤 연마 패드
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US20080271384A1 (en) * 2006-09-22 2008-11-06 Saint-Gobain Ceramics & Plastics, Inc. Conditioning tools and techniques for chemical mechanical planarization
US7234224B1 (en) 2006-11-03 2007-06-26 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Curved grooving of polishing pads
JP2008235508A (ja) * 2007-03-20 2008-10-02 Kuraray Co Ltd 研磨パッド、それを用いた研磨方法および半導体デバイスの製造方法
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP5143518B2 (ja) * 2007-09-27 2013-02-13 株式会社クラレ 繊維複合研磨パッド
TWI473685B (zh) * 2008-01-15 2015-02-21 Iv Technologies Co Ltd 研磨墊及其製造方法
JP2009267367A (ja) * 2008-03-31 2009-11-12 Toshiba Corp 半導体装置の製造方法
JP4641319B2 (ja) * 2008-05-12 2011-03-02 ジヤトコ株式会社 無段変速機用ベルト
TWI409137B (zh) * 2008-06-19 2013-09-21 Bestac Advanced Material Co Ltd 研磨墊及其微型結構形成方法
US7906427B2 (en) * 2008-10-14 2011-03-15 General Electric Company Dimension profiling of SiC devices
KR20110084877A (ko) * 2008-10-16 2011-07-26 어플라이드 머티어리얼스, 인코포레이티드 텍스쳐 처리된 플래튼
KR101413030B1 (ko) 2009-03-24 2014-07-02 생-고벵 아브라시프 화학적 기계적 평탄화 패드 컨디셔너로 사용되는 연마 공구
CA2764358A1 (en) 2009-06-02 2010-12-09 Saint-Gobain Abrasives, Inc. Corrosion-resistant cmp conditioning tools and methods for making and using same
SG178605A1 (en) 2009-09-01 2012-04-27 Saint Gobain Abrasives Inc Chemical mechanical polishing conditioner
CN102665518A (zh) * 2009-12-29 2012-09-12 圣戈班磨料磨具有限公司 清洁家用品表面的方法
DE102010010885B4 (de) * 2010-03-10 2017-06-08 Siltronic Ag Verfahren zum Polieren einer Halbleiterscheibe
TWI510328B (zh) * 2010-05-03 2015-12-01 Iv Technologies Co Ltd 基底層、包括此基底層的研磨墊及研磨方法
US9228785B2 (en) 2010-05-04 2016-01-05 Alexander Poltorak Fractal heat transfer device
JP5715770B2 (ja) * 2010-06-17 2015-05-13 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 低欠陥の一体型窓を有する化学機械研磨パッド及び当該化学機械研磨パッドを用いて基体を化学機械研磨する方法
US9156124B2 (en) * 2010-07-08 2015-10-13 Nexplanar Corporation Soft polishing pad for polishing a semiconductor substrate
US8628384B2 (en) * 2010-09-30 2014-01-14 Nexplanar Corporation Polishing pad for eddy current end-point detection
US8657653B2 (en) 2010-09-30 2014-02-25 Nexplanar Corporation Homogeneous polishing pad for eddy current end-point detection
WO2013123105A2 (en) * 2012-02-14 2013-08-22 Innopad, Inc. Method of manufacturing a chemical mechanical planarization pad
US10722997B2 (en) 2012-04-02 2020-07-28 Thomas West, Inc. Multilayer polishing pads made by the methods for centrifugal casting of polymer polish pads
KR102100654B1 (ko) 2012-04-02 2020-04-14 토마스 웨스트 인코포레이티드 폴리머 연마패드의 원심주조를 위한 방법 및 시스템 및 상기 방법으로 만들어진 연마패드
US10022842B2 (en) * 2012-04-02 2018-07-17 Thomas West, Inc. Method and systems to control optical transmissivity of a polish pad material
US9067299B2 (en) 2012-04-25 2015-06-30 Applied Materials, Inc. Printed chemical mechanical polishing pad
JP5789634B2 (ja) * 2012-05-14 2015-10-07 株式会社荏原製作所 ワークピースを研磨するための研磨パッド並びに化学機械研磨装置、および該化学機械研磨装置を用いてワークピースを研磨する方法
US9034063B2 (en) * 2012-09-27 2015-05-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method of manufacturing grooved chemical mechanical polishing layers
US9993907B2 (en) * 2013-12-20 2018-06-12 Applied Materials, Inc. Printed chemical mechanical polishing pad having printed window
