DE60132413T2 - Wasserumlöslichen Verbindung enthaltendes Polierkissen und Verfahren zur Herstellung desselben - Google Patents

Wasserumlöslichen Verbindung enthaltendes Polierkissen und Verfahren zur Herstellung desselben Download PDF

Info

Publication number
DE60132413T2
DE60132413T2 DE60132413T DE60132413T DE60132413T2 DE 60132413 T2 DE60132413 T2 DE 60132413T2 DE 60132413 T DE60132413 T DE 60132413T DE 60132413 T DE60132413 T DE 60132413T DE 60132413 T2 DE60132413 T2 DE 60132413T2
Authority
DE
Germany
Prior art keywords
polishing pad
water
weight
meth
producing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60132413T
Other languages
German (de)
English (en)
Other versions
DE60132413D1 (de
Inventor
Kou Hasegawa
Tomoo Koumura
Yutaka Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by JSR Corp filed Critical JSR Corp
Publication of DE60132413D1 publication Critical patent/DE60132413D1/de
Application granted granted Critical
Publication of DE60132413T2 publication Critical patent/DE60132413T2/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08JWORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00Manufacture of articles or shaped materials containing macromolecular substances
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24DTOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28Resins or natural or synthetic macromolecular compounds
    • B24D3/32Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00Lapping machines or devices; Accessories
    • B24B37/11Lapping tools
    • B24B37/20Lapping pads for working plane surfaces
    • B24B37/24Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
DE60132413T 2000-10-24 2001-10-23 Wasserumlöslichen Verbindung enthaltendes Polierkissen und Verfahren zur Herstellung desselben Expired - Lifetime DE60132413T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2000324139 2000-10-24
JP2000324139A JP3826702B2 (ja) 2000-10-24 2000-10-24 研磨パッド用組成物及びこれを用いた研磨パッド

Publications (2)

Publication Number Publication Date
DE60132413D1 DE60132413D1 (de) 2008-03-06
DE60132413T2 true DE60132413T2 (de) 2009-01-08

Family

ID=18801716

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60132413T Expired - Lifetime DE60132413T2 (de) 2000-10-24 2001-10-23 Wasserumlöslichen Verbindung enthaltendes Polierkissen und Verfahren zur Herstellung desselben

Country Status (6)

Country Link
US (1) US6645264B2 (https=)
EP (1) EP1201368B1 (https=)
JP (1) JP3826702B2 (https=)
KR (1) KR100770083B1 (https=)
DE (1) DE60132413T2 (https=)
TW (1) TWI263558B (https=)

Families Citing this family (48)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US6616513B1 (en) * 2000-04-07 2003-09-09 Applied Materials, Inc. Grid relief in CMP polishing pad to accurately measure pad wear, pad profile and pad wear profile
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Jsr株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
TWI228768B (en) * 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
EP1394202A3 (en) * 2002-08-26 2004-03-31 JSR Corporation Composition for polishing pad and polishing pad therewith
US20040058623A1 (en) * 2002-09-20 2004-03-25 Lam Research Corporation Polishing media for chemical mechanical planarization (CMP)
JP4039214B2 (ja) 2002-11-05 2008-01-30 Jsr株式会社 研磨パッド
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) * 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
CA2519942A1 (en) 2003-03-25 2004-10-14 Neopad Technologies Corporation Chip customized polish pads for chemical mechanical planarization (cmp)
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
CN100548576C (zh) * 2003-04-25 2009-10-14 Jsr株式会社 抛光垫和化学机械抛光方法
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
JP2005246599A (ja) * 2004-02-05 2005-09-15 Jsr Corp 化学機械研磨用パッド及び化学機械研磨方法
JP4697399B2 (ja) * 2004-06-11 2011-06-08 Jsr株式会社 化学機械研磨パッド及び化学機械研磨方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於cmp之特製拋光墊及其製造方法及其用途
SG160368A1 (en) 2005-03-08 2010-04-29 Toyo Tire & Rubber Co Polishing pad and process for producing the same
WO2006123559A1 (ja) 2005-05-17 2006-11-23 Toyo Tire & Rubber Co., Ltd. 研磨パッド
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
KR20080090496A (ko) * 2006-02-03 2008-10-08 제이에스알 가부시끼가이샤 화학 기계 연마 패드
US7591739B2 (en) * 2006-06-30 2009-09-22 Bridgestone Sports Co., Ltd. Golf ball material, golf ball, and method for preparing golf ball material
CN102152233B (zh) 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7371160B1 (en) 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
EP2083027B8 (en) 2008-01-24 2012-05-16 JSR Corporation Mechanical polishing pad and chemical mechanical polishing method
JP2008149458A (ja) * 2008-03-03 2008-07-03 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド
CN102884641B (zh) * 2010-03-16 2016-07-06 皇家飞利浦电子股份有限公司 具有可切换的照明/反射的光伏电池装置
WO2013042507A1 (ja) * 2011-09-22 2013-03-28 東洋ゴム工業株式会社 研磨パッド
JP2013086217A (ja) * 2011-10-19 2013-05-13 Dic Corp 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法
KR101417274B1 (ko) * 2012-05-23 2014-07-09 삼성전자주식회사 연마패드 및 그 제조방법
US9144880B2 (en) 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
JP5871978B2 (ja) 2014-03-14 2016-03-01 東洋ゴム工業株式会社 研磨パッド及びその製造方法
JP6312471B2 (ja) 2014-03-14 2018-04-18 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 研磨パッド及びその製造方法
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
WO2017175894A1 (ko) * 2016-04-06 2017-10-12 케이피엑스케미칼 주식회사 연마패드 제조 방법
US12109665B2 (en) * 2018-05-11 2024-10-08 Kuraray Co., Ltd. Modification method of polyurethane, polyurethane, polishing pad, and modification method of polishing pad
JP2024517999A (ja) * 2021-04-26 2024-04-23 ケムパワー コーポレーション パッド表面の再生および金属の回収
EP4395960A4 (en) 2021-09-03 2025-09-24 Chempower Corp TOOLS FOR CHEMICAL PLANARIZATION
CN115305057B (zh) * 2022-07-27 2023-11-21 安徽禾臣新材料有限公司 一种超细精密抛光粉及其制备方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4830438B1 (https=) * 1970-07-15 1973-09-20
SU901041A1 (ru) * 1979-04-25 1982-01-30 Опытное Конструкторско-Технологическое Бюро "Кристалл" Ленинградского Ордена Октябрьской Революции И Ордена Трудового Красного Знамени Технологического Института Им.Ленсовета Абразивна масса дл изготовлени шлифовального инструмента
RU2070852C1 (ru) * 1993-05-25 1996-12-27 Государственное научно-производственное объединение "Оптика" Состав алмазного инструмента
JPH09314657A (ja) * 1996-05-30 1997-12-09 Sekisui Chem Co Ltd ポリエチレン成形体の製造方法
JPH1148130A (ja) * 1997-07-31 1999-02-23 Sony Corp 研磨布及びその製造方法、半導体ウェーハの化学機械研磨装置及び化学機械研磨方法
JPH11322877A (ja) 1998-05-12 1999-11-26 Dainippon Ink & Chem Inc 微細泡含有成形物の製造方法及び微細泡含有成形物用ウレタン樹脂組成物
JP3918359B2 (ja) * 1998-05-15 2007-05-23 Jsr株式会社 研磨パッド用重合体組成物および研磨パッド
US6390890B1 (en) * 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
JP2000232082A (ja) * 1998-12-11 2000-08-22 Toray Ind Inc 研磨パッドおよび研磨装置
JP2000263423A (ja) 1999-03-16 2000-09-26 Toray Ind Inc 研磨パッドおよび研磨装置
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Jsr株式会社 研磨パッド用組成物及びこれを用いた研磨パッド

