JP4259069B2 - 研磨パッド用組成物及びこれを用いた研磨パッド - Google Patents

研磨パッド用組成物及びこれを用いた研磨パッド Download PDF

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Publication number
JP4259069B2
JP4259069B2 JP2002245830A JP2002245830A JP4259069B2 JP 4259069 B2 JP4259069 B2 JP 4259069B2 JP 2002245830 A JP2002245830 A JP 2002245830A JP 2002245830 A JP2002245830 A JP 2002245830A JP 4259069 B2 JP4259069 B2 JP 4259069B2
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Japan
Prior art keywords
uncrosslinked
water
polishing pad
mass
polishing
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JP2002245830A
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English (en)
Japanese (ja)
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JP2004083723A (ja
JP2004083723A5 (https=
Inventor
隆浩 岡本
亨 長谷川
信夫 川橋
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JSR Corp
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JSR Corp
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Filing date
Publication date
Priority to JP2002245830A priority Critical patent/JP4259069B2/ja
Application filed by JSR Corp filed Critical JSR Corp
Priority to EP03019174A priority patent/EP1394202A3/en
Priority to US10/646,891 priority patent/US20040063391A1/en
Priority to KR1020030058617A priority patent/KR100584050B1/ko
Priority to TW092123307A priority patent/TWI234503B/zh
Priority to CNB031549969A priority patent/CN100398598C/zh
Publication of JP2004083723A publication Critical patent/JP2004083723A/ja
Publication of JP2004083723A5 publication Critical patent/JP2004083723A5/ja
Application granted granted Critical
Publication of JP4259069B2 publication Critical patent/JP4259069B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Mechanical Treatment Of Semiconductor (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2002245830A 2002-08-26 2002-08-26 研磨パッド用組成物及びこれを用いた研磨パッド Expired - Fee Related JP4259069B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2002245830A JP4259069B2 (ja) 2002-08-26 2002-08-26 研磨パッド用組成物及びこれを用いた研磨パッド
US10/646,891 US20040063391A1 (en) 2002-08-26 2003-08-25 Composition for polishing pad and polishing pad therewith
KR1020030058617A KR100584050B1 (ko) 2002-08-26 2003-08-25 연마 패드용 조성물 및 이를 사용한 연마 패드
TW092123307A TWI234503B (en) 2002-08-26 2003-08-25 Composition for polishing pad and using this polishing pad
EP03019174A EP1394202A3 (en) 2002-08-26 2003-08-25 Composition for polishing pad and polishing pad therewith
CNB031549969A CN100398598C (zh) 2002-08-26 2003-08-26 研磨垫用组合物以及使用它的研磨垫

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2002245830A JP4259069B2 (ja) 2002-08-26 2002-08-26 研磨パッド用組成物及びこれを用いた研磨パッド

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2008052550A Division JP2008149458A (ja) 2008-03-03 2008-03-03 研磨パッド用組成物及びこれを用いた研磨パッド

Publications (3)

Publication Number Publication Date
JP2004083723A JP2004083723A (ja) 2004-03-18
JP2004083723A5 JP2004083723A5 (https=) 2005-06-02
JP4259069B2 true JP4259069B2 (ja) 2009-04-30

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Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002245830A Expired - Fee Related JP4259069B2 (ja) 2002-08-26 2002-08-26 研磨パッド用組成物及びこれを用いた研磨パッド

Country Status (1)

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JP (1) JP4259069B2 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4697399B2 (ja) * 2004-06-11 2011-06-08 Ｊｓｒ株式会社 化学機械研磨パッド及び化学機械研磨方法
JPWO2009072405A1 (ja) * 2007-12-07 2011-04-21 Jsr株式会社 化学機械研磨パッドおよび化学機械研磨方法

Also Published As

Publication number Publication date
JP2004083723A (ja) 2004-03-18

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