DE60132413D1 - Wasserumlöslichen Verbindung enthaltendes Polierkissen und Verfahren zur Herstellung desselben - Google Patents

Wasserumlöslichen Verbindung enthaltendes Polierkissen und Verfahren zur Herstellung desselben

Info

Publication number
DE60132413D1
DE60132413D1 DE60132413T DE60132413T DE60132413D1 DE 60132413 D1 DE60132413 D1 DE 60132413D1 DE 60132413 T DE60132413 T DE 60132413T DE 60132413 T DE60132413 T DE 60132413T DE 60132413 D1 DE60132413 D1 DE 60132413D1
Authority
DE
Germany
Prior art keywords
producing
water
same
polishing pad
soluble compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60132413T
Other languages
English (en)
Other versions
DE60132413T2 (de
Inventor
Kou Hasegawa
Tomoo Koumura
Yutaka Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Application granted granted Critical
Publication of DE60132413D1 publication Critical patent/DE60132413D1/de
Publication of DE60132413T2 publication Critical patent/DE60132413T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE60132413T 2000-10-24 2001-10-23 Wasserumlöslichen Verbindung enthaltendes Polierkissen und Verfahren zur Herstellung desselben Expired - Lifetime DE60132413T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000324139A JP3826702B2 (ja) 2000-10-24 2000-10-24 研磨パッド用組成物及びこれを用いた研磨パッド
JP2000324139 2000-10-24

Publications (2)

Publication Number Publication Date
DE60132413D1 true DE60132413D1 (de) 2008-03-06
DE60132413T2 DE60132413T2 (de) 2009-01-08

Family

ID=18801716

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60132413T Expired - Lifetime DE60132413T2 (de) 2000-10-24 2001-10-23 Wasserumlöslichen Verbindung enthaltendes Polierkissen und Verfahren zur Herstellung desselben

Country Status (6)

Country Link
US (1) US6645264B2 (de)
EP (1) EP1201368B1 (de)
JP (1) JP3826702B2 (de)
KR (1) KR100770083B1 (de)
DE (1) DE60132413T2 (de)
TW (1) TWI263558B (de)

Families Citing this family (44)

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MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
TWI228768B (en) * 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
US20040063391A1 (en) * 2002-08-26 2004-04-01 Jsr Corporation Composition for polishing pad and polishing pad therewith
US20040058623A1 (en) * 2002-09-20 2004-03-25 Lam Research Corporation Polishing media for chemical mechanical planarization (CMP)
JP4039214B2 (ja) * 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) * 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
CA2519942A1 (en) 2003-03-25 2004-10-14 Neopad Technologies Corporation Chip customized polish pads for chemical mechanical planarization (cmp)
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
JP2004343099A (ja) * 2003-04-25 2004-12-02 Jsr Corp 研磨パッドおよび化学機械研磨方法
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
JP2005246599A (ja) * 2004-02-05 2005-09-15 Jsr Corp 化学機械研磨用パッド及び化学機械研磨方法
JP4697399B2 (ja) * 2004-06-11 2011-06-08 Ｊｓｒ株式会社 化学機械研磨パッド及び化学機械研磨方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
CN101115779B (zh) 2005-03-08 2012-09-19 东洋橡胶工业株式会社 研磨垫及其制造方法
US8304467B2 (en) 2005-05-17 2012-11-06 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
EP1981070A4 (de) * 2006-02-03 2011-08-17 Jsr Corp Polierkissen für chemisch-mechanisches polieren
US7591739B2 (en) * 2006-06-30 2009-09-22 Bridgestone Sports Co., Ltd. Golf ball material, golf ball, and method for preparing golf ball material
CN101489721B (zh) 2006-08-28 2014-06-18 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US7371160B1 (en) 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
EP2083027B8 (de) 2008-01-24 2012-05-16 JSR Corporation Chemisch mechanisches Polierkissen und chemisch mechanisches Polierverfahren
JP2008149458A (ja) * 2008-03-03 2008-07-03 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド
KR101532990B1 (ko) * 2011-09-22 2015-07-01 도요 고무 고교 가부시키가이샤 연마 패드
JP2013086217A (ja) * 2011-10-19 2013-05-13 Dic Corp 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法
US9144880B2 (en) 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
JP6312471B2 (ja) 2014-03-14 2018-04-18 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 研磨パッド及びその製造方法
JP5871978B2 (ja) 2014-03-14 2016-03-01 東洋ゴム工業株式会社 研磨パッド及びその製造方法
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
CN107646138B (zh) * 2016-04-06 2020-11-06 Kpx化工有限公司 研磨垫制造方法
EP3792295A4 (de) * 2018-05-11 2022-05-11 Kuraray Co., Ltd. Verfahren zur modifizierung von polyurethan, polyurethan, polierkissen und verfahren zur modifizierung eines polierkissens
CN115305057B (zh) * 2022-07-27 2023-11-21 安徽禾臣新材料有限公司 一种超细精密抛光粉及其制备方法

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JPS4830438B1 (de) * 1970-07-15 1973-09-20
SU901041A1 (ru) * 1979-04-25 1982-01-30 Опытное Конструкторско-Технологическое Бюро "Кристалл" Ленинградского Ордена Октябрьской Революции И Ордена Трудового Красного Знамени Технологического Института Им.Ленсовета Абразивна масса дл изготовлени шлифовального инструмента
RU2070852C1 (ru) * 1993-05-25 1996-12-27 Государственное научно-производственное объединение "Оптика" Состав алмазного инструмента
JPH09314657A (ja) * 1996-05-30 1997-12-09 Sekisui Chem Co Ltd ポリエチレン成形体の製造方法
JPH1148130A (ja) * 1997-07-31 1999-02-23 Sony Corp 研磨布及びその製造方法、半導体ウェーハの化学機械研磨装置及び化学機械研磨方法
JPH11322877A (ja) 1998-05-12 1999-11-26 Dainippon Ink & Chem Inc 微細泡含有成形物の製造方法及び微細泡含有成形物用ウレタン樹脂組成物
JP3918359B2 (ja) * 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
US6390890B1 (en) * 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
JP2000232082A (ja) * 1998-12-11 2000-08-22 Toray Ind Inc 研磨パッドおよび研磨装置
JP2000263423A (ja) 1999-03-16 2000-09-26 Toray Ind Inc 研磨パッドおよび研磨装置
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド

Also Published As

Publication number Publication date
DE60132413T2 (de) 2009-01-08
JP3826702B2 (ja) 2006-09-27
KR20020032330A (ko) 2002-05-03
KR100770083B1 (ko) 2007-10-24
EP1201368B1 (de) 2008-01-16
US20020078632A1 (en) 2002-06-27
EP1201368A2 (de) 2002-05-02
TWI263558B (en) 2006-10-11
JP2002134445A (ja) 2002-05-10
EP1201368A3 (de) 2004-02-11
US6645264B2 (en) 2003-11-11

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