TWI263558B - Composition for forming polishing pad and polishing pad using the same - Google Patents

Composition for forming polishing pad and polishing pad using the same

Info

Publication number
TWI263558B
TWI263558B TW090126298A TW90126298A TWI263558B TW I263558 B TWI263558 B TW I263558B TW 090126298 A TW090126298 A TW 090126298A TW 90126298 A TW90126298 A TW 90126298A TW I263558 B TWI263558 B TW I263558B
Authority
TW
Taiwan
Prior art keywords
polishing pad
composition
forming
polishing
water
Prior art date
Application number
TW090126298A
Other languages
English (en)
Chinese (zh)
Inventor
Kuo Hasegawa
Tomoo Koumura
Yutaka Kobayashi
Original Assignee
Jsr Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jsr Corp filed Critical Jsr Corp
Application granted granted Critical
Publication of TWI263558B publication Critical patent/TWI263558B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
TW090126298A 2000-10-24 2001-10-24 Composition for forming polishing pad and polishing pad using the same TWI263558B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000324139A JP3826702B2 (ja) 2000-10-24 2000-10-24 研磨パッド用組成物及びこれを用いた研磨パッド

Publications (1)

Publication Number Publication Date
TWI263558B true TWI263558B (en) 2006-10-11

Family

ID=18801716

Family Applications (1)

Application Number Title Priority Date Filing Date
TW090126298A TWI263558B (en) 2000-10-24 2001-10-24 Composition for forming polishing pad and polishing pad using the same

Country Status (6)

Country Link
US (1) US6645264B2 (https=)
EP (1) EP1201368B1 (https=)
JP (1) JP3826702B2 (https=)
KR (1) KR100770083B1 (https=)
DE (1) DE60132413T2 (https=)
TW (1) TWI263558B (https=)

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TWI228768B (en) * 2002-08-08 2005-03-01 Jsr Corp Processing method of polishing pad for semiconductor wafer and polishing pad for semiconductor wafer
EP1394202A3 (en) * 2002-08-26 2004-03-31 JSR Corporation Composition for polishing pad and polishing pad therewith
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TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
JP3910921B2 (ja) * 2003-02-06 2007-04-25 株式会社東芝 研磨布および半導体装置の製造方法
US7704125B2 (en) 2003-03-24 2010-04-27 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
US8864859B2 (en) * 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
CA2519942A1 (en) 2003-03-25 2004-10-14 Neopad Technologies Corporation Chip customized polish pads for chemical mechanical planarization (cmp)
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
CN100548576C (zh) * 2003-04-25 2009-10-14 Jsr株式会社 抛光垫和化学机械抛光方法
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
JP2005246599A (ja) * 2004-02-05 2005-09-15 Jsr Corp 化学機械研磨用パッド及び化学機械研磨方法
JP4697399B2 (ja) * 2004-06-11 2011-06-08 Ｊｓｒ株式会社 化学機械研磨パッド及び化学機械研磨方法
TWI385050B (zh) * 2005-02-18 2013-02-11 Nexplanar Corp 用於ｃｍｐ之特製拋光墊及其製造方法及其用途
SG160368A1 (en) 2005-03-08 2010-04-29 Toyo Tire & Rubber Co Polishing pad and process for producing the same
WO2006123559A1 (ja) 2005-05-17 2006-11-23 Toyo Tire & Rubber Co., Ltd. 研磨パッド
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
KR20080090496A (ko) * 2006-02-03 2008-10-08 제이에스알 가부시끼가이샤 화학 기계 연마 패드
US7591739B2 (en) * 2006-06-30 2009-09-22 Bridgestone Sports Co., Ltd. Golf ball material, golf ball, and method for preparing golf ball material
CN102152233B (zh) 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7371160B1 (en) 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
EP2083027B8 (en) 2008-01-24 2012-05-16 JSR Corporation Mechanical polishing pad and chemical mechanical polishing method
JP2008149458A (ja) * 2008-03-03 2008-07-03 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド
CN102884641B (zh) * 2010-03-16 2016-07-06 皇家飞利浦电子股份有限公司 具有可切换的照明/反射的光伏电池装置
WO2013042507A1 (ja) * 2011-09-22 2013-03-28 東洋ゴム工業株式会社 研磨パッド
JP2013086217A (ja) * 2011-10-19 2013-05-13 Dic Corp 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法
KR101417274B1 (ko) * 2012-05-23 2014-07-09 삼성전자주식회사 연마패드 및 그 제조방법
US9144880B2 (en) 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
JP5871978B2 (ja) 2014-03-14 2016-03-01 東洋ゴム工業株式会社 研磨パッド及びその製造方法
JP6312471B2 (ja) 2014-03-14 2018-04-18 ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド 研磨パッド及びその製造方法
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
WO2017175894A1 (ko) * 2016-04-06 2017-10-12 케이피엑스케미칼 주식회사 연마패드 제조 방법
US12109665B2 (en) * 2018-05-11 2024-10-08 Kuraray Co., Ltd. Modification method of polyurethane, polyurethane, polishing pad, and modification method of polishing pad
JP2024517999A (ja) * 2021-04-26 2024-04-23 ケムパワー コーポレーション パッド表面の再生および金属の回収
EP4395960A4 (en) 2021-09-03 2025-09-24 Chempower Corp TOOLS FOR CHEMICAL PLANARIZATION
CN115305057B (zh) * 2022-07-27 2023-11-21 安徽禾臣新材料有限公司 一种超细精密抛光粉及其制备方法

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SU901041A1 (ru) * 1979-04-25 1982-01-30 Опытное Конструкторско-Технологическое Бюро "Кристалл" Ленинградского Ордена Октябрьской Революции И Ордена Трудового Красного Знамени Технологического Института Им.Ленсовета Абразивна масса дл изготовлени шлифовального инструмента
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JPH09314657A (ja) * 1996-05-30 1997-12-09 Sekisui Chem Co Ltd ポリエチレン成形体の製造方法
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JPH11322877A (ja) 1998-05-12 1999-11-26 Dainippon Ink & Chem Inc 微細泡含有成形物の製造方法及び微細泡含有成形物用ウレタン樹脂組成物
JP3918359B2 (ja) * 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
US6390890B1 (en) * 1999-02-06 2002-05-21 Charles J Molnar Finishing semiconductor wafers with a fixed abrasive finishing element
JP2000232082A (ja) * 1998-12-11 2000-08-22 Toray Ind Inc 研磨パッドおよび研磨装置
JP2000263423A (ja) 1999-03-16 2000-09-26 Toray Ind Inc 研磨パッドおよび研磨装置
JP3925041B2 (ja) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド

Also Published As

Publication number Publication date
DE60132413D1 (de) 2008-03-06
JP2002134445A (ja) 2002-05-10
US20020078632A1 (en) 2002-06-27
KR20020032330A (ko) 2002-05-03
EP1201368A3 (en) 2004-02-11
JP3826702B2 (ja) 2006-09-27
EP1201368A2 (en) 2002-05-02
DE60132413T2 (de) 2009-01-08
KR100770083B1 (ko) 2007-10-24
EP1201368B1 (en) 2008-01-16
US6645264B2 (en) 2003-11-11

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MM4A Annulment or lapse of patent due to non-payment of fees