JP2004083723A5 - - Google Patents
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- Publication number
- JP2004083723A5 JP2004083723A5 JP2002245830A JP2002245830A JP2004083723A5 JP 2004083723 A5 JP2004083723 A5 JP 2004083723A5 JP 2002245830 A JP2002245830 A JP 2002245830A JP 2002245830 A JP2002245830 A JP 2002245830A JP 2004083723 A5 JP2004083723 A5 JP 2004083723A5
- Authority
- JP
- Japan
- Prior art keywords
- crosslinked
- water
- polybutadiene
- insoluble matrix
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000005498 polishing Methods 0.000 claims description 19
- 239000011159 matrix material Substances 0.000 claims description 18
- 229920002589 poly(vinylethylene) polymer Polymers 0.000 claims description 17
- 229920006037 cross link polymer Polymers 0.000 claims description 8
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 claims description 7
- 239000005038 ethylene vinyl acetate Substances 0.000 claims description 6
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical group OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 claims description 4
- 239000002245 particle Substances 0.000 claims description 4
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 claims description 2
- 229910000147 aluminium phosphate Chemical group 0.000 claims description 2
- 125000003277 amino group Chemical group 0.000 claims description 2
- FACXGONDLDSNOE-UHFFFAOYSA-N buta-1,3-diene;styrene Chemical compound C=CC=C.C=CC1=CC=CC=C1.C=CC1=CC=CC=C1 FACXGONDLDSNOE-UHFFFAOYSA-N 0.000 claims description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims description 2
- 229920003020 cross-linked polyethylene Polymers 0.000 claims description 2
- 239000004703 cross-linked polyethylene Substances 0.000 claims description 2
- 125000003700 epoxy group Chemical group 0.000 claims description 2
- 125000000524 functional group Chemical group 0.000 claims description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 2
- 229920000642 polymer Polymers 0.000 claims description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 claims description 2
- 229920000468 styrene butadiene styrene block copolymer Polymers 0.000 claims description 2
- 125000000542 sulfonic acid group Chemical group 0.000 claims description 2
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims 1
- 239000005977 Ethylene Substances 0.000 claims 1
- 229920001577 copolymer Polymers 0.000 claims 1
- 238000004132 cross linking Methods 0.000 claims 1
- 239000005062 Polybutadiene Substances 0.000 description 1
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002245830A JP4259069B2 (ja) | 2002-08-26 | 2002-08-26 | 研磨パッド用組成物及びこれを用いた研磨パッド |
| US10/646,891 US20040063391A1 (en) | 2002-08-26 | 2003-08-25 | Composition for polishing pad and polishing pad therewith |
| KR1020030058617A KR100584050B1 (ko) | 2002-08-26 | 2003-08-25 | 연마 패드용 조성물 및 이를 사용한 연마 패드 |
| TW092123307A TWI234503B (en) | 2002-08-26 | 2003-08-25 | Composition for polishing pad and using this polishing pad |
| EP03019174A EP1394202A3 (en) | 2002-08-26 | 2003-08-25 | Composition for polishing pad and polishing pad therewith |
| CNB031549969A CN100398598C (zh) | 2002-08-26 | 2003-08-26 | 研磨垫用组合物以及使用它的研磨垫 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002245830A JP4259069B2 (ja) | 2002-08-26 | 2002-08-26 | 研磨パッド用組成物及びこれを用いた研磨パッド |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2008052550A Division JP2008149458A (ja) | 2008-03-03 | 2008-03-03 | 研磨パッド用組成物及びこれを用いた研磨パッド |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2004083723A JP2004083723A (ja) | 2004-03-18 |
| JP2004083723A5 true JP2004083723A5 (https=) | 2005-06-02 |
| JP4259069B2 JP4259069B2 (ja) | 2009-04-30 |
Family
ID=32053906
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2002245830A Expired - Fee Related JP4259069B2 (ja) | 2002-08-26 | 2002-08-26 | 研磨パッド用組成物及びこれを用いた研磨パッド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4259069B2 (https=) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4697399B2 (ja) * | 2004-06-11 | 2011-06-08 | Ｊｓｒ株式会社 | 化学機械研磨パッド及び化学機械研磨方法 |
| JPWO2009072405A1 (ja) * | 2007-12-07 | 2011-04-21 | Jsr株式会社 | 化学機械研磨パッドおよび化学機械研磨方法 |
-
2002
- 2002-08-26 JP JP2002245830A patent/JP4259069B2/ja not_active Expired - Fee Related
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