KR100770083B1 - 연마 패드용 조성물, 연마 패드용 가교결합체, 그를 사용한 연마 패드 및 그의 제조 방법 - Google Patents

연마 패드용 조성물, 연마 패드용 가교결합체, 그를 사용한 연마 패드 및 그의 제조 방법 Download PDF

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Publication number
KR100770083B1
KR100770083B1 KR1020010065504A KR20010065504A KR100770083B1 KR 100770083 B1 KR100770083 B1 KR 100770083B1 KR 1020010065504 A KR1020010065504 A KR 1020010065504A KR 20010065504 A KR20010065504 A KR 20010065504A KR 100770083 B1 KR100770083 B1 KR 100770083B1
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KR
South Korea
Prior art keywords
group
polishing pad
composition
water
carboxyl
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Expired - Fee Related
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KR1020010065504A
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English (en)
Korean (ko)
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KR20020032330A (ko
Inventor
고 하세가와
도무 고무라
유따까 고바야시
Original Assignee
제이에스알 가부시끼가이샤
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Publication of KR20020032330A publication Critical patent/KR20020032330A/ko
Application granted granted Critical
Publication of KR100770083B1 publication Critical patent/KR100770083B1/ko
Anticipated expiration legal-status Critical
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
KR1020010065504A 2000-10-24 2001-10-23 연마 패드용 조성물, 연마 패드용 가교결합체, 그를 사용한 연마 패드 및 그의 제조 방법 Expired - Fee Related KR100770083B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2000-00324139 2000-10-24
JP2000324139A JP3826702B2 (ja) 2000-10-24 2000-10-24 研磨パッド用組成物及びこれを用いた研磨パッド

Publications (2)

Publication Number Publication Date
KR20020032330A KR20020032330A (ko) 2002-05-03
KR100770083B1 true KR100770083B1 (ko) 2007-10-24

Family

ID=18801716

Family Applications (1)

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KR1020010065504A Expired - Fee Related KR100770083B1 (ko) 2000-10-24 2001-10-23 연마 패드용 조성물, 연마 패드용 가교결합체, 그를 사용한 연마 패드 및 그의 제조 방법

Country Status (6)

Country Link
US (1) US6645264B2 (https=)
EP (1) EP1201368B1 (https=)
JP (1) JP3826702B2 (https=)
KR (1) KR100770083B1 (https=)
DE (1) DE60132413T2 (https=)
TW (1) TWI263558B (https=)

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JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) * 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
CA2519942A1 (en) 2003-03-25 2004-10-14 Neopad Technologies Corporation Chip customized polish pads for chemical mechanical planarization (cmp)
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
CN100548576C (zh) * 2003-04-25 2009-10-14 Jsr株式会社 抛光垫和化学机械抛光方法
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
JP2005246599A (ja) * 2004-02-05 2005-09-15 Jsr Corp 化学機械研磨用パッド及び化学機械研磨方法
JP4697399B2 (ja) * 2004-06-11 2011-06-08 Ｊｓｒ株式会社 化学機械研磨パッド及び化学機械研磨方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
SG160368A1 (en) 2005-03-08 2010-04-29 Toyo Tire & Rubber Co Polishing pad and process for producing the same
WO2006123559A1 (ja) 2005-05-17 2006-11-23 Toyo Tire & Rubber Co., Ltd. 研磨パッド
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
KR20080090496A (ko) * 2006-02-03 2008-10-08 제이에스알 가부시끼가이샤 화학 기계 연마 패드
US7591739B2 (en) * 2006-06-30 2009-09-22 Bridgestone Sports Co., Ltd. Golf ball material, golf ball, and method for preparing golf ball material
CN102152233B (zh) 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7371160B1 (en) 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
EP2083027B8 (en) 2008-01-24 2012-05-16 JSR Corporation Mechanical polishing pad and chemical mechanical polishing method
JP2008149458A (ja) * 2008-03-03 2008-07-03 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド
CN102884641B (zh) * 2010-03-16 2016-07-06 皇家飞利浦电子股份有限公司 具有可切换的照明/反射的光伏电池装置
WO2013042507A1 (ja) * 2011-09-22 2013-03-28 東洋ゴム工業株式会社 研磨パッド
JP2013086217A (ja) * 2011-10-19 2013-05-13 Dic Corp 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法
KR101417274B1 (ko) * 2012-05-23 2014-07-09 삼성전자주식회사 연마패드 및 그 제조방법
US9144880B2 (en) 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
JP5871978B2 (ja) 2014-03-14 2016-03-01 東洋ゴム工業株式会社 研磨パッド及びその製造方法
JP6312471B2 (ja) 2014-03-14 2018-04-18 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 研磨パッド及びその製造方法
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
WO2017175894A1 (ko) * 2016-04-06 2017-10-12 케이피엑스케미칼 주식회사 연마패드 제조 방법
US12109665B2 (en) * 2018-05-11 2024-10-08 Kuraray Co., Ltd. Modification method of polyurethane, polyurethane, polishing pad, and modification method of polishing pad
JP2024517999A (ja) * 2021-04-26 2024-04-23 ケムパワー コーポレーション パッド表面の再生および金属の回収
EP4395960A4 (en) 2021-09-03 2025-09-24 Chempower Corp TOOLS FOR CHEMICAL PLANARIZATION
CN115305057B (zh) * 2022-07-27 2023-11-21 安徽禾臣新材料有限公司 一种超细精密抛光粉及其制备方法

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JPH09314657A (ja) * 1996-05-30 1997-12-09 Sekisui Chem Co Ltd ポリエチレン成形体の製造方法
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JP2000034416A (ja) * 1998-05-15 2000-02-02 Jsr Corp 重合体組成物および研磨パッド
JP2000232082A (ja) * 1998-12-11 2000-08-22 Toray Ind Inc 研磨パッドおよび研磨装置

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JPH09314657A (ja) * 1996-05-30 1997-12-09 Sekisui Chem Co Ltd ポリエチレン成形体の製造方法
JPH1148130A (ja) * 1997-07-31 1999-02-23 Sony Corp 研磨布及びその製造方法、半導体ウェーハの化学機械研磨装置及び化学機械研磨方法
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Also Published As

Publication number Publication date
DE60132413D1 (de) 2008-03-06
JP2002134445A (ja) 2002-05-10
US20020078632A1 (en) 2002-06-27
TWI263558B (en) 2006-10-11
KR20020032330A (ko) 2002-05-03
EP1201368A3 (en) 2004-02-11
JP3826702B2 (ja) 2006-09-27
EP1201368A2 (en) 2002-05-02
DE60132413T2 (de) 2009-01-08
EP1201368B1 (en) 2008-01-16
US6645264B2 (en) 2003-11-11

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