JP2002134445A5 - - Google Patents
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- Publication number
- JP2002134445A5 JP2002134445A5 JP2000324139A JP2000324139A JP2002134445A5 JP 2002134445 A5 JP2002134445 A5 JP 2002134445A5 JP 2000324139 A JP2000324139 A JP 2000324139A JP 2000324139 A JP2000324139 A JP 2000324139A JP 2002134445 A5 JP2002134445 A5 JP 2002134445A5
- Authority
- JP
- Japan
- Prior art keywords
- group
- composition
- mass
- polishing
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 24
- 239000000126 substance Substances 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 13
- 229920001971 elastomer Polymers 0.000 claims description 6
- 239000000806 elastomer Substances 0.000 claims description 6
- 125000000524 functional group Chemical group 0.000 claims description 5
- 229920000642 polymer Polymers 0.000 claims description 4
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 125000000542 sulfonic acid group Chemical group 0.000 claims description 2
- 125000002897 diene group Chemical group 0.000 claims 1
- 239000011159 matrix material Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical group O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 239000005062 Polybutadiene Substances 0.000 description 2
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 2
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 2
- 150000001993 dienes Chemical class 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 description 2
- GEYXPJBPASPPLI-UHFFFAOYSA-N manganese(iii) oxide Chemical compound O=[Mn]O[Mn]=O GEYXPJBPASPPLI-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000001451 organic peroxides Chemical class 0.000 description 2
- 229920002857 polybutadiene Polymers 0.000 description 2
- -1 polyethylene Polymers 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 229910052783 alkali metal Inorganic materials 0.000 description 1
- 150000001340 alkali metals Chemical class 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000002216 antistatic agent Substances 0.000 description 1
- AYJRCSIUFZENHW-DEQYMQKBSA-L barium(2+);oxomethanediolate Chemical compound [Ba+2].[O-][14C]([O-])=O AYJRCSIUFZENHW-DEQYMQKBSA-L 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- CETPSERCERDGAM-UHFFFAOYSA-N ceric oxide Chemical compound O=[Ce]=O CETPSERCERDGAM-UHFFFAOYSA-N 0.000 description 1
- 229910000422 cerium(IV) oxide Inorganic materials 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000008119 colloidal silica Chemical group 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 239000010954 inorganic particle Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 239000007800 oxidant agent Substances 0.000 description 1
- 239000003002 pH adjusting agent Substances 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 229920003169 water-soluble polymer Polymers 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000324139A JP3826702B2 (ja) | 2000-10-24 | 2000-10-24 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| EP01125161A EP1201368B1 (en) | 2000-10-24 | 2001-10-23 | Polishing pad comprising a water-insoluble substance and method for producing thereof |
| KR1020010065504A KR100770083B1 (ko) | 2000-10-24 | 2001-10-23 | 연마 패드용 조성물, 연마 패드용 가교결합체, 그를 사용한 연마 패드 및 그의 제조 방법 |
| US09/983,097 US6645264B2 (en) | 2000-10-24 | 2001-10-23 | Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereof |
| DE60132413T DE60132413T2 (de) | 2000-10-24 | 2001-10-23 | Wasserumlöslichen Verbindung enthaltendes Polierkissen und Verfahren zur Herstellung desselben |
| TW090126298A TWI263558B (en) | 2000-10-24 | 2001-10-24 | Composition for forming polishing pad and polishing pad using the same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000324139A JP3826702B2 (ja) | 2000-10-24 | 2000-10-24 | 研磨パッド用組成物及びこれを用いた研磨パッド |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2002134445A JP2002134445A (ja) | 2002-05-10 |
