JP3826702B2 - 研磨パッド用組成物及びこれを用いた研磨パッド - Google Patents

研磨パッド用組成物及びこれを用いた研磨パッド Download PDF

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Publication number
JP3826702B2
JP3826702B2 JP2000324139A JP2000324139A JP3826702B2 JP 3826702 B2 JP3826702 B2 JP 3826702B2 JP 2000324139 A JP2000324139 A JP 2000324139A JP 2000324139 A JP2000324139 A JP 2000324139A JP 3826702 B2 JP3826702 B2 JP 3826702B2
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JP
Japan
Prior art keywords
polishing pad
meth
acrylate
water
polishing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2000324139A
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English (en)
Japanese (ja)
Other versions
JP2002134445A (ja
JP2002134445A5 (https=
Inventor
亨 長谷川
知男 河村
豊 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JSR Corp
Original Assignee
JSR Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP2000324139A priority Critical patent/JP3826702B2/ja
Application filed by JSR Corp filed Critical JSR Corp
Priority to DE60132413T priority patent/DE60132413T2/de
Priority to EP01125161A priority patent/EP1201368B1/en
Priority to KR1020010065504A priority patent/KR100770083B1/ko
Priority to US09/983,097 priority patent/US6645264B2/en
Priority to TW090126298A priority patent/TWI263558B/zh
Publication of JP2002134445A publication Critical patent/JP2002134445A/ja
Publication of JP2002134445A5 publication Critical patent/JP2002134445A5/ja
Application granted granted Critical
Publication of JP3826702B2 publication Critical patent/JP3826702B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/28—Resins or natural or synthetic macromolecular compounds
    • B24D3/32—Resins or natural or synthetic macromolecular compounds for porous or cellular structure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
JP2000324139A 2000-10-24 2000-10-24 研磨パッド用組成物及びこれを用いた研磨パッド Expired - Fee Related JP3826702B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2000324139A JP3826702B2 (ja) 2000-10-24 2000-10-24 研磨パッド用組成物及びこれを用いた研磨パッド
EP01125161A EP1201368B1 (en) 2000-10-24 2001-10-23 Polishing pad comprising a water-insoluble substance and method for producing thereof
KR1020010065504A KR100770083B1 (ko) 2000-10-24 2001-10-23 연마 패드용 조성물, 연마 패드용 가교결합체, 그를 사용한 연마 패드 및 그의 제조 방법
US09/983,097 US6645264B2 (en) 2000-10-24 2001-10-23 Composition for forming polishing pad, crosslinked body for polishing pad, polishing pad using the same and method for producing thereof
DE60132413T DE60132413T2 (de) 2000-10-24 2001-10-23 Wasserumlöslichen Verbindung enthaltendes Polierkissen und Verfahren zur Herstellung desselben
TW090126298A TWI263558B (en) 2000-10-24 2001-10-24 Composition for forming polishing pad and polishing pad using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000324139A JP3826702B2 (ja) 2000-10-24 2000-10-24 研磨パッド用組成物及びこれを用いた研磨パッド

Publications (3)

Publication Number Publication Date
JP2002134445A JP2002134445A (ja) 2002-05-10
JP2002134445A5 JP2002134445A5 (https=) 2004-12-09
JP3826702B2 true JP3826702B2 (ja) 2006-09-27

Family

ID=18801716

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000324139A Expired - Fee Related JP3826702B2 (ja) 2000-10-24 2000-10-24 研磨パッド用組成物及びこれを用いた研磨パッド

Country Status (6)

Country Link
US (1) US6645264B2 (https=)
EP (1) EP1201368B1 (https=)
JP (1) JP3826702B2 (https=)
KR (1) KR100770083B1 (https=)
DE (1) DE60132413T2 (https=)
TW (1) TWI263558B (https=)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20160132882A (ko) 2014-03-14 2016-11-21 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 연마 패드 및 그 제조 방법
KR20160132883A (ko) 2014-03-14 2016-11-21 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 연마 패드 및 그 제조 방법