Also Published As

Publication number Publication date
DE60132413D1 (de) 2008-03-06
JP2002134445A (ja) 2002-05-10
US20020078632A1 (en) 2002-06-27
TWI263558B (en) 2006-10-11
KR20020032330A (ko) 2002-05-03
EP1201368A3 (en) 2004-02-11
JP3826702B2 (ja) 2006-09-27
EP1201368A2 (en) 2002-05-02
KR100770083B1 (ko) 2007-10-24
EP1201368B1 (en) 2008-01-16
US6645264B2 (en) 2003-11-11

Similar Documents

Publication Publication Date Title
DE60132413T2 (de) Wasserumlöslichen Verbindung enthaltendes Polierkissen und Verfahren zur Herstellung desselben
DE602004001268T2 (de) Polierkissen und chemisch-mechanisches Polierverfahren
DE60132399T2 (de) Zusammensetzung für Polierkissen und Polierkissen das diese Zusammensetzung verwendet
DE60219113T2 (de) Polierbelag für Halbleiter-Wafer
DE69937355T2 (de) Polierkissen
DE102013016780B4 (de) Chemisch-mechanische Polierzusammensetzung und Chemisch-Mechanisches Polierverfahren
DE112006001927B4 (de) Polierkissen enthaltend ein Zwischenräume durchdringendes Netzwerk aus verflüssigtem Vinylmomomer mit darin befindlicher Polyurethanmatrix
DE112005000723T5 (de) Polierkissen und Verfahren zur Herstellung desselben
DE112018003106B4 (de) Polierverfahren
DE102018006078A1 (de) Chemisch-mechanisches polierverfahren für wolfram
DE102022114532A1 (de) Cmp-polierkissen
DE10392153T5 (de) Abrasivum und Polierverfahren unter Verwendung desselben
DE602005006326T2 (de) Chemisch-mechanisches Polierkissen und Polierverfahren
DE102022122010A1 (de) Komprimierbares, nicht-netzförmiges polyharnstoff-polierkissen
JP2001214154A (ja) 研磨パッド用組成物及びそれを用いた研磨パッド
JP3849582B2 (ja) 研磨パッド及び複層型研磨パッド
JP4798103B2 (ja) 研磨パッド
DE112022004699T5 (de) Polierkissen
DE102022122023A1 (de) Heterogenes fluorpolymergemisch-polierkissen
JP2007049197A (ja) 研磨パッド用組成物及びこれを用いた研磨パッド
JP2021194162A (ja) ゴルフボール及びその製造方法
JP3867629B2 (ja) 研磨パッド及び複層型研磨パッド
JP2012056021A (ja) 化学機械研磨パッドおよびそれを用いた化学機械研磨方法
JP2006055983A (ja) 化学機械研磨パッド用組成物、化学機械研磨パッド及び化学機械研磨方法
JP2005246599A (ja) 化学機械研磨用パッド及び化学機械研磨方法

Legal Events

Date Code Title Description
8364 No opposition during term of opposition