| JP2002134445A5 true JP2002134445A5 (https=) | 2004-12-09 |
| JP3826702B2 JP3826702B2 (ja) | 2006-09-27 |
Family
ID=18801716
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000324139A Expired - Fee Related JP3826702B2 (ja) | 2000-10-24 | 2000-10-24 | 研磨パッド用組成物及びこれを用いた研磨パッド |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US6645264B2 (https=) |
| EP (1) | EP1201368B1 (https=) |
| JP (1) | JP3826702B2 (https=) |
| KR (1) | KR100770083B1 (https=) |
| DE (1) | DE60132413T2 (https=) |
| TW (1) | TWI263558B (https=) |
Families Citing this family (48)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| MY114512A (en) * | 1992-08-19 | 2002-11-30 | Rodel Inc | Polymeric substrate with polymeric microelements |
| US6616513B1 (en) * | 2000-04-07 | 2003-09-09 | Applied Materials, Inc. | Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile |
| JP3925041B2 (ja) * | 2000-05-31 | 2007-06-06 | Ｊｓｒ株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| TWI228768B (en) * | 2002-08-08 | 2005-03-01 | Jsr Corp | Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer |
| EP1394202A3 (en) * | 2002-08-26 | 2004-03-31 | JSR Corporation | Composition for polishing pad and polishing pad therewith |
| US20040058623A1 (en) * | 2002-09-20 | 2004-03-25 | Lam Research Corporation | Polishing media for chemical mechanical planarization (CMP) |
| JP4039214B2 (ja) | 2002-11-05 | 2008-01-30 | Ｊｓｒ株式会社 | 研磨パッド |
| TW592894B (en) * | 2002-11-19 | 2004-06-21 | Iv Technologies Co Ltd | Method of fabricating a polishing pad |
| JP3910921B2 (ja) * | 2003-02-06 | 2007-04-25 | 株式会社東芝 | 研磨布および半導体装置の製造方法 |
| US7704125B2 (en) | 2003-03-24 | 2010-04-27 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| US8864859B2 (en) * | 2003-03-25 | 2014-10-21 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| CA2519942A1 (en) | 2003-03-25 | 2004-10-14 | Neopad Technologies Corporation | Chip customized polish pads for chemical mechanical planarization (cmp) |
| US9278424B2 (en) | 2003-03-25 | 2016-03-08 | Nexplanar Corporation | Customized polishing pads for CMP and methods of fabrication and use thereof |
| CN100548576C (zh) * | 2003-04-25 | 2009-10-14 | Jsr株式会社 | 抛光垫和化学机械抛光方法 |
| US7086932B2 (en) * | 2004-05-11 | 2006-08-08 | Freudenberg Nonwovens | Polishing pad |
| JP2005246599A (ja) * | 2004-02-05 | 2005-09-15 | Jsr Corp | 化学機械研磨用パッド及び化学機械研磨方法 |
| JP4697399B2 (ja) * | 2004-06-11 | 2011-06-08 | Ｊｓｒ株式会社 | 化学機械研磨パッド及び化学機械研磨方法 |
| TWI385050B (zh) * | 2005-02-18 | 2013-02-11 | Nexplanar Corp | 用於ｃｍｐ之特製拋光墊及其製造方法及其用途 |
| SG160368A1 (en) | 2005-03-08 | 2010-04-29 | Toyo Tire & Rubber Co | Polishing pad and process for producing the same |
| WO2006123559A1 (ja) | 2005-05-17 | 2006-11-23 | Toyo Tire & Rubber Co., Ltd. | 研磨パッド |
| JP4884725B2 (ja) | 2005-08-30 | 2012-02-29 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP5031236B2 (ja) | 2006-01-10 | 2012-09-19 | 東洋ゴム工業株式会社 | 研磨パッド |
| KR20080090496A (ko) * | 2006-02-03 | 2008-10-08 | 제이에스알 가부시끼가이샤 | 화학 기계 연마 패드 |
| US7591739B2 (en) * | 2006-06-30 | 2009-09-22 | Bridgestone Sports Co., Ltd. | Golf ball material, golf ball, and method for preparing golf ball material |
| CN102152233B (zh) | 2006-08-28 | 2013-10-30 | 东洋橡胶工业株式会社 | 抛光垫 |
| JP5008927B2 (ja) | 2006-08-31 | 2012-08-22 | 東洋ゴム工業株式会社 | 研磨パッド |
| US7438636B2 (en) * | 2006-12-21 | 2008-10-21 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US7371160B1 (en) | 2006-12-21 | 2008-05-13 | Rohm And Haas Electronic Materials Cmp Holdings Inc. | Elastomer-modified chemical mechanical polishing pad |
| JP5078000B2 (ja) | 2007-03-28 | 2012-11-21 | 東洋ゴム工業株式会社 | 研磨パッド |
| EP2083027B8 (en) | 2008-01-24 | 2012-05-16 | JSR Corporation | Mechanical polishing pad and chemical mechanical polishing method |