SG10201807026VA (en) * 2014-02-20 2018-09-27 Thomas West Inc Method and systems to control optical transmissivity of a polish pad material
US9216489B2 (en) * 2014-03-28 2015-12-22 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad with endpoint detection window
US9259821B2 (en) * 2014-06-25 2016-02-16 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing layer formulation with conditioning tolerance
US9873180B2 (en) 2014-10-17 2018-01-23 Applied Materials, Inc. CMP pad construction with composite material properties using additive manufacturing processes
US11745302B2 (en) 2014-10-17 2023-09-05 Applied Materials, Inc. Methods and precursor formulations for forming advanced polishing pads by use of an additive manufacturing process
US9776361B2 (en) 2014-10-17 2017-10-03 Applied Materials, Inc. Polishing articles and integrated system and methods for manufacturing chemical mechanical polishing articles
US10821573B2 (en) 2014-10-17 2020-11-03 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
US10875145B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Polishing pads produced by an additive manufacturing process
KR20240015167A (ko) 2014-10-17 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 애디티브 제조 프로세스들을 이용한 복합 재료 특성들을 갖는 cmp 패드 구성
US10875153B2 (en) 2014-10-17 2020-12-29 Applied Materials, Inc. Advanced polishing pad materials and formulations
US10399201B2 (en) 2014-10-17 2019-09-03 Applied Materials, Inc. Advanced polishing pads having compositional gradients by use of an additive manufacturing process
CN113103145B (zh) 2015-10-30 2023-04-11 应用材料公司 形成具有期望ζ电位的抛光制品的设备与方法
US10593574B2 (en) 2015-11-06 2020-03-17 Applied Materials, Inc. Techniques for combining CMP process tracking data with 3D printed CMP consumables
US10391605B2 (en) 2016-01-19 2019-08-27 Applied Materials, Inc. Method and apparatus for forming porous advanced polishing pads using an additive manufacturing process
KR20240015161A (ko) 2016-01-19 2024-02-02 어플라이드 머티어리얼스, 인코포레이티드 다공성 화학적 기계적 연마 패드들
SG11201806820UA (en) 2016-03-09 2018-09-27 Applied Materials Inc Correction of fabricated shapes in additive manufacturing
DE112017003526T5 (de) * 2016-07-12 2019-03-28 Noritake Co., Limited Polierkörper und herstellungsverfahren dafür
WO2018013668A1 (en) 2016-07-12 2018-01-18 Alexander Poltorak System and method for maintaining efficiency of a heat sink
US20180079153A1 (en) 2016-09-20 2018-03-22 Applied Materials, Inc. Control of dispensing operations for additive manufacturing of a polishing pad
US20180085888A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pads having a consistent pad surface microtexture
US20180085891A1 (en) * 2016-09-29 2018-03-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Apparatus for shaping the surface of chemical mechanical polishing pads
US9802293B1 (en) 2016-09-29 2017-10-31 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Method to shape the surface of chemical mechanical polishing pads
KR102329099B1 (ko) 2017-01-20 2021-11-19 어플라이드 머티어리얼스, 인코포레이티드 Cmp 응용들을 위한 얇은 플라스틱 연마 물품
KR102285674B1 (ko) * 2017-03-31 2021-08-04 후루카와 덴끼고교 가부시키가이샤 연마 패드
US20180304539A1 (en) 2017-04-21 2018-10-25 Applied Materials, Inc. Energy delivery system with array of energy sources for an additive manufacturing apparatus
US10967482B2 (en) 2017-05-25 2021-04-06 Applied Materials, Inc. Fabrication of polishing pad by additive manufacturing onto mold
