DE60001292T2 - Siliciumnitridsinterkörper und Verfahren zum Herstellen desselben - Google Patents

Siliciumnitridsinterkörper und Verfahren zum Herstellen desselben

Info

Publication number
DE60001292T2
DE60001292T2 DE60001292T DE60001292T DE60001292T2 DE 60001292 T2 DE60001292 T2 DE 60001292T2 DE 60001292 T DE60001292 T DE 60001292T DE 60001292 T DE60001292 T DE 60001292T DE 60001292 T2 DE60001292 T2 DE 60001292T2
Authority
DE
Germany
Prior art keywords
producing
same
silicon nitride
sintered body
nitride sintered
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60001292T
Other languages
English (en)
Other versions
DE60001292D1 (de
Inventor
Kiyoshi Araki
Katsuhiro Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Application granted granted Critical
Publication of DE60001292D1 publication Critical patent/DE60001292D1/de
Publication of DE60001292T2 publication Critical patent/DE60001292T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/58—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides
    • C04B35/584—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride
    • C04B35/593—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride obtained by pressure sintering
    • C04B35/5935—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on borides, nitrides, i.e. nitrides, oxynitrides, carbonitrides or oxycarbonitrides or silicides based on silicon nitride obtained by pressure sintering obtained by gas pressure sintering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Structural Engineering (AREA)
  • Organic Chemistry (AREA)
  • Ceramic Products (AREA)
DE60001292T 1999-06-23 2000-06-20 Siliciumnitridsinterkörper und Verfahren zum Herstellen desselben Expired - Lifetime DE60001292T2 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17647899 1999-06-23

Publications (2)

Publication Number Publication Date
DE60001292D1 DE60001292D1 (de) 2003-03-06
DE60001292T2 true DE60001292T2 (de) 2003-11-13

Family

ID=16014379

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60001292T Expired - Lifetime DE60001292T2 (de) 1999-06-23 2000-06-20 Siliciumnitridsinterkörper und Verfahren zum Herstellen desselben

Country Status (3)

Country Link
US (1) US6391812B1 (de)
EP (1) EP1063211B1 (de)
DE (1) DE60001292T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017211320A1 (de) * 2017-07-04 2019-01-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bauteil, das mit ß-Siliciumnitridwerkstoff gebildet ist und ein Verfahren zu seiner Herstellung