| JP2008149458A (ja) * | 2008-03-03 | 2008-07-03 | Jsr Corp | 研磨パッド用組成物及びこれを用いた研磨パッド |
| CN102884641B (zh) * | 2010-03-16 | 2016-07-06 | 皇家飞利浦电子股份有限公司 | 具有可切换的照明/反射的光伏电池装置 |
| WO2013042507A1 (ja) * | 2011-09-22 | 2013-03-28 | 東洋ゴム工業株式会社 | 研磨パッド |
| JP2013086217A (ja) * | 2011-10-19 | 2013-05-13 | Dic Corp | 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法 |
| KR101417274B1 (ko) * | 2012-05-23 | 2014-07-09 | 삼성전자주식회사 | 연마패드 및 그 제조방법 |
| US9144880B2 (en) | 2012-11-01 | 2015-09-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad |
| US9238295B2 (en) | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical window polishing pad |
| US9238296B2 (en) | 2013-05-31 | 2016-01-19 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer |
| US9233451B2 (en) | 2013-05-31 | 2016-01-12 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Soft and conditionable chemical mechanical polishing pad stack |
| JP5871978B2 (ja) | 2014-03-14 | 2016-03-01 | 東洋ゴム工業株式会社 | 研磨パッド及びその製造方法 |
| JP6312471B2 (ja) | 2014-03-14 | 2018-04-18 | ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド | 研磨パッド及びその製造方法 |
| US20150306731A1 (en) | 2014-04-25 | 2015-10-29 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing pad |
| US9484212B1 (en) | 2015-10-30 | 2016-11-01 | Rohm And Haas Electronic Materials Cmp Holdings, Inc. | Chemical mechanical polishing method |
| WO2017175894A1 (ko) * | 2016-04-06 | 2017-10-12 | 케이피엑스케미칼 주식회사 | 연마패드 제조 방법 |
| US12109665B2 (en) * | 2018-05-11 | 2024-10-08 | Kuraray Co., Ltd. | Modification method of polyurethane, polyurethane, polishing pad, and modification method of polishing pad |
| JP2024517999A (ja) * | 2021-04-26 | 2024-04-23 | ケムパワー コーポレーション | パッド表面の再生および金属の回収 |
| EP4395960A4 (en) | 2021-09-03 | 2025-09-24 | Chempower Corp | TOOLS FOR CHEMICAL PLANARIZATION |
| CN115305057B (zh) * | 2022-07-27 | 2023-11-21 | 安徽禾臣新材料有限公司 | 一种超细精密抛光粉及其制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4830438B1 (https=) * | 1970-07-15 | 1973-09-20 | ||
| SU901041A1 (ru) * | 1979-04-25 | 1982-01-30 | Опытное Конструкторско-Технологическое Бюро "Кристалл" Ленинградского Ордена Октябрьской Революции И Ордена Трудового Красного Знамени Технологического Института Им.Ленсовета | Абразивна масса дл изготовлени шлифовального инструмента |
| RU2070852C1 (ru) * | 1993-05-25 | 1996-12-27 | Государственное научно-производственное объединение "Оптика" | Состав алмазного инструмента |
| JPH09314657A (ja) * | 1996-05-30 | 1997-12-09 | Sekisui Chem Co Ltd | ポリエチレン成形体の製造方法 |
| JPH1148130A (ja) * | 1997-07-31 | 1999-02-23 | Sony Corp | 研磨布及びその製造方法、半導体ウェーハの化学機械研磨装置及び化学機械研磨方法 |
| JPH11322877A (ja) | 1998-05-12 | 1999-11-26 | Dainippon Ink & Chem Inc | 微細泡含有成形物の製造方法及び微細泡含有成形物用ウレタン樹脂組成物 |
| JP3918359B2 (ja) * | 1998-05-15 | 2007-05-23 | Ｊｓｒ株式会社 | 研磨パッド用重合体組成物および研磨パッド |
| US6390890B1 (en) * | 1999-02-06 | 2002-05-21 | Charles J Molnar | Finishing semiconductor wafers with a fixed abrasive finishing element |
| JP2000232082A (ja) * | 1998-12-11 | 2000-08-22 | Toray Ind Inc | 研磨パッドおよび研磨装置 |
| JP2000263423A (ja) | 1999-03-16 | 2000-09-26 | Toray Ind Inc | 研磨パッドおよび研磨装置 |
| JP3925041B2 (ja) * | 2000-05-31 | 2007-06-06 | Ｊｓｒ株式会社 | 研磨パッド用組成物及びこれを用いた研磨パッド |
-
2000
- 2000-10-24 JP JP2000324139A patent/JP3826702B2/ja not_active Expired - Fee Related
-
2001
- 2001-10-23 DE DE60132413T patent/DE60132413T2/de not_active Expired - Lifetime
- 2001-10-23 US US09/983,097 patent/US6645264B2/en not_active Expired - Lifetime
- 2001-10-23 KR KR1020010065504A patent/KR100770083B1/ko not_active Expired - Fee Related
- 2001-10-23 EP EP01125161A patent/EP1201368B1/en not_active Expired - Lifetime
- 2001-10-24 TW TW090126298A patent/TWI263558B/zh not_active IP Right Cessation
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