US11084143B2 (en) 2017-05-25 2021-08-10 Applied Materials, Inc. Correction of fabricated shapes in additive manufacturing using modified edge
US11471999B2 (en) 2017-07-26 2022-10-18 Applied Materials, Inc. Integrated abrasive polishing pads and manufacturing methods
US11072050B2 (en) 2017-08-04 2021-07-27 Applied Materials, Inc. Polishing pad with window and manufacturing methods thereof
WO2019032286A1 (en) 2017-08-07 2019-02-14 Applied Materials, Inc. ABRASIVE DISTRIBUTION POLISHING PADS AND METHODS OF MAKING SAME
US11826876B2 (en) 2018-05-07 2023-11-28 Applied Materials, Inc. Hydrophilic and zeta potential tunable chemical mechanical polishing pads
KR20210042171A (ko) 2018-09-04 2021-04-16 어플라이드 머티어리얼스, 인코포레이티드 진보한 폴리싱 패드들을 위한 제형들
US11717936B2 (en) 2018-09-14 2023-08-08 Applied Materials, Inc. Methods for a web-based CMP system
US11851570B2 (en) 2019-04-12 2023-12-26 Applied Materials, Inc. Anionic polishing pads formed by printing processes
JP7514234B2 (ja) 2019-06-19 2024-07-10 株式会社クラレ 研磨パッド、研磨パッドの製造方法及び研磨方法
US11813712B2 (en) 2019-12-20 2023-11-14 Applied Materials, Inc. Polishing pads having selectively arranged porosity
JP7032469B2 (ja) * 2020-03-26 2022-03-08 大同メタル工業株式会社 摺動部材
US11806829B2 (en) 2020-06-19 2023-11-07 Applied Materials, Inc. Advanced polishing pads and related polishing pad manufacturing methods
US12138738B2 (en) * 2020-06-19 2024-11-12 Sk Enpulse Co., Ltd. Polishing pad, preparation method thereof and method for preparing semiconductor device using same
US11879850B2 (en) * 2020-07-22 2024-01-23 Elemental Scientific, Inc. Abrasive sampling system and method for representative, homogeneous, and planarized preparation of solid samples for laser ablation
KR102512675B1 (ko) * 2020-12-30 2023-03-21 에스케이엔펄스 주식회사 연마 패드, 연마 패드의 제조 방법 및 이를 이용한 반도체 소자의 제조 방법
US11878389B2 (en) 2021-02-10 2024-01-23 Applied Materials, Inc. Structures formed using an additive manufacturing process for regenerating surface texture in situ
CN114196327A (zh) * 2022-01-28 2022-03-18 淄博海泰新光光学技术有限公司 一种用于光学零件抛光的复合材料及制备方法
WO2025226271A1 (en) * 2024-04-25 2025-10-30 Ursa Major Technologies, Inc. Rocket motor additive manufacturing

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5081051A (en) 1990-09-12 1992-01-14 Intel Corporation Method for conditioning the surface of a polishing pad
US5489233A (en) 1994-04-08 1996-02-06 Rodel, Inc. Polishing pads and methods for their use
US5569062A (en) 1995-07-03 1996-10-29 Speedfam Corporation Polishing pad conditioning
KR100485847B1 (ko) 1997-04-04 2005-04-28 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 개선된 연마용 패드 및 이에 관한 방법
US6022268A (en) * 1998-04-03 2000-02-08 Rodel Holdings Inc. Polishing pads and methods relating thereto
US5990010A (en) 1997-04-08 1999-11-23 Lsi Logic Corporation Pre-conditioning polishing pads for chemical-mechanical polishing
US5921855A (en) * 1997-05-15 1999-07-13 Applied Materials, Inc. Polishing pad having a grooved pattern for use in a chemical mechanical polishing system
US6139402A (en) * 1997-12-30 2000-10-31 Micron Technology, Inc. Method and apparatus for mechanical and chemical-mechanical planarization of microelectronic substrates

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