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DE10146227B4 (de) * 2000-09-20 2015-01-29 Hitachi Metals, Ltd. Siliciumnitrid-Sinterkörper, Leiterplatte und thermoelektrisches Modul
EP1382589B1 (de) * 2002-06-13 2006-08-23 NGK Spark Plug Co., Ltd. Gesintertes Siliziumnitrid, Schneidplättchen, abriebfester Teil, Schneidwerkzeug und Verfahren zur Herstellung von gesintertem Siliziumnitrid
US7019390B2 (en) * 2004-02-03 2006-03-28 Visteon Global Technologies, Inc. Silicon nitride insulating substrate for power semiconductor module
EP2377839B1 (de) * 2009-01-13 2016-10-26 Hitachi Metals, Ltd. Verfahren zur herstellung eines siliciumnitridsubstrats
US8652981B2 (en) * 2010-01-21 2014-02-18 Ceradyne, Inc. Dense silicon nitride body having high strength, high Weibull modulus and high fracture toughness
CN103370174B (zh) 2010-12-31 2017-03-29 圣戈本陶瓷及塑料股份有限公司 具有特定形状的研磨颗粒和此类颗粒的形成方法
CN103764349B (zh) 2011-06-30 2017-06-09 圣戈本陶瓷及塑料股份有限公司 液相烧结碳化硅研磨颗粒
WO2013003830A2 (en) 2011-06-30 2013-01-03 Saint-Gobain Ceramics & Plastics, Inc. Abrasive articles including abrasive particles of silicon nitride
BR112014007089A2 (pt) 2011-09-26 2017-03-28 Saint-Gobain Ceram & Plastics Inc artigos abrasivos incluindo materiais de partículas abrasivas, abrasivos revestidos usando os materiais de partículas abrasivas e os métodos de formação
WO2013094665A1 (ja) 2011-12-22 2013-06-27 信越化学工業株式会社 複合基板
KR102187425B1 (ko) 2011-12-30 2020-12-09 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마입자 및 이의 형성방법
CN104114664B (zh) 2011-12-30 2016-06-15 圣戈本陶瓷及塑料股份有限公司 形成成型研磨颗粒
PL2797716T3 (pl) 2011-12-30 2021-07-05 Saint-Gobain Ceramics & Plastics, Inc. Kompozytowe ukształtowane cząstki ścierne i sposób ich formowania
EP3705177A1 (de) 2012-01-10 2020-09-09 Saint-Gobain Ceramics & Plastics Inc. Schleifpartikel mit komplexen formen und verfahren diese zu formen
US8840696B2 (en) 2012-01-10 2014-09-23 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particles having particular shapes and methods of forming such particles
US9242346B2 (en) 2012-03-30 2016-01-26 Saint-Gobain Abrasives, Inc. Abrasive products having fibrillated fibers
KR102534897B1 (ko) 2012-05-23 2023-05-30 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 형상화 연마입자들 및 이의 형성방법
US10106714B2 (en) 2012-06-29 2018-10-23 Saint-Gobain Ceramics & Plastics, Inc. Abrasive particles having particular shapes and methods of forming such particles
US9440332B2 (en) 2012-10-15 2016-09-13 Saint-Gobain Abrasives, Inc. Abrasive particles having particular shapes and methods of forming such particles
KR101818946B1 (ko) 2012-12-31 2018-01-17 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 미립자 소재 및 이의 형성방법
CN107685296B (zh) 2013-03-29 2020-03-06 圣戈班磨料磨具有限公司 具有特定形状的磨粒、形成这种粒子的方法及其用途
TW201502263A (zh) 2013-06-28 2015-01-16 Saint Gobain Ceramics 包含成形研磨粒子之研磨物品
CA3114978A1 (en) 2013-09-30 2015-04-02 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particles and methods of forming same
KR101870617B1 (ko) 2013-12-31 2018-06-26 생-고뱅 어브레이시브즈, 인코포레이티드 형상화 연마 입자들을 포함하는 연마 물품
US9771507B2 (en) 2014-01-31 2017-09-26 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle including dopant material and method of forming same
CN106062922B (zh) 2014-02-21 2019-04-05 信越化学工业株式会社 复合基板
DE112015001562B4 (de) * 2014-03-31 2022-03-03 Japan Fine Ceramics Co. Ltd. Verfahren zur Herstellung eines Siliciumnitrid-Substrates
ES2972193T3 (es) 2014-04-14 2024-06-11 Saint Gobain Ceramics Artículo abrasivo que incluye partículas abrasivas conformadas
MX2016013464A (es) 2014-04-14 2017-04-13 Saint-Gobain Ceram & Plastics Inc Articulo abrasivo que incluye particulas abrasivas conformadas.
WO2015184355A1 (en) 2014-05-30 2015-12-03 Saint-Gobain Abrasives, Inc. Method of using an abrasive article including shaped abrasive particles
JP6208646B2 (ja) 2014-09-30 2017-10-04 信越化学工業株式会社 貼り合わせ基板とその製造方法、および貼り合わせ用支持基板
US9707529B2 (en) 2014-12-23 2017-07-18 Saint-Gobain Ceramics & Plastics, Inc. Composite shaped abrasive particles and method of forming same
US9914864B2 (en) 2014-12-23 2018-03-13 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particles and method of forming same
US9676981B2 (en) * 2014-12-24 2017-06-13 Saint-Gobain Ceramics & Plastics, Inc. Shaped abrasive particle fractions and method of forming same
WO2016161157A1 (en) 2015-03-31 2016-10-06 Saint-Gobain Abrasives, Inc. Fixed abrasive articles and methods of forming same
TWI634200B (zh) 2015-03-31 2018-09-01 聖高拜磨料有限公司 固定磨料物品及其形成方法
EP3307483B1 (de) 2015-06-11 2020-06-17 Saint-Gobain Ceramics&Plastics, Inc. Schleifartikel mit geformten schleifpartikeln
CN109462993A (zh) 2016-05-10 2019-03-12 圣戈本陶瓷及塑料股份有限公司 磨料颗粒及其形成方法
PL3455321T3 (pl) 2016-05-10 2022-12-12 Saint-Gobain Ceramics&Plastics, Inc. Sposób formowania cząstek ściernych
EP4349896A3 (de) 2016-09-29 2024-06-12 Saint-Gobain Abrasives, Inc. Feste schleifartikel und verfahren zur formung davon
US10563105B2 (en) 2017-01-31 2020-02-18 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
US10759024B2 (en) 2017-01-31 2020-09-01 Saint-Gobain Ceramics & Plastics, Inc. Abrasive article including shaped abrasive particles
WO2018236989A1 (en) 2017-06-21 2018-12-27 Saint-Gobain Ceramics & Plastics, Inc. PARTICULATE MATERIALS AND METHODS OF FORMATION THEREOF
KR20220116556A (ko) 2019-12-27 2022-08-23 세인트-고바인 세라믹스 앤드 플라스틱스, 인크. 연마 물품 및 이의 형성 방법

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US3890250A (en) 1973-03-14 1975-06-17 Norton Co Hot pressed silicon nitride containing finely dispersed silicon carbide or silicon aluminum oxynitride
SU612913A1 (ru) 1976-03-09 1978-06-30 Ордена Трудового Красного Знамени Институт Проблем Материаловедения Ан Украинской Сср Огнеупорный материал
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US5238884A (en) * 1990-01-23 1993-08-24 Ngk Insulators, Ltd. Silicon nitride bodies and a process for producing the same
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KR0143870B1 (ko) * 1993-12-27 1998-07-01 사토 후미오 고열전도성 질화규소 구조부재 및 반도체 패키지, 히터, 서멀헤드
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102017211320A1 (de) * 2017-07-04 2019-01-10 Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. Bauteil, das mit ß-Siliciumnitridwerkstoff gebildet ist und ein Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
EP1063211A1 (de) 2000-12-27
DE60001292D1 (de) 2003-03-06
US6391812B1 (en) 2002-05-21
EP1063211B1 (de) 2003-01-29

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