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JP3925041B2 (ja) * 2000-05-31 2007-06-06 Ｊｓｒ株式会社 研磨パッド用組成物及びこれを用いた研磨パッド
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JP4039214B2 (ja) 2002-11-05 2008-01-30 Ｊｓｒ株式会社 研磨パッド
TW592894B (en) * 2002-11-19 2004-06-21 Iv Technologies Co Ltd Method of fabricating a polishing pad
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US8864859B2 (en) * 2003-03-25 2014-10-21 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
CA2519942A1 (en) 2003-03-25 2004-10-14 Neopad Technologies Corporation Chip customized polish pads for chemical mechanical planarization (cmp)
US9278424B2 (en) 2003-03-25 2016-03-08 Nexplanar Corporation Customized polishing pads for CMP and methods of fabrication and use thereof
CN100548576C (zh) * 2003-04-25 2009-10-14 Jsr株式会社 抛光垫和化学机械抛光方法
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
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SG160368A1 (en) 2005-03-08 2010-04-29 Toyo Tire & Rubber Co Polishing pad and process for producing the same
WO2006123559A1 (ja) 2005-05-17 2006-11-23 Toyo Tire & Rubber Co., Ltd. 研磨パッド
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
KR20080090496A (ko) * 2006-02-03 2008-10-08 제이에스알 가부시끼가이샤 화학 기계 연마 패드
US7591739B2 (en) * 2006-06-30 2009-09-22 Bridgestone Sports Co., Ltd. Golf ball material, golf ball, and method for preparing golf ball material
CN102152233B (zh) 2006-08-28 2013-10-30 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
US7438636B2 (en) * 2006-12-21 2008-10-21 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US7371160B1 (en) 2006-12-21 2008-05-13 Rohm And Haas Electronic Materials Cmp Holdings Inc. Elastomer-modified chemical mechanical polishing pad
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
EP2083027B8 (en) 2008-01-24 2012-05-16 JSR Corporation Mechanical polishing pad and chemical mechanical polishing method
JP2008149458A (ja) * 2008-03-03 2008-07-03 Jsr Corp 研磨パッド用組成物及びこれを用いた研磨パッド
CN102884641B (zh) * 2010-03-16 2016-07-06 皇家飞利浦电子股份有限公司 具有可切换的照明/反射的光伏电池装置
WO2013042507A1 (ja) * 2011-09-22 2013-03-28 東洋ゴム工業株式会社 研磨パッド
JP2013086217A (ja) * 2011-10-19 2013-05-13 Dic Corp 研磨パッド用ウレタン樹脂組成物、ポリウレタン研磨パッド及びポリウレタン研磨パッドの製造方法
KR101417274B1 (ko) * 2012-05-23 2014-07-09 삼성전자주식회사 연마패드 및 그 제조방법
US9144880B2 (en) 2012-11-01 2015-09-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad
US9238295B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical window polishing pad
US9238296B2 (en) 2013-05-31 2016-01-19 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Multilayer chemical mechanical polishing pad stack with soft and conditionable polishing layer
US9233451B2 (en) 2013-05-31 2016-01-12 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Soft and conditionable chemical mechanical polishing pad stack
US20150306731A1 (en) 2014-04-25 2015-10-29 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing pad
US9484212B1 (en) 2015-10-30 2016-11-01 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Chemical mechanical polishing method
WO2017175894A1 (ko) * 2016-04-06 2017-10-12 케이피엑스케미칼 주식회사 연마패드 제조 방법
US12109665B2 (en) * 2018-05-11 2024-10-08 Kuraray Co., Ltd. Modification method of polyurethane, polyurethane, polishing pad, and modification method of polishing pad
JP2024517999A (ja) * 2021-04-26 2024-04-23 ケムパワー コーポレーション パッド表面の再生および金属の回収
EP4395960A4 (en) 2021-09-03 2025-09-24 Chempower Corp TOOLS FOR CHEMICAL PLANARIZATION
CN115305057B (zh) * 2022-07-27 2023-11-21 安徽禾臣新材料有限公司 一种超细精密抛光粉及其制备方法

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Cited By (2)

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Publication number Priority date Publication date Assignee Title
KR20160132882A (ko) 2014-03-14 2016-11-21 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 연마 패드 및 그 제조 방법
KR20160132883A (ko) 2014-03-14 2016-11-21 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 연마 패드 및 그 제조 방법

Also Published As

Publication number Publication date
DE60132413D1 (de) 2008-03-06
JP2002134445A (ja) 2002-05-10
US20020078632A1 (en) 2002-06-27
TWI263558B (en) 2006-10-11
KR20020032330A (ko) 2002-05-03
EP1201368A3 (en) 2004-02-11
EP1201368A2 (en) 2002-05-02
DE60132413T2 (de) 2009-01-08
KR100770083B1 (ko) 2007-10-24
EP1201368B1 (en) 2008-01-16
US6645264B2 (en) 2003-11-11

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