JP2001334455A5 - - Google Patents

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Publication number
JP2001334455A5
JP2001334455A5 JP2000161520A JP2000161520A JP2001334455A5 JP 2001334455 A5 JP2001334455 A5 JP 2001334455A5 JP 2000161520 A JP2000161520 A JP 2000161520A JP 2000161520 A JP2000161520 A JP 2000161520A JP 2001334455 A5 JP2001334455 A5 JP 2001334455A5
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JP
Japan
Prior art keywords
water
polishing pad
composition
soluble
matrix material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2000161520A
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English (en)
Japanese (ja)
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JP3925041B2 (ja
JP2001334455A (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from JP2000161520A external-priority patent/JP3925041B2/ja
Priority to JP2000161520A priority Critical patent/JP3925041B2/ja
Priority to TW093131164A priority patent/TWI290576B/zh
Priority to TW090113083A priority patent/TWI290575B/zh
Priority to EP01113173A priority patent/EP1164559B1/en
Priority to DE60132399T priority patent/DE60132399T2/de
Priority to KR1020010029902A priority patent/KR100792102B1/ko
Priority to US09/867,541 priority patent/US6790883B2/en
Publication of JP2001334455A publication Critical patent/JP2001334455A/ja
Priority to US10/868,353 priority patent/US7077879B2/en
Publication of JP2001334455A5 publication Critical patent/JP2001334455A5/ja
Publication of JP3925041B2 publication Critical patent/JP3925041B2/ja
Application granted granted Critical
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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JP2000161520A 2000-05-31 2000-05-31 研磨パッド用組成物及びこれを用いた研磨パッド Expired - Lifetime JP3925041B2 (ja)

Priority Applications (8)

Application Number Priority Date Filing Date Title
JP2000161520A JP3925041B2 (ja) 2000-05-31 2000-05-31 研磨パッド用組成物及びこれを用いた研磨パッド
TW093131164A TWI290576B (en) 2000-05-31 2001-05-30 Composition for polishing pad and polishing pad using the same
TW090113083A TWI290575B (en) 2000-05-31 2001-05-30 Composition for polishing pad and polishing pad using the same
EP01113173A EP1164559B1 (en) 2000-05-31 2001-05-30 Composition for polishing pad and polishing pad using the same
DE60132399T DE60132399T2 (de) 2000-05-31 2001-05-30 Zusammensetzung für Polierkissen und Polierkissen das diese Zusammensetzung verwendet
KR1020010029902A KR100792102B1 (ko) 2000-05-31 2001-05-30 연마 패드용 조성물 및 이를 이용한 연마 패드
US09/867,541 US6790883B2 (en) 2000-05-31 2001-05-31 Composition for polishing pad and polishing pad using the same
US10/868,353 US7077879B2 (en) 2000-05-31 2004-06-16 Composition for polishing pad and polishing pad using the same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000161520A JP3925041B2 (ja) 2000-05-31 2000-05-31 研磨パッド用組成物及びこれを用いた研磨パッド

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2006296711A Division JP4379462B2 (ja) 2006-10-31 2006-10-31 研磨パッド用組成物及びこれを用いた研磨パッド

Publications (3)

Publication Number Publication Date
JP2001334455A JP2001334455A (ja) 2001-12-04
JP2001334455A5 true JP2001334455A5 (https=) 2004-12-16
JP3925041B2 JP3925041B2 (ja) 2007-06-06

Family

ID=18665534

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2000161520A Expired - Lifetime JP3925041B2 (ja) 2000-05-31 2000-05-31 研磨パッド用組成物及びこれを用いた研磨パッド

Country Status (6)

Country Link
US (2) US6790883B2 (https=)
EP (1) EP1164559B1 (https=)
JP (1) JP3925041B2 (https=)
KR (1) KR100792102B1 (https=)
DE (1) DE60132399T2 (https=)
TW (2) TWI290576B (https=)

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